JPH073445A - Joining method for sputtering target material - Google Patents

Abstract

PURPOSE:To inexpensively and easily join a hard-to-join material by vapor depositing Cr/Ni/Au at the joining part of a target material and a cooling member. CONSTITUTION:In the joining method for the sputtering target material which joins the target material 1 and the cooling member 4 consisting of copper and copper alloy or stainless steel by using In based solder 3 by heating and air- cooling, the target material and the cooling member 4 are subjected to the vapor deposition 2 with Cr/Ni/Au. The method is used even for such case that the target 1 is the hard-to-joint material such as Co, Cr and Nb series. In this way, the hard-to-joint material can be joined inexpensively and easily.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for brazing a target material of Cr-based difficult-to-bond material to a stainless steel cooling member which is copper or a copper alloy or a difficult-to-bond material.

[0002]

2. Description of the Related Art Conventionally, a cooling member is generally made of copper, which has a good thermal conductivity, and copper has a property of being easily wetted by any brazing material. Further, since it is easy to improve the surface of copper by plating, it is necessary to consider the joining only when the target material is a difficult-to-join material.

Further, since the copper and the target materials have different thermal expansion coefficients, the targets in the cooling process of the brazing are as described in JP-A 1-262088, 1-268989 and 2-11759. The brazing is performed while heating the material and the cooling member so that the contraction amounts are the same, and providing a warp caused by a difference in thermal expansion and a warp in the opposite direction according to the warp amount.

However, it is practically difficult to control the temperature and to give a proper warp in the opposite direction.

In Japanese Patent Application No. 4-159127, Ti / Pt / Au is used as the vapor deposition material.
u is very expensive and costs a lot to join.

[0006]

The sputtering target material is usually bonded to a cooling member made of copper and a copper alloy, mounted on a sputtering apparatus, and water-cooled before use.

However, in some sputtering material targets, rather than copper, instead of copper, a difficult-to-join material such as stainless steel may be used as the cooling member.

[0008] Stainless steel is generally hard to be wet with most brazing filler metals and is difficult to join.

The Cr-based target and the Co-based target are also
Hard to get wet with brazing material.

Therefore, the brazing filler metal does not spread by wetting unless a special flux is used.

However, if a flux is used to bond the sputtering target material used in a high vacuum state, harmful gas is generated, which hinders sputtering.

Further, when Ti / Pt / Au is used as the vapor deposition material, it is possible to join difficult-to-join materials, but there is a problem that a very expensive material is used and therefore a great cost is required for the joining. .

An object of the present invention is to provide a method for inexpensively joining a difficult-to-join target and a difficult-to-join cooling member.

[0014]

[Means for Solving the Problems] A Co-based or Cr-based target, which is a difficult-to-bond material, and a stainless steel cooling member are provided with Cr-N.
i-Au is vapor-deposited to modify the surface. This structure is much cheaper than Ti-Pt-Au.

According to this method, since no special flux is used, no harmful gas is generated even in a high vacuum state.

Au of the uppermost film is very easily wet with In solder and can be easily joined.

[0017]

The brazing material can be easily brazed by modifying the surface of the SUS material and the target material, which are hard to be wetted by the brazing material, by forming a vapor-deposited film of Cr-Ni-Au which is very wettable.

[0018]

[Examples] A 20TP material of SUS304 was vapor-deposited with a vapor deposition film thickness of Cr / Ni / Au of 0.1 µ / 0.2 µ / 0.2 µ, and a tape peeling test of adhesive strength was conducted.

As a result, no peeling was observed.

Similarly, a Co-Cr-Ta target is subjected to C
A tape peeling test was carried out by vapor deposition of r / Ni / Au, but no peeling was observed.

Preliminary test results show that SUS and Co-Cr
-It was confirmed that there was no problem in vapor deposition property and adhesive strength on the Ta target.

Next, φ130 / φ70 × 12t SUS304
The cooling member and the φ240 / 6tCo-Cr-Ta target were joined.

Since the SUS304 cooling member is ring-shaped, a vapor deposition mask is prepared so that only that portion is vapor-deposited.
A vapor deposition film was formed with a film thickness of r / Ni / Au of 0.1 / 0.2 / 0.2 μm, respectively.

Next, a mask is formed on the target material so as to be vapor-deposited on the joint surface of the SUS ring, and Cr / Ni is used.
A vapor deposition film was formed such that / Au had the same film thickness as the SUS material.

In is deposited on the bonding surface of the target after vapor deposition.
A solder foil is placed and heated to 180 to 200 ° C., and In solder welded on the joint surface is thinly spread on the entire surface of the target.

Similarly, the In solder is thinly spread on the entire surface of the SUS cooling member.

Next, an In solder foil was laminated between the target and the joining surface of the SUS cooling member so as not to shift, and clipped with a weight of about 10 kg and placed at an ambient temperature of 200.
Place in a furnace at ~ 230 ° C and hold for about 30 minutes.

As a result of joining in this way, joining without peeling or deformation was achieved.

As a result of the radiation inspection of the joined product, the area ratio of the joined portion was 95% or more, which was good. It has been possible to easily join the SUS material, which has been a difficult joining material up to now, and the Co—Cr—Ta target material at low cost without using a special jig or tool.

[0030]

According to the present invention, by applying Cr / Ni / Au vapor deposition to the target and the cooling member, it is possible to easily join the difficult-to-join materials at low cost.

[Brief description of drawings]

FIG. 1 is an explanatory view showing stacking of respective members before joining.

[Explanation of symbols]

1 ... Co-Cr-Ta target material, 2 ... Cr / Ni /
Au evaporated film, 3 ... brazing material, 4 ... SUS cooling member.

Claims (3)

[Claims] 1. A method of joining a sputtering target material, comprising a target material and a cooling member made of copper and a copper alloy or stainless steel using In-based solder, which is heated and air-cooled to bond the target material and the cooling member with Cr. / Ni /
A method for joining a sputtering target material, which comprises depositing Au and then joining. 2. The Co-based target material according to claim 1,
A method of joining a sputtering target material, comprising forming a strong intermetallic compound and brazing the material to a difficult-to-join material such as a Cr-based target material and a Nb-based target material by using the above method. 3. The method of joining a sputtering target material according to claim 1, wherein the cooling member is vapor-deposited similarly on stainless steel which is a difficult-to-join material to form a strong intermetallic compound for brazing.