JPH0621268Y2 - Equipment for testing semiconductor lasers - Google Patents

Description

[Detailed description of the device] "Industrial application field" This device has a semiconductor laser chip mounted on a stem,
The present invention relates to a semiconductor laser test fixture whose stem is attached to a subcarrier.

"Prior Art" As shown in FIG.
2 is attached, the stem 11 is attached to the subcarrier 13, and is handled together with the subcarrier 13 when the semiconductor laser chip 12 is tested. For the test of the semiconductor laser chip 12, the backward light 14 from the semiconductor laser chip 12 is received by the light receiving element 15. Conventionally, the light receiving element 15 is provided inside the subcarrier 13 as shown in FIG. In the test, the semiconductor laser chip 12 is handled together with the subcarriers 13, but it is not economical to provide the light receiving element 15 in each of the subcarriers 13.

[Means for Solving the Problems] According to the present invention, an optical guide is provided in the subcarrier for receiving the backward light of the semiconductor laser chip, introducing the light into the subcarrier, and then emitting the light out of the subcarrier. To be

[Embodiment] FIG. 1 shows an embodiment of the present invention, in which parts corresponding to those in FIG. In this invention, a light guide 16 is provided in the subcarrier 13. The light guide 16 is a glass optical fiber, a plastic optical fiber, or the like, one end surface of the light guide 16 faces the back surface of the semiconductor laser chip 12, and the backward light 14 of the semiconductor laser chip 12 is incident on the light guide 16. The other end surface of the light guide 16 is, for example, an opening 1 formed on the back surface of the subcarrier 13.
The light, which faces the optical waveguide 7 and is guided into the light guide 16, is emitted to the outside of the subcarrier 13.

A light receiving element 18 is provided to face the light guide 16 through the opening 17 to receive the emitted light.

The backward light 14 from the semiconductor laser chip 12 is the subcarrier 1
The light is incident on the light guide 16 in the light guide 3, and the light is guided to the light guide 16.
Is emitted to the outside of the subcarrier 13 and is incident on the light receiving element 18.

[Advantage of Invention] As described above, according to this invention, the backward light 14 of the semiconductor laser chip 12 is guided to the light guide 16 and passes through the subcarrier 13 to reach the light receiving element 18. Therefore, it is sufficient to provide the inexpensive light guide 16 without providing the expensive light receiving element 18 in the subcarrier 13.
Can be commonly used for a plurality of subcarriers 13, and the subcarriers 13 can be constructed at low cost.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional semiconductor laser test fixture.

Claims (1)

[Scope of utility model registration request] 1. A semiconductor laser test fixture in which a semiconductor laser chip is attached to a stem, and the stem is attached to a subcarrier, wherein the subcarrier receives rear light of the semiconductor laser chip. A test fitting for a semiconductor laser, comprising a light guide for introducing the light into the carrier and then emitting the light to the outside of the subcarrier.