JPH0621261U - Power module - Google Patents

Abstract

(57) [Abstract] [Purpose] Absorbing the thermal expansion of the connection terminal by using the elastic support member to hold the control board,
An object is to provide a power module that prevents solder cracks. [Structure] A control unit substrate 16 is arranged on the power unit substrate 10, and a case 18 is fixed to the power unit substrate with screws or the like so as to enclose the control unit substrate between the power unit substrate and the case. It is elastically supported by the supporting members 13 and 15 which are elastic by providing the notches. One end of the connection terminal 12 is connected to the power unit substrate by soldering, and the other end is connected to the control unit substrate by soldering.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a power module, and relates to holding a control unit substrate.

[0002]

[Prior art]

 Conventionally, a power module such as an inverter is equipped with a giant transistor and a rectifying diode for AC-DC conversion for controlling three-phase AC waveforms and peripheral devices, and is controlled by a microcomputer. FIG. 2 is a cross-sectional view of a conventional power module, in which a power element whose outside is fixed with a coating resin 2 is incorporated on the upper surface of the power unit substrate 1. On the upper part of the power part substrate 1, a control part substrate 7 having an electronic component such as a semiconductor element 8 mounted on the upper surface is arranged and held by a supporting member 3. The supporting member 3 is made of a plate-shaped metal, one end of which is soldered to the power unit substrate 1 and the other end of which is a clip terminal 5, which is soldered 6 to the terminal of the control unit substrate 7 to electrically connect both substrates. Connected to each other. The metal case 9 is fixed to the power unit substrate 1 with screws or the like so as to include these members. In this structure, the power section substrate 1 and the control section substrate 7 generate heat, so that the temperature inside the power module rises, the supporting member 3 expands, and cracks are generated at the solder portions. Therefore, the support member 3 that holds the control unit substrate 7 is made in consideration of expansion and contraction. Therefore, the method of holding the control unit substrate 7 and the connection between the control unit substrate 7 and the power unit substrate 1 become complicated, and the assembly work is difficult to perform and the workability is poor.

[0003]

[Problems to be solved by the device]

 The present invention has been made in view of the above-mentioned problems of the conventional technology, and absorbs thermal expansion of the connection terminal by using a supporting member having elasticity to hold the control board, thereby preventing solder cracks. It aims at providing the power module which prevents.

[0004]

[Means for Solving the Problems]

 In order to solve the above-mentioned problems, in the present invention, the control unit substrate is arranged on the power unit substrate, and one end of the connection terminal is soldered to the power unit substrate and the other end is soldered to the control unit substrate. Are electrically connected to each other, the case is fixed to the power part substrate in a form of including them, and the control part substrate is elastically supported by a supporting member provided between the power part substrate and the case. I did it.

[0005]

[Action]

 According to the above configuration, the controller board is elastically supported by the support member that is made elastic by providing the notch between the power board and the case, so that the connection terminal is not affected by the ambient heat. Even if it is heated and expanded / contracted, it is efficiently absorbed by the support member, and solder cracks can be prevented.

[0006]

【Example】

 Embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a side sectional view showing an embodiment of the power module of the present invention. In the figure, reference numeral 10 denotes a power unit substrate. A power element is incorporated on the upper surface of the substrate 10 and is hardened with an inner coat resin 11. Reference numeral 16 is a control unit substrate, on the upper surface of the base plate 16 electronic components such as a semiconductor element 17 are mounted, and is arranged on the power unit substrate 1. Reference numeral 12 is a connection terminal, one end of which is soldered 14 to the power unit substrate 1 and the other end of which is soldered 14 to the control unit substrate 16 so that both substrates are electrically connected. A case 18 is fixed to the power unit substrate 1 with screws or the like so as to include the above-mentioned members. Reference numeral 13 is a first support member, one end of which is fixed to the power unit substrate 10 and the other end of which is pressed against the control unit substrate. Reference numeral 15 denotes a second support member, one end of which is fixed to the case 18 and the other end of which is pressed against the control unit substrate 16. The first support member 13 and the second support member 15 are made to have elasticity in the vertical direction by alternately making cuts. The second support member 15 and the case 18 can be integrally formed using resin. When heat is generated in the case and the connection terminal 12 expands and contracts during operation of the power module, the first support member 13 and the second support member 15 have an elastic structure, so the expansion and contraction are absorbed and heat stress is reduced. This prevents the occurrence of cracks in the solder part 14 due to

[0007]

[Effect of device]

 As described above, in the present invention, the control board is held between the power board and the case from above and below by the supporting member, so that the thermal stress can be absorbed and the cracking of the solder part can be prevented. . In addition, since the assembly structure can be simplified, the effect of reducing the assembly cost is great.

[Brief description of drawings]

FIG. 1 is a side sectional view showing an embodiment of a power module of the present invention.

FIG. 2 is a side sectional view of a conventional power module.

[Explanation of symbols]

 1 Power Board 2 Internal Coat Resin 3 Supporting Member 4 Soldering 5 Clip Terminal 6 Soldering 7 Control Board 8 Semiconductor Element 9 Metal Case 10 Power Board 11 Internal Coat Resin 12 Connection Terminal 13 First Supporting Member 14 Soldering 15 Second support member 16 Controller board 17 Semiconductor element 18 Case

Claims (1)

[Scope of utility model registration request] 1. A control section substrate is disposed on a power section board, and one end of a connection terminal is soldered to the power section board and the other end is soldered to the control section board to electrically connect both boards. The case is fixed to the power unit board so as to include them, and the control unit board is elastically supported by a supporting member provided between the power unit board and the case. And power module.