JPH0621252Y2 - Semiconductor element mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a mounting device for semiconductor elements such as power transistors and triacs that generate heat when energized, and particularly when mounting a plurality of semiconductor elements on a chassis or the like. The present invention relates to a mounting device for a semiconductor element, which is effective when implemented in.

[Prior Art] As is well known, semiconductor elements, particularly power transistors and triacs, generate heat when energized, which raises the temperature in the device and adversely affects other semiconductor elements and electrical parts attached thereto. Particularly when a plurality of semiconductor elements are mounted close to each other, the mounting and heat dissipation measures are troublesome, and various mounting / heat dissipation means for this purpose have been proposed. As an example, there is a device disclosed in Japanese Utility Model Publication No. 63-25744.

This invention discloses a heat-dissipating member having a cross-section of a letter shape or a square shape in which a plurality of through holes are provided at opposite positions on both side walls, and a heat conduction member having a cylindrical protrusion corresponding to each of the through holes. An insulating plate made of a good material, and the cylindrical protrusions of the insulating plate are respectively fitted into the through holes of the heat dissipation member and the mounting piece of the semiconductor element is abutted thereon, and the mounting piece of the mounting piece is inserted through the bush. The bolt is inserted into and fixed to the hole and the cylindrical projection of the insulating plate.

[Problems to be Solved by the Invention] The semiconductor element mounting device configured as described above has features such as high heat dissipation effect and high dielectric strength, but since the structure is complicated, the number of parts is large, and assembly is troublesome. It was a cause of cost increase.

The present invention has been made to solve the above problems, and an object thereof is to obtain a mounting device for a semiconductor element, which has a simple structure, is easy to assemble, and has an excellent heat dissipation effect.

[Means for Solving the Problems] A device for mounting a semiconductor device according to the present invention has at least one locking hole having a shelf plate extending inward from a lower edge, and a terminal of the semiconductor device is fixed. A chassis made of a material having good heat conduction, which is fixed to the printed wiring board and is in contact with the back surface of the semiconductor element via an insulating plate, a flat portion, and an inner edge portion of the flat portion, which is orthogonal to the flat portion. A plurality of abutting pieces that are erected upright, and a member that extends inward from the inner edge of the flat portion, is folded back, and has a locking protrusion on its upper surface, and is inserted into the locking hole of the chassis. The stop piece and a plurality of fixing pieces extending from the outer edge of the flat portion in the opposite direction to the abutting piece and bent to be inclined inward are formed of a fixing member formed of a spring material. It is a thing.

[Operation] When the locking piece of the fixing metal fitting is inserted into the locking hole of the chassis and pushed in, the contacting piece abuts the surface of the chassis, and the locking protrusions of the locking piece engage the upper edges of the locking hole. Lock on. As a result, an inward force is generated at the tip of the fixing piece to press and fix the semiconductor element in contact with the chassis.

[Embodiment of the Invention] FIG. 1 is an exploded perspective view of an embodiment of the present invention. In the figure, 1 is a printed wiring board provided with a required wiring pattern, 2 is a chassis made of a material having good heat conduction such as aluminum, and mounting legs 3 and 3a to the printed wiring board 1 are provided in the lower portion. Has been. Numerals 4 and 4a are engagement holes formed by a press or the like, and the punched pieces are bent substantially horizontally from the lower edge to the inside to form shelf plates 5 and 5a.

Reference numeral 10 is a fixing member made of a spring plate, and a flat portion 11 is formed in a substantially central portion in the vertical direction, and an inner edge portion in the width direction is bent upward at a predetermined interval at a substantially right angle, Abutting pieces 12, 12a, 12b are formed. 13, 13a is the contact piece 12
Locking pieces provided between 12a, 12a and 12b, extending substantially horizontally inward from the flat portion 11 and then bent obliquely upward to form an inclined portion, and then the contact pieces 12 to 12a. It is folded back from the inside slightly parallel to the flat portion 11. 14,1
Reference numeral 4a is a locking protrusion provided on the inclined portion. The locking pieces 13 and 13a correspond to the engaging holes 4 and 4a formed in the chassis 2 and are formed to have a width that can be fitted into the engaging holes 4 and 4a. Reference numerals 15 to 15d denote fixing pieces that hang down from the outer edge of the flat portion 11 in the direction opposite to the contact pieces 12 to 12b and diagonally inward, and correspond to the semiconductor elements 20 to 20d arranged on the chassis 1 described later, respectively. is doing.

20 to 20d are brought into contact with the chassis 2 through an insulating plate 22 such as a car plate, and their terminals 21 are connected to the printed wiring board 1.
Is a semiconductor element connected to.

Next, the operation of the present invention will be described with reference to FIG. First, the mounting legs 3 and 3a of the chassis 2 are brought into contact with the printed wiring board 1 and fixed with screws 23 and 23a. Next, the insulating plate 22 is brought into contact with or affixed to the chassis 2, the semiconductor elements 20 to 20d are placed in contact therewith, and the terminals 21 are connected to the printed wiring board 1 respectively.
Solder to. In this state, the locking pieces 13,1 of the fixing bracket 10
Insert the 3a along the shelves 5 and 5a into the locking holes 4 and 4a of the chassis 2, and press the finger against the edge of the flat part 11 to push it in.
10 is mounted on the chassis 2.

At this time, the contact pieces 12 to 12b contact the surface of the chassis 2,
The locking pieces 13 and 13a elastically spring upward due to their elasticity, and the locking projections 14 and 14a provided on the locking pieces 13 and 13a lock inside the upper edges of the locking holes 4 and 4a. Exerts an inward force, and its tip strongly presses each of the semiconductor elements 20 to 20d to fix it in that position.

In this way, the semiconductor elements 20 to 20d whose terminals 21 are fixed to the printed wiring board 1 are firmly fixed to the chassis 2 by the fixing brackets 10 with one touch, and the heat generated by energization is
Heat is dissipated from the chassis 2 and the fixing bracket 10.

In the above embodiment, the case where the chassis 2 is provided with the two locking holes 4 and 4a is shown, but the number of the locking holes 4 and 4a may be one depending on the number of the semiconductor elements 20 to 20d to be mounted. Or 3
You may provide more than one. Similarly, the numbers of the contact pieces 12 to 12b, the locking pieces 13 and 13a, and the fixing pieces 15 to 15d of the fixing metal fitting 10b can be appropriately increased or decreased.

[Effects of the Invention] As is apparent from the above description, according to the present invention, the following effects can be achieved.

(1) Since the semiconductor element is fixed by the chassis with the locking holes and the fixing metal fittings, the number of parts is significantly reduced compared to the conventional one, and moreover, it can be fixed with one touch, so the number of assembly steps can be reduced. Therefore, the cost can be reduced.

(2) Further, even if the semiconductor elements have different thicknesses, the fixing piece is provided for each semiconductor element, so that they can be easily fixed.

(3) Since the chassis with which the semiconductor element abuts is made of a material having good heat conduction, and the fixing metal fitting for fixing the semiconductor element is made of a spring material, the heat radiation effect can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 (a) is a front view showing a mounting state of a semiconductor device according to the present invention, and FIG.
FIG. 1: Printed wiring board, 2: Chassis, 4, 4a: Locking hole, 5, 5a: Shelf board, 10: Fixing metal fitting, 11: Flat part, 12 to 12
b: abutment piece, 13, 13a: locking piece, 14, 14a: locking protrusion, 15 to 1
5d: fixed piece, 20 to 20d: semiconductor element, 21: terminal, 22: insulating plate.

Claims (1)

[Scope of utility model registration request] 1. A printed wiring board having at least one locking hole having a shelf plate extending inwardly from a lower edge thereof, the terminals of a semiconductor element being fixed to the printed wiring board, and an insulating plate interposed therebetween. A chassis made of a material having good thermal conductivity, which is in contact with the back surface of the semiconductor element, a flat portion, a plurality of contact pieces standing upright from an inner edge portion of the flat portion, and the flat portion. A locking piece that extends inward from the inner edge of the flat part, is folded back, and has a locking projection on its upper surface and is inserted into the locking hole of the chassis; A mounting device for a semiconductor element, comprising: a plurality of fixing pieces that extend in the opposite direction and are inclined and bent inward, and a fixing metal member formed of a spring material.