JPH06209037A - Ingot carrying device - Google Patents

Abstract

PURPOSE:To provide an ingot carrying device which can easily fix an ingot to the work dividing mechanism of a slicing machine. CONSTITUTION:A loader section 36 is mounted on guide rails so that the section 36 can move forward and backward on the rails. The section 36 is driven and controlled from an operating section and a chuck member is installed to the section 36. At the time of carrying an ingot 50, the ingot 50 is positioned to the delivering location of the ingot 50 by moving the section 36 on the guide rails. Then the ingot 50 carried to the delivering location on a carrying truck 52 is held by means of the engaging groove of an ingot chuck section. Thereafter, the ingot 50 is moved to the position of a work dividing mechanism by driving the section 36 and fixed to the work dividing mechanism after removing the ingot 50 from the chuck section.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ingot transfer device, and more particularly to an ingot transfer device for transferring a cylindrical silicon ingot to a slicing machine.

[0002]

2. Description of the Related Art A semiconductor wafer material ingot is manually lifted and fixed to an ingot holding portion of a slicing machine.

[0003]

However, since the semiconductor wafer tends to have a large diameter, the ingot also has a large weight, and the work of lifting such a heavy ingot and fixing it to the ingot holding part of the slicing machine is It has the drawback that it requires a lot of manpower and is time-consuming, and that installation work is dangerous.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an ingot transfer device which can easily fix an ingot to a slicing machine.

[0005]

In order to achieve the above-mentioned object, the present invention advances and retreats with respect to a post arranged in the vicinity of a slicing machine, a vertical direction of the post, and an ingot support portion of the slicing machine. A chuck member having an engaging portion capable of fitting with the upper engaging portion of the ingot, and an ingot supplying device for supplying a plurality of ingots to the vicinity of the post. The engaging portion is fitted to the upper engaging portion of the ingot supplied by the ingot supplying device to lift the ingot, and the ingot is suspended to move to the ingot supporting portion of the slicing machine to be the ingot supporting portion. It is characterized by delivering.

[0006]

According to the present invention, first, a plurality of ingots are moved to the vicinity of the post by the ingot feeder. next,
The chuck member is moved to the vicinity of the ingot feeder and lowered, and the engaging portion of the chuck member is fitted with the upper engaging portion of the ingot on the ingot feeder. Then, the chuck member lifts the ingot, and the ingot is conveyed to the ingot support portion of the slicing machine in a suspended state. Then, the chuck member is lowered and the ingot is transferred to the ingot support portion.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of an ingot carrying device according to the present invention will be described in detail below with reference to the accompanying drawings. Figure 1
FIG. 3 is a perspective view showing an embodiment in which the ingot transfer device 10 according to the present invention is applied to a wafer manufacturing system.

The ingot transfer device 10 is shown in FIGS.
As shown in FIG. 2, the post 12 and 14 are provided in a pair, and the posts 12 and 14 are installed close to the slicing machine 16 so as to sandwich the front part of the slicing machine 16. A support beam 18 is bridged and fixed to an upper portion of the pair of posts 12 and 14, and a guide rail 20 is fixed to the support beam 18 in a direction orthogonal to the support beam 18. The guide rail 20 is arranged so as to extend from above the ingot transport carriage 22 shown in FIG. 2, that is, from the delivery position of the ingot 24 to above the work indexing mechanism 26 of the slicing machine 16. The ingot transport carriage 22 and the slicing machine 16 will be described later. The support beam 18 and the guide rail 20 are
Covers 28 and 30 are covered, respectively.

The guide rail 20 includes a loader section 32.
Is along the guide rail 20 in the direction of the arrow in the figure (X-axis direction)
It is reciprocally movable. The loader unit 32 is drive-controlled by the operation unit 34 attached to the post 14. As shown in FIG. 3, the loader unit 32 includes a loader body 36 movably provided on the guide rail 20, a hydraulic cylinder 40 fixed to the loader body 36 with a cylinder rod 38 directed downward. Composed of. A chuck member 42 is fixed to the lower end of the cylinder rod 38, and an engaging portion 48 fixed to the upper end of the work block 46 is detachably engaged with an engaging groove 44 of the chuck member 42. Then, the ingot 24 is held.

As shown in FIG. 2, the ingot 24 is transported from the ingot storage location to the vicinity of the posts 12 and 14 (delivery position) of the ingot transport device 10 by the ingot transport vehicle 22 described above. This carrier truck 22
An elevating rod 50 is fixed in the vertical direction, and a substantially S-shaped hook portion 52 is fixed to the upper end of the elevating rod 50. The ingot 24 has the hook portion 52.
The work block 46 is fitted into the pair of hooking grooves 54, 54 formed on the carriage 22 and is held by the carriage 22 and is raised to the position of the loader section 32 by raising the elevating rod 50. It is held by the chuck member 42 of the portion 32.

The slicing machine 16 is a known slicing machine. This slicing machine 16
As shown in FIG. 1, the work indexing mechanism 26 described above is mounted on the work feeding mechanism 56 that is moved in the X direction. The ingot 24 transferred by the ingot transfer device 10 is fixed to the work indexing mechanism 26 and indexed in the cutting direction (Z-axis direction). An inner peripheral blade (not shown) is provided below the work feeding mechanism 56, and the ingot 24 fixed to the work indexing mechanism 26 is cut into wafers by the inner peripheral blade. The inner peripheral blade is formed by electrodepositing diamond abrasive grains on the inner peripheral edge of a doughnut-shaped blade. Further, the inner peripheral blade is rotated at a high speed by a rotating mechanism (not shown) while the outer peripheral edge of the blade is pulled up by a chuck body provided in the slicing machine 16.

Next, the operation of the ingot transfer device 10 constructed as described above will be described. First, the ingot 24 is held by the hook portion 52 of the transport carriage 22 shown in FIG. 2, and the ingot 24 is transported to the delivery position of the ingot transport device 10. Then, the lift rod 50 of the transport carriage 22 raises the ingot 24 and extends the cylinder rod 38 on the ingot transport device 10 side. Then, the carrier truck 22 is rotated to move the chuck member 4
The engaging portion 48 of the work block 46 is fitted into the second engaging groove 44, and the ingot 24 is held by the ingot transfer device 10. Then, the cylinder rod 38 is contracted to raise the ingot 24 so that the ingot 24 does not collide with the slicing machine 16 during conveyance.

Next, the slicing machine 1 is driven by controlling the loader section 32 of the ingot transfer apparatus 10 by the operation section 34.
6, the loader unit 32 is stopped when the ingot 24 is positioned below the work indexing mechanism 26 of the slicing machine 16. Then, the cylinder rod 38 on the ingot transfer device 10 side is extended to lower the ingot 24 to the vicinity of the work indexing mechanism 26,
The ingot 24 is fixed to the work indexing mechanism 26 as shown in FIG. This fixing method is performed by the holes 46A and 4A formed at the corners of the work block 46 shown in FIG.
Insert bolts (not shown) into 6A ...

Thus, in this embodiment, the loader unit 32
Since the ingot 24 is conveyed from the delivery position of the ingot 24 to the position of the work indexing mechanism 26 of the slicing machine 16 and is fixed to the work indexing mechanism 26, the conventional method of attaching and fixing the ingot is In comparison, the ingot 24
Can be easily fixed to the slicing machine 16.

[0015]

As described above, according to the ingot conveying device of the present invention, the ingot feeding device moves the ingot to the vicinity of the post, and the chuck member is moved to the vicinity of the ingot feeding device and lowered. The upper engaging part of the ingot on the ingot feeder is fitted to the engaging part of the chuck member, the ingot is lifted by the chuck member and the ingot is suspended and conveyed to the ingot support part of the slicing machine, and then the chuck member is lowered. Since the ingot is transferred to the ingot support portion by this, the ingot can be easily fixed to the slicing machine as compared with the conventional ingot attachment method of lifting and fixing the ingot to the ingot holding portion.

[Brief description of drawings]

FIG. 1 is an overall perspective view showing an embodiment in which an ingot transfer device according to the present invention is applied to a wafer manufacturing system.

FIG. 2 is a perspective view showing an embodiment of an ingot transfer device.

FIG. 3 is a front view showing a state in which the ingot is fixed to the ingot transfer device.

[Explanation of symbols]

 10 ... Ingot transfer device 12, 14 ... Post 16 ... Slicing machine 20 ... Guide rail 22 ... Transfer car 24 ... Ingot 32 ... Loader section 42 ... Chuck member 44 ... Engagement groove

Claims (1)

[Claims] 1. A post disposed in the vicinity of a slicing machine, and a post provided on the post so as to be movable in a vertical direction and in an advancing / retracting direction with respect to an ingot support portion of the slicing machine, and fitted to an upper engaging portion of the ingot. A chuck member having a matable engaging portion, and an ingot supplying device for supplying a plurality of ingots to the vicinity of the post, wherein the engaging portion of the chuck member is the ingot of the ingot supplied by the ingot supplying device. An ingot transporting device, characterized in that the ingot is fitted to an upper engaging portion to lift an ingot, the ingot is moved to an ingot supporting portion of a slicing machine in a suspended state, and the ingot is transferred to the ingot supporting portion.