JPH06208902A - Electronic component - Google Patents

Abstract

PURPOSE:To enable mounting of components onto a printed board even when the total mounting area of components exceeds the mounting capacity of the printed board by integrating the electronic components, e.g. resistors, with an insulating film. CONSTITUTION:After lead pins 1a, 1b are connected with a thin stripe resistor 1 at the opposite ends thereof, thin synthetic resin films 2a, 2b, e.g. PVC films, are applied to the top and bottom faces of the resistor 1. It is then thermally fused thus integrating the resistor with the insulating films. Consequently, the thickness of electronic component can be reduced and when the electronic component is mounted on a printed board, mounting area for the electronic component can be reduced. Furthermore, it can be folded compactly and thereby packaging paper or securing tape can be saved at the time of transportation.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounted on a high-density mounted printed circuit board which is increasing more and more in recent years, and more particularly to an electronic component having a small component mounting area on the printed circuit board.

[0002]

2. Description of the Related Art As an example of a conventional resistor mounted on a high-density printed circuit board, there is a resistor 5 as shown in FIGS. 7 (a) and 7 (b). In FIG. 7, 1 is a resistor, 4 is an insulating coating material for covering the resistor 1, and 1A and 1B are lead pins connected to the resistor 1. Front view Figure 7
As shown in (a), the resistor 1 is a resistor having an error of several% with respect to a predetermined resistance value, and conductor lead pins 1A and 1B are connected to both ends thereof. Further, the resistor 1A is surrounded and protected by an insulating paint having an insulating property. The resistor 1 of the resistor 5 has a cylindrical shape as shown in a front view 7 (a) and a left side view 7 (b) of the lead pin 1A from the center of the circular end surface of the cylinder. , 1B has been pulled out.

FIG. 8 is a sectional view of a printed circuit board when the resistor 5 is mounted on the printed circuit board. In FIG. 8, 7 is an integrated circuit IC, and 7A and 7B are lead pins arranged in parallel on both side surfaces of the IC 7. When this conventional resistor 5 is mounted on a printed circuit board, the structure shown in FIG.
As shown in FIG. 5, the lead pins 1A and 1B (bent in an L shape) together with a predetermined lead pin on the lead pin 7B on one side of the IC 7 and another lead pin apart from this lead pin are formed in through holes (not shown) of the printed circuit board 6. It is possible to consider a method of soldering after inserting into.

[0004]

However, according to this, an IC is formed by the size (thickness) of the circular resistor 5.
Since the resistor 5 protrudes from the side of 7, the individual area for each resistor is assigned on the printed circuit board, and mounting holes dedicated to the resistor are opened in the specific area on the printed circuit board for mounting. Had to do. Therefore, if the mounting area of all components including resistors exceeds the mounting capacity of the printed circuit board, it is unavoidable to change the function of the printed circuit board.
There were problems such as reductions and changes in specifications.

The present invention has been made to solve the above problems, and even when the mounting area of all the components exceeds the mounting capacity of the printed circuit board and cannot be mounted as described above, the components cannot be mounted. It is an object of the present invention to provide an electronic component that can be mounted on a printed circuit board.

[0006]

As shown in FIG. 1, the electronic component according to the first aspect of the invention has a structure in which an electronic component element such as a resistor 1 is integrated in an insulating film 2. As shown in FIG. 5, the electronic component according to the second aspect of the invention has a structure in which a plurality of electronic component elements such as the resistor 1 are arranged in parallel and integrated in the insulating film 2. As shown in FIG. 6, the electronic component according to the third aspect of the present invention includes an insulating film 2 and a resistor 1
Perforations 22 for each or a plurality of electronic component elements such as
It was configured to include.

[0007]

In the electronic component according to the first aspect of the present invention, the electronic component element such as the resistor 1 is integrated with the insulating film 2 to be thinned. In the electronic component according to the second aspect of the present invention, a plurality of electronic component elements such as the resistor 1 are arranged side by side and integrated in the insulating film 2, and are connected to a plurality of lead pins such as ICs as they are. The electronic component according to the third aspect of the invention is stored by folding the perforations 22 formed on the insulating film 2 as a fulcrum.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 and 2 are cutaway perspective views showing an electronic component according to an embodiment (embodiment 1) of the first invention.
In FIG. 1, 1 is a resistor as an electronic component element, 2 is an insulating film covering the resistor 1, and 1a and 1b are lead pins connected to both ends of the resistor 1. A resistor 3 as an electronic component is constituted by the resistors 1, the film 2 and the like. The lead pins 1a and 1b are connected to both ends of the resistor 1 made of a thin long-sided plate material, and the upper and lower surfaces of the resistor 1 are sandwiched by thin insulating films 2a and 2b made of synthetic resin such as PVC. Then, they are heated and melted to be integrated with each other in the integrated insulating film 2.

Next, a method of mounting the electronic component of the first embodiment on the printed board will be described. 3A and 3B are diagrams showing an example of a mounting state of the electronic component of the first embodiment on a printed circuit board. FIG. 3A is a side view and FIG. 3B is a front view.
In FIG. 3A, 6 is a printed circuit board, 7 is an IC to be mounted on the printed circuit board 6, 71 to 77 are lead pins on one side of the IC 7, 8 is lead pins 71 to 77 and prints on the back side of the printed circuit board 6. It is the solder that connects with the pattern. Now, the first lead pin 71 and the third lead pin 73 of the IC 7 are connected to the resistor 3 as an electronic component.
When the lead pins 71 to 77 of the IC 7 are inserted into the through holes 80 for lead pins of the printed circuit board 6x, the lead pins 1a and 1b are inserted together with the lead pins 71 and 73. Then, in order to connect with the print pattern of the printed board 6, the back side of the board 6 is dipped during solder melting and connected with the solder 8. As shown in FIG. 3B, since the resistor 3 is thin even when mounted on the printed circuit board, it is mounted along the side of the IC 7. Therefore, as shown in FIG. 4, IC7A, IC7
Even when Bs are mounted side by side, a component mounting area is not required as compared with the related art, and therefore, even if heat dissipation of the ICs is taken into consideration, it becomes possible to mount these ICs very close to each other. Moreover, the lead pins 1a and 1b of the resistor 3 are connected to the IC 7
Through hole 8 of printed circuit board 6 along with the corresponding pin
By inserting together with 0 (enlarged M portion), it is not necessary to mount a mounting hole dedicated to this resistor on the printed circuit board 6, so that the component mounting area originally possessed by this resistor itself is required. It is possible to further reduce.
Further, although the axial type resistor is described in the first embodiment, the same applies to the radial type resistor or the capacitor. In addition, since the lead pins that had to be connected with a print pattern in the past could be connected with a resistor, and the length of the print pattern can be shortened, it is possible to realize patternlessness in that part and generate noise. It can be reduced.

FIG. 5 is a view showing an electronic component according to an embodiment (embodiment 2) of the second invention, FIG. 5 (a) is a side view,
(B) is a front view. In FIG. 5, reference numeral 10 denotes a resistor as an electronic component, which has lead resistors 1a to 1g connected to one end of seven vertically arranged resistors 1 and the other end commonly connected by a lead wire 1m. Insulation film 2
It is sandwiched between a and 2b to be integrated. 7 as shown in FIG.
To connect the seven resistors 1 to the lead pins of the IC 7 having the book lead pins 71 to 77, the lead pins 71 to
77 together with lead pins 1a to 1g on the printed circuit board 6
If the resistor 10 itself is thin by inserting it into each of the through holes 80 and soldering, and the through hole dedicated to the resistor 10 is not required, the component mounting area of the resistor can be further reduced. As described above, in the first embodiment, the resistor is composed of one resistor, but in the second embodiment,
The resistor has a plurality of configurations by modularizing the resistor. This makes it possible to easily cope with the case where it is necessary to insert a resistor into the lead pins of a plurality of adjacent ICs or the like.

FIG. 6 is a diagram showing an electronic component according to an embodiment (embodiment 3) of the third invention. In FIG. 6, 2
Reference numeral 0 denotes a resistor as an electronic component, which is a resistor 1 having lead pins 1h and 1i vertically arranged side by side and made into a joule by the same insulating film 2 as described in FIG. Perforations 22 are provided between the resistors 1. The perforations 22 may be provided for each of the plurality of resistors 1. In this way, by perforating the insulating film 2 and connecting it to another resistor, it is possible to reduce the resistor-fixing wrapping paper or the fixing tape which has been conventionally required during transportation. Further, although the resistor of the single resistance body is described in the above-mentioned third embodiment, the same applies to the module type resistor.

[0012]

According to the first aspect of the present invention, since the electronic component elements such as the resistor are integrated in the insulating film, it is possible to make the device thinner, and to print this electronic component when it is mounted on a printed circuit board. This has the effect of reducing the mounting area of electronic components on the substrate. According to the second aspect of the present invention, since a plurality of electronic component elements such as resistors are arranged side by side and integrated in an insulating film, a printed circuit board is used when a plurality of adjacent lead pins such as ICs are connected by electronic components. There is an effect that the component mounting area of the electronic component can be further reduced as compared with the first invention. In the third aspect of the invention, the insulating film is provided with perforations for one or more electronic component elements such as resistors, so that the insulating film can be folded and made compact. In addition to the effects of the invention, there is an effect that the amount of fixing wrapping paper and fixing tape used for transportation can be reduced.

[Brief description of drawings]

FIG. 1 is a cutaway perspective view of an electronic component showing an embodiment of the first invention.

FIG. 2 is a side view and a front view of the electronic component shown in FIG.

FIG. 3 is a side view when an electronic component is mounted on a printed board.

FIG. 4 is a cross-sectional view when an electronic component is mounted on a printed board.

FIG. 5 is a side view and a front view of an electronic component showing an embodiment of the second invention.

FIG. 6 is a side view of an electronic component showing an embodiment of the third invention.

FIG. 7 is a side view and a front view showing an example of a conventional resistor.

FIG. 8 is a side view when the resistor of FIG. 7 is mounted on a printed board.

[Explanation of symbols]

 1 Resistor 1a, 1b Lead pin 2 Insulating film 3,10,20 Resistor 4 Insulating paint 6 Printed circuit board 7 IC

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[Procedure amendment]

[Submission date] June 21, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction content]

Next, a method of mounting the electronic component of the first embodiment on the printed board will be described. 3A and 3B are diagrams showing an example of a mounting state of the electronic component of the first embodiment on a printed circuit board. FIG. 3A is a side view and FIG. 3B is a front view.
In FIG. 3A, 6 is a printed circuit board, 7 is an IC to be mounted on the printed circuit board 6, 71 to 77 are lead pins on one side of the IC 7, 8 is lead pins 71 to 77 and prints on the back side of the printed circuit board 6. It is the solder that connects with the pattern. Now, the first lead pin 71 and the third lead pin 73 of the IC 7 are connected to the resistor 3 as an electronic component.
, The lead pins 71 to 77 of the IC 7 are connected to the through holes 8 for the lead pins of the printed circuit board 6 respectively.
When inserting into 0, the lead pins 1a and 1b are inserted together with the lead pins 71 and 73. Then, in order to connect with the print pattern of the printed board 6, the back side of the board 6 is dipped during solder melting and connected with the solder 8. As shown in FIG. 3B, since the resistor 3 is thin even when mounted on the printed circuit board, it is mounted along the side of the IC 7. Therefore, as shown in FIG. 4, IC7A, IC7
Even when Bs are mounted side by side, a component mounting area is not required as compared with the related art, and therefore, even if heat dissipation of the ICs is taken into consideration, it becomes possible to mount these ICs very close to each other. Moreover, the lead pins 1a and 1b of the resistor 3 are connected to the IC 7
Through hole 8 of printed circuit board 6 along with the corresponding pin
By inserting together with 0 (enlarged M portion), it is not necessary to mount a mounting hole dedicated to this resistor on the printed circuit board 6, so that the component mounting area originally possessed by this resistor itself is required. It is possible to further reduce.
Further, although the axial type resistor is described in the first embodiment, the same applies to the radial type resistor or the capacitor. In addition, since the lead pins that had to be connected with a print pattern in the past could be connected with a resistor, and the length of the print pattern can be shortened, it is possible to realize patternlessness in that part and generate noise. It can be reduced.

Claims (3)

[Claims] 1. An electronic component in which an electronic component element such as a resistor is integrated in an insulating film. 2. The electronic component according to claim 1, wherein a plurality of the electronic component elements are arranged in parallel and integrated in the insulating film. 3. An electronic component element is provided on the insulating film.
3. The electronic component according to claim 2, wherein perforations are provided for each piece or for each plurality.