JPH06204200A - 表面から微小粒子を除去する方法 - Google Patents
表面から微小粒子を除去する方法Info
- Publication number
- JPH06204200A JPH06204200A JP5103295A JP10329593A JPH06204200A JP H06204200 A JPH06204200 A JP H06204200A JP 5103295 A JP5103295 A JP 5103295A JP 10329593 A JP10329593 A JP 10329593A JP H06204200 A JPH06204200 A JP H06204200A
- Authority
- JP
- Japan
- Prior art keywords
- particles
- polar solution
- wafer
- water
- polar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US87587192A | 1992-04-29 | 1992-04-29 | |
| US875871 | 1992-04-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06204200A true JPH06204200A (ja) | 1994-07-22 |
Family
ID=25366514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5103295A Pending JPH06204200A (ja) | 1992-04-29 | 1993-04-28 | 表面から微小粒子を除去する方法 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0567939A3 (enFirst) |
| JP (1) | JPH06204200A (enFirst) |
| TW (1) | TW226053B (enFirst) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6037270A (en) * | 1994-06-30 | 2000-03-14 | Kabushiki Kaisha Toshiba | Method of manufacturing semiconductor device and methods of processing, analyzing and manufacturing its substrate |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0502356A3 (en) * | 1991-02-28 | 1993-03-10 | Texas Instruments Incorporated | Photo-stimulated removal of trace metals |
| US5695569A (en) * | 1991-02-28 | 1997-12-09 | Texas Instruments Incorporated | Removal of metal contamination |
| EP0702400A3 (en) * | 1992-05-29 | 1996-05-15 | Texas Instruments Inc | Removal of metal contamination |
| EP1250712A2 (en) * | 2000-01-22 | 2002-10-23 | Ted Albert Loxley | Process and apparatus for cleaning silicon wafers |
| WO2003029830A1 (en) * | 2001-10-03 | 2003-04-10 | Genomic Solutions Acquisitions Limited | Cleaning method |
| JP2005030378A (ja) | 2003-05-30 | 2005-02-03 | Mahindra & Mahindra Ltd | 重力充填式燃料供給ポンプを備えるディーゼルエンジンのセルフエア抜き燃料供給システム |
| US20080202569A1 (en) * | 2004-11-25 | 2008-08-28 | Franklin David Chandra | Cleaning Device |
-
1993
- 1993-04-22 EP EP19930106589 patent/EP0567939A3/en not_active Withdrawn
- 1993-04-28 JP JP5103295A patent/JPH06204200A/ja active Pending
- 1993-08-27 TW TW082106946A patent/TW226053B/zh active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6037270A (en) * | 1994-06-30 | 2000-03-14 | Kabushiki Kaisha Toshiba | Method of manufacturing semiconductor device and methods of processing, analyzing and manufacturing its substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| TW226053B (enFirst) | 1994-07-01 |
| EP0567939A2 (en) | 1993-11-03 |
| EP0567939A3 (en) | 1993-12-15 |
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