JPH06204200A - 表面から微小粒子を除去する方法 - Google Patents

表面から微小粒子を除去する方法

Info

Publication number
JPH06204200A
JPH06204200A JP5103295A JP10329593A JPH06204200A JP H06204200 A JPH06204200 A JP H06204200A JP 5103295 A JP5103295 A JP 5103295A JP 10329593 A JP10329593 A JP 10329593A JP H06204200 A JPH06204200 A JP H06204200A
Authority
JP
Japan
Prior art keywords
particles
polar solution
wafer
water
polar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5103295A
Other languages
English (en)
Japanese (ja)
Inventor
Monte A Douglas
エイ.ダグラス モンテ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of JPH06204200A publication Critical patent/JPH06204200A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00Cleaning of wafers, substrates or parts of devices
    • H10P70/10Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
JP5103295A 1992-04-29 1993-04-28 表面から微小粒子を除去する方法 Pending JPH06204200A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US87587192A 1992-04-29 1992-04-29
US875871 1992-04-29

Publications (1)

Publication Number Publication Date
JPH06204200A true JPH06204200A (ja) 1994-07-22

Family

ID=25366514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5103295A Pending JPH06204200A (ja) 1992-04-29 1993-04-28 表面から微小粒子を除去する方法

Country Status (3)

Country Link
EP (1) EP0567939A3 (enFirst)
JP (1) JPH06204200A (enFirst)
TW (1) TW226053B (enFirst)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037270A (en) * 1994-06-30 2000-03-14 Kabushiki Kaisha Toshiba Method of manufacturing semiconductor device and methods of processing, analyzing and manufacturing its substrate

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0502356A3 (en) * 1991-02-28 1993-03-10 Texas Instruments Incorporated Photo-stimulated removal of trace metals
US5695569A (en) * 1991-02-28 1997-12-09 Texas Instruments Incorporated Removal of metal contamination
EP0702400A3 (en) * 1992-05-29 1996-05-15 Texas Instruments Inc Removal of metal contamination
EP1250712A2 (en) * 2000-01-22 2002-10-23 Ted Albert Loxley Process and apparatus for cleaning silicon wafers
WO2003029830A1 (en) * 2001-10-03 2003-04-10 Genomic Solutions Acquisitions Limited Cleaning method
JP2005030378A (ja) 2003-05-30 2005-02-03 Mahindra & Mahindra Ltd 重力充填式燃料供給ポンプを備えるディーゼルエンジンのセルフエア抜き燃料供給システム
US20080202569A1 (en) * 2004-11-25 2008-08-28 Franklin David Chandra Cleaning Device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037270A (en) * 1994-06-30 2000-03-14 Kabushiki Kaisha Toshiba Method of manufacturing semiconductor device and methods of processing, analyzing and manufacturing its substrate

Also Published As

Publication number Publication date
TW226053B (enFirst) 1994-07-01
EP0567939A2 (en) 1993-11-03
EP0567939A3 (en) 1993-12-15

Similar Documents

Publication Publication Date Title
JP7094336B2 (ja) フィールドガイドによる埋設式露光、及び露光後ベークプロセス
KR101204175B1 (ko) 구성부품의 세정 방법 및 기억 매체
US7528386B2 (en) Submicron particle removal
US5229171A (en) Apparatus and method for uniformly coating a substrate in an evacuable chamber
KR20010032190A (ko) 박막의 안개화퇴적방법 및 그 장치
JPWO2002052627A1 (ja) パターン形成方法および装置並びに半導体デバイス、電気回路、表示体モジュール並びに発光素子
JP2002289585A (ja) 中性粒子ビーム処理装置
JPH06204200A (ja) 表面から微小粒子を除去する方法
WO1997034450A1 (en) Particulate contamination removal from wafers using plasmas and mechanical agitation
KR100330676B1 (ko) 마이크로파여기세정및린싱장치
JP2001137800A (ja) 基板処理装置及び処理方法
WO2002061811A2 (en) Laser cleaning process for semiconductor material
KR20190035708A (ko) 반도체 제조 장치
US20010001392A1 (en) Substrate treating method and apparatus
JP2001015581A (ja) 半導体装置の製造方法及び半導体製造装置
JP2000012500A (ja) 基板処理方法及びその装置
US7749327B2 (en) Methods for treating surfaces
US6110394A (en) Dry dispense of particles to form a fabrication mask
US20020150839A1 (en) Apparatus for automatically cleaning mask
JP2850887B2 (ja) ウエーハの洗浄方法及びその装置
US20200152430A1 (en) Device and method for plasma treatment of electronic materials
US6495215B1 (en) Method and apparatus for processing substrate
JPS6442134A (en) Apparatus for cleaning semiconductor wafer
JP3195508B2 (ja) レーザ処理装置及びレーザ処理方法
JPH05279844A (ja) レーザーアブレーション装置