JPH06201770A - Measuring probe board for semiconductor device - Google Patents

Abstract

PURPOSE:To provide the measuring probe board of a semiconductor device easy to maintain and capable of coping with the fine-pitch semiconductor device. CONSTITUTION:A block piece 3 having the mount section of a semiconductor device 10 is fitted to nearly the center section of a substrate 2, and multiple probe pins 4 are provided to penetrate the block piece 3. Contact ends 4a at one end of the probe pins 4 are protruded from the upper face of the block piece 3 and arranged in response to outer leads 11 of the semiconductor device 10, insertion ends 4b at the other end are inserted into the substrate 2 and connected to wiring patterns 21. The block piece 3 is removably fitted to the substrate 2 together with the probe pins 4, and the guide section 5 of the semiconductor device 10 is provided on the block piece 3 to form a measuring probe board 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to measuring the electrical characteristics of a semiconductor device derived from a plurality of outer leads.
The present invention relates to a probe board for measurement of a semiconductor device in which electrical continuity between each outer lead and an external electric circuit is obtained through a probe pin.

[0002]

2. Description of the Related Art In order to measure the electrical characteristics of a semiconductor device derived from a plurality of outer leads, for example, the semiconductor device is mounted in a measuring socket, and a probe pin is attached to the outer lead of the semiconductor device. There are things that are performed by contact. In the former, the lead gauge provided on the measurement socket and the outer lead of the semiconductor device are brought into contact with each other,
This measurement socket is attached to a board having a predetermined electric circuit.

In the latter case, the measuring probe board 1 as shown in the schematic sectional view of FIG. 8 is used. The measurement probe board 1 is composed of a substrate 2 on which a predetermined wiring pattern 21 is formed, and probe pins 4 attached to the substrate 2 so as to correspond to the outer leads 11 of the semiconductor device 10. The device 10 is mounted on the measurement probe board 1 and each outer lead 1
1 and the contact end 4b of each probe pin 4 are brought into contact with each other.

Alternatively, the measuring probe board 1 is approached from above the semiconductor device 10 placed at a predetermined position to bring the contact ends 4b of the probe pins 4 into contact with the outer leads 11 of the semiconductor device 10, respectively. . In either case, the outer lead of the semiconductor device 10 and the wiring pattern 21 of the substrate 2 are brought into conduction via the probe pin 4, and a predetermined electric characteristic can be measured by inputting and outputting an electric signal.

[0005]

However, such a probe board for measurement has the following problems. That is, the probe pins of the measurement probe board are directly attached to the surface of the substrate, and are obliquely attached to the substrate in order to reduce the contact pressure between the outer leads of the semiconductor device and the probe pins. For this reason, the probe pin becomes unstable, and it is easy to cause contact with the adjacent probe pin. In particular, when measuring a so-called fine-pitch semiconductor device having a narrow outer lead width or pitch, it is necessary to reduce the interval between adjacent probe pins, which is difficult to handle.

If the contact end of the probe pin is worn due to the contact between the semiconductor device and the probe pin and the probe pin needs to be replaced, the probe pin is directly attached to the substrate, and therefore the entire probe board for measurement is replaced. There is a need. Moreover, it is difficult to align the outer lead and the probe pin, and it is difficult to accurately contact the probe pin and the outer lead, particularly in the measurement of a fine-pitch semiconductor device. Therefore, it is an object of the present invention to provide a probe board for measuring a semiconductor device, which can be easily maintained and can be applied to a fine pitch semiconductor device.

[0007]

SUMMARY OF THE INVENTION The present invention is a probe board for measuring a semiconductor device, which has been made to solve such problems. That is, this measurement probe board is for contacting with a plurality of outer leads led out from the semiconductor device to obtain electrical continuity between the semiconductor device and an external electric circuit. As this measurement probe board, a substrate on which a predetermined wiring pattern was formed, a block piece attached to a substantially central portion of the substrate and having a mounting portion for the semiconductor device, and a state of penetrating the block piece were provided. It is composed of a plurality of probe pins, and one end of the plurality of probe pins is projected from the upper surface of the block piece and arranged at a position corresponding to the arrangement of each outer lead of the semiconductor device, and the other end is inserted into the substrate to form a wiring pattern And conducts.

Also, the block piece can be detachably attached from the substrate together with each probe pin, or
A guide portion for aligning each outer lead and each probe pin of the semiconductor device is also provided.

[0009]

Since the plurality of probe pins are provided so as to penetrate the block piece, the probe pins can be securely held. Therefore, the amount of displacement of the probe pins in the lateral direction can be reduced, and the contact between adjacent probe pins can be reduced. In addition, since the probe pin that penetrates the block piece is attached in the state of being inserted in the substrate,
From here, the block piece and the probe pin can be attached to and detached from the substrate. Moreover, since the semiconductor device can be positioned by the guide portion provided on the block piece, the outer lead and the probe pin can be accurately aligned.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of a probe board for measurement of a semiconductor device of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic cross-sectional view illustrating a measurement probe board of a semiconductor device according to the present invention. The measurement probe board 1 includes a plurality of outer leads 11 led out from the semiconductor device 10,
A substrate 2 on which a predetermined wiring pattern 21 is formed for obtaining electrical continuity with an external electric circuit (not shown).
And the block piece 3 attached to the substantially central portion of the substrate 2.
And a plurality of probe pins 4 penetrating the block piece 3.
It is composed of and.

The plurality of probe pins 4 have contact ends 4a, which are one end thereof, project from the upper surface of the block piece 3 and are arranged corresponding to the arrangement of the outer leads 11 of the semiconductor device 10. The insertion end 4b, which is the other end of the probe pin 4, extends downward from the block piece 3 and is inserted into the substrate 2, and is in electrical connection with the wiring pattern 21 formed on the substrate 2. Further, a bent portion 4c is provided between the contact end 4a of the probe pin 4 and the insertion end 4b, and the contact end 4a is slightly moved up and down by utilizing the elasticity of the bent portion 4c. ing. In this way, since the probe pin 4 penetrates the block piece 3 and is securely fixed to the block piece 3, the contact end 4 a of the probe pin 4 is
It is possible to reduce the amount of misalignment with respect to the lateral direction.

In order to measure the electrical characteristics of the semiconductor device 10 using the measuring probe board 1, first, the semiconductor device 10 is mounted on the measuring probe board 1 or the semiconductor device 10 is measured. The outer lead 1 of the semiconductor device 10 is mounted by mounting the probe board 1 for the semiconductor device.
1 and the probe pin 4 are electrically connected. In FIG. 1, the semiconductor device 10 is mounted on the measurement probe board 1 for the sake of simplicity.

That is, by mounting the semiconductor device 10 on the substantially central portion of the block piece 3, each outer lead 11 of the semiconductor device 10 has a corresponding probe pin 4.
It comes into contact with the contact end 4a. As a result, the outer lead 11 and the wiring pattern 21 of the substrate 2 are electrically connected to each other via the probe pin 4, and the electric circuit for measurement (not shown) connected to the wiring pattern 21 and the semiconductor device 10 are connected. It is possible to input and output the signal of.

Next, attachment / detachment of the block piece 3 will be described with reference to the schematic sectional view of FIG. That is, on the substrate 2,
Holes 22 corresponding to the positions of the plurality of probe pins 4 penetrating the block piece 3 are provided respectively.
The insertion end 4b of each probe pin 4 is attached to the. Therefore, the block pieces 3 can be removed by pulling out the probe pins 4 from the holes 22 as needed.

For example, as shown in FIG. 1, when the contact end 4a of the probe pin 4 is worn by the contact between the probe pin 4 and the outer lead 11 of the semiconductor device 10, the block piece 3 and the probe pin 4 are replaced by new ones. Can be exchanged. Also, when measuring different types of semiconductor devices 10, it is possible to replace with the block piece 3 having the probe pins 4 corresponding to the number of outer leads 11 of the semiconductor device 10. Note that, for example, an electrode that is electrically connected to the wiring pattern 21 is provided on the inner surface of the hole 22 for inserting the probe pin 4, and by inserting the probe pin 4, the electrode and the probe pin 4 come into contact with each other. , The electrical connection with the wiring pattern 21 is surely obtained.

Next, the case where the guide portion is provided on the block piece 3 of the measurement probe board 1 will be described. FIG. 3 is a schematic cross-sectional view (No. 1) for explaining the guide section, showing the measurement probe board 1 in which the block section 3 is provided with the guide section 5 corresponding to the outer shape of the package 12 of the semiconductor device 10. is there. For example, the guide portion 5 for positioning the four corners of the outer shape of the package 12 is provided on the mounting portion of the semiconductor device 10 of the block piece 3, and if the semiconductor device 10 is mounted along the guide portion 5, Each outer lead 11 is accurately aligned with the contact portion 4a of the corresponding probe pin 4.

Next, the schematic sectional view shown in FIG. 4 illustrates the guide portion 5 for positioning the lead frame 6. That is, in a state before the semiconductor device 10 is separated from the lead frame 6, the cutting of each outer lead 11 and the bending process are completed.
When measuring. The block piece 3 is provided with, for example, a pin-shaped guide portion 5, and the guide portion 5
Sprocket hole 6 used to convey the lead frame 6
It can be fitted to a.

That is, when the sprocket hole 6a of the lead frame 6 is fitted into the guide portion 5 provided on the block piece 3, the semiconductor device 10 still attached to the lead frame 6 is located at the substantially central portion of the block piece 3. As a result, the outer lead 11 and the contact end 4a of the probe pin 4 are accurately aligned. Since a plurality of semiconductor devices 10 are usually formed on the lead frame 6,
By shifting the position of the sprocket hole 6a fitted into the guide portion 5, it is possible to obtain conduction between the outer lead 11 of another semiconductor device 10 and the probe pin 4.

Next, the guide portion when the semiconductor device 10 is housed in the socket will be described with reference to FIGS. 5 and 6. That is, since it is difficult to handle the semiconductor device 10 which is small and lightweight, the semiconductor device 10 is stored in the carrier 7 as shown in FIG.

The carrier 7 is provided with a hole larger than the outer shape of the semiconductor device 10 in the substantially central portion thereof. The semiconductor device 10 is arranged in this hole and the package 12 of the semiconductor device 10 is fixed by the fastener 7a. Hold it while holding it down. FIG. 6 is a schematic sectional view illustrating the guide portion 5 for positioning the carrier 7 as described above. That is,
The block piece 3 of the measurement probe board 1 is provided with a guide portion 5 corresponding to the outer shape of the carrier 7. If the carrier 7 is positioned along the guide portion 5, the outer portion of the semiconductor device 10 housed therein is stored. The lead 11 and the contact end 4a of the probe pin 4 are accurately aligned.

As described above, by providing the block portion 3 of the measurement probe board 1 with the guide portion 5 adapted to various modes of the semiconductor device 10, the contact end between the outer lead 11 of the semiconductor device 10 and the probe pin 4 is provided. 4a can be surely contacted, and measurement errors due to poor contact do not occur. The shape of the guide portion 5 is not limited to the above description and may be any shape as long as the semiconductor device 10 can be positioned at a predetermined position on the block piece 3.

Next, an application example of the measurement probe board 1 of the present invention will be described. FIG. 7 is a schematic sectional view showing an example in which the measuring probe board 1 of the present invention is applied to the constant temperature bath 8. The block piece 3 of the measuring probe board 1 of the present invention is attached to the thermostat 8 from the outside to the inside thereof, and the outer lead 11 of the semiconductor device 10 and the probe pin 4 are contacted in the thermostat 8. The end 4a can be contacted.

The probe pin 4 is provided in a state of penetrating the block piece 4, and its contact end 4a is the block piece 4.
Since it protrudes from the upper surface of the substrate 2, it comes into contact with the semiconductor device 10 at a position separated from the substrate 2 by a predetermined height. Therefore, only the block piece 3 of the measurement probe board 1 needs to be attached to the constant temperature bath 8.
Since the hole to be made in the hole can be made smaller, the escape of heat can be reduced. Further, since the constant temperature bath 8 and the substrate 2 can be separated from each other, heat is less likely to be transferred from the constant temperature bath 8 to the substrate 2, and the adverse effect on the substrate 2 can be reduced.

The semiconductor device 1 is manufactured by using such a constant temperature bath 8.
In order to measure the electrical characteristics of 0, for example, the semiconductor device 10 is transported in the constant temperature bath 8 as indicated by the arrow in the figure, and the semiconductor device 10 is placed on the block piece 3. Then, the outer lead 11 of the semiconductor device 10 is brought into contact with the contact end 4 a of the probe pin 4, and the outer lead 11 and the constant temperature bath 8
Is electrically connected to the wiring pattern 21 of the substrate 2 arranged outside. As a result, signals can be input / output between the external electric circuit (not shown) connected to the wiring pattern 21 and the semiconductor device 10 in the constant temperature bath 8. In this state, after measuring a predetermined characteristic, the semiconductor device 10 is separated from the probe pin 4, the next semiconductor device 10 is transported, and the same measurement is performed.

Further, as described above, the block piece 3 is detachably attached to the substrate 2 together with the probe pin 4. Therefore, when another substrate 2 is desired to be used, the block piece 3 is placed in the constant temperature bath 8. Board 2 with it attached to
Only can be exchanged. That is, even if the substrate 2 is replaced, the temperature in the constant temperature bath 8 is not changed, so that the measurement can be started immediately after the replacement of the substrate 2.

[0026]

As described above, the measuring probe board of the semiconductor device of the present invention has the following effects. That is, since the amount of displacement of the contact end of the probe pin with respect to the lateral direction can be reduced, it is possible to reduce the contact with the adjacent probe pin. Further, since the block piece is provided with the guide portion, the outer lead of the semiconductor device and the contact end of the probe pin can be accurately aligned. As a result, it is possible to obtain reliable contact between the outer lead of the semiconductor device and the probe pin, especially when the distance between the adjacent probe pins corresponding to the fine pitch semiconductor device is narrow. Further, since the block piece is detachably attached to the substrate, the replacement work due to wear of the probe pin can be efficiently performed, and the maintainability is improved. Moreover, since several types of block pieces and probe pins can be prepared for one substrate, it is possible to deal with multiple types of semiconductor devices on one substrate, reducing the cost and storage of the measurement probe board. It is possible to raise it.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view illustrating a probe board for measurement of a semiconductor device of the present invention.

FIG. 2 is a schematic cross-sectional view illustrating attachment / detachment of a block piece.

FIG. 3 is a schematic cross-sectional view (No. 1) for explaining a guide portion.

FIG. 4 is a schematic cross-sectional view (No. 2) for explaining the guide portion.

FIG. 5 is a perspective view illustrating a carrier.

FIG. 6 is a schematic cross-sectional view (3) for explaining the guide portion.

FIG. 7 is a schematic cross-sectional view illustrating an application example of the present invention.

FIG. 8 is a schematic sectional view illustrating a conventional example.

[Explanation of symbols]

 1 Measurement Probe Board 2 Substrate 3 Block Piece 4 Probe Pin 4a Contact End 4b Insertion End 4c Bent Part 5 Guide Part 10 Semiconductor Device 11 Outer Lead 21 Wiring Pattern

Claims (3)

[Claims] 1. A probe board for measurement of a semiconductor device, which is in contact with a plurality of outer leads led out from a semiconductor device to obtain electrical continuity between the semiconductor device and an external electric circuit, wherein a predetermined wiring pattern is provided. A substrate formed, a block piece having a mounting portion for the semiconductor device, which is attached to a substantially central portion of the substrate, and a plurality of probe pins provided in a state of penetrating the block piece. One end of the probe pin projects from the upper surface of the block piece and is arranged at a position corresponding to the arrangement of each outer lead of the semiconductor device, and the other end is inserted into the substrate to be in a conductive state with the wiring pattern. A probe board for measuring semiconductor devices, which is characterized in that 2. The probe board for measuring a semiconductor device according to claim 1, wherein the block piece is detachably attached to the substrate together with the probe pins. 3. The semiconductor device according to claim 1, wherein the block piece is provided with a guide portion for aligning each outer lead of the semiconductor device with each probe pin. Measurement probe board.