JPH06198481A - Laser beam machining device - Google Patents

Abstract

PURPOSE:To always keep the distance from a laser beam oscillator to a machining head constant and to enable stable machining of the cutting quality by controlling the laser beam oscillator for transferring the laser beam to the machining head so as to move at the same velocity and the same distance as the machining head. CONSTITUTION:The laser beam oscillated from the laser beam oscillator 7 reaches the machining head 6 through a beam transferring tube 10 and irradiates a work 5 on a needle point holder 4a from a nozzle 6a in the machining head 6 and the machining of the work 5 is started. A control device for controlling the movement of a column 1a in the X axial direction and the movement of the machining head 6 in the Y axial direction calculates the moving distances from the original points of both, and controls the laser beam oscillator 7 so as to move at the same velocity as the machining head 6 so that the beam path length between the laser beam oscillator 7 and the machining head 6 is always made constant. Therefore, without changing the beam diameter of the laser beam entering into the machining head 6, the cutting machining stabilizing the cutting quality can be executed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus for processing a workpiece while maintaining a constant optical path length from a laser oscillator to a processing head.

[0002]

2. Description of the Related Art A conventional laser processing apparatus for processing a work by using a laser beam includes a processing head for irradiating the work with the laser beam, and the laser beam oscillated from a laser oscillator is processed by an optical system. It is designed to be guided to the head. Further, since the processing head moves to process the work, the optical path length from the laser oscillator installed in the apparatus body to the processing head changes as the processing head moves. As a result, the beam diameter of the laser light incident on the processing head changes, so that the condensing characteristic of the condensing lens provided in the processing head changes, which causes a problem that cutting quality changes.

In order to improve such a problem, a laser processing apparatus provided with an optical path length adjusting means for making the optical path length constant even if the processing head moves is disclosed in Japanese Patent Publication No. 1-55076.
No. 3, Japanese Patent Laid-Open No. 3-294079, Japanese Utility Model Publication No. 63-1161
No. 95 publication, No. 52-134198, No.
It is proposed in Japanese Patent No. 15273.

[0004]

However, in the above-mentioned conventional laser processing apparatus, the optical path length adjusting means, which is a combination of two reflecting mirrors, is moved by ½ of the moving distance of the processing head to make the optical path length constant. Since the method such as
Since output loss is large, such as a decrease in output due to the reflection mirror provided on the optical path, it is difficult to always keep the optical path length adjusting means and the moving axis of the processing head parallel to the beam axis. There was a problem that the beam axis wobbled and high quality cutting was not possible. The present invention has been made in order to improve such a conventional problem, and an object thereof is to provide a laser processing apparatus capable of processing with stable cutting quality.

[0005]

In order to achieve the above object, the present invention irradiates a work placed on a work table with a machining head which is movable in the X-axis and the Y-axis direction orthogonal to the work. In the laser processing device that processes with the laser light, the laser oscillator that sends the laser light to the processing head is controlled to move at the same speed and the same distance as the processing head. The optical path length of is always kept constant.

[0006]

[Operation] Even if the processing head moves due to the above configuration,
Since the optical path length from the laser oscillator to the processing head does not change, processing with high cutting quality becomes possible.

[0007]

Embodiment An embodiment of the present invention will be described in detail with reference to the drawings. In FIG. 1, reference numeral 1 is a main body of a laser processing machine, and guide rails 1b are laid on both sides of an upper part in the X-axis direction,
A column 1a that is movable in the X-axis direction by a X-axis motor 2 via a ball screw shaft 3 is supported on these guide rails 1b, and a work piece having a sword mountain 4a that supports the work piece 5 from below is provided under the column 1a. Table 4 is installed. A processing head 6 which is movable in the Y-axis direction perpendicular to the X-axis is provided below the column 1a, and the work 5 on the work table 4 is irradiated by the laser light emitted from the nozzle 6a of the processing head 6. Can be processed.

Reference numeral 7 denotes a laser oscillator, which is mounted on two guide rails 8 laid in the X-axis direction near the main body 1 and is rotated by a servomotor (not shown). The laser beam oscillated by the laser oscillator 7 is movable in the X-axis direction by means of 9 and passes through the inside of an expandable and contractible light guide tube 10 which is provided horizontally between the laser oscillator 7 and the column 1a. It is adapted to be guided to the head 6.

Next, the operation will be described with reference to FIGS. 2A and 2B. The laser light oscillated by the laser oscillator 7 reaches the processing head 6 through the light guide tube 10, and the processing head 6 is processed. Nozzle 6a of No. 6 irradiates the work 5 on the sword mountain 4a to start machining the work 5.
A control device (not shown) that controls the movement in the axial direction and the movement of the processing head 6 in the Y-axis direction calculates the movement distance from the origin of both, and the optical path length between the laser oscillator 7 and the processing head 6 is calculated. The laser oscillator 7 is controlled to move at the same speed as the machining head 6 so that L is always constant. That is, the column 1a is now moved in the X-axis direction by 1000 as shown in FIG.
When the machining head 6 is moved by 500 mm in the Y-axis direction as shown in (b) of FIG. 2, the control device calculates L = 1000 + 500 = 1500 (mm), and the laser oscillator 7 makes X. Axial direction (Although it may be Y-axis direction,
In this case, install the guide rail 8 in the Y-axis direction) to 15
Move 00 mm. As a result, even if the processing head 6 moves, the optical path length L from the laser oscillator 7 to the processing head 6
Is maintained constant, the beam diameter of the laser light incident on the processing head 6 does not change, and stable cutting quality can be achieved.

[0010]

As described above in detail, the present invention moves the same distance at the same speed as the moving speed of the machining head, so that even if the machining head moves during machining of the workpiece, the laser oscillator and the machining head move. The distance can always be kept constant. As a result, the beam diameter of the laser light incident on the processing head does not change, so that the work can be processed with high cutting quality. Further, since it is not necessary to provide a conventional reflection mirror on the optical path from the laser oscillator to the processing head, it is possible to solve the problem that the cutting ability is lowered due to output loss.

[Brief description of drawings]

FIG. 1 is an overall perspective view of a laser processing apparatus according to an embodiment of the present invention.

FIG. 2 is an operation explanatory view of the laser processing apparatus according to the embodiment of the present invention.

[Explanation of symbols]

4 ... work table, 5 ... work, 6 ... machining head, 7
… A laser oscillator.

Claims (1)

[Claims] 1. A laser processing apparatus for processing a work 5 placed on a work table 4 with laser light emitted from a processing head 6 which is movable in the X-axis and in the Y-axis direction orthogonal to the work. In the above, by controlling the laser oscillator 7 that sends laser light to the processing head 6 so as to move at the same speed and the same distance as the processing head, the optical path length between the processing heads 6 from the laser oscillator 7 is always kept constant. A laser processing apparatus characterized in that.