JPH03294079A - Laser beam machine - Google Patents

Abstract

PURPOSE:To improve working efficiency without increasing the size of the machine by providing an optical path length adjusting means which holds the optical path length of a laser beam from a laser beam generating source to an irradiation port for the laser beam at a specified distance. CONSTITUTION:A laser beam oscillator 2 leads the laser beam through the optical path protected by a laser beam protecting member 7 via the optical path length regulating means 3 up to the irradiation port 9 for the laser beam. A moving device 4 moves an irradiating part 8 having the irradiating port 9 in triaxial directions; X, Y, Z in accordance with the control signal of a control device 6, thereby holding the optical path length of the laser beam at the specified distance.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Field of Application) The present invention relates to an improvement in a laser processing apparatus that irradiates a workpiece with a laser beam and processes the workpiece.

(Prior art) Conventional laser processing equipment has a configuration in which a laser beam irradiation port for irradiating a workpiece with laser light is fixed and a table on which the workpiece is placed is moved, or a table on which the workpiece is placed is moved. Fix the stand,
A configuration in which the laser beam irradiation port is moved is known.

However, the former has the problem that the moving area becomes too large to process the workpiece, resulting in an increase in the size of the device, while the latter has the problem that the laser beam irradiation port moves from the laser beam source to the laser beam. There is a problem in that the optical path length of the laser beam reaching the light irradiation port increases or decreases, causing fluctuations in the output intensity of the laser beam, resulting in a decrease in work efficiency.

(Problems to be Solved by the Invention) The present invention has been made in view of the above problems, and aims to provide a laser processing device that does not increase in size and improves work efficiency. be.

[Structure of the Invention] (Means for Solving the Problems) In order to achieve the above object, the present invention includes a laser beam generation source and a method for directing the laser beam generated from the laser beam generation source to a workpiece. In a laser processing apparatus that processes the workpiece by growing a laser beam irradiation port and moving the laser beam irradiation port, an optical path of a laser beam from the laser beam generation source to the laser beam irradiation port. This is characterized by the provision of an optical path length adjusting means for maintaining the optical path length at a constant distance.

(Function) Since the optical path length adjustment means maintains the optical path length of the laser beam from the laser beam generation source to the laser beam irradiation port at a constant distance, it is possible to prevent fluctuations in the output intensity of the laser beam.

(Example) Hereinafter, the present invention will be specifically explained with reference to Examples.

FIG. 1 is an external perspective view with a partially broken surface showing a laser processing apparatus as an embodiment of the present invention, FIG. 2 is a schematic perspective view for explaining the configuration of an optical path length adjusting means, and FIG. 3 is a laser processing device FIG. 3 is a schematic perspective view for explaining the optical path of light and the operation of an optical path length adjusting means.

This laser processing device 1 includes a laser beam oscillation device (laser beam generation source) 2. Optical path length adjustment means 3. Mobile device 4. Base 5.
It is generally configured by a control device l[6.

The laser beam oscillator 2 includes, for example, a carbon dioxide laser oscillator (not shown), oscillates a laser beam for processing a workpiece, and transmits this laser beam through the optical path length adjusting means 3. , for example, through an optical path whose part is protected by a laser beam protection member 7 made of a spring pipe,
The laser beam is led out to a laser beam irradiation port 9, which will be described later.

The optical path length adjustment means 3 maintains the optical path length of the laser beam from the laser beam oscillation device 2 to the laser beam irradiation port 9 at a constant distance.

As shown in FIG. 2, the optical path length adjusting means 3 includes a pulley 20 (20a) configured to be linked to the processing operation (movement) of the laser beam irradiation port 9.

20 b, 20 c, 20 d), one end of which is fixed to the optical path length adjusting means 3 side, the other end of which is fixed to the moving device 4 side, and is attached to be routed around the pulley 20. 2), an interlocking mechanism consisting of a moving block 22, and a reflecting mirror holder 23 (23a) having a reflecting mirror attached to the moving block 22 and reflecting the laser beam.
, 23b). In addition, 24 (2
4a, 24b) are fixed reflector holders, 25
is fixed to the base 26, and the moving block 22 is a guide shaft that is inserted and moved.

The moving device 4 moves a laser beam irradiation unit 8 having a laser beam irradiation port 9 to x, y,
The movement in the X-axis direction (hereinafter also simply referred to as the X-axis) is performed by the X-axis moving motor 10 installed on the base 5 and the This is done by moving the guide section 12 provided at the bottom of the moving device 4 on the rails 13 provided on the base 5.

Further, movement in the Y-axis direction (hereinafter also simply referred to as Y-axis) is performed by a Y-axis movement motor (not shown) installed inside the movement device 4 and a Y-axis thread 14. The guide portion 15 provided inside the rail 16
By moving above, the laser beam irradiation section 8 is directly moved.

Furthermore, movement in the Z-axis direction (hereinafter also simply referred to as Z-axis) is performed by directly directing the laser beam irradiation unit 8 using a two-pong movement motor 17 installed inside the moving device 14 and a two-axis feed screw 18. This is done by moving.

The base 5 has a mounting frame 1 on which the workpiece is placed.
9a, and a large number of support bins 19b provided to stand up inside this mounting frame 19a. In addition, 30 in the figure is a fixing member for fixing the workpiece to the mounting portion 19, and there are actually a plurality of fixing members.

The control device 6 is, for example, an NC (Numerical
lyControlled) control.

Next, referring also to FIG. 3, the operation of the laser processing apparatus having the above configuration will be explained.

As shown in FIG. 3, the laser beam 31 oscillated from the laser beam oscillation device 2 is reflected by the reflecting mirror of the reflecting mirror holder 27, guided to the optical path length adjusting means 3, and then guided to each reflecting mirror holder 23. The laser beam is reflected by the 24.degree. 28.29 reflecting mirror, guided to the laser beam irradiation section 8, and irradiated from the laser beam irradiation port 9 to process the workpiece 32.

At this time, the fluctuation in the optical path length of the laser beam 31 due to the movement of the laser beam irradiation port 9 of the laser beam irradiation unit 8 according to the control signal of the control device 6 is
By moving the interlocking mechanism consisting of the wire 2) attached to the moving block 22, the reflecting mirror holder 23 (23a, 23b) having the reflecting mirror also moves (up and down), so that the optical path of the laser beam is always maintained. Keep the length at a constant distance.

According to the embodiment described in detail above, since the laser beam irradiation port is moved and the optical path length of the laser beam is always maintained at a constant distance, the output of the laser beam can be increased without increasing the size of the device. It is also possible to prevent variations in strength from occurring. Therefore, it is possible to improve the machining accuracy.

Although one embodiment of the present invention has been described above, it goes without saying that the present invention is not limited to the above embodiment, and that various modifications can be made.

[Effects of the Invention] As described above, according to the present invention, the device does not become large in size;
Moreover, it is possible to provide a laser processing device with improved working efficiency.

[Brief explanation of the drawing]

FIG. 1 is an external perspective view with a partially broken surface showing a laser processing apparatus as an embodiment of the present invention, FIG. 2 is a schematic perspective view for explaining the configuration of an optical path length adjusting means, and FIG. 3 is a laser processing device FIG. 3 is a schematic perspective view for explaining the optical path of light and the operation of an optical path length adjusting means. l... Laser processing device, 2... Laser beam oscillation device (laser beam generation source), 3...
- Optical path length adjustment means, 4... moving device, 5... base,
6...Control device.

Claims (2)

[Claims] (1) It has a laser beam generation source and a laser beam irradiation port that guides the laser beam generated from the laser beam generation source and irradiates the workpiece, and moves the laser beam irradiation port to irradiate the workpiece. A laser processing device for processing a workpiece, characterized in that the laser processing device is provided with an optical path length adjusting means for maintaining the optical path length of the laser beam from the laser beam generation source to the laser beam irradiation port at a constant distance. . (2) The optical path length adjusting means includes an interlocking mechanism that interlocks with the processing operation of the laser beam irradiation port, and a reflecting mirror attached to the interlocking mechanism that reflects the laser beam. The laser processing apparatus according to claim 1.