JPH06196747A - Optically coupled device - Google Patents

Optically coupled device

Info

Publication number
JPH06196747A
JPH06196747A JP34501692A JP34501692A JPH06196747A JP H06196747 A JPH06196747 A JP H06196747A JP 34501692 A JP34501692 A JP 34501692A JP 34501692 A JP34501692 A JP 34501692A JP H06196747 A JPH06196747 A JP H06196747A
Authority
JP
Japan
Prior art keywords
resin
optical coupling
light
coupling device
silicone resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP34501692A
Other languages
Japanese (ja)
Other versions
JP3247743B2 (en
Inventor
Masayuki Mitsui
正之 三ツ井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP34501692A priority Critical patent/JP3247743B2/en
Publication of JPH06196747A publication Critical patent/JPH06196747A/en
Application granted granted Critical
Publication of JP3247743B2 publication Critical patent/JP3247743B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Abstract

PURPOSE:To provide an optically coupled device having a high breakdown strength at a low cost in which the number of parts can be reduced and a manufacturing process can be simplified. CONSTITUTION:Both of a light emitting device 2 and a light receiving device 3 respectively mounted on a lead frame 1 are placed, and both of the devices 2 and 3 are respectively potted with a rubber transparent resin 10, and an optical coupling path is formed between both of potting parts by a gel transparent resin 11.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電気信号を発光素子に
より光信号に変換し、その信号を受光素子で再び電気信
号に変換することにより、入出力側を電気的に絶縁した
光結合装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical coupling device in which an input / output side is electrically insulated by converting an electric signal into an optical signal by a light emitting element and converting the signal into an electric signal again by a light receiving element. Regarding

【0002】[0002]

【従来の技術】従来の技術について図3を参照して説明
する。図3は、従来の光結合装置の断面図である。
2. Description of the Related Art A conventional technique will be described with reference to FIG. FIG. 3 is a sectional view of a conventional optical coupling device.

【0003】図3に示すように、従来の光結合装置は、
リードフレーム1にそれぞれ搭載された発光素子2及び
受光素子3間に、樹脂だれを防止し、光結合路となる透
明プラスチック4を配し、これらを単一の透明シリコー
ン樹脂5で覆っていた。さらに、この透明シリコーン樹
脂5上を反射性樹脂6で覆い、全体を遮光性樹脂7でモ
ールドしていた。以上の構造において、発光素子2より
出た光はシリコーン樹脂5及び透明プラスチック4を通
って、あるいは反射性樹脂6で反射され受光素子3に入
射する。なお、他の従来例として、遮光性樹脂7の代わ
りに反射性樹脂6を使用し、単一樹脂でモールドしたも
のもある。
As shown in FIG. 3, the conventional optical coupling device is
Between the light emitting element 2 and the light receiving element 3 respectively mounted on the lead frame 1, a transparent plastic 4 serving as an optical coupling path for preventing resin dripping is arranged and covered with a single transparent silicone resin 5. Further, the transparent silicone resin 5 was covered with the reflective resin 6, and the whole was molded with the light-shielding resin 7. In the above structure, the light emitted from the light emitting element 2 enters the light receiving element 3 through the silicone resin 5 and the transparent plastic 4 or is reflected by the reflective resin 6. As another conventional example, there is one in which the reflective resin 6 is used instead of the light-shielding resin 7 and molded with a single resin.

【0004】[0004]

【発明が解決しようとする課題】ところで、上記従来技
術によると、絶縁耐圧の確保のため発光素子2の搭載部
と受光素子3の搭載部とが離れているため、透明シリコ
ーン樹脂5が粘度の低いゲル状樹脂の場合、硬化するま
でに両素子間の隙間から樹脂だれが生じてしまう。これ
を防止するため、前述の透明プラスチック4を配するこ
とが不可欠であった。このため、製造工程が増える上、
部品点数も多くコストアップの要因となっていた。
By the way, according to the above-mentioned prior art, since the mounting portion of the light emitting element 2 and the mounting portion of the light receiving element 3 are separated from each other in order to secure the dielectric strength, the transparent silicone resin 5 has a high viscosity. In the case of a low gel-like resin, resin dripping occurs from the gap between both elements before it is cured. In order to prevent this, it was indispensable to arrange the above-mentioned transparent plastic 4. As a result, the number of manufacturing processes increases and
The number of parts was also large, which was a factor of cost increase.

【0005】これに対して、透明シリコーン樹脂5とし
て粘度の高い樹脂を使用すれば、前記した樹脂だれが生
じない上、透明シリコーン樹脂5は粘着性に劣ることか
ら反射性樹脂6との界面が密着せず隙間ができ、この隙
間によって光の反射効率が高くなるというメリットもあ
るが、絶縁耐圧が低下するという問題があった。
On the other hand, when a resin having a high viscosity is used as the transparent silicone resin 5, the above-mentioned resin dripping does not occur, and the transparent silicone resin 5 has poor adhesiveness, so that the interface with the reflective resin 6 is formed. Although there is a merit that a gap is formed without being in close contact and the light reflection efficiency is increased by this gap, there is a problem that the withstand voltage is lowered.

【0006】そこで本発明の目的は、簡易な構造で絶縁
耐圧が高く、しかも光伝達効率も向上できる光結合素子
を提供することにある。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an optical coupling element having a simple structure, high withstand voltage and improved light transmission efficiency.

【0007】[0007]

【課題を解決するための手段】前記目的を達成するため
に本発明の光結合装置は、リードフレームにそれぞれ搭
載した発光素子及び受光素子を併置し、前記両素子をそ
れぞれラバー状の透明樹脂でポッティングし、且つ該両
ポッティング部間にゲル状の透明樹脂による光結合路を
形成してなることを特徴とする。
In order to achieve the above object, the optical coupling device of the present invention comprises a light emitting element and a light receiving element, which are mounted on a lead frame, respectively, and both of the elements are made of a rubber-like transparent resin. It is characterized in that it is potted, and an optical coupling path made of a gel-like transparent resin is formed between the both potting portions.

【0008】[0008]

【作用】本発明の光結合装置は、上記したように、受発
光素子それぞれがラバー状の樹脂で覆われているので、
両素子間の樹脂の隙間が狭くなり、この間にゲル状の樹
脂を注入しても樹脂だれは生じない。従って、絶縁耐圧
を高く確保するために受発光間を離間しても、従来のよ
うに受発光間に透明プラスチックを配置する必要はな
く、部品点数の低減及び製造工程の簡略化ができ、コス
トダウンを図れる。また、この透明シリコーン樹脂はゲ
ルタイプであるので、さらに高絶縁耐圧を確保出来る。
In the optical coupling device of the present invention, as described above, since each of the light emitting and receiving elements is covered with the rubber-like resin,
The resin gap between both elements becomes narrower, and no resin dripping occurs even if a gel-like resin is injected between them. Therefore, even if the light receiving and emitting areas are separated from each other to secure a high withstand voltage, it is not necessary to arrange a transparent plastic between the light receiving and emitting areas as in the conventional case, and the number of parts can be reduced and the manufacturing process can be simplified, resulting in cost reduction You can go down. Further, since this transparent silicone resin is a gel type, a higher withstand voltage can be secured.

【0009】また、ラバー状の樹脂の粘着性は低いた
め、ゲル状の樹脂との間に隙間ができる。このため、こ
の隙間によって光の反射効率が向上するので光伝達効率
が向上する。
Further, since the rubber-like resin has low adhesiveness, a gap is formed between the rubber-like resin and the gel-like resin. Therefore, this gap improves the light reflection efficiency and thus the light transmission efficiency.

【0010】[0010]

【実施例】本発明の一実施例について、図1及び図2を
参照して説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS.

【0011】図1は本実施例による光結合装置の断面
図、図2(a),(b)は本実施例による光結合素子の
製造工程を示す図である。
FIG. 1 is a sectional view of an optical coupling device according to this embodiment, and FIGS. 2A and 2B are views showing a manufacturing process of an optical coupling device according to this embodiment.

【0012】なお、図3に示す従来例と同一機能部分に
は同一記号を付している。
The same functional parts as those of the conventional example shown in FIG. 3 are designated by the same symbols.

【0013】図1に示すように、本実施例の光結合装置
は、リードフレーム1の発光素子2及び受光素子3をそ
れぞれ、ラバータイプの透明シリコーン樹脂10で覆
い、両素子間をゲルタイプの透明シリコーン樹脂11で
埋めており、さらに全体を反射性樹脂12でモールドし
ている。反射性樹脂12としては、例えば酸化チタン等
の反射性材料をエポキシ樹脂に混入したものを使用す
る。
As shown in FIG. 1, in the optical coupling device of this embodiment, each of the light emitting element 2 and the light receiving element 3 of the lead frame 1 is covered with a transparent silicone resin 10 of rubber type, and the space between both elements is of gel type. It is filled with a transparent silicone resin 11, and the whole is molded with a reflective resin 12. As the reflective resin 12, an epoxy resin mixed with a reflective material such as titanium oxide is used.

【0014】上記構造の光結合装置の樹脂ポッティング
方法は、図2(a)に示すように、まず、両素子に対す
る注入口を有するポッティング装置14で、ラバータイ
プの透明シリコーン樹脂10を受発光両素子上に同時に
滴下、硬化し、その後、別のポッティング装置15によ
ってゲルタイプの透明シリコーン樹脂11を受発光素子
間に注入、硬化する。
In the resin potting method of the optical coupling device having the above structure, as shown in FIG. 2A, first, a rubber type transparent silicone resin 10 is received and emitted by a potting device 14 having injection ports for both elements. At the same time, it is dropped and cured on the element, and then a gel type transparent silicone resin 11 is injected and cured between the light emitting and receiving elements by another potting device 15.

【0015】本実施例によれば、受発光素子それぞれが
ラバータイプの透明シリコーン樹脂10で覆われている
ので、両素子間の樹脂の隙間が狭くなり、この間にゲル
タイプの透明シリコーン樹脂11を注入しても樹脂だれ
は生じない。従って、絶縁耐圧を高く確保するために受
発光間を離間しても、従来のように受発光間に透明プラ
スチック4を配置する必要はなく、部品点数の低減及び
製造工程の簡略化ができ、コストダウンを図れる。ま
た、この透明シリコーン樹脂11はゲルタイプであるの
で、さらに高絶縁耐圧を確保出来る。
According to the present embodiment, since each of the light emitting and receiving elements is covered with the rubber type transparent silicone resin 10, the resin gap between the elements is narrowed, and the gel type transparent silicone resin 11 is provided therebetween. No resin dripping occurs when injected. Therefore, it is not necessary to dispose the transparent plastic 4 between the light emitting and receiving sides as in the conventional case even if the light receiving and emitting sides are separated from each other in order to secure a high withstand voltage, and the number of parts can be reduced and the manufacturing process can be simplified. The cost can be reduced. Further, since this transparent silicone resin 11 is a gel type, a higher withstand voltage can be secured.

【0016】また、ラバータイプの透明シリコーン樹脂
10の粘着性は低いため、ゲルタイプの反射性樹脂12
との間に隙間13ができる。このため、この隙間13に
よって光の反射効率が向上するので光伝達効率が向上す
る。
Since the rubber type transparent silicone resin 10 has low adhesiveness, the gel type reflective resin 12 is used.
A gap 13 is formed between and. For this reason, the gap 13 improves the light reflection efficiency and thus the light transmission efficiency.

【0017】[0017]

【発明の効果】以上説明したように本発明によれば、部
品点数の低減及び製造工程の簡略化ができ、安価で高絶
縁耐圧、高光伝達効率の光結合装置を提供できる。
As described above, according to the present invention, the number of parts can be reduced and the manufacturing process can be simplified, and an inexpensive optical coupling device with high withstand voltage and high light transmission efficiency can be provided.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例による光結合装置の断面図で
ある。
FIG. 1 is a sectional view of an optical coupling device according to an embodiment of the present invention.

【図2】(a)及び(b)は、本発明の一実施例による
光結合装置の一製造工程を示す図である。
2A and 2B are views showing one manufacturing process of an optical coupling device according to an embodiment of the present invention.

【図3】従来例による光結合装置の断面図である。FIG. 3 is a sectional view of an optical coupling device according to a conventional example.

【符号の説明】[Explanation of symbols]

1 リードフレーム 2 発光素子 3 受光素子 10 ラバー状の透明シリコーン樹脂 11 ゲル状の透明シリコーン樹脂 1 Lead frame 2 Light emitting element 3 Light receiving element 10 Rubber-like transparent silicone resin 11 Gel-like transparent silicone resin

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 リードフレームにそれぞれ搭載した発光
素子及び受光素子を併置し、前記両素子をそれぞれラバ
ー状の透明樹脂でポッティングし、且つ該両ポッティン
グ部間にゲル状の透明樹脂による光結合路を形成してな
ることを特徴とする光結合装置。
1. A light-emitting element and a light-receiving element mounted on a lead frame, respectively, are arranged side by side, both elements are potted with a rubber-like transparent resin, and an optical coupling path made of a gel-like transparent resin is provided between the potting portions. An optical coupling device comprising:
JP34501692A 1992-12-25 1992-12-25 Optical coupling device and method of manufacturing the same Expired - Fee Related JP3247743B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34501692A JP3247743B2 (en) 1992-12-25 1992-12-25 Optical coupling device and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34501692A JP3247743B2 (en) 1992-12-25 1992-12-25 Optical coupling device and method of manufacturing the same

Publications (2)

Publication Number Publication Date
JPH06196747A true JPH06196747A (en) 1994-07-15
JP3247743B2 JP3247743B2 (en) 2002-01-21

Family

ID=18373718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34501692A Expired - Fee Related JP3247743B2 (en) 1992-12-25 1992-12-25 Optical coupling device and method of manufacturing the same

Country Status (1)

Country Link
JP (1) JP3247743B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010161202A (en) * 2009-01-08 2010-07-22 Renesas Electronics Corp Optically coupled device and method of manufacturing the same
US8743461B2 (en) 2011-02-17 2014-06-03 Seiko Epson Corporation Optical module and electronic apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010161202A (en) * 2009-01-08 2010-07-22 Renesas Electronics Corp Optically coupled device and method of manufacturing the same
US8743461B2 (en) 2011-02-17 2014-06-03 Seiko Epson Corporation Optical module and electronic apparatus
US9019611B2 (en) 2011-02-17 2015-04-28 Seiko Epson Corporation Optical module and electronic apparatus

Also Published As

Publication number Publication date
JP3247743B2 (en) 2002-01-21

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