JPH06192899A - Production of tapered wire for polishing micropore - Google Patents

Production of tapered wire for polishing micropore

Info

Publication number
JPH06192899A
JPH06192899A JP34870892A JP34870892A JPH06192899A JP H06192899 A JPH06192899 A JP H06192899A JP 34870892 A JP34870892 A JP 34870892A JP 34870892 A JP34870892 A JP 34870892A JP H06192899 A JPH06192899 A JP H06192899A
Authority
JP
Japan
Prior art keywords
wire
tapered
polishing
electrolytic
reel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP34870892A
Other languages
Japanese (ja)
Inventor
Akihiro Nakane
章浩 中根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP34870892A priority Critical patent/JPH06192899A/en
Publication of JPH06192899A publication Critical patent/JPH06192899A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To produce a tapered wire having a tapered part and a straight part with good productivity at the time of producing the tapered wire for polishing micropores by electrolytic polishing by adjusting the amt. of electrolytic current to be applied or the conveying speed of the material wire. CONSTITUTION:A steel wire WA is rewound from a rewinding reel 1, brought into contact 'with a guide roller 2 as one electrode, passed through a Pb cathode cylinder 9 in a sulfuric acid elecrtolyte 8 in an electrolytic cell 3 and electrolytic polished. In this case, a current to be applied between the roller 2 and the cylinder 9 is gradually decreased to decrease the polishing amt. of the electrolyte or the traveling speed of the wire WA in the electrolyte is gradually increased and then fixed, and an intermediate wire WB provided with a tapered part 10 and a straight part 11 is formed. The process is repeated to prepare a continuous wire having plural intermediate wires WB, which is passed through a cleaning tank 4 and a drier 5 and wound on a reel 7. The continuous wire is cut into plural intermediate wires WB, and a tapered wire is produced with good productivity.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、セラミックス、ルビー
等の硬脆材よりなる光ファイバーコネクタ用フェルー
ル、時計用軸受等に穿設された微小孔の研磨用として使
用されるテーパーワイヤの製造方法に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ferrule for an optical fiber connector made of a hard and brittle material such as ceramics and ruby, and a tapered wire used for polishing fine holes formed in a bearing for a watch. It is a thing.

【0002】[0002]

【従来の技術】一般に、硬脆材の孔研磨には、図3に示
す如きテーパー部20とストレート部21とからなるテ
ーパーワイヤ22が使用されている。このテーパーワイ
ヤ22は、テーパー部20によって孔壁を次第に所定孔
寸法になるように研磨し、ストレート部21によって孔
寸法を整えると共に孔壁の表面状態を所望の仕上がり状
態に研磨するように設計されている。
2. Description of the Related Art Generally, a taper wire 22 composed of a taper portion 20 and a straight portion 21 as shown in FIG. 3 is used for polishing a hole of a hard and brittle material. This taper wire 22 is designed so that the taper portion 20 gradually polishes the hole wall to a predetermined hole size, the straight portion 21 adjusts the hole size, and the surface condition of the hole wall is polished to a desired finished state. ing.

【0003】上記テーパーワイヤ22は、図4に示すよ
うな状態で硬脆材の孔研磨加工に使用されている。同図
において、30は硬脆材であり、予め穿設された孔を有
する。この硬脆材30を複数個並列配置し、それらの孔
内にテーパーワイヤ22を挿入して数珠繋ぎした状態
で、孔壁とワイヤ間にダイヤモンドダイス粉等の研磨材
を介在させている。そして、上記ワイヤ22を走行しつ
つ硬脆材30を回転および往復動することで、孔壁にワ
イヤ22を研磨材と共に圧接摺動させ、孔壁を研磨して
いる。
The taper wire 22 is used for polishing a hole of a hard and brittle material in the state shown in FIG. In the figure, reference numeral 30 denotes a hard and brittle material, which has a pre-drilled hole. A plurality of the hard and brittle materials 30 are arranged in parallel, and the tapered wires 22 are inserted into the holes to connect the beads, and an abrasive material such as diamond die powder is interposed between the hole walls and the wires. Then, by rotating and reciprocating the hard and brittle material 30 while traveling along the wire 22, the wire 22 is pressed and slid on the hole wall together with the abrasive, and the hole wall is polished.

【0004】上述のようなテーパーワイヤ22は一般
に、所要線径に伸線加工した線材を、10〜15m程度
の所要長さに切断した後、その線材の一端より所要長を
電解液中に垂下浸漬し、浸漬時間を変化させることでワ
イヤ長手方向の腐食量を調整して、所要寸法のテーパー
部を形成するようにして製造されている。
The taper wire 22 as described above is generally formed by cutting a wire rod drawn to a required wire diameter into a required length of about 10 to 15 m, and then hanging the required length from one end of the wire rod into an electrolytic solution. It is manufactured by immersing and adjusting the immersing time to adjust the amount of corrosion in the longitudinal direction of the wire to form a tapered portion having a required dimension.

【0005】[0005]

【発明が解決しようとする課題】上記従来の製造方法に
よる場合、線材を所要長さに切断した後、電解研磨を施
し、各々1本毎にテーパー部を形成するため、作業が非
常に煩雑である。すなわち、上記従来の製造方法による
場合には、切断時にリールに巻取る工程、電解研磨時に
電解液中へ導入する工程および引取る工程を要し、工程
が複雑化するため、作業が煩雑となる。また、電解研磨
時には線材の腐食量を適正に調整する上で線材に張力を
付与する必要があり、線材の一端に重りを付ける等の処
置が講ぜられているため作業が煩雑となる。
In the case of the above-mentioned conventional manufacturing method, the wire rod is cut into a required length and then electrolytically polished to form a taper portion for each wire, so that the work is very complicated. is there. That is, in the case of the above-described conventional manufacturing method, a step of winding on a reel at the time of cutting, a step of introducing into an electrolytic solution at the time of electrolytic polishing and a step of taking back are required, and the steps are complicated, which makes the work complicated. . In addition, it is necessary to apply tension to the wire rod in order to properly adjust the amount of corrosion of the wire rod during electrolytic polishing, and the work is complicated because measures such as attaching a weight to one end of the wire rod are taken.

【0006】また、上記従来の製造方法によれば、スト
レート部へは何ら処置が施されていないため、その表面
肌は伸線上がりの非常に滑らかな表面状態のままであ
る。孔壁の表面状態は、研磨力と密接した関係にあり、
その研磨力は孔内への研磨材の持ち込み状態、すなわち
ワイヤのストレート部の表面状態によって変化する。こ
のため、孔壁の表面状態を所望に仕上げるためにはスト
レート部の表面肌を適宜調整する必要があるが、この調
整は別途施す化学的処理、機械的処理に委ねることとな
る。したがって、作業が煩雑であると共に製造コストが
高くなる。
Further, according to the above conventional manufacturing method, since no treatment is applied to the straight portion, the surface skin of the straight portion remains in a very smooth surface state in which the wire is drawn up. The surface condition of the hole wall is closely related to the polishing force,
The polishing force varies depending on the state of the abrasive brought into the hole, that is, the surface state of the straight portion of the wire. Therefore, in order to finish the surface condition of the hole wall as desired, it is necessary to appropriately adjust the surface texture of the straight portion, but this adjustment is left to chemical treatment and mechanical treatment to be separately performed. Therefore, the work is complicated and the manufacturing cost is high.

【0007】本発明は上記課題に鑑みてなされたもので
あり、作業性に優れ、製造コストを低減し得る微小孔研
磨用テーパーワイヤの製造方法を提供することを目的と
する。
The present invention has been made in view of the above problems, and an object of the present invention is to provide a method of manufacturing a tapered wire for polishing fine holes, which has excellent workability and can reduce the manufacturing cost.

【0008】[0008]

【課題を解決するための手段】本発明の微小孔研磨用テ
ーパーワイヤの製造方法は、電解液中にワイヤを走行通
過させると共に、上記ワイヤの腐食量を調整しつつ電解
研磨を施し、長手方向にテーパー部、略ストレート部を
繰返し有するワイヤを形成した後、該ワイヤを所要長さ
に切断するように構成し、この構成によって上記目的を
達成せんとする。
A method of manufacturing a tapered wire for polishing fine holes according to the present invention comprises: running a wire in an electrolytic solution; and electrolytically polishing the wire while adjusting the amount of corrosion of the wire. After forming a wire having a taper portion and a substantially straight portion repeatedly, the wire is cut into a required length, and the above object is achieved by this structure.

【0009】上記構成において、電解研磨を施す際に
は、電流量、ワイヤの走行速度を変化させて、ワイヤの
腐食量を調整することが可能であり、操作上いずれか一
方を変化させるのが好適である。
In the above construction, when electrolytic polishing is performed, it is possible to adjust the amount of corrosion of the wire by changing the amount of current and the traveling speed of the wire, and it is possible to change either one in operation. It is suitable.

【0010】[0010]

【作用】上記構成になした本発明の製造方法によれば、
少なくとも電解研磨工程完了までは一連の工程で以て連
続して製造できるため、繰り出しおよび巻取りに費す作
業労力が従来に比して著しく低減され、作業性が向上す
る。また、ワイヤを電解液中に走行通過させるため、電
解研磨時に略ストレート部の表面肌を自在に調整でき、
別途調整が不要となり、作業性を向上できると共に製造
コストを低減できる。
According to the manufacturing method of the present invention having the above structure,
At least until the electrolytic polishing step is completed, the manufacturing process can be continuously performed by a series of steps, so that the labor required for paying out and winding can be remarkably reduced as compared with the conventional method, and the workability is improved. Further, since the wire is passed through the electrolytic solution, the surface skin of the substantially straight portion can be freely adjusted during electrolytic polishing.
No separate adjustment is required, which improves workability and reduces manufacturing costs.

【0011】[0011]

【実施例】以下、本発明の一実施例を図1に基づき説明
する。図1は電解研磨工程における装置の概略説明図で
あり、繰出しリール1には伸線加工によって所要線径が
付与されたワイヤWAが巻装されている。このワイヤW
Aは、ガイドローラ2によって電解槽3へ案内され、次
いで洗浄槽4、乾燥装置5、ガイドローラ6を経て巻取
りリール7に巻取られる。上記電解槽3内には電解液8
が挿入されており、またその液8中には陰極通電される
陰極筒9が潜入されている。また、ガイドローラ2には
陽極通電がなされており、ワイヤWAが電解液8中を通
過する際、電解研磨が施されるようになっている。上記
電解液8には硫酸を、陰極筒9には鉛筒を用いている。
なお、洗浄槽4には湯を装入し、湯洗を行うようにして
いるが、アルカリによる中和処理をその後施しても構わ
ない。また、ガイドローラ6には絶縁ローラを使用して
いる。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. FIG. 1 is a schematic explanatory view of an apparatus in an electrolytic polishing step, in which a payout reel 1 is wound with a wire WA to which a required wire diameter is given by wire drawing. This wire W
A is guided to the electrolytic bath 3 by the guide roller 2, and then wound on the take-up reel 7 via the washing bath 4, the drying device 5, and the guide roller 6. An electrolytic solution 8 is placed in the electrolytic bath 3.
And a cathode tube 9 energized by the cathode is submerged in the liquid 8. Further, the guide roller 2 is energized with an anode so that when the wire WA passes through the electrolytic solution 8, electrolytic polishing is performed. Sulfuric acid is used as the electrolytic solution 8 and a lead tube is used as the cathode tube 9.
Although the washing tank 4 is charged with hot water and is washed with hot water, it may be subjected to neutralization treatment with an alkali. An insulating roller is used as the guide roller 6.

【0012】次に、上記電解研磨装置を用いた本発明の
製造方法の実施例について、以下説明する。
Next, an embodiment of the manufacturing method of the present invention using the above electropolishing apparatus will be described below.

【0013】(実施例1)線径0.125mmの鋼製ワ
イヤWAを繰出しリール1より2m/分の一定速度で繰
り出し、陽極通電したガイドローラ2に接触させつつ電
解槽3内の電解液8中を通過させた。上記ガイドローラ
2への通電は電流値を80Aとし、その後上記電流値を
4分間で5A以下まで次第に低下させ、ワイヤWAにテ
ーパー比0.025mm/8mのテーパー部10を形成
した。その後3分間は電流値を変化せず、ワイヤWAに
は上記テーパー部10に連続して6mの略ストレート部
11を形成した。以上の如き電流値の調整を繰返し行い
ながら電解研磨を施して、図2に示すような中間ワイヤ
WBを形成し、洗浄、乾燥後一旦リール7に巻取り、し
かる後その中間ワイヤWBを切断して、テーパー部10
および略ストレート部11を有するテーパーワイヤを得
た。
(Embodiment 1) A steel wire WA having a wire diameter of 0.125 mm is fed from a feeding reel 1 at a constant speed of 2 m / min, and is brought into contact with a guide roller 2 which is energized with an anode, and an electrolytic solution 8 in an electrolytic cell 3 I let it pass through. The current value for energizing the guide roller 2 was set to 80 A, and then the current value was gradually decreased to 5 A or less in 4 minutes to form a taper portion 10 having a taper ratio of 0.025 mm / 8 m on the wire WA. After that, the current value was not changed for 3 minutes, and a substantially straight portion 11 having a length of 6 m was formed on the wire WA so as to be continuous with the tapered portion 10. Electrolytic polishing is performed while repeatedly adjusting the current value as described above to form the intermediate wire WB as shown in FIG. 2, which is washed and dried, and then temporarily wound on the reel 7, and then the intermediate wire WB is cut. Taper 10
And the taper wire which has the substantially straight part 11 was obtained.

【0014】(実施例2)線径0.125mmの鋼製ワ
イヤWAを繰出しリール1より繰り出し、60Aの一定
電流値で陽極通電したガイドローラ2に接触させつつ電
解槽3内の電解液8中を通過させた。上記電解液8中の
ワイヤWA通過速度は1.5m/分より徐々に上昇さ
せ、8m経過時には40m/分まで上昇させ、ワイヤW
Aにテーパー比0.025mm/8mのテーパー部10
を形成した。その後4秒間40m/分の速度を保ち、ワ
イヤWAには上記テーパー部に連続して6mの略ストレ
ート部11を形成した。以上の如きワイヤWAの走行速
度の調整を繰返し行いながら電解研磨を施して、図2に
示すような中間ワイヤWBを形成し、洗浄、乾燥後、一
旦リール7に巻取り、しかる後その中間ワイヤWBを切
断して、テーパー部10および略ストレート部11を有
するテーパーワイヤを得た。
(Embodiment 2) A steel wire WA having a wire diameter of 0.125 mm is unwound from a unwind reel 1 and in a electrolytic solution 8 in an electrolytic cell 3 while being in contact with a guide roller 2 which is anodically energized at a constant current value of 60 A. Passed through. The passing speed of the wire WA in the electrolyte 8 is gradually increased from 1.5 m / min to 40 m / min after 8 m.
A taper part 10 with a taper ratio of 0.025 mm / 8 m
Was formed. After that, a speed of 40 m / min was maintained for 4 seconds, and a substantially straight portion 11 having a length of 6 m was formed on the wire WA continuously from the tapered portion. Electrolytic polishing is performed while repeatedly adjusting the traveling speed of the wire WA as described above to form the intermediate wire WB as shown in FIG. 2, which is washed and dried, and then temporarily wound on the reel 7 and then the intermediate wire WB. WB was cut to obtain a tapered wire having a tapered portion 10 and a substantially straight portion 11.

【0015】上記各実施例において、略ストレート部の
表面肌を所望状態になす場合、電解液濃度、電流値、ワ
イヤ走行速度等を適宜調整することで、表面粗さRt=
0.2〜1.2μm程度の範囲で粗くしたり、細かくし
たりすることが可能である。
In each of the above embodiments, when the surface skin of the substantially straight portion is formed in a desired state, the surface roughness Rt = is obtained by appropriately adjusting the electrolytic solution concentration, the current value, the wire traveling speed and the like.
It is possible to make it coarse or fine in the range of about 0.2 to 1.2 μm.

【0016】[0016]

【発明の効果】本発明によれば、電解研磨によるテーパ
ー部の形成をインラインで連続的に施すため、繰り返
し、巻取りならびに搬送に費す工数が従来の約1/2と
なり、作業労力が著しく低減され、微小孔研磨用テーパ
ーワイヤを作業性および生産性良好にして製造できる。
また、略ストレート部の表面肌の状態を、電解研磨時に
自在に調整できるため、別途調整が不要となり、作業性
を向上できると共に製造コストを大幅に低減できる等の
優れた効果を奏する。
According to the present invention, since the taper portion is continuously formed in-line by electropolishing, the number of man-hours required for repetition, winding and transporting is about half that of the conventional method, and the labor required is remarkably high. The tapered wire for polishing fine holes can be manufactured with reduced workability and productivity.
In addition, since the surface texture of the substantially straight portion can be freely adjusted during electrolytic polishing, no separate adjustment is required, and the workability can be improved and the manufacturing cost can be significantly reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例で使用する電解研磨装置を示す
概略説明図である。
FIG. 1 is a schematic explanatory view showing an electrolytic polishing apparatus used in an example of the present invention.

【図2】本発明の実施例1、2で得られる中間ワイヤW
Bの概略図である。
FIG. 2 is an intermediate wire W obtained in Examples 1 and 2 of the present invention.
It is a schematic diagram of B.

【図3】従来のテーパーワイヤの概略図である。FIG. 3 is a schematic view of a conventional tapered wire.

【図4】テーパーワイヤによる孔研磨加工状態を示す概
略説明図である。
FIG. 4 is a schematic explanatory view showing a hole polishing processing state with a tapered wire.

【符号の説明】[Explanation of symbols]

1 繰出しリール 2、6 ガイドローラ 3 電解槽 4 洗浄槽 5 乾燥装置 7 巻取リール 8 電解液 9 陰極筒 10 テーパー部 11 略ストレート部 WA ワイヤ WB 中間ワイヤ 1 Feeding Reel 2, 6 Guide Roller 3 Electrolytic Tank 4 Cleaning Tank 5 Drying Device 7 Take-up Reel 8 Electrolyte 9 Cathode Cylinder 10 Tapered Part 11 Almost Straight Part WA Wire WB Intermediate Wire

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 電解液中にワイヤを走行通過させると共
に、上記ワイヤの腐食量を調整しつつ電解研磨を施し、
長手方向にテーパー部、略ストレート部を繰り返し有す
るワイヤを形成した後、該ワイヤを切断してなる微小孔
研磨用テーパーワイヤの製造方法。
1. A wire is passed through an electrolytic solution, and electrolytic polishing is performed while adjusting the amount of corrosion of the wire.
A method for producing a tapered wire for polishing fine holes, comprising forming a wire having a taper portion and a substantially straight portion repeatedly in the longitudinal direction and then cutting the wire.
【請求項2】 電流量を変化させてワイヤの腐食量を調
整する請求項1記載の微小孔研磨用テーパーワイヤの製
造方法。
2. The method for manufacturing a tapered wire for polishing fine holes according to claim 1, wherein the amount of corrosion of the wire is adjusted by changing the amount of current.
【請求項3】 ワイヤの走行速度を変化させてワイヤの
腐食量を調整する請求項1記載の微小孔研磨用テーパー
ワイヤの製造方法。
3. The method for producing a tapered wire for polishing fine holes according to claim 1, wherein the running speed of the wire is changed to adjust the amount of corrosion of the wire.
JP34870892A 1992-12-28 1992-12-28 Production of tapered wire for polishing micropore Pending JPH06192899A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34870892A JPH06192899A (en) 1992-12-28 1992-12-28 Production of tapered wire for polishing micropore

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34870892A JPH06192899A (en) 1992-12-28 1992-12-28 Production of tapered wire for polishing micropore

Publications (1)

Publication Number Publication Date
JPH06192899A true JPH06192899A (en) 1994-07-12

Family

ID=18398834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34870892A Pending JPH06192899A (en) 1992-12-28 1992-12-28 Production of tapered wire for polishing micropore

Country Status (1)

Country Link
JP (1) JPH06192899A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI767689B (en) * 2021-05-05 2022-06-11 健行學校財團法人健行科技大學 Micro-hole polished device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI767689B (en) * 2021-05-05 2022-06-11 健行學校財團法人健行科技大學 Micro-hole polished device

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