JPH06187906A - Assembling method for electron gun - Google Patents
Assembling method for electron gunInfo
- Publication number
- JPH06187906A JPH06187906A JP33889092A JP33889092A JPH06187906A JP H06187906 A JPH06187906 A JP H06187906A JP 33889092 A JP33889092 A JP 33889092A JP 33889092 A JP33889092 A JP 33889092A JP H06187906 A JPH06187906 A JP H06187906A
- Authority
- JP
- Japan
- Prior art keywords
- grid
- electron gun
- ceramic
- bead
- grids
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子銃の組立方法に係
り、特に、組立時に電子銃を構成する複数のグリッドに
変形損傷を与えない電子銃の組立方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electron gun assembling method, and more particularly to an electron gun assembling method which does not cause deformation and damage to a plurality of grids constituting the electron gun during assembly.
【０００２】[0002]
【従来の技術】従来の電子銃の組立方法は、図７に示す
ように、まず複数のグリッドＧのそれぞれに支持ピン３
を予め溶接、又は、一体的に突設させておき、この各グ
リッドＧを所定の順番で、且つ、各グリッドＧ間にスペ
ーサーＳを介在させて所定の位置関係に支持する。次
に、ビードガラス４を加熱軟化し、このビードガラス４
を各グリッドＧ側に押圧して各支持ピン３の先端をビー
ドガラス４内に埋設する。そして、ビードガラス４が固
化した後にスペーサーＳを取り除く。このようにして組
付けたグリッド組付体にカソード等を固着して完了する
（特開昭５８−１３１６４０号公報参照）。2. Description of the Related Art In a conventional electron gun assembling method, as shown in FIG. 7, first, a support pin 3 is attached to each of a plurality of grids G.
Are preliminarily welded or integrally projected, and the grids G are supported in a predetermined order and in a predetermined positional relationship with a spacer S interposed between the grids G. Next, the bead glass 4 is softened by heating, and the bead glass 4 is softened.
Is pressed toward each grid G to embed the tip of each support pin 3 in the bead glass 4. Then, the spacer S is removed after the bead glass 4 is solidified. A cathode or the like is fixed to the grid assembly thus assembled to complete the process (see JP-A-58-131640).
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記従
来の方法によれば、加熱軟化したビードガラス４が固化
する過程において熱収縮を起こし、この熱収縮によって
各グリッドＧ間隔の寸法に誤差が生じやすい。また、こ
の影響によってビードガラス４固化後のスペーサーＳの
抜き抵抗が大きくなり、グリッドＧに損傷を与えるおそ
れがある。さらに、加熱軟化したビードガラス４を支持
ピン３先端に食い込ませる際にグリッドＧも一緒に押圧
することになるため、グリッドＧが加圧変形するおそれ
がある。However, according to the above conventional method, heat shrinkage occurs in the process of solidification of the bead glass 4 that has been softened by heating, and this heat shrinkage easily causes an error in the size of each grid G interval. . Further, due to this effect, the extraction resistance of the spacer S after the bead glass 4 is solidified is increased, and the grid G may be damaged. Furthermore, since the grid G is also pressed when the heat-softened bead glass 4 bites into the tip of the support pin 3, the grid G may be deformed under pressure.
【０００４】そこで、本発明は上記課題を考慮してグリ
ッドに熱や外力による応力がかからない電子銃の組立方
法を提供することを目的とする。In view of the above problems, an object of the present invention is to provide an assembling method of an electron gun in which the grid is not stressed by heat or external force.
【０００５】[0005]
【課題を解決するための手段】上記課題は本発明によれ
ば、所定の位置にグリッドを支持するための複数の支持
部品を突設し且つ複数のレーザー照射用穴を設けたセラ
ミックからなるビーディング材を用意し、複数のグリッ
ドをスペーサーを介して所定の位置関係に配置し、前記
複数のレーザー照射用穴からレーザーを照射することに
よって、前記セラミックビーディング材に突設した前記
複数の支持部品と前記複数のグリッドとを接合固定し、
その後、前記スペーサーを取り除く工程を有することを
特徴とする電子銃の組立方法によって解決される。According to the present invention, there is provided a beer made of ceramic having a plurality of supporting parts for supporting the grid at predetermined positions and a plurality of laser irradiation holes. Prepare a bonding material, arrange a plurality of grids in a predetermined positional relationship via a spacer, and irradiate a laser through the plurality of laser irradiation holes to support the plurality of supports protruding from the ceramic beading material. Joining and fixing the parts and the plurality of grids,
After that, a solution is provided by a method of assembling an electron gun, which comprises a step of removing the spacer.
【０００６】本発明では、支持部品３がビードセラミッ
ク５と略同一の熱膨張係数を有する材料からなることが
熱変形を抑えるために有効である。In the present invention, it is effective that the support component 3 is made of a material having a thermal expansion coefficient substantially the same as that of the bead ceramic 5 in order to suppress thermal deformation.
【０００７】また本発明では前記レーザー照射用穴が照
射側が広くなるテーパ状を有していることが好ましい。Further, in the present invention, it is preferable that the laser irradiation hole has a tapered shape such that the irradiation side is widened.
【０００８】[0008]
【作用】本発明によれば、グリッドを支持するための支
持部品３を、セラミックからなるビーディング材料（ビ
ードセラミック：通常のビードガラスに対応）５に予め
突設しておき、同様にそのビードセラミック５に設けた
穴７を介してレーザー照射することによって支持部品３
と、所定配置のグリッドＧを無加圧溶接、接合するため
に、グリッドに外力が作用せず、加圧変形することがな
く、さらに、上記の如く熱や外力による応力がグリッド
に作用しないためにスペーサーには必要以上に大きな抜
き抵抗もかからない。According to the present invention, the support component 3 for supporting the grid is preliminarily provided on the beading material 5 made of ceramic (bead ceramic: corresponding to ordinary bead glass), and the bead is similarly formed. By irradiating the laser through the hole 7 provided in the ceramic 5, the supporting component 3
Since the grids G arranged in a predetermined arrangement are welded and joined together without pressure, no external force acts on the grid and is not deformed under pressure. Further, as described above, stress due to heat or external force does not act on the grid. Moreover, the spacer does not have an excessive pulling resistance.
【０００９】[0009]
【実施例】以下、本発明の実施例を図面を用いて説明す
る。図１及び図２は本発明の一実施例を示す。Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 show an embodiment of the present invention.
【００１０】図１は、本実施例で用いるビードセラミッ
クの模式図であり、特に（ａ）は平面図、（ｂ）はＡ−
Ａ断面図、（ｃ）はＢ−Ｂ断面図である。FIG. 1 is a schematic view of a bead ceramic used in the present embodiment. Particularly, (a) is a plan view and (b) is A-.
A sectional view, (c) is a BB sectional view.
【００１１】本発明ではセラミックを材料としたビーデ
ィング材をビードセラミックと称する。本実施例で用い
るビードセラミックには図１に示すように、主に長軸側
の両側面に一列に支持ピン差込み用穴６と、中央部に一
列にレーザー照射用穴７が設けられている。支持ピン差
込み用穴６にはグリッド支持用のピンが差し込まれ、ガ
ラス付けによって固定される。またレーザー照射用穴７
はグリッドと支持ピンを溶接するためにレーザー光を照
射するための穴であり、グリッド対向面（下面）の方
が、狭くなるようにテーパ状になっている。レーザー光
は上面側から照射される。In the present invention, a beading material made of ceramic is referred to as a bead ceramic. As shown in FIG. 1, the bead ceramic used in this embodiment is provided with support pin insertion holes 6 in a row mainly on both side surfaces on the major axis side, and laser irradiation holes 7 in a row in the central portion. . A pin for grid support is inserted into the support pin insertion hole 6 and fixed by attaching glass. Also, laser irradiation hole 7
Is a hole for irradiating a laser beam for welding the grid and the support pin, and the grid facing surface (lower surface) is tapered so as to be narrower. Laser light is emitted from the upper surface side.
【００１２】上記のようなビードセラミックを用意した
後、図２に示すようにビードセラミックには、グリッド
支持用の支持ピン３を支持ピン差込み用穴６に突設す
る。その突設状態は図２（ｂ），（ｃ）及び（ｄ）でよ
く示されているようにグリッド側の穴７をまたぐように
コの字型になっている。この支持ピン３の対グリッド面
（図２（ｃ））はグリッドに溶接しやすいようにグリッ
ド面に平行で所定の面積を有している。図２において、
特に（ａ）は上面図、（ｂ）はＣ−Ｃ断面図、（ｃ）は
底面図、（ｄ）はＤ−Ｄ断面図、（ｅ）はＥ−Ｅ断面
図、（ｆ）はＦ部拡大図を示している。支持ピン３には
特に、図２（ｅ）で示すように、突設された継線用のリ
ードあるいはピンを溶接するための継線用溶接タブ８を
設ける。この継線用溶接によってタブ８は、継線用のリ
ードあるいはピンを溶接する際に外力が加わってもその
影響をグリッド本体に及ぶことを避けることができる。
図２（ｆ）で示した支持ピン３上のガラス部９は、支持
ピン３をビードセラミックにガラス付け（接着）した際
のガラス部分である。このガラス付けの際も加熱軟化及
び固化の過程で熱膨張、熱収縮を起こすため、ビードセ
ラミック５と支持ピン３の熱膨張係数は略同一であるの
が好ましく、本実施例では支持ピン３の材料としてコバ
ール（鉄コバルトニッケル合金：２９Ｎｉ−１８Ｃｏ−
Ｆｅ）やデュメット線心材（鉄ニッケル合金：４０〜５
０Ｎｉ−Ｆｅ）等が用いられる。After the bead ceramic as described above is prepared, as shown in FIG. 2, the support pins 3 for supporting the grid are projected from the support pin insertion holes 6 in the bead ceramic. The projecting state is U-shaped so as to straddle the holes 7 on the grid side, as well shown in FIGS. 2 (b), 2 (c) and 2 (d). The surface of the support pin 3 against the grid (FIG. 2C) is parallel to the grid surface and has a predetermined area so that it can be easily welded to the grid. In FIG.
In particular, (a) is a top view, (b) is a CC sectional view, (c) is a bottom view, (d) is a DD sectional view, (e) is an EE sectional view, and (f) is F. The enlarged view is shown. In particular, as shown in FIG. 2 (e), the support pin 3 is provided with a wire welding tab 8 for welding a protruding wire lead or pin. By this welding for connecting wire, the tab 8 can avoid the influence of external force applied to the grid main body when welding the lead or pin for connecting wire.
The glass portion 9 on the support pin 3 shown in FIG. 2F is a glass portion when the support pin 3 is glass-attached (bonded) to the bead ceramic. Since the thermal expansion and the thermal contraction occur during the process of softening and solidifying by heating even when this glass is attached, it is preferable that the thermal expansion coefficients of the bead ceramic 5 and the support pin 3 are substantially the same. As a material, Kovar (iron-cobalt-nickel alloy: 29Ni-18Co-
Fe) and dumet wire core material (iron-nickel alloy: 40-5)
0Ni-Fe) or the like is used.
【００１３】上記のように支持ピン３を配設した一対の
ビードセラミック５を用いて、以下図３に示すようにし
て電子銃の組立を行った。図３（ａ）は電子銃組立前の
電子銃とビードガラスの配置関係を示す図であり、
（ｂ）は電子銃組立完了時の図を示す。図３（ａ）に示
すように、Ｇ１，Ｇ２，Ｇ３A，Ｇ３B，Ｇ４，ＧD，ＧB
１〜ＧB３の各グリッドＧと、各グリッド間のクリアラ
ンスの保持と位置決めのためのスペーサーＳとをグリッ
ド位置決め用治具Ｈ内に所定の順及び位置で配置させ
る。次に図１，図２で説明したように、支持ピンをガラ
ス付けした一対のビードセラミック５をグリッドを配し
た治具Ｈの両側面からグリッドＧの方へ（矢印）近付け
てゆき、治具Ｈ側のグリッドＧとビードセラミック側の
支持ピン３を接触させる。その後、その接触面に孔７を
介して無加圧接着の一種であるレーザー溶接で接着す
る。支持ピン３と各グリッドＧ間のレーザー溶接時には
各グリッドＧに何ら外力が作用しないため、変形するこ
とがない。An electron gun was assembled as shown in FIG. 3 below using the pair of bead ceramics 5 having the support pins 3 arranged as described above. FIG. 3A is a view showing the arrangement relationship between the electron gun and the bead glass before the electron gun is assembled,
(B) shows a diagram when the electron gun assembly is completed. As shown in FIG. 3A, G1, G2, G3 A , G3 B , G4, G D , G B
And each grid G of 1-G B 3, is arranged in a predetermined order and position the spacer S to the grid positioning jigs in H for the clearance holding the positioning between each grid. Next, as described with reference to FIGS. 1 and 2, the pair of bead ceramics 5 to which the support pins are attached by glass are brought closer to the grid G (arrows) from both sides of the jig H on which the grid is arranged, and the jig is moved. The grid G on the H side and the support pins 3 on the bead ceramic side are brought into contact with each other. Thereafter, the contact surface is bonded via the hole 7 by laser welding which is a kind of pressureless bonding. At the time of laser welding between the support pin 3 and each grid G, no external force acts on each grid G, so that no deformation occurs.
【００１４】次に、各スペーサーＳを取り除くが、各グ
リッドＧには上記の如く熱や外力による応力が発生して
いないため、各スペーサーＳは必要以上に大きな抜き抵
抗もなく取り除き、図３（ｂ）に示したグリッド組立体
を得る。Next, the spacers S are removed, but since the stresses due to heat and external force are not generated in the grids G as described above, the spacers S are removed without an excessively large pulling resistance. Obtain the grid assembly shown in b).
【００１５】このグリッド組立体にカソード１，コンバ
ーカップ（コンバープレート）１１，ステム２等を組み
付け固着し、継線ピン１２の配線を行い、図４に示す電
子銃を完成させた。A cathode 1, a convertor cup (converter plate) 11, a stem 2 and the like were assembled and fixed to this grid assembly and wiring of the connecting wire pins 12 was carried out to complete the electron gun shown in FIG.
【００１６】なお、本実施例でビーディング後の継線工
程を簡略化するために図５及び図６に示すビードセラミ
ック構造をとることができる。In this embodiment, the bead ceramic structure shown in FIGS. 5 and 6 can be adopted in order to simplify the connection process after beading.
【００１７】まず図５に示す構造は、同電位となるグリ
ッドＧを支持している２箇所の支持ピン３部位を支持ピ
ン３ａのように、一体化させた構造である。このような
支持ピンの一体化構造によってこの部位に必要であった
継線の配線を省略することができる。First, the structure shown in FIG. 5 is a structure in which two support pin 3 parts supporting the grid G having the same potential are integrated like a support pin 3a. With such an integrated structure of the support pins, it is possible to omit the wiring of the connecting wire which is necessary in this portion.
【００１８】また図６に示す構造は、予め導電材を印刷
した箇所間に接続線１０あるいは抵抗を設けた構造であ
る。導電材印刷としては、カーボン等をインクとして印
刷するのが好ましい。Further, the structure shown in FIG. 6 is a structure in which a connecting wire 10 or a resistor is provided between portions where a conductive material is printed in advance. As the conductive material printing, it is preferable to print using carbon or the like as ink.
【００１９】[0019]
【発明の効果】以上説明したように本発明によれば、電
子銃の組立時にビードセラミックに設けた支持ピンを各
グリッドに無加圧接着して固定させることができるので
各グリッドに熱や外力による応力が発生せず、組立精度
が向上する。As described above, according to the present invention, the support pins provided on the bead ceramic can be fixed to each grid by pressureless bonding when the electron gun is assembled, so that heat or external force can be applied to each grid. As a result, no stress is generated and assembly accuracy is improved.
【００２０】また、グリッド等の部品の多少の変更に対
して、対応する支持ピンを変更するだけでよく、作業性
も良好である。Further, even if the parts such as the grid are slightly changed, only the corresponding support pins need to be changed, and the workability is also good.
【図１】本発明に係るビードセラミックを説明するため
の図（支持ピン装着前）である。FIG. 1 is a view for explaining a bead ceramic according to the present invention (before mounting a support pin).
【図２】本発明に係るビードセラミックを説明するため
の図（支持ピン装着後）である。FIG. 2 is a view for explaining a bead ceramic according to the present invention (after mounting a support pin).
【図３】本発明に係る電子銃組立方法を説明するための
図である。FIG. 3 is a diagram for explaining an electron gun assembly method according to the present invention.
【図４】本発明に係る電子銃組立完成図である。FIG. 4 is a completed view of an electron gun assembly according to the present invention.
【図５】本発明に係る変形支持ピン例を示す図である。FIG. 5 is a diagram showing an example of a modified support pin according to the present invention.
【図６】本発明に係る継線及び抵抗付加例を示す図であ
る。FIG. 6 is a diagram showing an example of connection wire and resistance addition according to the present invention.
【図７】従来の電子銃の組立方法を説明するための図で
ある。FIG. 7 is a diagram for explaining a conventional method of assembling an electron gun.
１ カソード ２ ステム ３ 支持ピン ４ ビードガラス ５ ビードセラミック ６ 支持ピン差込み用穴 ７ レーザー照射用孔 ８ 継線用溶接タブ ９ ガラス部 １０ 接続線（抵抗） Ｇ グリッド（電極） Ｓ スペーサー Ｈ グリッド位置決め治具 1 Cathode 2 Stem 3 Support Pin 4 Bead Glass 5 Bead Ceramic 6 Support Pin Insertion Hole 7 Laser Irradiation Hole 8 Connection Welding Tab 9 Glass Part 10 Connection Wire (Resistance) G Grid (Electrode) S Spacer H Grid Positioning Fixture Ingredient
Claims (3)
複数の支持部品を突設し且つ複数のレーザー照射用穴を
設けたセラミックからなるビーディング材を用意し、 複数のグリッドを、スペーサーを介して所定の位置関係
に配置し、 前記複数のレーザー照射用穴からレーザーを照射するこ
とによって、前記セラミックビーディング材に突設した
前記複数の支持部品と前記複数のグリッドとを接合固定
し、その後、前記スペーサーを取り除く工程を有するこ
とを特徴とする電子銃の組立方法。1. A beading material made of ceramics, which is provided with a plurality of supporting parts for supporting a grid at predetermined positions and which is provided with a plurality of laser irradiation holes, is prepared, and a plurality of grids and spacers are provided. Arranged in a predetermined positional relationship through, by irradiating the laser from the plurality of laser irradiation holes, to join and fix the plurality of support components and the plurality of grids protruding from the ceramic beading material, Then, the method of assembling an electron gun, comprising a step of removing the spacer.
の熱膨張係数を有する材料からなることを特徴とする請
求項１記載の電子銃の組立方法。2. The method of assembling an electron gun according to claim 1, wherein the supporting component is made of a material having a coefficient of thermal expansion substantially the same as that of the ceramic.
るテーパ状を有していることを特徴とする請求項１記載
の電子銃の組立方法。3. The method of assembling an electron gun according to claim 1, wherein the laser irradiation hole has a tapered shape such that the irradiation side is widened.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33889092A JP3168741B2 (en) | 1992-12-18 | 1992-12-18 | How to assemble an electron gun |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33889092A JP3168741B2 (en) | 1992-12-18 | 1992-12-18 | How to assemble an electron gun |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06187906A true JPH06187906A (en) | 1994-07-08 |
| JP3168741B2 JP3168741B2 (en) | 2001-05-21 |
Family
ID=18322328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33889092A Expired - Fee Related JP3168741B2 (en) | 1992-12-18 | 1992-12-18 | How to assemble an electron gun |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3168741B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5951351A (en) * | 1996-12-17 | 1999-09-14 | U.S. Philips Corporation | Method for manufacturing an electron gun |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014049890A (en) * | 2012-08-30 | 2014-03-17 | Nikon Corp | Imaging apparatus, imaging method, and program |
-
1992
- 1992-12-18 JP JP33889092A patent/JP3168741B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5951351A (en) * | 1996-12-17 | 1999-09-14 | U.S. Philips Corporation | Method for manufacturing an electron gun |
| US6215238B1 (en) | 1996-12-17 | 2001-04-10 | U.S. Philips Corporation | Cathode ray tube, electron gun for a cathode ray tube, method for manufacturing an electron gun, parts used in method for manufacturing an electron gun |
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| Publication number | Publication date |
|---|---|
| JP3168741B2 (en) | 2001-05-21 |
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