JPH0618467Y2 - 加熱蒸散装置 - Google Patents
加熱蒸散装置Info
- Publication number
- JPH0618467Y2 JPH0618467Y2 JP1989046184U JP4618489U JPH0618467Y2 JP H0618467 Y2 JPH0618467 Y2 JP H0618467Y2 JP 1989046184 U JP1989046184 U JP 1989046184U JP 4618489 U JP4618489 U JP 4618489U JP H0618467 Y2 JPH0618467 Y2 JP H0618467Y2
- Authority
- JP
- Japan
- Prior art keywords
- bottle
- chamber
- container
- heating
- storage chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Catching Or Destruction (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989046184U JPH0618467Y2 (ja) | 1989-04-21 | 1989-04-21 | 加熱蒸散装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989046184U JPH0618467Y2 (ja) | 1989-04-21 | 1989-04-21 | 加熱蒸散装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02138577U JPH02138577U (cs) | 1990-11-19 |
JPH0618467Y2 true JPH0618467Y2 (ja) | 1994-05-18 |
Family
ID=31561041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989046184U Expired - Lifetime JPH0618467Y2 (ja) | 1989-04-21 | 1989-04-21 | 加熱蒸散装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0618467Y2 (cs) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0661205A (ja) * | 1992-08-11 | 1994-03-04 | Fujitsu Ltd | 半導体ウェハの研磨方法および研磨装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6169983U (cs) * | 1984-10-12 | 1986-05-13 | ||
JPH046548Y2 (cs) * | 1987-04-17 | 1992-02-21 |
-
1989
- 1989-04-21 JP JP1989046184U patent/JPH0618467Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0661205A (ja) * | 1992-08-11 | 1994-03-04 | Fujitsu Ltd | 半導体ウェハの研磨方法および研磨装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH02138577U (cs) | 1990-11-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |