JPH06181388A - Manufacture of multilayer ceramic board - Google Patents

Abstract

PURPOSE:To make possible a thinning of a circuit to minimize the number of green sheet layers and to make it possible to make high the bonding strength between the greent sheet layers by a method wherein chips made of gold are force fitted in the green sheets and gold wires are wired. CONSTITUTION:Chips, which are made of gold and have a size of about 100mum, are first force fitted in and are buried in green sheets 11a to 11d, which are sintered at a temperature under 1000 deg.C; at respective prescribed position on the sheets 11a to 11d as via holes. Then, component mounting pads 17 are formed on the sheet 11d using a conductor paste. In three sheets of the sheets 11a to 11c, gold wires 13 of a diameter of several terms Pure are subjected to ultrasonic bonding to the buried chips 12 made of gold and the chips 12 buried in at the prescribed positions are bonded together by these gold wires 13. That is, the gold wires 13 are wired using the chips as relay points to form a necessary circuit pattern. Then, after four sheets of the sheets are laminated in a prescribed order, the whole surface of the laminated material is pressed equally under a temperature of 300 to 350 deg.C to pressure bond the sheets and the laminated material is subjected to firing at temperature of 800 to 1000 deg.C to form a multilayer ceramic board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multi-layer ceramic substrate used as a substrate for mounting electronic parts to construct an electronic circuit.

[0002]

2. Description of the Related Art A multilayer ceramic substrate is capable of having a high number of layers of several tens, has high thermal conductivity, and is advantageous for direct mounting of silicon chips due to its small thermal expansion coefficient. It is often used as a substrate for ICs. As is well known, ceramic substrates include ceramic powder, organic solvents, binders, plasticizers, wetting agents,
And the like are kneaded to form a clay called slurry, formed into a flat sheet having a predetermined thickness by a method such as molding with a roller, dried, and then baked at a high temperature. The one that is kept until it is dried is called a green sheet,
A multilayer ceramic substrate is obtained by stacking these green sheets to form a multilayer. Ceramics have various compositions, but the most common one has a firing temperature of about 1500.
A multi-layer ceramic substrate was started to be made from this alumina ceramic as a material. However, since the firing temperature is extremely high, a high melting point metal such as molybdenum or tungsten having a melting point higher than the firing temperature is used for the conductor material forming the circuit.
Since these refractory metals have high electric resistance, signal loss is large and the circuit pattern cannot be made fine. Further, since air oxidization causes oxidation, calcination in a reducing atmosphere furnace is essential and the equipment becomes large-scale. Further, alumina ceramic has a high dielectric constant and is not suitable for high frequency circuits. In order to solve this problem, by adding glass and other substances to alumina ceramics and adjusting the composition and its component ratio, it is possible to fire at temperatures lower than 1000 ° C, and various ceramic materials with low dielectric constant have been developed. It has been. It becomes possible to fire at less than 1000 ° C, so that even if fired in air, it does not oxidize, and precious metals such as gold and silver, which have a relatively low electric resistance, can be used as conductor materials. Became. As described above, the materials of the ceramic substrate are roughly classified into two types according to the difference in firing temperature. One that is fired at a high temperature of 1500 ° C. is called a high temperature fired ceramic, and one that is fired at a temperature of less than 1000 ° C. is called a low temperature fired ceramic. Different. The high-temperature-fired multilayer ceramic substrate and the low-temperature-fired multilayer ceramic substrate are substantially the same in manufacturing process and multilayer method except that the ceramic material and the conductor material are different.

FIG. 12 is a cross-sectional view showing the structure of a conventional multilayer ceramic substrate. The green sheets 1a, 1b, 1c, 1 are shown in FIG.
This is an example in which the multilayer ceramic substrate 2 having a four-layer structure is constituted by four sheets of d, and the ceramic material may be either one for high temperature firing or one for low temperature firing. If the multilayer ceramic substrate 2 has been fired, four green sheets 1a are used.
The expressions 1d are integrated and the boundaries of the layers are not clear, so the expression "green sheet" is not appropriate, but for convenience of explanation of the structure, they are referred to as green sheets regardless of before and after firing. Circuit patterns 3a to 3d are formed on the green sheets 1a to 1d, respectively.
The circuit patterns 3a to 3c of 1c are the multilayer ceramic substrate 2
The inner layer pattern inside the green sheet 1d
The circuit pattern 3d in FIG. 2 includes a pad pattern for mounting components. Further, each of the green sheets 1b to 1d is provided with via holes 4b to 4d in a necessary portion, and the circuit patterns 3a to 3d of the green sheets 1a to 1d are three-dimensionally interconnected with the via holes 4b to 4d. The ceramic substrate 2 constitutes one circuit as a whole.

FIG. 13 is a perspective view showing the layer structure and manufacturing method of the one shown in FIG. 12, in which the green sheets 1b to 1d are first punched by a die into the through holes for the via holes 4b to 4d at predetermined positions. Provided by laser processing.
Next, the required circuit patterns 3a to 3d are formed on the green sheets 1a to 1d by the screen printing method by using a conductive paste made by kneading a metal powder as a conductive material and an organic solvent to form a paste. At the same time or separately, the conductive material is also filled in the through holes to form the via holes 4b.
4d is formed. Further, in order to ensure the connection between the circuit patterns 3a to 3d and the via holes 4b to 4d, the circuit pattern 3a is provided with a land pattern 5a having a partly enlarged pattern, and the land pattern 5b is provided around the via holes 4b and 4c. , 5c are formed. Green sheet 1d
In the above, since it is possible for a part of the circuit pattern 3d to function as a land pattern, it is not particularly necessary to provide it as a land pattern. The steps up to this point are performed separately for each of the four green sheets 1a to 1d, and then the four green sheets 1a to 1d are aligned and stacked at room temperature to
The entire surface is uniformly pressed under a temperature in the range of 100 ° C., and the abutting boundary surfaces of the green sheets 1a to 1d are pressed. When fired thereafter, the multilayer ceramic substrate 2 integrated and integrated by chemical reaction and crystallization on the boundary surface is completed.

[0005]

In the conventional multilayer ceramic substrate 2 as described above, in order to secure the connection between the via holes 4b and 4c and the circuit patterns 3a to 3d, the via holes are formed around the via holes 4b and 4c. It is necessary to form land patterns 5b and 5c having a diameter 3 to 5 times the diameter of the hole.
Further, in the lowermost green sheet 1a having no via hole, a part of the circuit pattern 3a is used as the land pattern 5a.
Must be formed as a connection pattern with the via hole 4b. Since this land pattern is much larger than the width of the circuit pattern, it is difficult to achieve high-density wiring.Therefore, the number of layers must be increased to secure the wiring area, and the higher the number of layers, the higher the manufacturing cost. There is a problem of becoming.

Further, since the printed pattern uses the conductor paste, there is a problem in that the circuit patterns 3a to 3d have a missing pattern, a blur, or a blur.

Further, in addition to the large land pattern as described above, the circuit pattern made of the conductor paste has a width of 100 μm or more at the minimum, so that the ratio of the applied area of the conductor paste to the area of the green sheet is high.
In particular, when a grid pattern is formed on the entire surface as a common signal source such as a power source or a ground as in the green sheet 1a of FIG. 13, the ratio of the coating area of the conductor paste is very high, and when the green sheet 1a is laminated, It is impossible to secure a sufficient fusion and integration area of the ceramics at the boundary surface with the green sheet 1b that overlaps with each other, so that the bonding strength between the layers of these two green sheets becomes weak, and the layers are damaged by thermal shock or mechanical shock. There is a problem that it is easy to peel off or chip.

It is an object of the present invention to obtain a multilayer ceramic substrate which enables a finer circuit and minimizes the number of layers of green sheets and has a high bonding strength between the layers of the green sheets.

[0009]

According to the present invention, a low-temperature firing green sheet having a sintering temperature of less than 1000 ° C. is used, and a via hole having a size of 100 μm is used.
About 10 m of a gold chip is press-fitted and embedded, and the gold chip is bonded by a gold wire thermosonic bonding method with a diameter of several tens of μm.
The gold chips at predetermined positions are connected by a gold wire to wire a circuit using the gold chips as relay points.

In addition, during lamination, a gold chip embedded as a via hole in a single green sheet or a gold wire laid on the gold chip and a green located above or below this green sheet. 3 with the gold chip embedded in the sheet or the gold wire laid on the gold chip
The pressure is applied at a temperature of 00 to 350 ° C. and thermocompression bonding is performed to form a three-dimensional circuit through the via hole of the gold chip.

Further, in one green sheet, the gold chips are press-fitted into the entire surface at a predetermined pitch both vertically and horizontally, and a gold wire is thermosonic bonded to the gold chips to form a row of gold chips. All of them are connected in a straight line and wired to form a single linear circuit. Similarly, for each of the columns and rows of the gold chip, a single linear circuit is similarly arranged to form a grid circuit. To form.

In the same manner as described above, using a green sheet in which gold chips are pressed into the entire surface at a predetermined pitch in both length and width and a gold mesh knitted in a plain weave for a predetermined target, the gold chips and the gold chips are used. The mesh is thermocompression bonded to form a grid-like circuit.

When the ceramic slurry is molded into a flat sheet, the gold mesh is embedded in the sheet, or the gold mesh is sandwiched between two green sheets and pressure-bonded. A green sheet with a built-in mesh is formed, and the gold chip is pressed into the green sheet as a via hole to form a grid-shaped circuit.

[0014]

Since the size of the via hole is about 100 μm and the width of the wiring is several tens of μm, the wiring density can be more than double that of the printed pattern. Further, even when wiring is performed on the entire surface of the green sheet like a grid-shaped circuit, the area occupied by the circuit pattern can be suppressed small.

Further, since the conductor paste is not used, problems such as pattern bleeding, chipping, and blurring relating to the pattern forming accuracy do not occur.

[0016]

【Example】

Example 1. FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a perspective view showing a layer structure and a manufacturing method of the one shown in FIG. 1, taking a case of four layers as an example. The multilayer ceramic substrate 10 is composed of four green sheets 11a to 11d, and the green sheets 11a to 11d are low temperature firing green sheets that are sintered at a temperature lower than 1000 ° C. As a method for producing a green sheet, the material composition and composition ratio differ between high temperature firing and low temperature firing, and the point is that a ceramic slurry is made, shaped into a flat plate with a predetermined thickness, and dried. Exactly the same. In the green sheets 11a to 11d, first, a disk type metal chip 12 having a diameter of about 100 μm or a square plate type having a side of about 100 μm is arranged as a via hole at a predetermined position by using a metal mask or the like and press-fitted. To embed. The via hole forming process is performed in the same manner for each of the green sheets 11a to 11d, but the circuit formation is different between the green sheets 11a to 11c which are the inner layers after the lamination and the green sheet 11d which is the outermost layer.
In 3 pieces of 11c, embedded gold chip 12
Then, a gold wire 13 having a diameter of several tens of μm is thermosonically bonded, and gold chips embedded at predetermined positions are connected by this gold wire 13. That is, the gold wire 13 is laid out using the gold chip 12 as a relay point to form the required circuit patterns 14a to 14c.

The thermosonic bonding is a method of mainly bonding gold and gold, and is a method of bonding and integrating a bonded object and an object by applying ultrasonic vibration at a temperature of 150 to 200 ° C. In the case of gold-to-gold bonding, thermocompression bonding is also possible, but in this case, it is a method of bonding and integrating gold members by applying pressure at a temperature of 300 to 350 ° C. The green sheet becomes brittle when left to stand at a temperature of 300 ° C. or higher, which makes it brittle, and even when laminated, it is difficult for the green sheets to fuse and integrate, so thermo-sonic bonding, which has a low temperature, was used. However, when the time of exposure to a temperature of 300 ° C. or higher is short, the change in the green sheet is small even at a temperature of 300 ° C., so thermocompression bonding can be adopted. FIG. 3 is a schematic diagram showing a method of laying the gold wire 13, 15 is an ultrasonic bonding tool to which ultrasonic vibration is applied, and 16 is a hot plate. For example, one green sheet 11a is
Heated to 150-200 ℃, and then gold chip 1
A gold wire 13 is applied to the second part, and this gold wire ultrasonic bonding tool 15
Ultrasonic vibration is applied to the tip of the and the pressure is applied to join the abutting portions of the gold tip 12 and the gold wire 13, and the gold wire is extended to the gold tip 12 at another position to be connected next,
The gold chip 12 and the gold wire 13 are thermosonic bonded again. With this, one line segment of the circuit pattern 14a is formed, and the gold wire 13 is fed to another gold chip 12 to be further connected, and a plurality of gold chips 12 are connected by thermosonic bonding. The circuit pattern 14a passing through is formed. Similarly, the circuit patterns 14b and 14c are formed on the green sheets 11b and 11c, respectively.

The green sheet 11 which becomes the outermost layer after lamination
As for d, parts will be installed eventually, so
It is necessary to form the component mounting pad 17, and the component mounting pad 17 is formed by a method such as printing a conductor paste as in the conventional example. Green sheet 11d
In order to connect the gold chip 12 embedded in the via hole to the component mounting pad 17 as a via hole, the component mounting pad 17 is formed by covering the gold chip 12 when printed. The green sheet 11d is used only for component mounting, and it is common to provide all the circuit patterns on the inner layer. However, when the circuit pattern is required, the component mounting pad 1
7 may be formed by printing together with the green sheet 11a.
Alternatively, it may be formed by laying the gold wire 13 in the same manner as in -11c. The process up to here is 4 green sheets 1
1a to 11d are performed separately, and then the four sheets are aligned and laminated, and the entire surface is evenly pressed at a temperature of 300 to 350 ° C. to separate the contact surfaces of the green sheets 11a to 11d. Crimp. The crimping of the green sheets themselves is exactly the same as the case of the conventional example, but in this crimping step, the gold chip 12 or the gold wire 13 of one green sheet and the position above or below this green sheet are positioned. Another green sheet of gold chips 12
Alternatively, thermocompression bonding with the gold wire 13 is simultaneously performed. For example, the gold chip 12 of the green sheet 11b and the circuit pattern 14a formed by the gold chip 12 and the gold wire 13 of the green sheet 11a have a plurality of contact points.
The gold chip 12 or the gold chip 12 and the gold wire 13 that come into contact with each other when pressed at a temperature of 0 to 350 ° C. are thermocompression bonded. Similarly, the gold members abutting each other between the four green sheets 11a to 11d are thermocompression bonded,
The gold chip 12 functions as a via hole, and four green sheets 11a to 11d form one three-dimensional circuit. 800-10 after crimping process
4 sheets of green sheets 11a-fired at a temperature of 00 ° C
The multilayer ceramic substrate 10 in which 11d is fused and integrated is formed.

Example 2. FIG. 4 is a plan view showing another embodiment of the present invention, and FIG. 5 is a sectional view of what is shown in FIG.
Here, for example, the green sheet 11a shown in FIG. 1 and FIG. 2 of the first embodiment is used, and gold chips 12 are embedded in the entire surface at equal intervals at a predetermined pitch in the vertical and horizontal directions, and then the gold chip 12 is used. Each of the gold chips 12 in one row, for example, a vertical row, which is constituted by (1) is sequentially connected by thermosonic bonding with the gold wire 13 similarly to the first embodiment. Do this for all other columns, then connect the rows of gold chips 12 in the same way with gold wires 13, and use the gold wires 13 that are laid in parallel in the vertical and horizontal directions to form a grid pattern. The circuit 18 is formed. When laying the vertical rows first and then the horizontal rows, each gold tip 12
Since the gold wire 13 for connecting the vertical row has already been joined to, the gold wire 13 for connecting the horizontal row must be superposed on the gold wire 13 laid in the vertical row by thermosonic bonding. However, there is no problem in the thermosonic bonding of the gold wires 13. FIG. 6 shows a usage example of the grid-shaped circuit 18 thus formed on one green sheet 11a. The grid-shaped circuit 18 is used as a common signal layer such as a power source and a ground as one of a plurality of green sheets such as the multilayer ceramic substrate 10 shown in FIGS. The pressure bonding and firing steps are the same as in Example 1. In this example, the grid-shaped circuits are formed by the vertical and horizontal rows of the gold chips 12, but it is also possible to form the grid in a diagonal arrangement.

Example 3. FIG. 7 shows a grid-shaped circuit 1 according to the second embodiment.
8 is a perspective view showing another method of forming 8, and FIG. 8 is a cross-sectional view of what is shown in FIG. 7. As the green sheet, the green sheet 11a is used as in the second embodiment. 19 is a gold mesh made by plain weaving a gold wire with a thickness of a few dozen μm, and the opening width is
Set as desired. Similar to the second embodiment, the green sheet 11a is filled with gold chips 12 at equal intervals in both vertical and horizontal directions, and the gold mesh 1 is formed.
9 is put on this green sheet 11a, and 300-350
The green sheet 11 is pressed evenly over the entire surface at a temperature of ℃.
All of the contact points of the gold chips 12 and the gold mesh 19 embedded in a are thermocompression bonded at the same time to form a grid-like circuit on the entire surface of the green sheet 11a. The gold mesh 19 can be prepared and stored in advance irrespective of the manufacturing process of the multilayer ceramic substrate, and the grid-shaped circuit 18 can be formed only by cutting it into a size necessary for manufacturing the multilayer ceramic substrate. You can

Example 4. FIG. 9 shows Example 2 or Example 3.
A grid-like circuit 18 used as a common signal layer in the same manner as
9 is a cross-sectional view showing still another method of forming
FIG. 6 is a perspective view showing a manufacturing method of the one shown in FIG. Reference numeral 20 denotes a green sheet for low temperature firing similar to that used in Examples 1 to 3. This green sheet 20
And two gold meshes 1 similar to those used in Example 3
9, a gold mesh 19 is sandwiched between the two green sheets 20, and the entire surface is uniformly pressed at a temperature of 100 to 150 ° C., which is sufficient for pressing the green sheets together.
A green sheet 21 containing the gold mesh 19 is formed. As it is, the gold mesh 19 is covered with the green sheet 20 and insulated, so that the gold chip 12 is press-fitted into a predetermined place as a via hole in order to function as a common signal layer. Gold mesh 19 at this point
And the gold chip 12 are only in contact with each other and are not joined, but when the lamination and pressure bonding steps as the multilayer ceramic are performed in the same manner as in Examples 1 to 3, the green sheet with the built-in gold mesh is formed. At the same time as another green sheet gold chip 12 or gold wire 13 overlapping 21 is thermocompression bonded at a temperature of 300 to 350 ° C., a gold mesh 19 is formed.
And the gold chip 12 are also thermocompression bonded. This gold mesh built-in green sheet 21 can be prepared and stored in advance irrespective of the manufacturing process of the multilayer ceramic substrate, and the gold chip 12 is cut by cutting it into a size necessary for manufacturing the multilayer ceramic substrate. The grid-shaped circuit 18 can be formed only by embedding.

Embodiment 5. FIG. 11 shows another manufacturing method of the gold mesh built-in green sheet 21 of Example 4, 22 is a slurry of low temperature firing ceramic, and the slurry 22 which has passed through the roller 23 of the sheet molding machine is a flat sheet. Is molded into. At this time, the same gold mesh 19 as that used in Examples 3 and 4 was supplied together with the slurry 22, and the molding sheet 24 containing the gold mesh 19 therein.
Is formed, and the molded sheet 24 is dried to form the gold mesh built-in green sheet 21. Similar to the case of the fourth embodiment, the gold mesh built-in green sheet 21 can be prepared and stored in advance regardless of the manufacturing process of the multilayer ceramic substrate, and has a size required for manufacturing the multilayer ceramic substrate. The grid-shaped circuit can be formed by simply cutting the metal into a chip and press-fitting the gold chip 12.

[0023]

As described above, the present invention is described below because a gold chip having a size of about 100 μm is press-fitted as a via hole and a circuit pattern is a gold wire having a diameter of several tens of μm. It has the effect of

Since the circuit pattern density in one green sheet can be easily increased to more than double that in the case of the conventional printing pattern, the number of layers of the green sheet can be reduced and the pattern formation can be achieved. Since there is no chipping, fading, or bleeding of the pattern in, the yield can be improved and the production cost can be reduced.

Further, even when the density of the circuit pattern is increased by utilizing the above advantages, or even when the grid-like circuit used as a common signal layer such as a power source or a ground is formed, the gold wire constituting the circuit is extremely difficult. Since it is very thin, the area occupied as a circuit pattern can be kept small, so that the fusion of ceramics in the laminated green sheets and the integration area can be secured large enough,
The gold wire bites into the upper and lower green sheets due to the pressure applied during lamination and pressure bonding, and an anchor effect is produced, so that a multilayer ceramic substrate in which delamination is difficult can be obtained.

[Brief description of drawings]

FIG. 1 is a sectional view showing a first embodiment of the present invention.

FIG. 2 is a perspective view showing a first embodiment of the present invention.

FIG. 3 is a schematic diagram showing a method of laying a gold wire in Examples 1 and 2 of the present invention.

FIG. 4 is a plan view showing a second embodiment of the present invention.

FIG. 5 is a sectional view showing a second embodiment of the present invention.

FIG. 6 is a perspective view showing a second embodiment of the present invention.

FIG. 7 is a perspective view showing a third embodiment of the present invention.

FIG. 8 is a sectional view showing Embodiment 3 of the present invention.

FIG. 9 is a sectional view showing Embodiment 4 and Embodiment 5 of the present invention.

FIG. 10 is a perspective view showing Embodiment 4 of the present invention.

FIG. 11 is a schematic diagram showing Embodiment 5 of the present invention.

FIG. 12 is a sectional view showing a structure of a conventional multilayer ceramic substrate.

FIG. 13 is a perspective view showing a layer structure and a manufacturing method of a conventional multilayer ceramic substrate.

[Explanation of symbols]

 1 Green Sheet 2 Multilayer Ceramic Substrate 3 Circuit Pattern 4 Via Hole 5 Land Pattern 10 Multilayer Ceramic Substrate 11 Green Sheet 12 Gold Chip 13 Gold Wire 14 Circuit Pattern 15 Ultrasonic Bonding Tool 16 Hot Plate 17 Component Mounting Pad 18 Lattice Circuit 19 Gold mesh 20 Green sheet 21 Gold mesh built-in green sheet 22 Slurry 23 Roller 24 Molded sheet

Claims (5)

[Claims] 1. A method for manufacturing a multi-layer ceramic substrate, which is formed by laminating and firing a plurality of green sheets, and a plurality of green sheets having a sintering temperature of less than 1000 ° C. and a disc type having a diameter of about 100 μm or One side 100
Using a plurality of square plate-shaped gold chips of about μm, press the gold chips into predetermined positions on all of the plurality of green sheets, and then press the plurality of green sheets. Among them, at least a component mounting pad is formed by using a conductor paste on the green sheet which is the outermost layer when laminated, and a gold wire having a diameter of several tens of μm is used for all the green sheets which are the inner layer when laminated. While wiring the desired circuit with a plurality of gold chips press-fitted in a predetermined position as a relay point as described above, the contact points of the gold wire and the plurality of gold chips are thermosonic bonded, After laminating the green sheet on which the component mounting pads are formed as described above and the green sheet on which the circuit of the gold wire is laid in a predetermined order, the front surface is uniformly applied at a temperature of 300 to 350 ° C. Press and crimp, 80 A method for manufacturing a multi-layer ceramic substrate, which is formed by firing at a temperature of 0 to 1000 ° C. 2. A gold chip similar to the above is press-fitted onto the entire surface of one of the green sheets at a predetermined interval, and all of the plurality of gold chips lined up in a row using the same gold wire as described above. A single linear circuit that serves as a relay point is laid out, and the contact points between the gold wire and a plurality of gold chips are thermosonically joined together, and all are made up of a plurality of gold chips that are press-fitted in the same manner. 2. A multi-layer ceramic substrate according to claim 1, wherein one linear circuit is laid in each of the vertical and horizontal rows, and a lattice-shaped circuit is formed by a plurality of linear circuits laid in the vertical and horizontal directions. Method. 3. A gold mesh in which a gold wire similar to the above is plain-woven into a lattice shape, and the gold mesh is pressed into a single green sheet on the entire surface at predetermined intervals in the same manner as described above. The stacking, the entire surface is uniformly pressed at a temperature of 300 to 350 ° C., and the plurality of contact points of the gold chip and the gold mesh are thermocompression bonded to each other to form a grid-shaped circuit. A method for manufacturing the multilayer ceramic substrate as described above. 4. A ceramic slurry is formed into a sheet and dried to produce a green sheet. In a sheet forming step, a gold mesh similar to the above is inserted into the ceramic slurry to form and dry the sheet. A green sheet with a built-in gold mesh is formed, and then the above-mentioned gold chips are pressed into the entire surface of the green sheet with a built-in gold mesh at a predetermined interval to be built into the gold chip and the green sheet. The method for manufacturing a multilayer ceramic substrate according to claim 1, wherein a lattice-shaped circuit is formed by using the gold mesh. 5. The same two green sheets that are sintered at less than 1000 ° C. as described above are used, and the same gold mesh as the above is sandwiched between the two green sheets and pressure-bonded, and the gold mesh is built in. Formed into a green sheet, and then the gold chips are pressed into the entire surface of the green sheet containing the gold mesh at a predetermined interval to form the gold chip and the gold mesh embedded in the green sheet. The method for manufacturing a multilayer ceramic substrate according to claim 1, wherein the lattice-shaped circuit is formed by.