JPH06181372A - Printed-substrate mounting method - Google Patents

Abstract

PURPOSE:To enhance the storage capacity of inner and outer cables of the title printed-substrate packaged on the card frame of an electronic equipment, the characteristics of the parts to be adjusted and the radiating capacity of the same. CONSTITUTION:The mother board 2 of a card frame 1 is inclined at a specific angle so that certain spaces may be allowed right side and left side as well as printed substrates may be mutually provided with stepped parts in the card frame 1 thereby enabling the card frame 1 to be provided with a storage part of cables. Furthermore, the space for the part 9 to be adjusted can be allowed while enhancing the part radiating effect and the spacing efficiency by inclining the mother board 2 at a specific angle.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a control device for controlling an electronic device, and a card (printed circuit board) frame using a plurality of printed circuit boards on which electronic parts are mounted and a motherboard on which the printed circuit boards are mounted. When configuring,
The present invention relates to a mounting method for a printed circuit board.

[0002]

2. Description of the Related Art Generally, electronic parts such as integrated circuits used in control devices for controlling electronic equipment are mounted on a plurality of printed circuit boards according to the circuit scale, and the plurality of printed circuit boards are mounted on the printed circuit boards. It is inserted into a unit for mounting a printed circuit board called a card frame which is integrated with a mother board for supplying a common power source and signals between the printed circuit boards. FIG. 6 is a plan view showing a conventional printed circuit board mounting method, in which 1 is a card frame and 2 is a card frame.
Is a mother board, 3a to 3n are printed boards on which electronic parts are mounted, 4 is a B / B connector for connecting the mother board to the printed board, 5 is a cable (internal) for connecting the printed boards, and 6 is the printed board to the card. A cable (external) that connects to a device outside the frame,
Reference numeral 7 is a circuit component mounted on a printed circuit board, 8 is a connector for connecting a cable, and 9 is a component requiring adjustment for test adjustment of the printed circuit board alone or a group of a plurality of printed circuit boards. Hereinafter, description will be given with reference to the drawings.

These printed circuit boards 3a to 3n are mounted on the card frame 1 generally with a certain interval D in order to facilitate mounting and prevent temperature rise. The printed circuit boards 3a to 3n mounted on the card frame 1 are provided with ventilation fans (not shown) above and below or left and right of the card frame 1 in order to discharge heat generated in the circuit components 7 during movement. I try to get a cooling effect. In front of the printed circuit boards 3a to 3n, there is provided a connector 8 for connecting the printed circuit boards 3a to 3n to each other with a cable 5 or a cable 6 from the outside.

Further, since the printed boards 3a to 3n require electrical adjustment, it is general that the parts 9 required for the adjustment are arranged in front. Due to the distance D, a large component cannot be mounted on the adjustment-required component 9, so that all the adjustments from the front cannot be performed. FIG. 4 is a perspective view of a large electronic device, and FIG. 5 is a perspective view of a small electronic device.

[0005]

In the conventional printed circuit board mounting method configured as described above, when the cables are connected to each other or from the outside, the space on the cable connection side is small and the cable can be easily accommodated. Not. In addition, the adjustment of the printed circuit board alone or the adjustment-required components for adjusting the entire apparatus are in the printed circuit boards, and the adjustment is extremely difficult. The printed circuit board is in the same position (the direction in which the component mounting surfaces of the printed circuit board overlap)
Since it is mounted on, there are many problems such as it is difficult to cool parts having a large heat radiation amount.

The present invention has been made to solve the above problems, and provides a printed circuit board mounting method for improving the accommodation of cables, the maintainability of parts requiring adjustment, and the heat dissipation of parts. is there.

[0007]

The printed circuit board mounting method of the present invention is such that a step is formed on the printed circuit board by inclining the mother board of the card frame at an angle. This step is effectively used to solve the above problems.

[0008]

[Function] By deciding the left and right mounting positions of the card frame according to the characteristics of the printed circuit board, such as the number of connectors on the printed circuit board and the heat dissipation parts, the cable can be easily accommodated and the heat dissipation can be improved. Adjustment) and adjustment of the entire device can be facilitated. Further, another unit can be placed in the space formed on the motherboard side, which is space efficient.

[0009]

【Example】

Example 1. An embodiment of the present invention will be described below with reference to FIGS. 1 and 2 are plan views showing a printed circuit board mounting method applied to large and medium-sized electronic devices according to the present invention, and FIG. 3 is a side view showing a printed circuit board mounting method applied to small electronic devices. 1 and 2 are the left and right reversed, and have the same technical idea. The printed circuit board is mounted in the vertical direction, and the ventilation flows in the vertical direction. In FIG. 3, the printed circuit board is mounted horizontally, and the ventilation flows in the left and right directions. Even in large and medium-sized electronic devices,
It goes without saying that horizontal mounting is also possible. Also, in a small electronic device, vertical mounting may be performed.

In FIG. 1, the same parts as those in the conventional example are designated by the same reference numerals, and the description thereof will be omitted. A mother board 2 is attached to the card frame 1, and printed circuits 3 a to 3 n are fitted to the BB connector 4 mounted on the mother board 2 to generate a circuit. The printed circuit boards 3a to 3n are not orthogonal to the mother board 2 but are mounted on the mother board 2 with an inclination as shown in the drawing. As a result, a step C is generated between the spaces A and B and the printed circuit board as shown in the figure.

By arranging the cables 5 and 6 connected to the printed circuit boards or to the outside to the space A side as much as possible, the storability of the cables 5 and 6 is improved, and the maintainability and the ease of mounting are improved. By arranging the adjustment-required component 9 of the printed circuit board on the front side of the printed circuit board, it becomes possible to perform adjustment while viewing from the side due to the step C. Conventionally, there have been inconveniences such as wasting time for removing the printed circuit board to be adjusted, mounting an extension card, fitting the printed circuit board to the extension card for adjustment, and turning off the power once. In order to improve the heat dissipation of the parts, the parts that generate heat are
The step C can be effectively used by arranging the step C at the same position.

Ventilation with an increased temperature passes between the printed circuit boards. Ventilation with no temperature increase flows in a wider space than before, which leads to further improvement in heat dissipation. As a result, a space-efficient card frame can be provided in which a separate unit such as a power source can be arranged.

[0013]

As described above, by providing the printed circuit board mounting method of the present invention, effects such as improvement in the accommodation of the cable, improvement in the ease of adjustment of adjustment-required parts, improvement in heat dissipation of parts, and improvement in space efficiency can be obtained. is there.

[Brief description of drawings]

FIG. 1 is a plan view of a printed circuit board mounting method applied to large and medium-sized electronic equipment according to an embodiment of the present invention.

FIG. 2 is a symmetry diagram of FIG.

FIG. 3 is a side view of a printed circuit board mounting method applied to a small electronic device according to an embodiment of the present invention.

FIG. 4 is a perspective view of a large-medium-sized electronic device.

FIG. 5 is a perspective view of a small electronic device.

FIG. 6 is a plan view showing a conventional printed circuit board mounting method.

[Explanation of symbols]

 1 Card Frame 2 Motherboard 3a to 3n Printed Circuit Board 4 BB Connector 5 Cable (Internal) 6 Cable (External) 7 Circuit Parts 8 Connector 9 Adjustment Required Parts A, B Space

Claims (3)

[Claims] 1. In a mounting method of mounting a plurality of printed circuit boards on which electronic components are mounted on a mother board that supplies a power source common to these printed circuit boards and a signal that extends between the printed circuit boards, to fit the printed circuit boards. The surface of the motherboard on which the connector of
A printed circuit board mounting method characterized in that the printed circuit board has an inclination with respect to an insertion surface of the printed circuit board. 2. The printed circuit board mounting method according to claim 1, wherein a surface of the connector in contact with the mother board has the same inclination as that formed by the printed circuit board and the mother board. 3. The size of the printed circuit boards is the same, and the printed circuit boards to which a cable for transmitting a signal from the connector on the printed circuit boards is connected to the motherboard when the printed circuit boards are mounted on both ends of the motherboard. When a line orthogonal to the insertion surface of the printed circuit board is drawn from the midpoint of the side of the parallelogram formed by the printed circuit board facing the mother board, the straight line does not intersect the parallelogram. The printed circuit board mounting method according to claim 1, wherein mounting is performed from a position far from the point.