JPH05160584A - Mounting system of mother board for communication equipment - Google Patents

Abstract

PURPOSE:To shorten a wiring distance for connecting a signal between both and to prevent deterioration, delay, etc., of a signal by mounting a daughter board group and a large-scale integration module group on first and second surfaces of a mother board. CONSTITUTION:A mother board is installed by crossing its lateral direction, and a daughter board 5 contained in parallel with the shelf is connected by a connector in a book shelf type to a first surface 1a. On the other hand, a integration module 6 such as many multichip modules, etc., are flat surface- mounted on a second surface 1b. A signal transmission between a component on one daughter board 5 and a component on the other daughter board is heretofore executed always through a wiring pattern on a mother board, but with this structure, in the case of the module 6 flat surface-mounted on the second surface of the mother board, a signal can be connected directly to the board 5, and a wiring distance may be short.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a new mounting method for a mother board which constitutes a communication device such as an electronic exchange.

[0002]

2. Description of the Related Art In recent years, communication services in the field of telecommunications have become more and more diversified, and a high processing capability has been required for communication devices in association with an increase in the amount of communication information. In order to realize these social demands, the technology of highly integrating electronic circuit parts has advanced, the miniaturization of the device body has been realized, and the transmission system has changed from analog to digital. Further, with the widespread use of moving image communication such as a videophone, miniaturization of devices by high-speed digital signal processing and high-density mounting is being accelerated.

On the other hand, the failure of the communication system in the information society is a serious problem that paralyzes the social function, and the demand for the reliability of communication equipment is increasing more and more. As shown in FIG. 8, many conventional communication devices are configured by stacking and mounting units, which accommodate a large number of daughter boards 21 in a bookshelf system in a shelf 20, on a frame 26.
It was easy to maintain and excellent in mounting efficiency, and there were many points that contributed to downsizing of the device. In the case of analog communication or low-speed digital communication, since the signal transmission speed between electronic circuit elements is relatively slow, it is not necessary to pay much attention to the wiring distance between each component. For this reason, in the conventional bookshelf mounting, as shown in FIG. 9, a common motherboard 22 is attached in a direction orthogonal to a plurality of daughter boards 21, and connector pins mounted through the motherboard 22 are attached. The connector 25 of the daughter board 21 is connected to the connector 23 that is provided, and the electronic components mounted on the daughter boards 21 are signal-connected to each other via the wiring pattern on the motherboard 22. In addition,
Since the pins 24 of the connector for connecting an external line are projected on the rear surface side of this mother board, there is no space for mounting electronic parts and the like on this surface, and it is used exclusively for wiring.

[0004]

However, high-speed digital communication, which is expected to develop in the future, requires high-speed signal processing, which causes a long wiring distance between circuit elements and a signal transmission delay. There is also a fear that the digital signal may pass through many connectors, and there is a concern that the signal may be deteriorated or the noise may be affected. Therefore, it is required to electrically connect the circuit elements as close as possible to each other with short wiring.

Another problem in high-speed digital communication is that a large number of electronic parts such as LSI whose gate scale is an order of magnitude larger than the conventional one are used, so that the amount of heat generated during operation is significantly larger than that of the conventional one. There is a need for more efficient cooling means. The present invention solves the above-mentioned problems of the conventional technology, and is suitable for high-speed digital communication. The signal wiring distance between electronic circuit elements is as short as possible, and moreover, a mother board capable of efficiently cooling high-heat-generating electronic components. The purpose is to provide a new mounting method.

[0006]

The object of the present invention is to provide a motherboard in which a plurality of daughter boards are accommodated in parallel in a shelf in a bookshelf type and the rear side of the shelf is installed orthogonally to the arrangement direction of the daughter boards. On one side,
Each daughter board is connected through a group of first connectors to perform signal connection between daughter boards to form a unit, and a plurality of the units are stacked and mounted on a frame to form a communication device. On the other surface of the mother board, a group of second connectors electrically and structurally independent of the first connector is mounted, and a highly integrated module is connected to the second connector for planar mounting, and In this way, the forced cooling means for cooling the heat generation of the highly integrated module group mounted on the motherboard is installed in the space on the back side of the frame, which is achieved by the mounting method of the motherboard of the communication device. It

[0007]

The respective daughter boards are mounted on one surface of the mother board through the first connector and are connected to each other for signal connection, and the other highly integrated modules are separately arranged on the other surface through the second connector. It is mounted and has a direct signal connection to the daughter board. Signal connections are made from each daughter board to these highly integrated modules directly over short distances through printed wiring on the surface of the motherboard. Therefore, the signal transmission speed is improved and the deterioration of the signal is prevented.

Further, since the forced cooling means is installed only for the highly integrated module group mounted intensively on the rear surface side of the mother board, the forced cooling means can be constructed in a relatively small size. In addition, efficient cooling can be performed. Hereinafter, the present invention will be described in more detail with reference to the preferred embodiments shown in the drawings.

[0009]

1 is a sectional view of a mother board used in the present invention. A large number of connector pins 2a are fixed to the first surface 1a of the mother board 1 by press-fitting as usual, and constitute a connector 2 for mounting a daughter board on a bookshelf. A large number of connector pins 3a are fixed to the second surface 1b on the opposite side by press-fitting to form a connector 3 for planarly mounting the highly integrated module. These connector pins 2a and 3a are electrically and structurally independent of each other, and each is signal-connected to the wiring pattern 4 inside the motherboard 1.

The mother board 1 thus constructed is installed in the shelf across the width thereof, and as shown in FIG. 2, a daughter board 5 accommodated in parallel with the shelf is provided on the first surface 1a. It is connected to the bookshelf connector. On the other hand, the highly integrated module 6, on the second surface 1b,
For example, many multi-chip modules and the like are mounted on a plane. FIG. 3 shows an example of the unit 7 thus configured in units of shelves.

With this configuration, conventionally, signal transmission between a component on one daughter board 5 and a component on another daughter board was always performed via the wiring pattern on the motherboard 1. In the case of the highly-integrated modules 6 which are concentrated and planarly mounted on the second surface of the mother board, the signal connection can be made directly to the daughter board 5, and the wiring distance can be short.

A plurality of the units 7 are combined and stacked on the frame 11 to form one system. An example thereof is shown in FIGS. As shown in the side view of FIG. 5, an electronic circuit component having a relatively small amount of heat generation is mounted on the daughter board 5 and arranged on the first surface 1a side of the mother board 1 while the heat generation is performed. A large amount of highly integrated modules 6 are collectively and planarly mounted on the second surface 1b of the backboard, and the rear area of the internal space of the frame 11 with the vertical surface on which the backboard group is arranged sandwiching the entire system The heat generation amount in A is overwhelmingly larger than that in the front region B.

In the present invention, the daughter board 5 is cooled by the conventional forced convection method in which the structure facilitated by the cooling fan 8 installed on the upper and / or lower portion of the frame 11 is simple. The cooling for the highly integrated module 6 is performed by the blower 9 as shown in the perspective view in FIG.
And an air duct 10, which is a separate system from the air collision type. As a result, the highly-integrated module 6 in any position is not affected by the air heated by cooling the other modules, and fresh air having a low temperature is constantly supplied from the blowing nozzle 10a of the duct. Efficiently cooled.

In order to further improve the cooling efficiency, the length of the blowing nozzle 10a is changed according to the position to form a plurality of groups, and the module 6 is cooled between the groups to warm the air. The discharge flow path may be formed.

[0015]

As described above in detail, according to the motherboard mounting method of the present invention, the daughter board group and the highly integrated module group are mounted on the first and second surfaces of the motherboard, respectively. The wiring distance for connecting signals between them can be short, and deterioration and delay of signals can be prevented.

Furthermore, since the components on the daughter board having a relatively low heat generation and the highly integrated module having a high heat generation are collectively installed in separate areas in the frame with the mother board as a boundary, they are respectively installed. As the most efficient cooling method, the forced convection method can be adopted for the former and the air collision type method can be adopted for the latter.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a motherboard structure used in the present invention.

FIG. 2 is a side view showing a state of connector connection to the motherboard of the present invention.

FIG. 3 is a perspective view showing a configuration of a unit according to the method of the present invention.

FIG. 4 is a front view of a system constructed according to the method of the present invention.

FIG. 5 is a side view of the same.

FIG. 6 is a rear view of the same.

FIG. 7 is a perspective view of the back side of the same.

FIG. 8 is an exploded perspective view of a configuration of a conventional bookshelf system.

FIG. 9 is a perspective view showing a rear structure of a conventional motherboard.

[Explanation of symbols]

 1 ... Motherboard 2 ... Daughter board connector 2a ... Connector pin 3 ... Module connector 3a ... Connector pin 4 ... Wiring pattern 5 ... Daughter board 6 ... Highly integrated module 7 ... Unit 8 ... Cooling fan 9 ... Blower 10 ... Air duct 10a … Blowout nozzle 11… Frame

Claims (3)

[Claims] 1. A motherboard (1) in which a plurality of daughter boards (5) are accommodated in parallel in a shelf in a bookshelf type, and which is installed on the back side of the shelf at right angles to the arrangement direction of the daughter boards (5). ) One side (1a)
In addition, each daughter board (5) is connected through a group of first connectors (2) to perform signal connection between the daughter boards to form a unit (7), and a plurality of the units (7) are connected. A communication device is formed by stacking and mounting on a frame (11), and is electrically and structurally independent of the first connector (2) on the other surface (1b) of the motherboard (1). The second connector (3) of the above group is mounted, and the highly integrated module (6) is connected to the second connector (3) for planar mounting. Further, the highly integrated module (6) mounted on the motherboard (1) in this way. ) A mounting method for a mother board of a communication device, wherein forced cooling means (9, 10, 10a) for cooling the heat generation of the group is installed in a space on the back side of the frame (11). 2. The forced cooling means (9, 10, 10a)
The mounting method according to claim 1, wherein is an air collision type method. 3. The mounting method according to claim 1, wherein a cooling means (8) of a system different from the forced cooling means is installed to cool the daughter board (5) group.