JPH06177506A - Manufacture of circuit substrate and circuit substrate manufacturing composite solder material - Google Patents
Manufacture of circuit substrate and circuit substrate manufacturing composite solder materialInfo
- Publication number
- JPH06177506A JPH06177506A JP35266592A JP35266592A JPH06177506A JP H06177506 A JPH06177506 A JP H06177506A JP 35266592 A JP35266592 A JP 35266592A JP 35266592 A JP35266592 A JP 35266592A JP H06177506 A JPH06177506 A JP H06177506A
- Authority
- JP
- Japan
- Prior art keywords
- circuit substrate
- circuit board
- circuit
- brazing material
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、大電力電源回路に用い
られるインバーター等に組み込まれる回路基板の製造方
法及び回路基板製造用複合ろう材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a circuit board incorporated in an inverter or the like used in a high-power power supply circuit, and a composite brazing material for manufacturing a circuit board.
【０００２】[0002]
【従来の技術】従来、上記回路基板を製造するには、図
５に示すようにセラミックスの基板１上に活性金属のペ
ーストろう２をスクリーン印刷してパターンを形成し、
次に図６に示すようにＣｕ板３を接合し、然る後Ｃｕ板
３にレジスト塗布してパターン形成後エッチング加工し
て図７に示すように回路４を形成して回路基板５を作っ
ている。2. Description of the Related Art Conventionally, in order to manufacture the above circuit board, as shown in FIG. 5, an active metal paste solder 2 is screen-printed on a ceramic substrate 1 to form a pattern,
Next, the Cu plate 3 is joined as shown in FIG. 6, and then the Cu plate 3 is coated with a resist, and after pattern formation is etched, a circuit 4 is formed as shown in FIG. 7 to form a circuit board 5. ing.
【０００３】ところで、かかる回路基板の製造方法で
は、セラミックスの基板１上に活性金属のペーストろう
２をスクリーン印刷してパターンを形成するのに手間隙
がかかり、能率が悪い。即ち、ペーストろう２の作成に
始まって、スクリーン印刷、乾燥、ろう付けに至るまで
に多くの時間と手間がかかり、生産性が悪い。また形成
されたろうパターンにＣｕ板３をろう付けにて接合した
後、Ｃｕ板３をエッチング加工して回路４を形成するの
で、ろうパターンと回路４とにずれが生じ、回路４の接
合強度が不十分となり、且つ回路４の寸法精度が悪かっ
た。By the way, in such a circuit board manufacturing method, it takes a lot of time to screen-print the active metal paste solder 2 on the ceramic substrate 1 to form a pattern, which is inefficient. That is, it takes a lot of time and labor from the preparation of the paste wax 2 to the screen printing, drying and brazing, and the productivity is poor. Further, after the Cu plate 3 is joined to the formed brazing pattern by brazing, the Cu plate 3 is etched to form the circuit 4, so that a gap occurs between the brazing pattern and the circuit 4, and the joining strength of the circuit 4 is increased. It became insufficient and the dimensional accuracy of the circuit 4 was poor.
【０００４】[0004]
【発明が解決しようとする課題】そこで本発明は、能率
良く製造でき、しかも回路の接合強度及び寸法精度の高
い回路基板を製造できる方法及び回路基板製造用複合ろ
う材を提供しようとするものである。SUMMARY OF THE INVENTION Therefore, the present invention is intended to provide a method and a composite brazing material for producing a circuit board, which are capable of producing a circuit board having a high bonding strength and dimensional accuracy of a circuit, which can be manufactured efficiently. is there.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
の本発明の回路基板の製造方法は、セラミックスの基板
上に、Ｃｕ板に活性金属ろうの薄板をクラッドした複合
ろう材を、活性金属ろうの薄板側で接合し、然る後複合
ろう材をエッチング加工して回路を形成することを特徴
とするものである。また、本発明の回路基板製造用複合
ろう材は、Ｃｕ板に、活性金属ろうの薄板をクラッドし
てなるものである。A method for manufacturing a circuit board according to the present invention for solving the above-mentioned problems is to provide a composite brazing material obtained by clad a thin plate of an active metal braze on a Cu plate on a ceramic substrate. It is characterized in that the thin plate side of the brazing material is joined, and then the composite brazing material is etched to form a circuit. Further, the composite brazing material for producing a circuit board of the present invention comprises a Cu plate clad with a thin plate of an active metal brazing material.
【０００６】[0006]
【作用】上記のように本発明の回路基板の製造方法は、
Ｃｕ板に活性金属ろうの薄板をクラッドした複合ろう材
を活性金属ろうの薄板側でセラミックスの基板に接合す
るので、従来のようにペーストろうの作成、ペーストろ
うのスクリーン印刷、乾燥、ろう付け等の工程は不要で
あるので、これに要した多くの時間と手間が省ける。ま
た、セラミックスの基板に接合した複合ろう材をエッチ
ング加工して回路を形成するので、Ｃｕ板と活性金属ろ
うは一体にパターンが形成されて位置ずれがない。従っ
て、回路の接合強度及び寸法精度の高い回路基板が能率
良く製造できて、生産性が良い。なお、クラッドした複
合ろう材は、二層に限らず三層等の多層複合ろう材でも
同様である。As described above, the circuit board manufacturing method of the present invention is
Since the composite brazing material in which the thin plate of the active metal brazing is clad on the Cu plate is joined to the ceramic substrate on the thin side of the active metal brazing, paste brazing, screen printing of paste brazing, drying, brazing etc. Since the step of is unnecessary, much time and labor required for this can be saved. Further, since the circuit is formed by etching the composite brazing material bonded to the ceramic substrate, the Cu plate and the active metal brazing material are integrally formed with a pattern, and there is no displacement. Therefore, a circuit board having high circuit bonding strength and dimensional accuracy can be efficiently manufactured, and the productivity is good. The clad composite brazing material is not limited to two layers and may be a multi-layer composite brazing material such as three layers.
【０００７】[0007]
【実施例】本発明の回路基板の製造方法及び回路基板製
造用複合ろう材の一実施例について説明する。先ず、回
路基板製造用複合ろう材について説明すると、図１に示
すように厚さ0.3mm、幅30mm、長さ50mmのＣｕ板６に、
厚さ0.05mm、幅30mm、長さ50mmのＡｇ71％Ｃｕ27％Ｔｉ
２％よりなる活性金属ろうの薄板７をクラッドして複合
ろう材８を構成している。EXAMPLE An example of a method for manufacturing a circuit board and a composite brazing material for manufacturing a circuit board according to the present invention will be described. First, the composite brazing material for manufacturing a circuit board will be described. As shown in FIG. 1, a Cu plate 6 having a thickness of 0.3 mm, a width of 30 mm, and a length of 50 mm is prepared.
0.05mm thick, 30mm wide, 50mm long Ag71% Cu27% Ti
A composite brazing filler metal 8 is constructed by clad a thin plate 7 of active metal brazing composed of 2%.
【０００８】この複合ろう材８を用いる回路基板の製造
方法について説明すると、図２に示す厚さ 0.5mm、幅30
mm、長さ50mmのＡｌＮのセラミックス基板１上に、図１
に示す複合ろう材８を活性金属ろうの薄板７側で１×10
-5Ｔｏｒｒの真空炉で 820℃、10分間かけて図３に示す
ようにベタ付けにて接合し、レジスト塗布してパターン
形成後複合ろう材８を図４に示すように弗化水素酸をエ
ッチング液に用いてエッチング加工し、回路９を形成し
て回路基板10を得た。A method of manufacturing a circuit board using the composite brazing material 8 will be described. A thickness of 0.5 mm and a width of 30 are shown in FIG.
1 mm on the ceramic substrate 1 made of AlN with a length of 50 mm.
The composite brazing material 8 shown in Fig. 1 is applied to the active metal brazing thin plate 7 side at 1 ×
-5 Torr in a vacuum furnace at 820 ° C. for 10 minutes, followed by solid bonding as shown in FIG. 3, resist coating and pattern formation. Then, the composite brazing material 8 is treated with hydrofluoric acid as shown in FIG. A circuit board 10 was obtained by forming a circuit 9 by etching using an etching solution.
【０００９】このような回路基板10の製造方法では、従
来のようなペーストろうの作成、ペーストろうのスクリ
ーン印刷、乾燥、ろう付け等の工程が不要であるので、
これに要した多くの時間と手間が省け、工程が短くな
る。またペーストろう中のバインダー、溶剤等の処理が
無くなるので真空炉が汚染されることがない。In the method of manufacturing the circuit board 10 as described above, the conventional steps of forming the solder paste, screen-printing the solder paste, drying, brazing, etc. are unnecessary.
This saves a lot of time and labor required for this, and shortens the process. Further, since the treatment of the binder, solvent, etc. in the paste wax is eliminated, the vacuum furnace is not contaminated.
【００１０】またＡｌＮのセラミックス基板１に接合し
た複合ろう材８をエッチング加工して回路９を形成する
ので、Ｃｕ板６と活性金属ろうの薄板７は一体にパター
ンが形成されて位置ずれがない。従って、回路９の接合
強度及び寸法精度の高い回路基板10が能率良く製造でき
て、生産性が良い。尚、上記実施例の複合ろう材８は二
層であるが、三層でも四層でも良いものである。Further, since the circuit 9 is formed by etching the composite brazing material 8 bonded to the AlN ceramic substrate 1, the Cu plate 6 and the active metal brazing thin plate 7 are integrally formed with a pattern so that there is no displacement. . Therefore, the circuit board 10 having high bonding strength and dimensional accuracy of the circuit 9 can be efficiently manufactured, and the productivity is good. Although the composite brazing material 8 in the above embodiment has two layers, it may have three layers or four layers.
【００１１】[0011]
【発明の効果】以上の通り本発明の回路基板の製造方法
によれば、回路の接合強度及び寸法精度の高い回路基板
を能率良く製造できる。また本発明の回路基板製造用複
合ろう材によれば、上記の優れた回路基板の製造方法を
効率良く行なうことができる。As described above, according to the method of manufacturing a circuit board of the present invention, it is possible to efficiently manufacture a circuit board having high circuit bonding strength and dimensional accuracy. Further, according to the composite brazing material for producing a circuit board of the present invention, the excellent method for producing a circuit board described above can be efficiently performed.
【図１】本発明の回路基板製造用複合ろう材の一実施例
を示す図である。FIG. 1 is a diagram showing an example of a composite brazing material for producing a circuit board according to the present invention.
【図２】本発明の回路基板の製造方法の一実施例の工程
を示す図である。FIG. 2 is a diagram showing steps of an embodiment of a method for manufacturing a circuit board of the present invention.
【図３】本発明の回路基板の製造方法の一実施例の工程
を示す図である。FIG. 3 is a diagram showing steps of an embodiment of a method for manufacturing a circuit board of the present invention.
【図４】本発明の回路基板の製造方法の一実施例の工程
を示す図である。FIG. 4 is a diagram showing steps of an embodiment of a method for manufacturing a circuit board of the present invention.
【図５】従来の回路基板の製造方法の工程を示す図であ
る。FIG. 5 is a diagram showing steps of a conventional method for manufacturing a circuit board.
【図６】従来の回路基板の製造方法の工程を示す図であ
る。FIG. 6 is a diagram showing steps of a conventional method for manufacturing a circuit board.
【図７】従来の回路基板の製造方法の工程を示す図であ
る。FIG. 7 is a diagram showing steps of a conventional method for manufacturing a circuit board.
１ セラミックス基板 ６ Ｃｕ板 ７ 活性金属ろうの薄板 ８ 複合ろう材 ９ 回路 10 回路基板 1 Ceramics Substrate 6 Cu Plate 7 Active Metal Wax Thin Plate 8 Composite Brazing Material 9 Circuit 10 Circuit Board
Claims (2)
金属ろうの薄板をクラッドした複合ろう材を、活性金属
ろうの薄板側で接合し、然る後複合ろう材をエッチング
加工して回路を形成する回路基板の製造方法。1. A composite brazing material in which a thin plate of an active metal brazing material is clad on a Cu plate is bonded on a ceramic substrate on the thin plate side of the active metal brazing material, and then the composite brazing material is etched to form a circuit. A method of manufacturing a circuit board to be formed.
してなる回路基板製造用複合ろう材。2. A composite brazing material for producing a circuit board, comprising a Cu plate clad with a thin plate of an active metal brazing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35266592A JPH06177506A (en) | 1992-12-10 | 1992-12-10 | Manufacture of circuit substrate and circuit substrate manufacturing composite solder material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35266592A JPH06177506A (en) | 1992-12-10 | 1992-12-10 | Manufacture of circuit substrate and circuit substrate manufacturing composite solder material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06177506A true JPH06177506A (en) | 1994-06-24 |
Family
ID=18425602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35266592A Pending JPH06177506A (en) | 1992-12-10 | 1992-12-10 | Manufacture of circuit substrate and circuit substrate manufacturing composite solder material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06177506A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101153560B1 (en) * | 2004-06-24 | 2012-06-13 | 에스엔에쎄엠아 프로폴지옹 솔리드 | A method of brazing composite material parts sealed with a silicon-based composition |
-
1992
- 1992-12-10 JP JP35266592A patent/JPH06177506A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101153560B1 (en) * | 2004-06-24 | 2012-06-13 | 에스엔에쎄엠아 프로폴지옹 솔리드 | A method of brazing composite material parts sealed with a silicon-based composition |
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