JPH06177306A - Manufacture and manufacturing equipment of multi-layered lead frame - Google Patents

Abstract

PURPOSE:To improve handleability by excluding useless material and making frame width common. CONSTITUTION:A strip-form lead frame 20 is bonded to similar strip-form frames 10, 20 provided with retaining frames for a power supply plane or an earth plane. Retaining frame parts like a rail or a section bar which are unnecessary for a manufactured article are separated and eliminated from the frame provided with the retaining frame, and a multilayered lead frame is manufactured. Pin holes are previously formed at part positions of the lead frame overlapping the retaining frame parts wherein the frame provided with the retaining frame is unnecessary. After the lead frame is put upon and bonded to the frame provided with the retaining frame, the unnecessary retining frame parts are isolated and eliminated by thrusting pins 4 into pin holes 18, 28, 38.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is designed such that a lead frame formed in a strip shape and a frame with a support frame separately formed are superposed and joined to each other, and then a support frame portion unnecessary for a product is separated by the frame with a support frame. The present invention relates to a method and an apparatus for manufacturing a multilayer lead frame that is removed by removing.

[0002]

2. Description of the Related Art A multilayer lead frame has a power plane, a ground plane, etc. provided in a layer different from the lead frame, and is formed by laminating an electrically insulating layer such as polyimide between the layers. In manufacturing this multi-layered lead frame, it is necessary to form the lead frame and the plane to be joined to each strip in a strip shape because it is necessary to easily handle each plane and to accurately align each plane with each other. These are superposed and bonded by pressure bonding between the layers via an electrically insulating layer.

By the way, when the separate planes are joined to the lead frame as described above, the power plane and the ground plane are joined together through an electrically insulating layer. The supporting frame portions that are unnecessary for the product, such as the rails and section bars that supported the plane, are separated and removed. FIG. 5 shows a conventional method in which an unnecessary supporting frame portion is separated and removed after the plane is joined to the lead frame. In the figure, 5 is a lead frame, 6, 7
Is a frame with a support frame that is joined to the lead frame 5,
Reference numeral 6 is a power supply plane frame, and 7 is a ground plane frame with a supporting frame. The lead frame 5 and the frames 6 and 7 with a support frame are joined to each other via an electrically insulating layer 8.

As shown in the figure, when the unnecessary portions such as the rails are removed from the support frame-equipped frames 6 and 7 after the support frame-attached frames 6 and 7 are joined to the lead frame 5, the conventional method is the frame with the support frame. The side edges of 6 and 7 are clamped so that the side edges are bent to separate and remove. A separation part such as a rail is previously formed with a separation part by half etching or the like, and can be easily separated and removed by a bending operation.

[0005]

As described above, in manufacturing the conventional multilayer lead frame, the side edge of the frame with the supporting frame is formed when the lead frame formed into a strip shape and the frame with the supporting frame are superposed and joined. The frame with support frame is formed wider than the lead frame so that the parts can be clamped. Forming a wide frame with a support frame in this way does not damage the lead frame when removing unnecessary parts by conventional methods, whether by mechanical operation or by manual separation. It was necessary to remove unnecessary parts.

However, forming a wide frame with a supporting frame as described above wastes materials and makes handling inconvenient when setting frames on a processing machine because frames of different widths are handled. There was a problem such as. Therefore, the present invention has been made to solve the above problems, and an object of the present invention is to reduce the material cost in the manufacturing of a multilayer lead frame and to make the handleability by making the frame width common. An object of the present invention is to provide a method and an apparatus for manufacturing a multi-layer lead frame, which has advantages such as improvement.

[0007]

The present invention has the following constitution in order to achieve the above object. That is, after joining a strip-shaped lead frame and a strip with a supporting frame for a power plane or a ground plane, which is formed separately from the strip, to the rail or section bar from the supporting frame. In a method for manufacturing a multilayer lead frame, wherein unnecessary supporting frame parts are removed and formed in multiple layers in the product, when the lead frame and the supporting frame-containing frame are superposed, the unnecessary parts of the supporting frame-containing frame are removed. A pin hole is provided in advance in a portion of the lead frame that overlaps the support frame portion, the lead frame and the frame with the support frame are overlapped and joined, and then the unnecessary support frame is formed by projecting the pin hole portion with a pin. It is characterized in that the portion is separated and removed. In the method of manufacturing a multilayer lead frame having a three-layer structure in which a power plane, a ground plane, etc. are joined to the lead frame, the plane arrangement of pin holes provided in the uppermost layer and the lowermost layer of the three-layer planes is different from each other. In addition to the arrangement, the pin holes provided in the plane of the intermediate layer are commonly provided in all the pin holes of the uppermost layer and the lowermost layer. Further, the pin holes provided in the uppermost layer and the lowermost layer are arranged in a plane of inverted symmetry. In addition, after joining a strip-shaped lead frame and a frame with a supporting frame for a power plane or a ground plane, which is formed separately from the lead frame, to the rail or section bar, etc. Is a manufacturing apparatus of a multilayer lead frame for separating and removing unnecessary supporting frame parts from the product of FIG. 3 to form a multilayer, and providing a supporting plate for positioning and setting a joined body of the lead frame and the frame with the supporting frame. When the lead frame and the frame with the support frame are superposed, the pins are fitted in accordance with the arrangement of the pin holes provided in advance in the portion of the lead frame which is superposed with the unnecessary support frame part of the frame with the support frame. An upright pushing plate is provided, and the pushing plate is driven to push the pin into the pin hole. Characterized in that a driving mechanism for separating and removing the unnecessary support frame portion from the support frame with the frame.

[0008]

[Operation] In order to remove unnecessary supporting frame portions such as rails and section bars from the joined body in which the lead frame and the frame with the supporting frame formed separately from each other are joined, the supporting frame is separated and removed. The lead frame is provided with a pin hole in advance corresponding to the supporting frame portion to be removed, and the pin hole portion is pierced with a pin to separate and remove the unnecessary supporting frame portion from the joined body. Since the unnecessary supporting frame portion is separated and removed by the pin pushing operation, it is not necessary to form the frame with the supporting frame wider than the lead frame.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 shows an embodiment of a lead frame and a frame with a support frame used in the method for manufacturing a multilayer lead frame according to the present invention. In the multilayer lead frame of this embodiment, the lead frame is used as an intermediate layer 3
It is a layered product, in which FIG. 1 (a) is the first frame 10 with a support frame joined to the upper layer of the lead frame, FIG. 1 (b) is the lead frame 20, and FIG. 1 (c) is the lower layer of the lead frame 20. The frame 30 with the 2nd support frame joined is shown. It should be noted that fine pattern portions such as a lead pattern are omitted in the drawing.

In FIG. 1 (a), 12 is a rail and 14 is a section bar. Further, in FIG. 1 (c), 32 is a rail and 34 is a section bar. These rails 12, 32 and section bars 14, 34 are parts provided for fixing the power supply plane, the ground plane, etc. to the support frame, and are unnecessary parts for the product. Therefore, it is a part to be separated and removed after joining the respective planes at required parts.

FIG. 2 is an enlarged view showing the vicinity of the section bar 14 of the first frame 10 with a support frame. The section bar 14 is provided so as to extend across the rails 12, 12, and a half etching section 16 is provided at a connecting portion between the rail 12 and the section bar 14 so that the rail 12 and the section bar 14 can be separated and removed. deep. The rail 12 is separated and removed by the half etching section 16 by a bending operation as in the conventional case. Reference numeral 17 is a pilot hole used when positioning the first frame 10 with a support frame. Regarding the frame 30 with the second support frame, the configuration of the rail 32 and the section bar 34 is the first.
Like the frame 10 with a supporting frame, the half-etched portion 36 is formed at the connecting portion between the rail 32 and the section bar 34.
To provide. 37 is a pilot hole.

When a multilayer lead frame is formed by using the first frame 10 with support frame, the lead frame 20, and the second frame 30 with support frame, first, the first frame 10 with support frame and the lead frame 20 are first formed. , The second frame 30 with a support frame is aligned with each other and overlapped with each other, and a required range portion such as a power plane and a ground plane is joined by using an adhesive having an electrical insulation property, and then the joined body is joined. By separating and removing the rails 12, 32 and the section bars 14, 34 described above. Here, in the present embodiment, the first frame 10 with a support frame, the lead frame 20, and the second frame 30 with a support frame are all formed to have the same width, and the rails 12, 32, the section bar 14,
First support frame 1 for separating and removing 34
0, lead frame 20, second supporting frame 3
0 is provided with a pin hole for passing a pin for separating the rails 12, 32 and the section bars 14, 34.

FIG. 3 is a sectional view of the section bars 14 and 34 showing a state in which the first frame 10 with a support frame and the second frame 30 with a support frame are joined to the lead frame 20. The uppermost layer is the frame 10 with the first supporting frame, the intermediate layer is the lead frame 20, and the lowermost layer is the frame 30 with the second supporting frame. In the figure, 18 is a pin hole provided in the section bar 14 of the frame 10 with the first support frame, and 38 is a second hole.
It is a pin hole provided in the section bar 34 of the frame 30 with the support frame. The pin holes 18 and 38 are arranged so as to be at different positions in a superposed state as shown in the drawing. In addition,
In the embodiment, the pin holes 18 and 38 of the frame 10 with the first support frame and the frame 30 with the second support frame are set to the inverted symmetrical positions so that the same pin position is obtained when the joined body is turned upside down.

Pin hole 28 provided in the lead frame 20
Is the pin hole 18 provided in the frame 10 with the first support frame.
The hole position is set so as to be common to both the pin hole 38 provided in the second frame 30 with the support frame. FIG. 3 shows how the section bar 14 is pierced by the pin 40 to be separated and removed. The pin 40 is adjusted to the position of the pin holes 38, 38 provided in the second frame 30 with a support frame.
In this arrangement, the section bar 14 is separated from the first frame 10 with support frame by pushing up the section bar 14 from below the second frame 30 with support frame through the pin holes 38 and 28. In addition, when the section bar 34 is separated and removed from the second frame with support frame 30, the frame 1 with the first support frame is turned upside down.
Separated and removed by pushing section bar 34 up with pin 40 with 0 down.

As described above, in the method for manufacturing a multilayer lead frame according to the present invention, after forming the joined body of the lead frame and the frame with the support frame, the pin hole portion is pierced by the pin to remove the unnecessary portion. It is characterized by doing.
Therefore, when a pin hole is provided in each frame forming the joined body, it is necessary to set the hole position so that the pin comes into contact with a portion to be separated and removed when these frames are superposed. Section bars 14, 34 of the above embodiment
This is an example in which the parts are arranged in different positions in a superposed state, and when they are turned upside down, the pushing operation can be performed at the same pin position.

In the example shown in FIG. 1, for the rails 12 and 32, a pin hole 19 is provided in the vicinity of the side edge of the first frame 10 with a support frame, and a pin hole 39 is similarly provided in the second frame 30 with a support frame. And the lead frame 20 is provided with pin holes 29, 29 so as to be commonly arranged. In this manner, the pin holes 19 and 39 are provided at different positions in the first frame 10 with a support frame and the second frame 30 with a support frame, and the pin holes 2 are commonly arranged in the lead frame 20.
By providing 9, the section bar 14 above,
The rails 12, 32 can be separated and removed by a pin pushing operation in the same manner as 34 is separated.

In the case of using the pin to project the portion to be removed such as the rail or section bar as described above, it is necessary to form the frames 10 and 30 with the supporting frame wider than the lead frame 20. Even if they are formed with the same width, they can be easily separated and removed. This makes it possible to eliminate the waste of material, and by making the frame width common, the handling in the manufacturing process can be made common and the manufacturing of the multilayer lead frame can be facilitated.

FIG. 4 shows an embodiment of an apparatus for joining and removing a frame with a support frame to a lead frame, and then separating and removing an unnecessary portion of the frame with a support frame, such as a rail part, by the method described above. The figure shows the state as viewed from the side. This device is a device for separating and removing a rail and a section bar from a multi-layer lead frame composed of three layers of the first frame 10 with a support frame, the lead frame 20, and the second frame 30 with a support frame, Pin 40a for separating and removing the rail 12 of the frame 10 with the first support frame
A pin 40b for separating and removing the rail 32 of the second frame with a support frame, and a pin 40c for separating and removing the section bars 14 and 34, respectively.
It is provided in 51 and 52, and is configured to be driven separately.

The pushing plates 50, 51, 52 are arranged in alignment with the longitudinal direction of the strip-shaped lead frame, and are vertically movably guided and vertically driven by air. Reference numeral 54 is a support plate for mounting the joined body 60 of the lead frame and the frame with the support frame,
Reference numeral 56 is a pressing plate for positioning and setting the bonded body 60 on the support plate 54.

In using this apparatus, first, the lead frame 20 is joined with the first supporting frame 10 and the second supporting frame 30 and the joined body 60 is placed on the support plate 54, and the pressing plate is attached. After being supported by 56, the pushing plate 50 is moved upward to separate and remove the rail 12 of the first frame 10 with a support frame, and then the pushing plate 51 is moved upward to separate and remove the section bar 14. Next, after the joined body 60 is turned upside down and placed on the support plate 54, the pushing plate 52 is moved upward to separate and remove the rail 32 of the second frame 30 with a support frame, and then the pushing plate. The section bar 34 is separated and removed by moving 51 upward. Thus, the pins 40a, 40
Unnecessary portions of the rails 12 and 32 and the section bars 14 and 34 can be separated and removed from the frame 10 with the first supporting frame and the frame 30 with the second supporting frame by performing the pushing operation with b and 40c.

In this way, when the support frame is removed by the pushing operation with the pin, the apparatus does not become so complicated, it can be easily formed, and the automation enables efficient work. . In each of the above embodiments, an example of a multilayer lead frame having a three-layer structure has been described. It is possible to separate and remove unnecessary supporting frame portions. Further, the order of arrangement of the lead frame, the power plane, the ground plane, etc. can be set appropriately. Further, in the above-mentioned embodiment, the lead frame, the first supporting frame-equipped frame and the second supporting frame-equipped frame all have the same width, but the method of the present invention does not necessarily have to have the same width. Further, forming the pin holes of the lead frame or the like as in the above-described embodiment has an advantage that it can be performed without any problem in manufacturing the lead frame or the like.

[0022]

As described above, according to the manufacturing method and the manufacturing apparatus for a multilayer lead frame of the present invention, the lead frame and the frame with a supporting frame can be formed to have the same width, and the waste of materials can be eliminated. It is possible to improve the handleability. Moreover, it is possible to effectively and reliably separate and remove unnecessary supporting frames such as rails and section bars of the frame with supporting frames.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a lead frame and a frame with a support frame used in manufacturing a multilayer lead frame.

FIG. 2 is an explanatory view showing an enlarged part near a section bar of a frame with a support frame.

3A and 3B are a cross-sectional view and a pin arrangement of a section bar portion in a state where a lead frame and a frame with a support frame are joined.

FIG. 4 is an explanatory diagram showing a configuration of a manufacturing apparatus for a multilayer lead frame.

FIG. 5 is an explanatory diagram of a conventional method for removing unnecessary portions from a lead frame and a frame with a support frame.

[Explanation of symbols]

 10 First Frame with Support Frame 12 Rail 14 Section Bar 16 Half Etched Part 17 Pilot Hole 18, 19 Pin Hole 20 Lead Frame 28, 29 Pin Hole 30 Second Frame with Support Frame 32 Rail 34 Section Bar 36 Half Etched Part 38, 39 Pin hole 40, 40a, 40b, 40c Pin 50, 51, 52 Pushing plate 56 Pressing plate 60 Joined body

Claims (4)

[Claims] 1. A strip-shaped lead frame is joined to a frame with a supporting frame for a power plane or a ground plane, which is formed separately from the strip-shaped lead frame, and then the rail or the frame with the supporting frame is joined. In a method of manufacturing a multilayer lead frame in which a support frame portion unnecessary for a product such as a section bar is separated and removed to form a multilayer, when the lead frame and the frame with the support frame are superposed, A pin hole is provided in advance in the portion of the lead frame that overlaps with the unnecessary support frame portion, the lead frame and the frame with the support frame are overlapped and joined, and then the pin hole portion is pierced with a pin to eliminate the unnecessary A method of manufacturing a multilayer lead frame, characterized in that the supporting frame portion is removed separately. 2. A method for manufacturing a multi-layer lead frame having a three-layer structure in which a power plane, a ground plane, etc. are joined to a lead frame, wherein plane arrangements of pin holes provided in the uppermost layer and the lowermost layer of the three-layered planes are mutually different. And set to different placement,
The pin hole provided in the plane of the intermediate layer is commonly provided to all the pin holes of the uppermost layer and the lowermost layer.
A method for manufacturing the multilayer lead frame described. 3. The method for manufacturing a multilayer lead frame according to claim 2, wherein the pinholes provided in the uppermost layer and the lowermost layer are arranged in a plane of inverted symmetry. 4. A strip-shaped lead frame is joined to a frame with a supporting frame for a power plane or a ground plane, which is formed separately from the strip, and is connected to the rail or the A multi-layer lead frame manufacturing apparatus for separating and removing a supporting frame portion unnecessary for a product such as a section bar to form a multi-layer structure, wherein the joint body of the lead frame and the frame with the supporting frame is positioned and set. A plate is provided, and when the lead frame and the frame with the support frame are superposed, in accordance with the arrangement of the pin holes provided in advance in the portion of the lead frame that overlaps with the unnecessary support frame portion of the frame with the support frame. Is provided with a push plate with the pin standing upright, and the push plate is pushed to drive the pin into the pin hole. An apparatus for manufacturing a multilayer lead frame, comprising a drive mechanism for separating and removing the unnecessary support frame portion from the frame with the support frame.