JPH06177298A - Integrated circuit - Google Patents

Abstract

PURPOSE:To suppress the rise in temperature of an integrated circuit chip and thus prevent its malfunction by providing a microfan in a duct running in the plastic package of the integrated circuit. CONSTITUTION:An integrated circuit chip 2 on a die pad 1 is connected through a wire 4 with terminals 3 for external connection. The chip and part of the terminals are integrally molded with resin 6. A microfan is provided in the resin 6 to draw air at one end of a duct 7 in the resin and discharge it at the other end; that is, the microfan passes outside air inside the device to cool the chip 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit device (hereinafter referred to as IC which can prevent malfunction caused by heat generation).
The device is called).

[0002]

2. Description of the Related Art FIG. 7 is a sectional view showing the structure of a conventional IC device. In the figure, 1 is a die pad, 2 is an integrated circuit chip (hereinafter referred to as an IC) mounted on the upper surface of the die pad 1.
3 is a plurality of terminals provided for connecting the IC chip 2 to an external substrate (not shown) via the wires 4. Reference numeral 5 is a heat spreader arranged in the vicinity of the IC chip 2. Is a resin that seals and integrates a part of the die pad 1, the IC chip 2, the wires 4, the heat spreader 5, and the terminals 3.

Next, the operation of the IC device configured as described above will be described. First, the IC chip 2 processes the signal sent from the external board connected through the terminal 3, and then generates heat while repeating the operation of sending it to the external board side again. This heat is transmitted to the outside air through the die pad 1, the wire 4 and the resin 6. However, since the thermal conductivity of the resin 6 is low and the heat radiation is not sufficient, the temperature of the resin 6 near the IC chip 2 rises extremely, and the IC chip 2 exceeds the allowable temperature, causing malfunction.

Therefore, as shown in FIG.
A heat spreader 5 having a high thermal conductivity is provided in the vicinity of the C chip 2 so that the temperature of the IC chip 2 is temporarily increased.
In response to this, the temperature is evenly transmitted to the inside of the resin 6 and the heat is radiated from the resin 6 to the outside air, thereby improving the heat radiation performance in the vicinity of the IC chip 2.

[0005]

Since the conventional IC device is constructed as described above, the heat of the IC chip 2 is radiated to the outside air from the resin 6 by utilizing the heat conduction of the heat spreader 5. However, there is a problem in that the heat generated by the IC chip 2 cannot be dissipated efficiently and the IC chip 2 exceeds the allowable temperature, causing malfunction of the IC device.

The present invention has been made in order to solve the above problems, and an object thereof is to obtain an IC device capable of suppressing the temperature rise of an IC chip and preventing malfunction.

[0007]

[Means for Solving the Problems] Claim 1 according to the present invention
The integrated circuit device of (1) is provided with a micro fan in an air passage provided in resin along the integrated circuit chip.

An integrated circuit device according to a second aspect of the present invention is provided with a microfan in a ventilation path provided in a resin along the integrated circuit chip and generates an electromotive force generated by a temperature rise of the integrated circuit chip. It is equipped with a thermocouple for supplying to a micro fan.

According to a third aspect of the present invention, there is provided an integrated circuit device, wherein a microfan which is provided along the integrated circuit chip in resin and which is rotated by convection of outside air in a ventilation passage, and an electromotive force generated by the microfan. And an abnormal signal generating means for generating an abnormal signal when the value of exceeds a predetermined value.

[0010]

The microfan according to the first aspect of the present invention circulates the outside air in the ventilation passage to radiate the heat of the IC chip to the outside.

The thermocouple according to claim 2 of the present invention is an IC
Super power is generated by detecting the temperature rise of the chip, and the micro fan is driven by this super power.

The abnormal signal means of the third aspect of the present invention generates an abnormal signal when the electromotive force generated by the microfan exceeds a predetermined value.

[0013]

EXAMPLES Example 1. Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are a longitudinal sectional view and a lateral sectional view showing the configuration of an IC device according to a first embodiment of the present invention. In the figure, the same parts as those in the conventional case are designated by the same reference numerals, and the description thereof will be omitted. An air passage 7 is formed in an X shape in the resin 6 above the IC chip 2 and has an air inlet 7a at each open end and an air outlet 7b penetrating above the central portion, and 8 is an air passage 7 Ventilation entrance 7a
, Which are provided in the vicinity of each of the above, and are driven by electric power supplied from the terminal 3 through the electric power supply line 9 to suck the outside air from the ventilation inlet 7a and discharge it from the ventilation outlet 7b.

Next, the operation of the IC device configured as described above will be described. First, a part of the electric power used for driving the IC chip 2 is supplied to the micro fan 8 from the power supply line 9, and the micro fan 8 is rotated to introduce the outside air from the ventilation inlet 7a and circulate in the ventilation passage 7. After that, the air is discharged from the ventilation outlet 7b. According to the first embodiment described above, since the outside air constantly circulates in the ventilation passage 7 in this way, the heat generated in the IC chip 2 is released to the outside by the outside air, so that the IC chip 2 is heated to the allowable temperature or higher. It never happens.

Example 2. In the case of the first embodiment, the micro fan 8 is supplied with a part of the electric power used for driving the IC chip 2 by the electric power supply line 9, but here, as shown in FIG. 3, a thermocouple 10 is provided, Even when the electromotive force generated in the thermocouple 10 due to the temperature rise of the IC chip 2 is supplied to the microfan 8 to be driven, the same effect as that of the first embodiment is obtained.

Embodiment 3. In the case of the first embodiment, the micro fan 8 is powered by the power supply line 9,
Here, even if bumps 11 are provided as shown in FIG. 4 so that electric power can be directly supplied to the micro fan 8 from the IC chip 2, the same effect as that of the first embodiment is obtained.

Embodiment 4. In each of the above embodiments, the IC device integrated by the resin 6 is described, but here, as shown in FIG. 5, a part of the die pad 1, the IC chip 2, the wire 4, the micro fan 8, the bump 11 and the terminal 3 is shown. Are integrated by a metal cap 12, a cooling medium 13 is filled in the metal cap 12, and the cooling medium 13
Also in the IC device which is designed to cool the C chip 2, the micro fan 8 is driven to convect the cooling medium 13, so that the heat of the IC chip 2 is cooled by the cooling medium 1.
3 allows efficient heat dissipation.

Example 5. 6 is a sectional view showing the structure of an IC device according to the fifth embodiment of the present invention. In the figure,
The same parts as those in the conventional case are designated by the same reference numerals and the description thereof will be omitted. An air passage 14 is formed in an X shape in the resin 6 above the IC chip 2 and has an air outlet 14a at each open end and an air inlet 14b penetrating above the central portion, and 15 is an air passage 14 Micro-fans, 16 respectively provided near the respective ventilation outlets 14a of, input the electromotive force generated by the micro-fan 15 rotated by convection of the outside air through the signal line 17, and from this electromotive force I
This is a self-defense circuit that converts the amount of heat generated by the C chip 2 and stops the operation of the IC device when this value reaches an abnormal value.

Next, the operation of the IC device configured as described above will be described. First, the IC chip 2 is connected through the terminal 3, processes a signal sent from an external board (not shown), and then generates heat while repeating the operation of sending it to the external board side again. The generated heat causes a convection of the outside air that is introduced into the ventilation passage 14 from the ventilation inlet 14b and discharged from the ventilation outlet 14a, and the convection of the outside air causes the microfan 15 to rotate and generate an electromotive force.

That is, the electromotive force generated by the micro fan 15 also changes according to the degree of heat generation of the IC chip 2. Therefore, the self-defense circuit 16 constantly detects the electromotive force generated by the micro fan 15 via the signal line 17, converts the heat generation amount of the IC chip 2 from the detected electromotive force, and the value is equal to or higher than the allowable temperature. Then, the operation of the IC device is stopped.

Example 6. In each of the above-described embodiments, the IC device in which the ventilation passages 7 and 14 are provided on the upper side of the IC chip 2 has been described, but the present invention is not limited to this, and even if the ventilation passages are provided on the lower side of the IC chip 2, the same applies. Produce the effect of.

Example 7. In each of the above embodiments, the IC device in which the ventilation passages 7 and 14 are provided in the X shape has been described, but the present invention is not limited to this, and the same effect can be obtained even if a plurality of linear ventilation passages are provided.

Example 8. In each of the above-mentioned embodiments, the IC device provided in the vicinity of the ventilation opening 7a has been described, but the present invention is not limited to this, and a similar effect can be obtained by providing a microfan in the vicinity of the ventilation outlet 7b.

Example 9. Although the IC device provided in the vicinity of the ventilation outlet 14a is described in the fifth embodiment, the invention is not limited to this, and the ventilation inlet 14 is not limited thereto.
Even if a micro fan is provided in the vicinity of b, the same effect can be obtained.

[0025]

As described above, according to the invention of claim 1, the micro-fan is provided in the ventilation passage provided in the resin along the integrated circuit chip, and according to the invention of claim 2. For example, a micro-fan is provided in a ventilation path provided in the resin along the integrated circuit chip, and a thermocouple is provided to supply electromotive force generated by a temperature rise of the integrated circuit chip to the micro-fan. According to the invention of Item 3, the microfan which is provided along the integrated circuit chip in the resin by the convection of the outside air in the ventilation passage and the value of the electromotive force generated by the microfan exceeds a predetermined value. Since the abnormal signal generating means for generating an abnormal signal is provided at times, there is an effect that it is possible to obtain an IC device capable of suppressing the temperature rise of the IC chip and preventing malfunction.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing the configuration of an IC device according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing the configuration of the IC device according to FIG.

FIG. 3 is a sectional view showing the configuration of an IC device according to a second embodiment of the present invention.

FIG. 4 is a sectional view showing a configuration of an IC device according to a third embodiment of the present invention.

FIG. 5 is a sectional view showing a configuration of an IC device according to a fourth embodiment of the present invention.

FIG. 6 is a sectional view showing the structure of an IC device according to a fifth embodiment of the present invention.

FIG. 7 is a cross-sectional view showing a configuration of a conventional IC device.

[Explanation of reference numerals] 1 die pad 2 IC chip 3 terminal 4 wire 6 resin 7, 14 ventilation passages 7a, 14b ventilation inlet 7b, 14a ventilation outlet 8, 15 micro fan 9 power supply line 10 thermocouple 11 bump 12 metal cap 13 cooling Medium 16 Self-defense circuit 17 Signal line

Claims (3)

[Claims] 1. An integrated circuit chip mounted on a die pad, a terminal connected to the integrated circuit chip via a wire and provided for external connection, the integrated circuit chip and a part of the terminal. A resin that seals and integrates the resin, an air passage provided in the resin along the integrated circuit chip, and provided in the air passage. The outside air is sucked in from one end of the air passage and discharged to the other end. An integrated circuit device comprising a micro fan for controlling. 2. An integrated circuit chip mounted on a die pad, a terminal connected to the integrated circuit chip through a wire and provided for external connection, the integrated circuit chip and a part of the terminal. A resin that seals and integrates the resin, an air passage provided in the resin along the integrated circuit chip, and provided in the air passage. The outside air is sucked in from one end of the air passage and discharged to the other end. And a thermocouple for generating an electromotive force by detecting a temperature rise of the integrated circuit chip and supplying the electromotive force to the microfan. 3. An integrated circuit chip mounted on a die pad, a terminal connected to the integrated circuit chip via a wire and provided for external connection, the integrated circuit chip and a part of the terminal. A resin that seals and integrates the air, an air passage provided in the resin along the integrated circuit chip, and an outside air that is provided in the air passage and that increases and decreases due to a temperature rise of the integrated circuit chip and flows through the air passage. An integrated circuit device comprising: a micro fan that is rotated by to generate an electromotive force; and an abnormal signal generation unit that generates an abnormal signal when the electromotive force generated by the micro fan exceeds a predetermined value.