JPH06169185A - Electronic equipment - Google Patents

Abstract

PURPOSE:To increase the holding strength of a substrate for preventing the cracking on a solder part during the fixing step of the substrate used for various electronic equipments CONSTITUTION:The electronic equipment is composed of a main board 1, a sub-board 2 vertically fixed on the main board 1 and a front panel 3 etc., provided with sub-board holding pawls 4 positioned on the front surface of the sub-board 2. Next, this front panel 3 is fixed on a chassis simultaneously holding the sub-board 2 by board holding pawls 4. In such a constitution, the holding strength of the sub-board 2 can be increased thereby enabling the cracking on a soldering part to be avoided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device used as a satellite broadcast receiver or the like having a front panel.

[0002]

2. Description of the Related Art FIG. 4 is a view showing a sub-board mounting portion of a conventional electronic device.

In FIG. 4, reference numeral 1 denotes a main board, and a sub-board 2 is inserted and attached to a hole provided in the main board 1.

The sub-board 2 is attached to the main board 1 by connecting the connector 6 and a part 7 of the sub-board to the main board 1.
It was done by soldering after inserting into.

[0005]

However, in such a conventional configuration, the sub-board 2 is held by the main board 1.
Since it is only the contact surface portion with, the stress is concentrated on the holding portion of the sub-board 2 due to external stress such as vibration. Therefore, there is a problem that cracks occur in the soldered portion.

The present invention solves the above-mentioned conventional problems, and an object thereof is to prevent stress from concentrating on the holding portion of the sub-board and to prevent cracking in the soldering portion.

[0007]

In order to achieve this object, an electronic apparatus of the present invention is provided with a main board, a sub-board vertically attached to the main board, and a front surface of the sub-board. The front panel is provided with a claw for holding the sub-board, and the claw holds the sub-board.

[0008]

With this structure, since the sub-board is held by the main board and the claws provided on the front panel, stress is not concentrated only on the holding section of the sub-board, and cracks at the soldering section are prevented. can do.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of a sub-board mounting portion in one embodiment of the present invention, and FIG. 2 is a side sectional view thereof. 1 and 2, reference numeral 1 is a main board, and the main board 1 is a printed wiring board. Reference numeral 2 denotes a sub-board, and this sub-board 2 is also a printed wiring board, which is attached to the main board 1 vertically by soldering via a connector 6. 3 is a front panel,
It is a molded housing located on the front surface of the sub-board 2. Reference numeral 4 is a claw integrally formed with the front panel 3, and is a claw for holding the sub-board 2.

The operation of the electronic device configured as described above will be described below. The sub-board 2 is fixed to the main board 1 in the vertical direction by soldering, and the main board 1 is fixed to the chassis 5.
The front panel 3 is fixed to the chassis 5,
At this time, simultaneously, the sub-board holding claws 4 provided on the front panel 3 hang on both side surfaces of the sub-board 2 to lock the sub-board 2. The claw 4 may be locked on the upper surface of the sub-board 2.

Further, as shown in FIG. 3, by arranging the holding claws 4 so as to be positioned on the vertical side of the sub-board 2, and the sub-board 2 locked by the holding claws 4
By making a notch in the shape of "U" or making a square hole, the holding force works effectively against stress such as vibration applied in the X and Y directions, and even if the number of claws 4 is small. The concentration of stress can be reduced.

As described above, according to this embodiment, the claws 4 for fixing the sub-board 2 are provided on the front panel 3 located on the front surface of the sub-board 2 mounted perpendicularly to the main board 1. The sub-board 2 can be fixed and held by.

[0014]

As described above, according to the present invention, since the sub-board is held by the claws provided on the main board and the front panel, the stress is not concentrated only on the holding portion of the sub-board, and the soldering is prevented. There is an effect that it is possible to prevent the occurrence of cracks in the attachment part.

Further, since the holding claws are provided on the front panel, individual parts are not required, and the sub-board can be held at the same time when the front panel is attached, so that the holding is inexpensive.

[Brief description of drawings]

FIG. 1 is a plan view of a main part of an electronic device according to an embodiment of the present invention.

FIG. 2 is a side sectional view of the same electronic device.

FIG. 3 is a front view of the substrate holding unit of the same.

FIG. 4 is a front view of a board holding portion of a conventional electronic device.

[Explanation of symbols]

 1 main board 2 sub board 3 front panel 4 claws

Claims (3)

[Claims] 1. A main board, a sub-board mounted in a direction perpendicular to the main board, and a front panel provided on the front surface of the sub-board and provided with claws for holding the sub-board. An electronic device that locks the sub-board with a claw. 2. The holding claw provided on the front panel locks a vertical side of the sub-board.
Electronic device described. 3. The electronic device according to claim 1, wherein a notch is provided in a portion of the sub-board that faces the claw.