JPH06168985A - Packaging structure of semiconductor element - Google Patents

Abstract

PURPOSE:To partially reinforce a film carrier having flexibility by building a layer of a reinforcing material to arrest flexibility around the resin cladding and on the cladding itself of the film carrier which comprises two or three highly flexible layers. CONSTITUTION:An opening 4a is formed in a preset part of a flexible film 4, upon which a group of lead wires 3a are formed with a conductor wiring 3 and part of it extending to the opening 4a, thereby forming a two-layer film carrier 9. Here, the size of the opening 4a is formed slightly larger than that of a semiconductor element 1 and, onto the opposite side of the surface on which this semiconductor 1 is mounted, a reinforcing material 6 having an opening 6a which is larger than that opening is glued with an adhesive 7 and fixed. As a result, high dimensional stability and improved flatness are obtained at the reinforced part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a mounting structure for integrally mounting a semiconductor element on a flexible film carrier.

[0002]

2. Description of the Related Art In recent years, development of devices and equipment using a large number of semiconductor elements has been promoted. In these, a large number of ICs, depending on the specifications of the final product,
It has become necessary to mount the LSI on a substrate having a predetermined area with high density and thinness.

In a conventional semiconductor element mounting structure,
ICs and LSIs are molded in DIL or flat pack type packages, or T using a film carrier.
It is well known to mold to AB, and at the time of mounting, a semiconductor element (integrated circuit) cut from a peripheral lead group is planarly mounted on a relatively thick circuit board. In such a structure in which the semiconductor elements are mounted on the substrate in a plane, there is a drawback that the occupied area in a plane is inevitably large, so that the substrate becomes large. Therefore, one board is divided into a plurality of boards, each board is connected by a flexible board, and the boards are laminated to each other to eliminate the occupied area.

However, in such an implementation,
Since the steps of newly dividing the circuit board and connecting the flexible board are increased, the mounting cost including the mounting step of the semiconductor element is increased and it is difficult to improve the reliability at the time of each connection. Have. At the same time, in recent years, as the degree of integration of integrated circuits has advanced, the number of leads to be pulled out from the semiconductor element has become large, and not only the mounting structure that is molded in the package as described above but also the TAB is molded. It is extremely difficult to improve the reliability even in the case where the device is mounted separately from the device.

Therefore, in recent years, as a mounting structure for improving reliability, a film carrier of a semiconductor element molded in the TAB is used as it is as a printed circuit board having flexibility, and after being connected to an ordinary printed circuit board, it can be used at any time. Some of them are formed by bending.

[0006]

In the structure in which the TAB itself is directly mounted on the intended circuit board, a predetermined shape is maintained when the TAB is mounted by the self-elasticity of the film carrier to restore it. Becomes difficult. Therefore, a large curvature may be required when the film is bent, and the film carrier may have an unnecessarily large area. The above-mentioned drawbacks make the film carrier thinner,
If a flexible film carrier with weak self-elasticity is used, its curvature can be made small, but this time it becomes difficult to maintain the flatness in the vicinity of the semiconductor element mounting part, and there is no dimensional stability. Becomes difficult.

The present invention is intended to eliminate the above-mentioned drawbacks, and an object of the present invention is to partially reinforce a flexible film carrier.

[0008]

SUMMARY OF THE INVENTION The present invention comprises at least one
An electrode of a semiconductor element is bonded to a lead wire group formed on a flexible film carrier having two openings and protruding to the opening, and the semiconductor element and the lead wire group are covered with a resin. In the mounting structure of the semiconductor element,
The flexible film carrier has high flexibility.
It is formed of three layers or layers with flexibility equivalent to it,
It is intended to provide a mounting structure characterized in that a reinforcing member for preventing the flexibility is laminated around the coating with the resin and at an arbitrary position.

[0009]

According to the present invention, the flexible film carrier facilitates the bending and mounting of the substrate, and
By laminating the reinforcing material around the resin coating of the semiconductor element and the lead wire group, it is possible to improve the flatness in the bent portion around the semiconductor element and to obtain good dimensional stability against external force. Become.

[0010]

EXAMPLE An example of the present invention will be described below. In FIG. 1, reference numeral 4 denotes a flexible film made of, for example, a film of polyimide, glass epoxy, polyester or the like, an opening 4a is formed at a predetermined portion, and a conductor wiring 3 is formed on the film.
A part of the conductor wiring 3 extends into the opening 4a to form a lead wire group 3a, and a two-layer type film carrier 9 is formed. The lead wire group 3a is bonded to the electrode portion of the semiconductor element 1 via the bump 2. Here, the size of the opening 4a is formed slightly larger than that of the semiconductor element 1, and a reinforcing material 6 having an opening 6a larger than the opening is provided on the opposite side of the mounting surface of the semiconductor element 1 with an adhesive 7. It is attached and fixed by. After mounting the semiconductor element 1 and the reinforcing material 6, both openings 4a, 6a are filled with resin 5 and covered.

The reinforcing material 6 is made of a film such as polyimide, glass epoxy, polyester or the like, a plate material such as a baking plate, glass epoxy or glass, or an insulating material. In addition to the adhesive 7, polyimide, polyester or the like is used. The same effect can be obtained by using the tape. The resin 5 is a sealing resin, and generally an epoxy resin having high purity is used.

FIG. 2 shows another embodiment. In the drawing, the same parts as those in FIG. 1 are designated by the same reference numerals. In FIG. 2, reference numeral 4 denotes a flexible film, which has an opening 4a formed therein, a conductor wiring 3 is formed on the film, and a part of the conductive wiring 3 extends to the opening 4a to form a lead wire group 3a. The film carrier 9 of FIG. The lead wire group 3a is bonded to the electrode portion of the semiconductor element 1 via the bump 2. Here, the size of the opening 4a is formed slightly larger than that of the semiconductor element 1, and a reinforcing resin 8 is formed by printing or transferring instead of the reinforcing material 6 on the side opposite to the mounting surface of the semiconductor element 1. After the semiconductor element 1 and the reinforcing resin 8 are formed, both openings 4a and 6a are filled and covered with the resin 5.

Since the reinforcing resin 8 is in direct contact with the conductor wiring 3, a composition such as an epoxy type, a silicon type, a polyimide type or a butadiene type can be used, which may be replaced by a solder resist. Is.

In the above embodiment, an example of general face-up bonding is presented, but the present invention is not limited to this. In face-down bonding, the reinforcing material 6 is added to the flexible film 4. The (reinforcing resin 8) may be arranged on the opposite side of the embodiment.

Further, the portion forming the reinforcing material 6 (reinforcing resin 8) is not limited to the periphery of the opening 4a for mounting the semiconductor element 1, but is formed on the back surface side when mounting another mounting body. But it is effective.

The film carrier in both of the above-mentioned embodiments is presented as a two-layer structure, and the thickness is usually 50 μm or less for the flexible film and 15 μm to 35 μm for the conductor wiring, which is extremely thin and flexible. The current mainstream is a three-layer film carrier having a flexible film, conductor wiring, and an adhesive layer for adhering both of them.
If the total thickness of 5 μm to 125 μm can be reduced to about 50 μm by thinning the flexible film, etc., it has the same flexibility as that of the above-mentioned two-layer structure flexible film. Is also possible.

[0017]

As described above, according to the present invention, the semiconductor element is directly mounted on the conductor wiring and the lead group formed on the flexible film, and the TAB film substrate is formed to be bent on the liquid crystal display panel or the like. The flexible film carrier can reduce the number of electrode connection processes, shorten the wiring distance, and provide a highly reliable mounting structure. The reinforcing material 6 (reinforcing resin 8) is formed in a predetermined portion of the above, and by strengthening the portion, the portion other than the reinforcing portion has high flexibility and can be easily bent, so that the reinforcing portion is high. The dimensional stability and the flatness are improved, the mounting flexibility is high, and the mounting structure having a small mounting area can be realized.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of a semiconductor element mounting structure according to the present invention.

FIG. 2 is a sectional view showing another embodiment of the mounting structure of the semiconductor device according to the present invention.

[Explanation of symbols]

 1 Semiconductor Element 3 Conductor Wiring 3a Lead Wire Group 4 Flexible Film 4a Opening 5 Resin 6 Reinforcing Material 6a Opening 7 Adhesive 8 Reinforcing Resin

Claims (2)

[Claims] 1. A semiconductor element and a lead wire group, wherein an electrode of a semiconductor element is joined to a lead wire group formed on a flexible film carrier having at least one hole portion and protruding into the hole portion. In a semiconductor element mounting structure in which resin coating is performed, the flexible film carrier has high flexibility.
It is formed of three layers or layers with flexibility equivalent to it,
A mounting structure for a semiconductor element, characterized in that a reinforcing member for preventing the flexibility is laminated around the resin coating and at an arbitrary position. 2. The reinforcing member is a film material such as polyimide, glass epoxy, polyester or the like, a bake plate, a plate material such as glass epoxy, glass or the like, a tape such as polyimide or polyester, an epoxy type, a silicon type, a polyimide type, The mounting structure for a semiconductor element according to claim 1, wherein the mounting structure is formed of a resin such as a butadiene resin.