JPH06164078A - Bending and cutting board structure - Google Patents
Bending and cutting board structureInfo
- Publication number
- JPH06164078A JPH06164078A JP33006892A JP33006892A JPH06164078A JP H06164078 A JPH06164078 A JP H06164078A JP 33006892 A JP33006892 A JP 33006892A JP 33006892 A JP33006892 A JP 33006892A JP H06164078 A JPH06164078 A JP H06164078A
- Authority
- JP
- Japan
- Prior art keywords
- board
- sub
- printed board
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】本発明は、折欠き基板構造に関し、例え
ば、メインプリント基板中にサブプリント基板が折り欠
き可能に形成されている折欠き基板構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a broken board structure, for example, a broken board structure in which a sub printed board is formed in a main printed board so as to be broken.
【０００２】[0002]
【従来の技術】近年、比較的大きなメインプリント基板
（メインＰＣＢ）においては、高さの高い部品等を搭載
することができない中央部を有効に活用するため、中央
部のデットスペースにサブプリント基板を折り欠き可能
に形成した折欠き基板構造とすることが行われている。
従来、この種の折欠き基板構造は、図２に示すように、
メインプリント基板２１の中央部のデットスペースに、
サブプリント基板２２が丸穴２３及び／又は小判穴２４
を連ねたミシン目２５と丸穴２３を介在した溝穴２６と
に囲まれて折り欠き可能に形成されてなる。図２におい
て２７はトランス、２８はコネクター、２９はＩＣ、３
０は電源端子である。2. Description of the Related Art In recent years, in a relatively large main printed circuit board (main PCB), a sub printed circuit board is placed in a dead space in the central part in order to effectively utilize the central part where high components cannot be mounted. It has been practiced to provide a notched substrate structure in which is formed so as to be capable of being notched.
Conventionally, this kind of notched substrate structure is as shown in FIG.
In the dead space in the center of the main printed circuit board 21,
The sub-printed circuit board 22 has a round hole 23 and / or an oval hole 24.
It is formed so as to be foldable by being surrounded by perforations 25 and a slot 26 having a round hole 23. In FIG. 2, 27 is a transformer, 28 is a connector, 29 is an IC, 3
0 is a power supply terminal.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、従来の
折欠き基板構造においては、ミシン目を同時にカットす
るために、プレス金型等の大掛かりなカット治具が必要
となると共に、カットのために専門の人員が必要であっ
た。そのためカット工程が必要となって工数がかかり、
かつ作業に危険を伴う一方、基板のひび割れ等によって
基板ロスが出やすい不具合があった。そこで、本発明
は、サブプリント基板の折り欠きを手で行うようにする
ことにより、カット治具及びカット工程を不要とし、か
つ危険性を少なくすると共に、基板ロスを低減し得る折
欠き基板構造を提供することを目的とする。However, in the conventional notched substrate structure, a large-scale cutting jig such as a press die is required to cut perforations at the same time, and a specialized cutting tool is required. Personnel were needed. Therefore, a cutting process is required and man-hours are required,
Moreover, while the work is dangerous, there is a problem that substrate loss easily occurs due to cracks in the substrate. Therefore, the present invention eliminates the need for a cutting jig and a cutting step by manually performing the folding of the sub-printed circuit board, reduces the risk, and reduces the substrate loss. The purpose is to provide.
【０００４】[0004]
【課題を解決するための手段】本発明の折欠き基板構造
は、メインプリント基板中にサブプリント基板が折り欠
き可能に形成されている折欠き基板構造において、サブ
プリント基板の一辺がミシン目によりメインプリント基
板と接続され、サブプリント基板の残りの辺が溝穴によ
りメインプリント基板と分離される一方、溝穴の一部に
掛け穴部が少なくとも１つ形成され、かつ掛け穴部に隣
接してメインプリント基板及び／又はサブプリント基板
と小判穴を介在した溝穴で分離された捨て基板が形成さ
れていることを特徴とするするものである。The broken board structure of the present invention is a broken board structure in which a sub printed board is formed so as to be broken in a main printed board, and one side of the sub printed board is perforated. While being connected to the main printed circuit board and the remaining side of the sub printed circuit board is separated from the main printed circuit board by the slot, at least one hanging hole is formed in a part of the slot and is adjacent to the hanging hole. The main printed circuit board and / or the sub printed circuit board are separated from each other by slot holes having oval holes.
【０００５】[0005]
【作用】本発明の折欠き基板構造においては、サブプリ
ント基板が主として一辺のミシン目のみでメインプリン
ト基板と接続され、捨て基板を手又はラジオペンチ等の
工具で折り欠いた後、サブプリント基板を把持してミシ
ン目を手又は工具で容易に折り欠くことが可能となる。
掛け穴部は、ミシン目からできるだけ離れた位置に設け
ることが好ましい。このようにすることにより、折り欠
く際の力を小さくすることができる。In the notched board structure of the present invention, the sub-printed board is connected to the main printed-circuit board mainly only by perforations on one side, and after discarding the discarded board by hand or a tool such as radio pliers, the sub-printed board is formed. It is possible to easily fold the perforations by hand or by grasping the.
The hanging hole portion is preferably provided at a position as far as possible from the perforation. By doing so, the force at the time of folding can be reduced.
【０００６】[0006]
【実施例】以下、本発明の実施例について図面を参照し
て説明する。図１は本発明の一実施例の折欠き基板構造
を有するプリント基板の平面図である。このプリント基
板は、比較的大きなメインプリント基板１の中央部のデ
ットスペースに、方形状のサブプリント基板２の一辺
が、丸穴３及び小判穴４を連ねたミシン目５によりメイ
ンプリント基板１と接続され、かつ残りの辺が溝穴６に
よりメインプリント基板１と分離されて形成されている
一方、上記一辺の対向する辺の両端部の溝穴６の一部
に、この部分を広幅の円形に拡幅し、指又はラジオペン
チ等の工具の挿入を可能とする掛け穴部７がそれぞれ形
成され、かつ各指掛け穴部７に隣接して、メインプリン
ト基板１及びサブプリント基板２と小判穴８を介在した
溝穴９で分離した捨て基板１０が形成された折欠き基板
構造とされている。図１において１１はトランス、１２
はコネクター、１３はＩＣ、１４は電源端子である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of a printed circuit board having a broken board structure according to an embodiment of the present invention. This printed circuit board is connected to the main printed circuit board 1 by a perforation 5 in which one side of a rectangular sub printed circuit board 2 connects a round hole 3 and an oval hole 4 in a relatively large central dead space of the main printed circuit board 1. The connecting side and the remaining side are formed by being separated from the main printed circuit board 1 by the slot 6, while the part of the slot 6 at both ends of the opposite side of the above-mentioned one side has a wide circular shape. Is formed in the main printed circuit board 1 and the sub printed circuit board 2 and the oval hole 8 adjacent to each finger hooking hole 7 so that a tool such as a finger or radio pliers can be inserted. It has a notched substrate structure in which the discarded substrate 10 separated by the intervening slot 9 is formed. In FIG. 1, 11 is a transformer and 12
Is a connector, 13 is an IC, and 14 is a power supply terminal.
【０００７】上記構造のプリント基板においては、サブ
プリント基板２が主として一辺のミシン目５のみでメイ
ンプリント基板１と接続されているので、各掛け穴部７
から指又は工具を挿入したそれぞれの捨て基板１０を手
で折り欠いた後、捨て基板１０が除去された両方の穴に
指又は工具を挿入してサブプリント基板２を把持し、ミ
シン目５を手で折り欠いてサブプリント基板２をメイン
プリント基板１から分離することができる。したがっ
て、従来のようにカット治具を用いる必要がなくなり、
サブプリント基板２の折り欠きをライン作業の一部とし
てできるので、カット専門の人員が不要となり、作業効
率が向上し、危険も少なくなる。又、大きな治具をプリ
ント基板の種類毎に作製し、管理する必要もなくなる。In the printed circuit board having the above structure, since the sub printed circuit board 2 is connected to the main printed circuit board 1 mainly only by the perforations 5 on one side, each hanging hole 7 is formed.
After the respective waste boards 10 into which fingers or tools have been inserted are folded off by hand, the fingers or tools are inserted into both holes from which the waste boards 10 have been removed, and the sub-printed board 2 is gripped, and the perforations 5 are formed. The sub printed circuit board 2 can be separated from the main printed circuit board 1 by folding it by hand. Therefore, there is no need to use a cutting jig as in the past,
Since the notch of the sub-printed circuit board 2 can be formed as a part of the line work, the personnel specialized in cutting is not required, the work efficiency is improved, and the risk is reduced. Also, it is not necessary to manufacture and manage a large jig for each type of printed circuit board.
【０００８】なお、上述した実施例においては、指掛け
穴部７及び捨て基板１０を２個所に設ける場合について
説明したが、これらをミシン目５から最も遠い１個所に
設けるようにしてもよい。In the above-described embodiment, the case where the finger-holding hole portion 7 and the discarding board 10 are provided at two locations has been described, but they may be provided at one location farthest from the perforation 5.
【０００９】[0009]
【発明の効果】以上説明したように、本発明の折欠き基
板構造によれば、サブプリント基板が主として一辺のミ
シン目のみでメインプリント基板と接続されるので、捨
て基板を手又はラジオペンチ等の工具で折り欠いた後、
サブプリント基板を把持してミシン目を手又は工具で容
易に折り欠くことができる。したがって、従来のように
大掛かりなカット治具及びカット工程が不要となり、サ
ブプリント基板の折り欠きをライン作業の一部としてで
きるので、カット専門の人員が不要となり、作業効率を
向上でき、かつ危険も少なくなる。又、基板のロスも低
減でき、かつ大きな治具を基板の種類毎に作製し、管理
する必要もなくなる。As described above, according to the notched board structure of the present invention, the sub-printed board is connected to the main printed board mainly by the perforations on one side. After breaking it with the tool of
The perforations can be easily broken by hand or with a tool while holding the sub-printed board. Therefore, it does not require a large-scale cutting jig and cutting process as in the past, and the folding of the sub-printed circuit board can be done as a part of the line work. Also less. In addition, the loss of the substrate can be reduced, and it becomes unnecessary to manufacture and manage a large jig for each type of substrate.
【図１】本発明の一実施例の折欠き基板構造を有するプ
リント基板の平面図である。FIG. 1 is a plan view of a printed circuit board having a broken board structure according to an embodiment of the present invention.
【図２】従来の折欠き基板構造を有するプリント基板の
平面図である。FIG. 2 is a plan view of a printed circuit board having a conventional broken board structure.
１ メインプリント基板 ２ サブプリント基板 ５ ミシン目 ６ 溝穴 ７ 掛け穴部 ８ 小判穴 ９ 溝穴 １０ 捨て基板 1 Main Printed Circuit Board 2 Sub Printed Circuit Board 5 Perforation 6 Groove Hole 7 Hanging Hole 8 Oval Hole 9 Groove Hole 10 Discarded Board
Claims (1)
板が折り欠き可能に形成されている折欠き基板構造にお
いて、サブプリント基板の一辺がミシン目によりメイン
プリント基板と接続され、サブプリント基板の残りの辺
が溝穴によりメインプリント基板と分離される一方、溝
穴の一部に掛け穴部が少なくとも１つ形成され、かつ掛
け穴部に隣接してメインプリント基板及び／又はサブプ
リント基板と小判穴を介在した溝穴で分離された捨て基
板が形成されていることを特徴とする折欠き基板構造。1. A folded board structure in which a sub printed board is formed so as to be able to be folded in a main printed board, wherein one side of the sub printed board is connected to the main printed board by a perforation and the remaining portion of the sub printed board. While the side is separated from the main printed circuit board by the slot, at least one hanging hole is formed in a part of the slot, and the main printed board and / or the sub printed board and the oval hole are adjacent to the hanging hole. A notched substrate structure, characterized in that a discarded substrate is formed by being separated by a slot having a groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4330068A JP2679560B2 (en) | 1992-11-16 | 1992-11-16 | Broken board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4330068A JP2679560B2 (en) | 1992-11-16 | 1992-11-16 | Broken board structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06164078A true JPH06164078A (en) | 1994-06-10 |
| JP2679560B2 JP2679560B2 (en) | 1997-11-19 |
Family
ID=18228424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4330068A Expired - Fee Related JP2679560B2 (en) | 1992-11-16 | 1992-11-16 | Broken board structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2679560B2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58153469U (en) * | 1982-04-07 | 1983-10-14 | 株式会社東芝 | Printed board |
| JPS62170664U (en) * | 1986-04-19 | 1987-10-29 | ||
| JPS6441162U (en) * | 1987-09-08 | 1989-03-13 | ||
| JP3079466U (en) * | 2001-02-07 | 2001-08-17 | 株式会社エーデン | Receipt paper |
-
1992
- 1992-11-16 JP JP4330068A patent/JP2679560B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58153469U (en) * | 1982-04-07 | 1983-10-14 | 株式会社東芝 | Printed board |
| JPS62170664U (en) * | 1986-04-19 | 1987-10-29 | ||
| JPS6441162U (en) * | 1987-09-08 | 1989-03-13 | ||
| JP3079466U (en) * | 2001-02-07 | 2001-08-17 | 株式会社エーデン | Receipt paper |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2679560B2 (en) | 1997-11-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |