JPH03129893A - Collective board - Google Patents
Collective boardInfo
- Publication number
- JPH03129893A JPH03129893A JP1268510A JP26851089A JPH03129893A JP H03129893 A JPH03129893 A JP H03129893A JP 1268510 A JP1268510 A JP 1268510A JP 26851089 A JP26851089 A JP 26851089A JP H03129893 A JPH03129893 A JP H03129893A
- Authority
- JP
- Japan
- Prior art keywords
- cut
- full
- board
- hole
- boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005553 drilling Methods 0.000 claims description 2
- 101700004678 SLIT3 Proteins 0.000 abstract description 7
- 102100027339 Slit homolog 3 protein Human genes 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 5
- 238000004381 surface treatment Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 8
- 230000006378 damage Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
この発明は、プリント配線基板(Printed Ci
r・cuit Board 略称PCB)や混成集積
回路基板(Hybrid Inte「8rated C
1rcuit Board 略称HICB)等の集合
基板に間し、特に、定尺の単葉基板中に多品種に亘る基
板を印刷技術により形成し、基板に設けたカットライン
で折り割りする集合基板において、折り割りで生じる破
断突起を分割した基板の外形ラインに突出させないよう
にした集合基板に間する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a printed wiring board (Printed Ci
r・cut Board (abbreviated as PCB) and hybrid integrated circuit board (Hybrid
1rcuit board (abbreviated as HICB), etc., especially in the case of a collective board in which a wide variety of boards are formed using printing technology in a fixed-length single board, and the board is folded along a cut line provided on the board. The broken protrusions caused by the splitting process are placed between the assembled substrates in such a way that they do not protrude into the outline line of the divided substrates.
[発明の背景]
近年、家電機器、音響機器、OA機器等にプリント配線
基板や混成集積回路基板が幅広く使用されるようになっ
た。[Background of the Invention] In recent years, printed wiring boards and hybrid integrated circuit boards have come to be widely used in home appliances, audio equipment, OA equipment, and the like.
そして、そのプリント配線基板や混成集積回路基板は、
基板の効率的利用及び経済性を考慮して一枚の定尺の基
板中に多品種に亘る基板を印刷技術によって形成し、基
板に穿孔したミシン目の力・ントラインで所望のプリン
ト配線基板や混成集積回路基板に折り割りで分割してい
た。The printed wiring board and hybrid integrated circuit board are
In consideration of efficient use and economy of the board, a wide variety of boards are formed on a single fixed-sized board using printing technology, and the desired printed wiring board or It was divided into hybrid integrated circuit boards by folding.
カットラインとして基板に穿孔したミシン目等は、例え
ば第4図で示すように混成集積回路基板6にレーザ・ス
クライブ(図示しない)で断面逆円錐形の孔7にすると
か、第5図右側で示すように、プリント配線基板1の電
気的接続のない部分に橋掛け2してフルカットスリット
3.3を対穿設していた。Perforations made in the board as cut lines can be made, for example, by laser scribing (not shown) holes 7 in the hybrid integrated circuit board 6 as shown in FIG. As shown, a full cut slit 3.3 was formed by a bridge 2 in a portion of the printed wiring board 1 that was not electrically connected.
また、−プリント配線基板1のカットライン上に、7字
型ハーフカット溝(図示しない)を刻設して折り割りす
ることもある。Further, a 7-shaped half-cut groove (not shown) may be carved on the cut line of the printed wiring board 1 and the printed wiring board 1 may be folded.
[発明が解決しようとする課題]
前述のようなカットラインを折り割りすると、例えばフ
ルカットスリット3.3の間やフルカットホール5.5
の間の橋が、第6図で示すように表面ギザギザの破断突
起8となり、部品の実装する時や機器を利用する時に部
品を傷付けたり、指を傷付けることがあった。[Problems to be Solved by the Invention] When the cut line as described above is broken, for example, between the full cut slits 3.3 or the full cut holes 5.5
As shown in FIG. 6, the bridge between the parts becomes a broken protrusion 8 with a jagged surface, which may damage the parts or damage fingers when mounting the parts or using the equipment.
このような事態を避けるために、例えば第5図左側で示
すように、橋掛け2した部分を囲むように小さなフルカ
ットホール5等を穿けて折り割りする方法も知られてい
る。In order to avoid this situation, for example, as shown on the left side of FIG. 5, a method is known in which a small full-cut hole 5 or the like is made to surround the bridged portion 2 and then the material is broken.
しかしながら、上記のような方法をとっても、第7図で
示すようにテーバ状の破断突起8が発生する。However, even with the above method, a tapered fracture protrusion 8 occurs as shown in FIG.
何れの場合でも、表面処理をして破断突起8の除去をし
なければならなかった。特に、テーバ状の破断突起8は
見落とし易いが、必ず発生するので表面処理を忘れずに
しなければならなかった。In either case, it was necessary to perform surface treatment to remove the fracture projections 8. In particular, the tapered fracture protrusions 8 are easy to overlook, but since they always occur, surface treatment must be carried out.
この発明は、上記のような点に鑑みなされたもので、カ
ットラインの折り割り後の面倒な表面処理を必要とせず
、事後の実装作業が安全かつ確実に行える集合基板の提
供を目的とする。This invention has been made in view of the above points, and aims to provide a collective board that does not require troublesome surface treatment after folding at the cut line and allows for safe and reliable mounting work afterward. .
[!!題を解決するための手段]
上述の課題を解決するため、この発明においては、単葉
の基板にフルカットスリット及びフルカットホール等を
穿設して複数の基板に分割する集合基板において、
フルカットスリットの終端に、そのフルカットスリット
より幅の大きなラージホールを穿設すると共に、分割す
る基板の内側にフルカットホール等を穿設し、破断突起
が分割した基板の外形ラインに突出させないことを特徴
とするものである。[! ! Means for Solving the Problems] In order to solve the above-mentioned problems, in the present invention, in a collective board in which a single board is divided into a plurality of boards by drilling full-cut slits, full-cut holes, etc., the full-cut At the end of the slit, a large hole with a width larger than that of the full-cut slit is drilled, and at the same time, a full-cut hole, etc. is drilled inside the board to be divided, so that the break protrusion does not protrude into the outline line of the divided board. This is a characteristic feature.
[作 用]
第1図〜第3図で示す実施第1例において、橋掛け2で
連結されている右側のプリント配線基板1Aと左側のプ
リント配線基板IBを第2図矢印で示すように力を加え
ると、先ず、第2図で示すように奥のラージホール4か
ら左側のフルカットホール5〜左手前のフルカットホー
ル5〜手前のラージホール4と亀裂9が入る。さらに、
力を加え続けると、その亀裂9が拡がって、左側のプリ
ント配線基板IBが第3図のように分離される。[Function] In the first embodiment shown in FIGS. 1 to 3, the right printed wiring board 1A and the left printed wiring board IB, which are connected by the bridge 2, are forced as shown by the arrows in FIG. When adding , first, as shown in FIG. 2, from the large hole 4 at the back, the full cut hole 5 on the left side, the full cut hole 5 on the left front side, the large hole 4 on the front side, and the crack 9 enter. moreover,
As the force continues to be applied, the crack 9 widens and the left printed wiring board IB is separated as shown in FIG.
次に、橋掛け2部分を摘んで折り割りする。Next, pick up the 2 parts of the bridge and break it.
[実 施 例]
続いて、この発明に係る集合基板の実施の一例について
、図面を参照して詳細に説明する。[Embodiment] Next, an embodiment of the collective substrate according to the present invention will be described in detail with reference to the drawings.
第1図において、集合基板としてのプリント配線基板l
は、例えばガラスエポキシ樹脂、エポキシ樹脂、紙フエ
ノール樹脂等の絶縁板で製せられ、定尺(例えば100
0mmX 1000sv)に裁断されている。In Figure 1, a printed wiring board l as a collective board
is made of an insulating board such as glass epoxy resin, epoxy resin, paper phenol resin, etc., and has a fixed length (for example, 100
0mm x 1000sv).
そして、このプリント配線基板1には、多品種に亘って
所望の配線がプリントされ、分割するラインに沿ってカ
ットラインCLが施されている。Desired wiring is printed on the printed wiring board 1 for a wide variety of products, and a cut line CL is provided along the dividing line.
定尺のプリント印刷基板(厚さ1. (3mm) 1
に施されるカットラインCLは、例えば、第1図でその
一部を示すように、電気的接続のない部分に橋掛け2し
て暢2III11のフルカットスリット3.3を対穿設
し、そのフルカットスリット3.3の対向する端部に直
径8amのラージホール4.4を各穿設すると共に、橋
掛け2した外側に直径5mmのフルカットホール5.5
を並んで穿設する。Standard size printed circuit board (thickness 1. (3mm) 1
For example, as part of the cut line CL shown in FIG. A large hole 4.4 with a diameter of 8 am is bored at the opposite end of the full cut slit 3.3, and a full cut hole 5.5 with a diameter of 5 mm is formed on the outside of the bridge 2.
are drilled side by side.
上記のラージホール4は、カットしたラインの外側にテ
ーバ状の破断突起8を残さないように穿設したものであ
る。The above-mentioned large hole 4 is drilled so as not to leave a tapered breaking protrusion 8 outside the cut line.
このように橋掛け2を挟んで、ラージホール4、フルカ
ットスリット3が各連穿設されると共に、フルカットホ
ール5.5が各並んで対設されることによって、プリン
ト配線基板lが右側のプリント配線基板IAと左側のプ
リント配線基板IBとに分けられる。In this way, the large holes 4 and the full cut slits 3 are formed in series with the bridge 2 in between, and the full cut holes 5.5 are arranged side by side and opposite each other, so that the printed wiring board l is placed on the right side. It is divided into a printed wiring board IA on the left side and a printed wiring board IB on the left side.
そして、プリント配線基板lには、右側のプリント基板
IAの力、ットラインCLと左側のプリント基板IBの
カットラインCLが形成される。Then, a cut line CL of the printed wiring board IA on the right side and a cut line CL of the printed wiring board IB on the left side are formed on the printed wiring board l.
さらに詳しくは、右側のプリント配線基板IAのカット
ラインCLは、奥のフルカットスリット3の右側〜奥の
ラージホール4の右11(約90度)〜右奥のフルカッ
トホール5〜右手前のフルカットホール5〜手前のラー
ジホール4の右l1l(約90度)に形成される。More specifically, the cut line CL of the printed wiring board IA on the right side is from the right side of the full cut slit 3 at the back to the right side 11 (approximately 90 degrees) of the large hole 4 at the back to the full cut hole 5 at the back right to the right side at the front right. It is formed to the right l1l (approximately 90 degrees) of the large hole 4 in front of the full cut hole 5.
また、左側のプリント配線基板IBのカットラインCL
は、奥のフルカットスリット3の左側〜奥のラージホー
ル4の左wJ(tJ90度)〜左奥のフルカットホール
5〜左手前のフルカットホール5〜手前のラージホール
4の左側(約90度)〜手前のフルカットスリット3の
左側に形成される。Also, the cut line CL of the printed wiring board IB on the left side
is the left side of the back full cut slit 3 ~ the left wJ (tJ 90 degrees) of the back large hole 4 ~ the left back full cut hole 5 ~ the left front full cut hole 5 ~ the left side of the front large hole 4 (approximately 90 degrees) degree) to the left side of the front full-cut slit 3.
第1図〜第3図で示す実施第1例において、橋措け2で
連結されている右側のプリント配線基板IAと左側のプ
リント配線基板IBを、第2図矢印で示すように力を加
えると、先ず第2図で示すように奥のラージホール4か
ら左奥のフルカットホール5〜左手前のフルカットホー
ル5〜手前のラージホール4と亀裂9が入る。さらに、
力を加え続けると、その亀裂9が拡がって、左側のプリ
ント配線基板IBが第3図のように分離される。In the first implementation example shown in FIGS. 1 to 3, a force is applied to the right printed wiring board IA and the left printed wiring board IB, which are connected by the bridge structure 2, as shown by the arrow in FIG. First, as shown in FIG. 2, from the large hole 4 in the back, the full cut hole 5 in the back left, the full cut hole 5 in the front left, the large hole 4 in the front, and the crack 9 enter. moreover,
As the force continues to be applied, the crack 9 widens and the left printed wiring board IB is separated as shown in FIG.
次に、橋掛け2部分を摘んで折り割りする。Next, pick up the 2 parts of the bridge and break it.
基板形状が矩形の場合は、その後、コンデンサ、ICチ
ップ、抵抗、チップ部品等(図示しない)を実装する。If the substrate shape is rectangular, then capacitors, IC chips, resistors, chip components, etc. (not shown) are mounted.
基板形状が複雑な場合は、単葉基板にコンデンサ、IC
チップ、抵抗、チップ部品等を実装後、本発明の通りに
折り割りする。If the board shape is complicated, capacitors and ICs may be placed on a single board.
After mounting chips, resistors, chip components, etc., it is folded according to the present invention.
以上、実施例においては、輻2mmのフルカットスリッ
ト3に対して、ラージホール4の直径を8謂−としたが
、ラージホール4の直径は、フルカットスリット3の幅
より大きければよい。但し、破断によるテーバ状の破断
突起8が分割した基板の外形ラインL(第3図2点鎖線
で示す)より突出しないことが条件となる。同じく、橋
掛け2の外側(分割する基板の内11111)に穿設す
るフルカットホール5も破断によるギザギザ状の破断突
起8が分割した基板の外形ラインLより突出しなければ
、その深さく奥行き)や形状は問わない。また、フルカ
ットホールでなくてもよい。In the above embodiment, the diameter of the large hole 4 was set to 8 mm for the full cut slit 3 with a diameter of 2 mm, but the diameter of the large hole 4 may be larger than the width of the full cut slit 3. However, the condition is that the tapered fracture protrusion 8 caused by the fracture does not protrude beyond the outline line L (shown by the two-dot chain line in FIG. 3) of the divided substrate. Similarly, the full cut hole 5 to be drilled on the outside of the bridge 2 (inside the board to be divided 11111) is also deep if the jagged fracture protrusion 8 due to the fracture does not protrude beyond the outline line L of the divided board. It doesn't matter what shape it is. Moreover, it does not have to be a full cut hole.
[発明の効果]
以上のように、本発明に係る集合基板は、−枚の大きな
基板に多品種に亘って所望の配線がプリントされた後に
、複数の基板に分割する集合基板において、フルカット
スリットの終端にラージホールを穿設すると共に、分割
する基板の内側にカットラインの一部となるフルカット
ホール等を穿設したものである。[Effects of the Invention] As described above, the collective board according to the present invention is capable of full-cutting in the collective board that is divided into a plurality of boards after desired wiring of various types is printed on two large boards. A large hole is formed at the end of the slit, and a full cut hole, etc., which becomes part of the cut line, is formed inside the substrate to be divided.
このような集合基板は、折り割りした時に破断突起が基
板の外形ラインから突出することがない。When such a collective substrate is folded, the breakage protrusion does not protrude from the outer contour line of the substrate.
よって、従来のように折り割り後の面倒な表面処理作業
の必要がなく、工程の簡略化及びコストダウンが行える
。さらに、破断突起による怪我や部品の破損、リード線
の切断等の事故が防止できると共に、作業の安全性が確
保でき、歩溜りの向上ができる等その実用的、経済的効
果は極めて大きい。Therefore, unlike the conventional method, there is no need for troublesome surface treatment work after folding, and the process can be simplified and costs can be reduced. Furthermore, it is possible to prevent accidents such as injuries caused by broken protrusions, damage to parts, and breakage of lead wires, as well as ensuring work safety and improving yields, which has extremely large practical and economical effects.
フた状態の斜視図、第3図はカットした面を示す斜視図
−第4図及び第5図は従来例の斜視図、第6図及び第7
図は従来例のカット面を示す斜視図である。FIG. 3 is a perspective view showing the cut surface; FIGS. 4 and 5 are perspective views of the conventional example, and FIGS. 6 and 7.
The figure is a perspective view showing a cut surface of a conventional example.
・カットライン ・外形ライン ・プリント配線基板 ・橋掛は 争フルカ・ントスリ・ソト ・ラージホール ・フルカットホール・Cut line ・Outline line ・Printed wiring board ・Hashikake is War Furka Ntosuri Soto ・Large hole ・Full cut hole
Claims (1)
ホール等を穿設して複数の基板に分割する集合基板にお
いて、 フルカットスリットの終端に、そのフルカットスリット
より幅の大きなラージホールを穿設すると共に、分割す
る基板の内側にフルカットホール等を穿設し、破断突起
が分割した基板の外形ラインに突出させないことを特徴
とする集合基板。(1) For collective boards that are divided into multiple boards by drilling full-cut slits, full-cut holes, etc. on a single board, at the end of the full-cut slit, a large hole wider than the full-cut slit is drilled at the end of the full-cut slit. At the same time, the assembled board is characterized in that a full cut hole or the like is formed inside the board to be divided so that the breaking protrusion does not protrude into the outline line of the divided board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1268510A JPH03129893A (en) | 1989-10-16 | 1989-10-16 | Collective board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1268510A JPH03129893A (en) | 1989-10-16 | 1989-10-16 | Collective board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03129893A true JPH03129893A (en) | 1991-06-03 |
Family
ID=17459510
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1268510A Pending JPH03129893A (en) | 1989-10-16 | 1989-10-16 | Collective board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03129893A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004014438A1 (en) * | 2004-03-24 | 2005-11-03 | Siemens Ag | Circuit board benefits with a variety of circuit carriers, circuit carrier and method for separating circuit carriers from a circuit board benefits |
-
1989
- 1989-10-16 JP JP1268510A patent/JPH03129893A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004014438A1 (en) * | 2004-03-24 | 2005-11-03 | Siemens Ag | Circuit board benefits with a variety of circuit carriers, circuit carrier and method for separating circuit carriers from a circuit board benefits |
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