JPH06163997A - Dehumidifier using thermoelectric effect, and method of controlling dehumidifier - Google Patents

Abstract

PURPOSE:To provide a low-cost dehumidifier of high performance and high efficiency using a thermoelectric device. CONSTITUTION:A thermoelectric device 21 is composed of a thermoelectric circuit 22 and two fins 23. The thermoelectric circuit includes a heat-conducting plate 28 and a fin 23 or each of the upper or heat-generation side and the lower on heat-absorption side. The fins 23 are arranged to pass damp air in horizontal directions in the figure. Damp air conducted in the direction of the arrow through a path 30 by a cross flow fan 29. The path 30 includes an opening 31, through which external damp air is introduced by the cross flow fan 29. The damp air is mixed with the cool dry air coming past the heat absorption side, and the mixed air flows to the heat generation side.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dehumidifying device for electrically dehumidifying utilizing a Peltier effect and a control method thereof.

[0002]

2. Description of the Related Art A conventional dehumidifying device utilizing the Peltier effect will be described with reference to FIGS. FIG. 8 shows the entire dehumidifying device, and FIG. 9 shows the configuration of the thermoelectric device installed in the dehumidifying device.

First, the structure of the thermoelectric device will be described with reference to FIG. The thermoelectric device 1 has a thermoelectric circuit in which an N-type semiconductor 2, a conductor 3, a P-type semiconductor 4, and a conductor 5 are arranged in this order. The conductor 3 is located above the thermoelectric circuit and the conductor 5 is located below the thermoelectric circuit. I am letting you. In addition, the conductor 3 is provided above the conductor 3.
The heat conductor 6 in contact with the conductor 5, the heat conductor 7 in contact with the conductor 5 is arranged below the conductor 5, and two fins 8 and 9 are arranged above and below the conductor.

In the above structure, the current flowing into the thermoelectric circuit heats or absorbs heat at the interface between the semiconductors 2 and 4 and the conductors 3 and 5 due to the Peltier effect. At this time, since the N-type semiconductors 2 and the P-type semiconductors 4 are alternately arranged, one of the conductors 3 and 5 serves as a heat generating portion or the other serves as a heat absorbing portion, and the heat conducting plates 6 and 7 are electrically conductive as described above. Since they are in contact with one of the bodies 3 and 5, one of them serves as heat generation and the other serves as heat absorption. Further, the fins 8 and 9 similarly serve as heat generation fins and the other heat absorption fins. Therefore, heat is absorbed from the heat exchanged fluid flowing through the fins 8 (or heat is dissipated into the heat exchanged fluid), and heat is dissipated into the heat exchanged fluid flowing through the fins 9 (or heat is exchanged from the heat exchanged fluid). Form a heat pump that performs absorption.

Next, the dehumidifying device will be described with reference to FIG.
The thermoelectric device 1 of FIG. 9 is installed in the central portion of FIG. The moist air is guided in the direction of the arrow by the cross flow fan 10 and the flow passage 11. At this time, the lower part of the thermoelectric device is the cooling side and the upper part is the heat radiating side. Therefore, the moist air flowing by the cross flow fan 10 is first cooled,
After reaching the dew point, water vapor condenses and lowers the absolute humidity.
After that, it is flowed into the heat radiation side by the flow path 11, receives the heat radiation from the thermoelectric circuit, rises in temperature, and is discharged to the outside as dry warm air.

The operation of such a dehumidifier is controlled by detecting the humidity by a humidity sensor (not shown) installed at the moist air inlet.

[0007]

However, such a conventional dehumidifying device has the following problems. (1) Generally, the efficiency of the thermoelectric device is low and the power consumption is large. (2) Since the capacity of the thermoelectric device is small, a large amount of thermoelectric device is required, resulting in high cost. (3) The cost of the humidity sensor for operation control is high.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a dehumidifying apparatus and a control method for the dehumidifying apparatus which have improved performance and efficiency and are low in cost.

[0009]

In order to achieve the above object, the dehumidifying device of the present invention comprises an N-type semiconductor, a first conductor and a P-type semiconductor.
Type semiconductor and second conductor in this order so that the end portions of each semiconductor / conductor are in electrical contact with each other, and the first conductor located on one side of the thermoelectric circuit A heat exchanging means that makes thermal contact with the heat exchanging means, a heat exchanging means that is located in a direction opposite to the heat exchanging means and is in thermal contact with the second conductor, and a cooling side when energizing humid air to the thermoelectric circuit. In the dehumidifying device provided with a blower and a blower flow path, in which the heat exchanging means that becomes the heat exchanging means and the heat exchanging means that becomes the heat radiating side flow in order, (1) When the air flowing out from the cooling side flows into the heat exchanging side Is provided with a mechanism for adding the moist air. (2) The lengths of the N-type semiconductor and the P-type semiconductor, which are located on the downstream side of the heat exchange means on the cooling side when energized, in the current direction are shorter than those on the upstream side. (3) The cross-sectional area of the N-type semiconductor and the P-type semiconductor located on the downstream side of the heat exchange means, which is the cooling side when energized, is made larger than that on the upstream side. (4) The temperature difference between the cooling-side inlet and the heat-radiating-side outlet of the moist air is measured, and the supply voltage or the supply current to the thermoelectric circuit is controlled by the temperature difference. (5) Measure the voltage and current value supplied to the thermoelectric circuit,
The ratio controls the supply voltage or supply current to the thermoelectric circuit. The configuration and the control method are used.

[0010]

The operation obtained by the above-mentioned configuration or method is as follows. First, the operation of the first invention will be described with reference to FIG. FIG. 10 shows how the temperature of the moist air in the dehumidifier changes. The thick line in the figure shows the temperature change of the moist air flowing on the heat radiating side and the cooling side.The moist air flows in at the state of point A in the figure and gives heat to the semiconductor cooling side shown by the dashed line in the figure, Is decreased and reaches the dew point at the point B, and then the temperature is lowered while condensing the water vapor in the moist air, and at the point C, the cooling side fins flow out. After that, it flows into the heat radiation side fin, receives heat from the semiconductor heat radiation side indicated by the one-dot chain line, the temperature rises, and flows out at the point D. Since the efficiency of the thermoelectric device is relatively low, the amount of heat radiation is larger than the amount of heat absorption, and the temperature rise on the heat radiation side is larger than on the cooling side.

On the other hand, as a characteristic of the thermoelectric device, if the temperature difference between both ends of the semiconductor becomes large, the capacity and efficiency of the thermoelectric device will be greatly reduced. When using the bismuth-tellurium-based material that is currently most used as a semiconductor material, the temperature difference is 2
The efficiency is about 1.2 at 0 deg, but the temperature difference is 30 d.
The efficiency drops to 0.7 at eg. At this time, the cooling capacity decreases to about 80%, but conversely, the amount of heat on the heat radiation side increases by 30%.

Therefore, in the present invention, not only the air from the cooling side but also the air from the outside is taken in to increase the amount of air on the heat radiating side, and the amount of air is increased to lower the temperature on the heat radiating side. Figure 1
The thick wavy line and two-dot chain line shown in 0 indicate the heat radiation when the air flowing in from the cooling side receives part of the heat radiation and rises in temperature, and when the surrounding moist air flows in at the part where the inlet temperature of the moist air has been reached. 2 shows changes in the air temperature on the high temperature side and the temperature on the high temperature side of the semiconductor. The heat capacity of the air flowing on the heat radiating side increases, the temperature rise width decreases, and the outlet temperature decreases from D to D '. Along with this, the temperature on the high temperature side of the semiconductor also decreases, and the temperature difference between both ends of the semiconductor decreases from Tb to Tc. Therefore, the capacity and efficiency in this part can be increased, and the capacity and efficiency of the entire dehumidifying device can be improved.

Next, the operation of the second and third inventions will be described. In FIG. 10, the temperature differences Tb and Tc on the left side of the figure are larger than the temperature difference Ta on the right side of the figure,
There is a big difference between the two. On the other hand, in FIG.
It shows the efficiency of the thermoelectric device with respect to the value of the current flowing through the thermoelectric device, and shows the temperature difference between both ends of the semiconductor as a parameter. Here, the current value for obtaining the maximum efficiency at the temperature difference of 20 deg shown by the solid line is shown by a thin dashed line. The thick dash-dotted line indicates that the thermoelectric device has the same shape and the temperature difference is 10
This is the aspect of efficiency when the degree becomes deg. From these comparisons, in the dehumidifier in which the temperature difference between both ends of the semiconductor changes greatly inside the thermoelectric device, it is not possible to flow an optimal current through the entire thermoelectric device. Therefore, as in the present invention, by changing the shape of the semiconductor in the portion where the temperature difference is small, it is possible to make the maximum efficiency currents substantially coincide with each other as indicated by the characteristic indicated by the chain double-dashed line. Specifically, this effect can be obtained by shortening the length of the semiconductor in the current direction or increasing the cross-sectional area of the semiconductor. As a result, the efficiency of the dehumidifier is improved and the capacity is also improved.

Next, the operation of the fourth and fifth inventions will be described with reference to FIG. FIG. 12 is similar to FIG.
It shows the aspect of the temperature change of the moist air in the dehumidifier. The thick line in the figure shows the temperature change of the moist air flowing on the heat radiation side and the heat absorption side. The temperature difference between the inlet temperature and the outlet temperature of the moist air is Te. The broken line shows the temperature change when the humidity of the moist air decreases. Since the dew point lowers, the dehumidification start portion moves to the downstream portion on the cooling side, and as a result, the outlet temperature on the cooling side decreases. Since it flows into the heat radiation side at this outlet temperature, the heat radiation side outlet temperature also decreases. At this time, the temperature difference between the inlet temperature and the outlet temperature of the moist air is Te '. That is, it is possible to detect the humidity change of the humid air by the temperature difference between the inlet side temperature and the outlet side temperature of the humid air. Therefore, the operation control of the dehumidifier can be performed only by using a relatively low-cost sensor such as a thermistor. The voltage supplied to the thermoelectric device is represented by the sum of the voltage obtained by multiplying the resistance of the thermoelectric device by the current and the voltage proportional to the temperature difference across the semiconductor. Therefore, as shown in FIG. 12, when the humidity of the humid air decreases, the temperature difference across the semiconductor decreases in most parts of the thermoelectric device, and the supply voltage decreases. Therefore, it is possible to control the operation of the dehumidifier by detecting the supply voltage and the supply current and using the ratio of the detected values.

As described above, according to the present invention, the capacity and efficiency of the dehumidifier can be improved and the cost can be reduced.

[0016]

【Example】

(Embodiment 1) Specific examples according to the present invention will be described in detail below. FIG. 1 shows an embodiment of the first invention, showing a structure of a dehumidifying device. As shown in the figure, the thermoelectric device 21 includes a thermoelectric circuit 22 and two fins 23 on both sides of the thermoelectric circuit 22. The thermoelectric circuit 22 includes an N-type semiconductor 24 and a conductor 2.
5, a P-type semiconductor 26 and a conductor 27 are formed in this order,
The conductor 25 is located above the thermoelectric circuit, and the conductor 27 is located below the thermoelectric circuit. In addition, the conductors 25, 2
Two heat conductors 28 contacting each of 7 are installed,
Further, two fins 23 are located on both sides thereof.

In the above structure, the current flowing into the thermoelectric circuit generates or absorbs heat by the Peltier effect at the interfaces between the semiconductors 24 and 26 and the conductors 25 and 27. At this time,
Since the N-type semiconductors 24 and the P-type semiconductors 26 are alternately arranged, one of the conductors 25 and 27 serves as a heat generating portion and the other serves as a heat absorbing portion. In FIG. 1, the conductor 25 serves as a heat generating portion and the conductor 27 serves as a heat absorbing portion depending on the current direction (not shown). Therefore, the heat conducting plate 28 and the fin 23 located above the thermoelectric circuit 22 are on the heat generating side, and the heat conducting plate 28 and the fin 23 located below are on the heat absorbing side.

The fins 23 are installed so that moist air flows in the left-right direction in the drawing. The moist air is guided in the direction of the arrow by the cross flow fan 29 and the flow passage 30. Moist air is first cooled and, after reaching the dew point, water vapor condenses, reducing the absolute humidity. After that, it is flown into the heat radiation side by the flow path 30, receives heat radiation from the thermoelectric circuit, rises in temperature, and is discharged to the outside as dry warm air. At this time,
Since the flow path 30 has the opening 31 formed therein, the cross flow fan 29 allows the outside moist air to flow in through the opening 31 and mixes with the low-temperature low-humidity air coming from the heat absorption side to radiate heat. Flows into the side. Therefore, the heat capacity of the air flowing on the heat radiation side increases, the temperature rise width decreases, and the outlet temperature decreases. Along with this, the temperature on the high temperature side of the semiconductor is also lowered, and the temperature difference between both sides of the semiconductor is reduced, so that it is possible to improve the capacity and efficiency of the dehumidifier.

The effect of this embodiment does not depend on the shape of the thermoelectric circuit, and other shapes can be applied as long as the thermoelectric circuit has one surface that radiates heat and the other surface that absorbs heat. In addition, although the example in which the air is sucked by the fan 29 is described, it goes without saying that the above-described effect can be obtained if the structure is provided with a mechanism in which external air flows in from the opening 31.

As described above, according to the present invention, a temperature difference between both ends of a semiconductor is reduced, and a thermoelectric device having high performance and efficiency is provided. (Embodiment 2) FIG. 2 shows another embodiment of the first invention, showing the construction of a dehumidifying device.

As shown, the thermoelectric device 21 includes a thermoelectric circuit 22.
And two fins 23. Thermoelectric device 21
Is similar to that shown in FIG. The moist air is
It is guided in the direction of the arrow by the cross flow fan 29 and the flow path 32. Moist air is first cooled and, after reaching the dew point, water vapor condenses, reducing the absolute humidity. afterwards,
The flow path 32 causes the heat to flow into the heat radiation side, receives heat radiation from the thermoelectric circuit, rises in temperature, and is discharged to the outside as dry warm air. At this time, since the fins 23 on the radiating side have the openings 33 formed therein, the cross flow fan 29 allows the outside humid air to flow in through the openings 33. Channel 32
The air flowing from the fins 23 to the fins 23 has a low temperature and low humidity on the heat absorbing side, and then receives heat from the heat radiating portion and rises in temperature. In the vicinity of the opening 33, the temperature rises to the same level as the temperature of the outside moist air and mixes with the air flowing in from the opening 33. Therefore, in the portion upstream of the opening 33, heat is radiated to low temperature air, the temperature on the high temperature side of the semiconductor is low, and the temperature difference between both sides of the semiconductor is small, so the efficiency of the thermoelectric circuit is high.
On the other hand, in the downstream part of the opening 33, the heat capacity of the flowing air increases, the temperature rise width decreases, and the outlet temperature decreases. Along with this, the temperature on the high temperature side of the semiconductor is reduced in the downstream portion, and the temperature difference between both ends of the semiconductor is reduced, so that the capacity and efficiency of the dehumidifier can be improved.

The effect of the present embodiment is not influenced by the shape of the thermoelectric circuit, and other shapes can be applied as long as the thermoelectric circuit has one surface for heat dissipation and the other surface for heat absorption. In addition, although the example in which the air is sucked by the fan 29 is described, it goes without saying that the effect of the present invention can be obtained as long as the structure has a mechanism in which the outside air flows in from the opening 33.

As described above, according to the present invention, a dehumidifying device which has a small temperature difference between both ends of a semiconductor and which has high performance and efficiency is provided. (Embodiment 3) FIG. 3 shows one embodiment of the second invention, showing the construction of a thermoelectric device installed in a dehumidifier.

As shown, the thermoelectric device 41 includes a thermoelectric circuit 42.
And two fins 43. Thermoelectric circuit 42
Is formed by sequentially arranging an N-type semiconductor 44, a conductor 45, a P-type semiconductor 46, and a conductor 47, and the conductor 45 is located above the thermoelectric circuit and the conductor 47 is located below the thermoelectric circuit. In addition, 2 which is in contact with each of the conductors 45 and 47
Two heat conductors 48 are installed, and two fins 43 are located on both sides of the heat conductor 48.

The current flowing into the thermoelectric circuit is the semiconductor 4
At the interfaces between the conductors 4, 46 and the conductors 45, 47, heat is generated or heat is absorbed by the Peltier effect. At this time, since the N-type semiconductors 44 and the P-type semiconductors 46 are alternately arranged, the conductor 4
One of the heating elements 5 and 47 serves as a heat generating portion and the other serves as a heat absorbing portion. In FIG. 3, the conductor 45 serves as a heat generating portion and the conductor 47 serves as a heat absorbing portion depending on the current direction (not shown). Therefore, the heat conducting plate 48 and the fin 43 located above the thermoelectric circuit 42 are on the heat generating side, and the heat conducting plate 48 and the fin 43 located below are on the heat absorbing side. The right portion of the thermoelectric circuit 42 is a deformed portion 49 in which the dimensions of the semiconductor and the conductor are changed from those of the other portions.
It is composed of The height of the conductor is made lower than that of the semiconductor of other portions, and the thickness of the conductor is made larger. The moist air flows in from the left side of the fins 43 on the heat absorption side, is cooled and dehumidified, flows out from the right side, flows in again from the right side of the fins 43 located above, is heated, and then flows out from the left side. In such a dehumidifier, the temperature difference between both ends of the thermoelectric circuit 42 is large in the left part and small in the right part. Although the current flowing through each semiconductor forming the thermoelectric circuit 42 does not change, since the deforming portion 49 is provided as described above, the ability and efficiency can be increased even in the deforming portion 49 having a small temperature difference between both ends of the semiconductor. it can.

As described above, according to the present invention, a dehumidifying device with high capacity and efficiency is provided. (Embodiment 4) FIG. 4 shows another embodiment of the second invention, showing the structure of a thermoelectric device installed in a dehumidifier.

As shown, the thermoelectric device 51 includes a thermoelectric circuit 52.
And two corrugated fins 53. An N-type semiconductor 55, a conductor 56, a P-type semiconductor 57, and a conductor 58 are sequentially formed on one surface of the insulating film substrate 54. The insulating film substrate 54 has a corrugated shape in which the conductor 56 is located in the convex and the conductor 58 is located in the concave. In addition, two heat conductors 59 that are in contact with the conductors 56 and 58 are installed, and further two corrugated fins 5 are provided on both sides thereof.
3 is located.

The current flowing into the thermoelectric circuit is the semiconductor 5
Heat or heat is absorbed at the interface between the conductors 5, 57 and the conductors 56, 58 by the Peltier effect. At this time, since the N-type semiconductors 55 and the P-type semiconductors 57 are alternately arranged, the conductor 5
One of the heat generating parts 6 and 58 is a heat generating part and the other is a heat absorbing part. In FIG. 4, the conductor 56 serves as a heat generating portion and the conductor 58 serves as a heat absorbing portion depending on the current direction (not shown). Therefore, the heat conducting plate 59 and the fin 53 located above the thermoelectric circuit 52 are on the heat generating side, and the heat conducting plate 59 and the fin 53 located below are on the heat absorbing side. The rear part of the thermoelectric circuit 52 is
Deformation part 6 in which the dimensions of the semiconductor and the conductor are different from those of other parts
It consists of zero. That is, the width is smaller than that of the semiconductor in other portions, and the length of the conductor is increased.

The moist air flows in from the front of the heat absorbing side corrugated fins 53 located at the lower part, is cooled and dehumidified, and then flows out from the rear, and the corrugated fins 5 located at the upper part.
3 again flows in from the rear, is heated, and then flows out from the front. In such a dehumidifier, the temperature difference between both ends of the thermoelectric circuit 52 is large in the front part and small in the rear part.
Although the current flowing through each of the semiconductors forming the thermoelectric circuit 52 does not change, as described above, the deformation portion 60 has a short semiconductor length, which reduces the electric resistance and increases the current density. Even in the deforming section 60 having a small difference, the capacity and efficiency can be increased.

In the present embodiment, the corrugated fins are used as the heat exchange means, but the same effect can be obtained by using other heat exchange means, and the corrugated fins can be exchanged with the heat exchange means. It is also possible to apply corrugated processing for heat transfer characteristics, louvers, and slit processing. (Embodiment 5) FIG. 5 shows one embodiment of the third invention and shows the construction of a thermoelectric device installed in a dehumidifying device.

The thermoelectric device 61 comprises a thermoelectric circuit 62 and two fins 63. The thermoelectric circuit 62 is formed by arranging an N-type semiconductor 64, a conductor 65, an N-type semiconductor 66, and a conductor 67 in order, and the conductor 65 has a shape in which it is located above the thermoelectric circuit and the conductor 67 is located below the thermoelectric circuit. ing. In addition, two heat conductors 68 that are in contact with the conductors 65 and 67 are installed, and two fins 63 are provided on both sides thereof.
Is located.

The current flowing into the thermoelectric circuit is the semiconductor 6
Heat is generated or absorbed by the Peltier effect at the interface between the conductors 4, 66 and the conductors 65, 67. At this time, since the N-type semiconductors 64 and the P-type semiconductors 66 are alternately arranged, the conductor 6
One of 5 and 67 serves as a heat generating portion and the other serves as a heat absorbing portion. In FIG. 5, the conductor 65 serves as a heat generating portion and the conductor 67 serves as a heat absorbing portion depending on the current direction (not shown). Therefore, the heat conducting plate 68 and the fin 63 located above the thermoelectric circuit 62 are on the heat generating side, and the heat conducting plate 68 and the fin 63 located below are on the heat absorbing side. The right portion of the thermoelectric circuit 62 is composed of a deformed portion 69 in which the size of the semiconductor is changed from that of the other portions. That is, a semiconductor having a larger cross-sectional area than the semiconductor of the other part is installed.

The moist air flows in from the left side of the fin 63 on the heat absorption side, is cooled and dehumidified, flows out from the right side, flows in again from the right side of the fin 63 located above, is heated, and then flows out from the left side. To do. At such a dehumidifying temperature, the temperature difference between both ends of the thermoelectric circuit 62 is large in the left part and small in the right part. The current flowing through each semiconductor forming the thermoelectric circuit 62 does not change, but since the deforming portion 69 is provided as described above, the deforming portion 69 having a small temperature difference between both ends of the semiconductor.
Also in, the capacity and efficiency can be increased.

As described above, the present invention provides a dehumidifying device with high capacity and efficiency. (Embodiment 6) FIG. 6 shows an embodiment according to the fourth invention.
The structure of a dehumidifier is shown. As shown, the thermoelectric device 71 includes a thermoelectric circuit 72 and two fins 73. The thermoelectric circuit 72 is composed of N-type and P-type semiconductors and conductors, and has an upper surface serving as a heat radiation surface and a lower surface serving as a heat absorption surface. Since the two fins 73 are located on both sides of the thermoelectric circuit 72, the upper fin 73 is on the heat generating side and the lower fin 73 is on the heat absorbing side. The fins 73 are installed so that moist air flows in the left-right direction in the drawing.

The moist air is guided in the direction of the arrow by the cross flow fan 74 and the flow path 75. Moist air is first cooled and, after reaching the dew point, water vapor condenses, reducing the absolute humidity. After that, it is flowed into the heat radiation side by the flow path 75, receives heat radiation from the thermoelectric circuit, rises in temperature, and is discharged to the outside as dry hot air. Two thermistors 76 are installed at the inlet and the outlet of the moist air, and the controller 7
Each temperature is input to 8. In the controller 78, the thermistor 7
6, the inlet / outlet temperature difference of the moist air is calculated, and the output value to the current line 79 supplied to the thermoelectric circuit 72 is controlled according to the temperature difference. Specifically, the current is supplied when the temperature difference is above a certain level, and the current is stopped when the temperature difference is below a certain level.

The effect of this embodiment does not depend on the shape of the thermoelectric circuit, and other shapes can be applied as long as the thermoelectric circuit has one surface that radiates heat and the other surface that absorbs heat. Although the thermistor is used as the temperature difference detecting means, it goes without saying that the effect of the present invention can be obtained as long as it has a temperature detecting mechanism.

As described above, according to the present invention, it is possible to control the dehumidifying device without using expensive detecting means such as a humidity detector. (Embodiment 7) FIG. 7 shows an embodiment according to the fifth invention.
The structure of a dehumidifier is shown. As shown, the thermoelectric device 81 includes a thermoelectric circuit 82 and two fins 83. The thermoelectric circuit 82 is composed of N-type and P-type semiconductors and conductors, and has an upper surface serving as a heat radiation surface and a lower surface serving as a heat absorption surface. Since the two fins 83 are located on both sides of the thermoelectric device 81, the upper fin 83 is on the heat generating side and the lower fin 83 is on the heat absorbing side. The fins 83 are installed so that moist air flows in the left-right direction in the drawing.

The moist air is guided in the direction of the arrow by the cross flow fan 84 and the flow path 85. Moist air is first cooled and, after reaching the dew point, water vapor condenses, reducing the absolute humidity. After that, it is flowed into the heat radiation side by the flow path 85, receives heat radiation from the thermoelectric circuit, rises in temperature, and is discharged to the outside as dry warm air. The controller 86 that supplies a current to the thermoelectric device 82 controls the output value to the current line 87 according to the supplied voltage value and current value. Specifically, the current is supplied when the ratio between the voltage value and the current value is above a certain level, and the current is stopped below a certain level.

The effect of this embodiment does not depend on the shape of the thermoelectric circuit, and other shapes can be applied as long as the thermoelectric circuit has one surface that radiates heat and the other surface that absorbs heat. As described above, according to the present invention, it is possible to control the dehumidifying device without using expensive detecting means such as a humidity detector.

[0040]

As is apparent from the above description of the embodiments, the thermoelectric device according to the present invention has a semiconductor, an N-type semiconductor, a first conductor, a P-type semiconductor, and a second conductor in this order.
A thermoelectric circuit installed so that the ends of the electric conductors are in electrical contact with each other; heat exchange means located on one side of the thermoelectric circuit and in thermal contact with the first electric conductor; and the heat exchange. A heat exchange means located in a direction opposite to the means and in thermal contact with the second conductor; a moist air, the heat exchange means serving as a cooling side when energizing the thermoelectric circuit, and the heat exchange serving as a heat radiating side. In a dehumidifying device having a blower and a blower flow path for making the means flow in order, (1) a mechanism for adding the moist air when the air flowing out from the cooling side flows into the heat exchange means on the heat radiation side. (2) The lengths of the N-type semiconductor and the P-type semiconductor, which are located on the downstream side of the heat exchange means on the cooling side when energized, in the current direction are shorter than those on the upstream side. (3) The cross-sectional areas of the N-type semiconductor and the P-type semiconductor located on the downstream side of the heat exchanging means during cooling when energized are made larger than those on the upstream side. (4) The temperature difference between the cooling-side inlet and the heat-radiating-side outlet of the moist air is measured, and the supply voltage or the supply current to the thermoelectric circuit is controlled by the temperature difference. (5) Measure the voltage and current value supplied to the thermoelectric circuit,
The ratio controls the supply voltage or supply current to the thermoelectric circuit. As a result, the present invention enables a dehumidifier with improved capacity and efficiency and low cost.

[Brief description of drawings]

FIG. 1 is a schematic view of a dehumidifying device according to an embodiment of the first invention.

FIG. 2 is a schematic view of a dehumidifying device according to another embodiment of the first invention.

FIG. 3 is a schematic view of a thermoelectric device used in the dehumidifier of one embodiment of the second invention.

FIG. 4 is a schematic view of a thermoelectric device used in the dehumidifying device of another embodiment of the second invention.

FIG. 5 is a schematic view of a thermoelectric device used in the dehumidifier of one embodiment of the third invention.

FIG. 6 is a schematic view of a dehumidifying device according to an embodiment of the fourth invention.

FIG. 7 is a schematic view of a dehumidifying device according to an embodiment of the fifth invention.

FIG. 8 is a schematic view of a conventional dehumidifier.

FIG. 9 is a schematic view of a thermoelectric device used in a dehumidifier.

FIG. 10 is an explanatory diagram of a temperature change inside the dehumidifier.

FIG. 11 is an explanatory diagram of the efficiency of the thermoelectric device.

FIG. 12 is an explanatory diagram of a temperature change of air in the dehumidifier.

[Explanation of symbols]

 1 Thermoelectric Device 22 Thermoelectric Circuit 31 Opening 49 Deformation Part

Claims (7)

[Claims] 1. A thermoelectric circuit in which an N-type semiconductor, a first conductor, a P-type semiconductor, and a second conductor are installed in this order so that the ends of each semiconductor / conductor are in electrical contact with each other. A heat exchange means located on one side of the thermoelectric circuit and in thermal contact with the first conductor; and a heat exchange means located on the opposite side of the heat exchange means and in thermal contact with the second conductor. A heat exchanging means on the heat radiating side, comprising a heat exchanging means, a blower and a blower flow path for letting the moist air flow into the heat exchanging means on the cooling side and the heat exchanging means on the heat radiating side in this order when electricity is applied to the thermoelectric circuit. A dehumidifier using a thermoelectric effect, which is provided with a mechanism for adding the moist air when the air flowing out from the cooling side flows into the device. 2. The dehumidifier using the thermoelectric effect according to claim 1, wherein a mechanism for adding moist air is provided in the middle of the heat exchange means on the heat radiation side. 3. The dehumidifying device using the thermoelectric effect according to claim 1, wherein the moist air adding mechanism is configured by forming an opening in an air flow passage connected to the heat exchanging means on the heat radiating side. . 4. A thermoelectric circuit comprising an N-type semiconductor, a first conductor, a P-type semiconductor, and a second conductor, which are installed in this order so that the ends of each semiconductor / conductor are in electrical contact with each other. Heat exchange means located on one side of the thermoelectric circuit and in thermal contact with the first conductor, and heat exchange means located on the opposite side of the heat exchange means and in thermal contact with the second conductor. Means and a blower and a blower flow path for allowing air to flow in the opposite direction to the two heat exchange means, and the current directions of the N-type semiconductor and the P-type semiconductor located on the downstream side of the heat exchange means, which is the cooling side when energized. The dehumidifier using the thermoelectric effect that shortens the length of the upstream side compared to the upstream side. 5. A thermoelectric circuit comprising an N-type semiconductor, a first conductor, a P-type semiconductor and a second conductor, which are installed in this order so that the ends of each semiconductor / conductor are in electrical contact with each other. A heat exchange means located on one side of the thermoelectric circuit and in thermal contact with the first conductor, and heat located opposite to the heat exchange means and in thermal contact with the second conductor. An exchanging means, a blower and a blower flow passage for flowing air to the two heat exchanging means in opposite directions, and disconnection of the N-type semiconductor and the P-type semiconductor located on the downstream side of the heat exchanging means, which is the cooling side when energized. A dehumidifier that uses the thermoelectric effect to make the area larger than the upstream side. 6. A thermoelectric circuit comprising an N-type semiconductor, a first conductor, a P-type semiconductor, and a second conductor, which are installed in this order so that the ends of each semiconductor / conductor are in electrical contact with each other. A heat exchange means located on one side of the thermoelectric circuit and in thermal contact with the first conductor, and heat located opposite to the heat exchange means and in thermal contact with the second conductor. A cooling side inlet of the moist air is provided with an exchange means, a blower and a blower flow path for causing the moist air to flow in order of the heat exchange means on the cooling side and the heat exchange means on the heat radiation side when the thermoelectric circuit is energized. And a method for controlling a dehumidifier using a thermoelectric effect, in which the temperature difference between the heat radiation side outlet is measured and the supply voltage or the supply current to the thermoelectric circuit is controlled by the temperature difference. 7. A thermoelectric circuit comprising an N-type semiconductor, a first conductor, a P-type semiconductor, and a second conductor, which are installed in this order so that the end portions of each semiconductor / conductor are in electrical contact with each other. A heat exchange means located on one side of the thermoelectric circuit and in thermal contact with the first conductor, and heat located opposite to the heat exchange means and in thermal contact with the second conductor. A voltage supplied to the thermoelectric circuit, which is provided with an exchanging means, a blower and a blower flow path for causing humid air to flow in order of the heat exchanging means on the cooling side and the heat exchanging means on the heat radiating side when electricity is applied to the thermoelectric circuit. And a current value are measured, and a dehumidifying device control method using a thermoelectric effect in which a supply voltage or a supply current to the thermoelectric circuit is controlled by a ratio thereof.