JPH06163627A - Wire bonding system - Google Patents

Abstract

PURPOSE:To reduce the area for supply and recovery of a magazine by half by providing with a magazine transportation mechanism that allows transportation in reverse direction to form a wire bonding system, and supplying and ejecting the magazine only at one at a wire bonding device. CONSTITUTION:A plurality of wire bonding devices A are arrayed in one direction, to be assumed as a wire bonding device array B, in addition, a plurality bonding device arrays B are arrayed in parallel with each other to constitute a wire bonding system. A magazine supply/eject part E supplies the magazine and, after completion of wire bonding, recovers the magazine loaded with a lead frame. Supply and recovery of the magazine to and from each wire bonding device array B is done at the magazine supply/eject part E, and for advancement direction D of the magazine, leftward or rightward is allowed. Thus, an automatic carrier access area G can be set only in one direction of a wire bonding device group C.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding system, and more particularly to a wire bonding system in which one or a plurality of wire bonding devices are arranged in one direction and one or a plurality of wire bonding devices are arranged in parallel.

[0002]

2. Description of the Related Art FIG. 6 shows the outline of a conventional in-line wire bonding system.
.. are wire bonding apparatuses, and four wire bonding apparatus rows b, b, and b are formed by arranging three wire bonding apparatuses a, a, and a in one direction (left and right direction in FIG. 6). , B are arranged in parallel to form one wire bonding system (wire bonding device group) c.

Reference numerals d, d, d, and d are arrows indicating a traveling direction of a magazine that accommodates a large number of semiconductor element-mounted lead frames, and the traveling direction is one direction. e, e, e, e
Where a storage lead frame supplies a magazine that has not been wire-bonded, and f, f, f, and f discharge (recover) a magazine that contains a lead frame that has undergone wire bonding, a station for automatic guided vehicles is installed. The supply and collection of the magazines are performed by an automatic carrier, and g and g are access areas of the automatic carrier.
In addition, h is a worker who performs monitoring and the like. The automated guided vehicle is installed at a position higher than the wire bonding device and moves in areas g, g. FIG. 7 is an explanatory diagram for explaining the flow of the magazine in one wire bonding device row,
i is a flow arrow.

In the conventional wire bonding system, as shown in FIG. 6, access areas g, g of the automated guided vehicle are provided on both left and right sides of the wire bonding device group c. That is, each wire bonding device row b, b, b, b
The magazine is supplied from one end to the other end, and the magazine is supplied and discharged (recovered) at both ends of each wire bonding device row b, b, b, b.
Access areas g, g of the automatic guided vehicle are required on both sides of the wire bonding apparatus group c. That is, two complicated mechanisms for transporting the magazine by the automatic transport vehicle are required.

[0005]

By the way, the conventional wire bonding system has a wire bonding device group c.
Since it was necessary to provide access areas g, g of the automatic guided vehicle on both sides of the above, there were the following problems. First, 1
Since the access areas g and g of the two automated guided vehicles are required for one wire bonding system, the occupied area of the wire bonding system becomes large, the utilization efficiency of the clean room deteriorates, and the cost of the semiconductor device directly increases. . A clean room is a room that maintains an extremely high degree of cleanliness, but maintaining a high degree of cleanness requires a very high cost, so low utilization efficiency of the clean room directly leads to an increase in the cost of semiconductor devices. .

Secondly, although the access system of the automatic carrier for supplying and discharging the magazine to and from the wire bonding system has a complicated mechanism even though efforts have been made to eliminate dust, dust is generated. Although it is inevitable to be a source, it is a factor to prevent maintaining a high degree of cleanliness in a clean room by having two such dust sources. Thirdly, since the access system of an automated guided vehicle is a complicated system, it is easy to cause a failure and needs frequent maintenance. However, two access systems for the automated guided vehicle that require such maintenance are also required. This is a factor that prevents maintenance costs from being reduced.

The present invention has been made in order to solve such problems, and halves the area of the area for supplying and collecting magazines, reduces the amount of dust generated, and reduces maintenance costs. The purpose is to

[0008]

According to the wire bonding system of the present invention, a magazine transfer mechanism is provided in the wire bonding apparatus so that the magazine transfer mechanism can be reversed in the transfer direction, and each wire bonding apparatus row has one magazine transfer mechanism. It is characterized in that a mechanism is formed so that the magazine is fed and ejected only at one end side of the magazine transport mechanism including the magazine transport mechanism of each wire bonding device row.

[0009]

According to the wire bonding system of the present invention,
Since the magazine can be supplied and stored only on one side of the wire bonding device or the device group, the magazine supply such as an automatic carrier, the number of storing means, and the area occupied by the active area can be small. It is possible to reduce the area of the area for supplying and collecting magazines by half, reduce the amount of dust generated, and reduce maintenance costs.

[0010]

The wire bonding system of the present invention will be described in detail below with reference to the illustrated embodiments. FIG. 1 is a plan view for explaining the outline of the wire bonding system of the present invention. In the drawing, A, A, ... Are wire bonding devices, and a plurality of wire bonding device rows B, B in which a plurality of wire bonding apparatuses A, A, ... Are arranged in one direction (left and right direction in FIG. 1). , Are arranged side by side to form one wire bonding system (wire bonding device group) C.

Denoted by D, D, ... are arrows indicating the traveling direction of a magazine accommodating a large number of semiconductor element mounted lead frames, and these directions are two directions, that is, a forward direction and a reverse direction. E, E, ... Supply magazines to each wire bonding device row B and collect wire bonding completed lead frame mounted magazines from each wire bonding device row B. The supply and collection of magazines is performed by an automated guided vehicle. I, G is the access area of the automated guided vehicle.

In the present invention, as shown in FIG. 1, the supply of the magazine to each wire bonding device row B and the collection of the wire bonding completed magazine are carried out at E at one end of the wire bonding device row B, and the magazine is indicated by an arrow. According to D, it is possible to proceed to the right side in FIG. 1 or to return to the left side. Therefore, the automatic guided vehicle access area G only needs to be provided on one side of the wire bonding apparatus group C.

FIG. 2 shows one wire bonding apparatus row B.
In the flow chart of the magazine focusing on, the supply / discharge section E and the magazine are wire-bonded as indicated by a line I indicating the flow. It reciprocates to and from the wire bonding apparatus A.
In this way, since the magazine is supplied and discharged only on one side of the wire bonding device row,
The automatic carrier access area G may be provided only on one side of the wire bonding apparatus group C. Therefore, it is possible to reduce the area of the area for supplying and collecting the magazine by half, reduce the amount of dust generated, and reduce the maintenance cost.

A specific example to which the wire bonding system of the present invention is applied will be described in detail below. FIGS. 3 to 5 are for explaining one embodiment of the magazine transport mechanism of the present invention, and FIG. 3 is a perspective view showing only one row of the wire bonding system including the magazine transport mechanism. An outline of the wire bonding system will be described according to 1.

.. are wire bonding devices having substantially the same structure and function, each having a magazine transport mechanism 2 on the front side. Wire bonding equipment 1, 1, ...
Are arranged side by side so that the respective magazine transport mechanisms 2, 2, ... Align to form a single transport path. Reference numeral 3 denotes a magazine take-in section for taking the magazine of each wire bonding apparatus 1 near the wire bonding section. The magazine transport mechanisms 2, 2, ... Are each covered with a cover.

Reference numeral 4 is an automatic loading station for supplying or recovering a magazine from one end thereof to a magazine transport path including the wire bonding apparatuses 1, 1, ..., 5 is a wiring shape of a lead frame of the magazine which has completed the wire bonding process. It is an automatic wiring inspection device for inspection. An automatic carrier for supplying a magazine to the station 4 and collecting a magazine from the station 4 is not shown.

FIG. 4 is an enlarged perspective view of the magazine transport mechanism. Next, the magazine transport mechanism 2 will be described in detail with reference to FIG. Reference numeral 6 denotes a roller support, which has a U-shaped cross section and is provided substantially horizontally so that the pair of side pieces 6a and 6b face upward and the intermediate piece 6b forms a bottom portion. A plurality of rotating shafts 7, 7, ... Are rotatably attached to the upper portions of the pieces 6a, 6b at substantially regular intervals. This interval is set to be at least smaller than the length of the magazine.

One end of each of the rotary shafts 7, 7, ... Penetrates the side piece 6a of the roller support 6 so as to project to the outside (front side), and a pulley 8 is fixed to each of the projecting ends. ing. Then, the side pieces 6a of the rotary shafts 7, 7, ...
Conveyor rollers 9 are fixed to both ends of the portion between 6b.

A rotary support 10 is rotatably attached to one end (right end) of the roller support 6. Similarly to the roller support body 6, the rotation support body 10 has a rotating shaft 7,
, ..., pulleys 8, 8, ... And conveyance rollers 9, 9 ,.
The rotary support 10 and the roller support 6 compose one transport path in the folded state as shown in the figure, but when the rotary support 10 is rotated by approximately 90 degrees to be oriented, It is designed so that a part of it can be cut and the hands and human body can get inside to perform maintenance. Reference numerals 11 and 11 are stoppers that define the rotation angle of the rotation support body 10.

Reference numerals 12 and 12 denote belts wound around pulleys 8 and 8 fixed to one end of each of rotary shafts 7 of the roller support 6 and the rotary support.
By rotating 2 the conveying rollers 9,
The magazines 9 can be rotated to convey the magazine.
In addition, 13, 13, ... Are idle cars. Reference numeral 14 is a motor capable of rotating in the forward and reverse directions, the rotation of which is the belt 12a and the transmission roller
5 is transmitted to the belt 12 on the roller support 6a side via the belt 12b, and is transmitted to the belt 12 on the rotation support body 10 side via the belt 12a, the transmission roller 15 and the belt 12c.

Therefore, the roller support 6 and the rotary support 1
0 of the transport rollers 9, 9, ... When the motor 14 rotates,
All can rotate in the same direction and thus the magazine can be transported in one direction. Of course, if the rotation direction of the motor 14 is reversed, the respective conveying rollers 9, 9, ...
It is possible to reverse all the rotation directions of and to reverse the conveyance direction of the magazine. .. are guide wheels (cam followers), which are rotatably attached to the support shafts. The support shafts of the respective guide wheels 16, 16, ... Are side pieces 6a, 6b and 1 of the roller support body 6 and the rotation support body 10.
It is planted at appropriate intervals on the upper end surfaces of 0a and 10b.

The guide wheels 16, 16, ... Are conveying rollers 9,
It plays the role of guiding the magazines conveyed by 9, ...

FIG. 5 illustrates the transfer of the magazine between the magazine transport mechanism 2 and the wire bonding section of the wire bonding apparatus. Reference numerals 17 and 17 denote magazine lifting members, which are driven by an elevator groove (not shown) and lifted a magazine 18 on the magazine transport mechanism 2 to transfer it to the transport arms 19 and 19 that can move forward and backward, or conversely from the transport arms 19 and 19. It plays the role of receiving 18 and soft landing on the magazine transport mechanism 2. In the normal state, the rollers are retracted to a position lower than the conveying rollers 9, 9, ....

In the wire bonding system shown in FIGS. 3 to 5, the station 4 is arranged only on one side of the wire bonding row, and on the station 4 from the automatic carrier (not shown) to the carrier path by the magazine carrier mechanism 2. The magazine 18 is supplied and the wire-bonded magazine 18 is collected. Therefore, the area of the access area of the automatic carrier, which is dedicated to supplying and collecting the magazine 18, is halved, and the amount of dust generated is reduced. Then
Maintenance costs can be reduced.

In the above embodiment, the wire bonding system has a plurality of wire bonding devices.
The present invention can also be applied to a wire bonding system having one wire bonding device. That is,
There may be a case where only one wire bonding device is used. In that case, conventionally, stations are provided at both ends of the magazine transport mechanism provided corresponding to the wire bonding device, and only one magazine is supplied at one station. , The other station only stored magazines. Therefore, the problem that the utilization efficiency of the clean room becomes low was remarkable.

However, if the present invention is applied when only one wire bonding device is used, one magazine supply / discharge station may be installed on one side of the wire bonding device. Needless to say, as a magazine transport mechanism provided corresponding to the wire bonding apparatus, a magazine transport mechanism capable of reversing the transport direction as shown in FIGS. 3 to 5 is suitable.

[0027]

According to the wire bonding system of the present invention,
The wire-bonding device is provided with a magazine transporting mechanism capable of reversing the transporting direction, one magazine transporting mechanism including each magazine transporting mechanism is formed for each wire-bonding device row, and the magazine transporting mechanism for each wire-bonding device row is formed. It is characterized in that the magazine is supplied and discharged only on one end side of the magazine transport path. Therefore, according to the wire bonding system of the present invention, it is possible to supply and store the magazine only on one side of the wire bonding device or the device group, so that the magazine supply such as an automatic carrier, the number of storing means, and the access area. Can occupy a small area, which in turn can reduce the area of the area dedicated to supplying and collecting magazines by half, reduce the amount of dust generated, and reduce maintenance costs.

[Brief description of drawings]

FIG. 1 is a plan view illustrating the outline of one embodiment of a wire bonding system of the present invention.

FIG. 2 is a flow chart of a magazine in one wire bonding device row of the wire bonding system shown in FIG.

FIG. 3 is a perspective view specifically showing one wire bonding device row of an application example of the present invention.

FIG. 4 is a perspective view of a magazine transport mechanism provided for each wire bonding device of the wire bonding system.

FIG. 5 is a perspective view illustrating transfer of a magazine between a magazine transport mechanism and a wire bonding unit side.

FIG. 6 is a schematic plan view of a conventional example.

FIG. 7 is an explanatory diagram of a flow of a magazine in one wire bonding device row of a conventional example.

[Explanation of symbols]

 A wire bonding device B wire bonding device row C wire bonding device group E magazine supply / discharge unit

Claims (2)

[Claims] 1. In a wire bonding system in which a row of wire bonding apparatuses in which a plurality of wire bonding apparatuses are arranged in one direction is provided or a plurality of rows are arranged side by side, each wire bonding apparatus is provided with a magazine transport mechanism capable of reversing the transport direction. For each wire bonding device row, one magazine transfer path consisting of each magazine transfer mechanism is formed, and magazines are supplied and discharged only at one end of the magazine transfer mechanism consisting of the magazine transfer mechanism of each wire bonding device row. Wire bonding system characterized in that 2. A wire bonding system characterized in that one wire bonding apparatus is provided with a magazine transfer mechanism capable of reversing the transfer direction, and the magazine is supplied and discharged only at one end side of the magazine transfer mechanism.