JPH06152080A - Wiring board - Google Patents

Abstract

PURPOSE:To increase heat resistance and at the same time to package high- density parts in the same substrate. CONSTITUTION:A copper block 4 for cooling which also plays a role of a conductor for mounting parts is adhered to one part of the upper surface of a first insulation board 1 to form a packaging part of parts 9 with a large calorific value and at the same time a second insulation board 2 is adhered to the other part of the upper surface of the insulation board 1 to form a copper foil pattern 3 at nearly the same level as the copper block 4 on the upper surface for forming a high-density packaging part of parts 10, thus packaging the parts 9 with a large calorific value and the other parts 10 densely on a same wiring board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board excellent in heat resistance and high density mounting.

[0002]

2. Description of the Related Art Conventionally, when mounting a plurality of chip components, which greatly differ in the amount of heat generated, on a wiring board, it has been done as shown in FIG. That is, since heat resistance is required on the side on which the chip component 9 that generates a large amount of heat is mounted, the heat dissipation copper block 4 also serving as a conductor is adhered to the upper surface of the insulating plate 11, and the chip component 9 is soldered to the surface thereof. Implement.

On the other hand, high density mounting is required on the side on which the chip parts 10 which generate a small amount of heat are mounted. However, since it is impossible to form a pattern with the above-mentioned copper block 4, a separate printed circuit board is required. Therefore, the copper foil pattern 3 is formed on the upper surface of the insulating plate 2, and the chip component 10 is mounted on the surface by soldering. Thus, the copper block 4 on which the chip components 9 and 10 are mounted and the copper foil pattern 3 are connected by a bonding wire 5 or a connector (not shown).

[0004]

As described above, the conventional mounting method requires two or more substrates depending on the characteristics of the chip components to be mounted. After mounting the components on each substrate, wiring between both substrates is performed. However, there is a problem that the number of steps is increased because the connection is made by connecting the two. The present invention has been made to solve the above problems, and an object of the present invention is to provide both heat resistance and high-density mounting property on the same substrate.

[0005]

In order to achieve the above object, a first aspect of the present invention is characterized in that a heat radiating copper block also serving as a component mounting conductor is bonded to a part of the upper surface of a first insulating plate to generate heat. A copper foil pattern is formed so that a mounting portion for a large amount of parts is formed, and a second insulating plate is adhered to another portion of the upper surface of the first insulating plate so that the upper surface has almost the same level as the copper block. Is formed to form a high-density component mounting portion.

A second invention is the first invention according to the first invention.
It is characterized in that a metal base for heat dissipation is adhered to the lower surface of the insulating plate.

A third invention is characterized in that, in the first or second invention, a copper block for heat radiation is adhered to the lower surface of the second insulating plate.

[0008]

In the first aspect of the present invention, the heat dissipation copper block also serving as the component mounting conductor is adhered to a part of the upper surface of the first insulating plate to form the mounting portion of the component that generates a large amount of heat. The second insulating plate is adhered to the other part of the upper surface of the first insulating plate, and the copper foil pattern is formed on the upper surface so as to be at substantially the same level as the copper block to form a high-density component mounting portion. It As a result, it becomes possible to mount components that generate a large amount of heat and mount other components at high density on the same wiring board.

According to the second aspect of the present invention, the metal base for heat radiation is further adhered to the lower surface of the first insulating plate to improve the heat resistance.

In the third aspect of the present invention, a heat-dissipating copper block is further adhered to the lower surface of the second insulating plate to increase the heat resistance of the high density component mounting portion.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of an embodiment according to the first invention. In the figure, 11 is an insulating plate made of glass epoxy resin or the like, and an insulating plate 2 is bonded to the upper surface of the insulating plate 1 via an insulating plate 1 made of prepreg or the like. A copper foil pattern 3 is previously formed on the insulating plate 2 by etching so that components can be mounted at high density. In addition, holes are preliminarily formed in the insulating plate 2 at positions corresponding to the mounting portions of the components that generate a large amount of heat and replaced with the copper blocks 4.

These insulating plates 1, 11 and 2 and the copper block 4 are bonded together by heat pressing and connected by a bonding wire 5. On the upper surface of the copper block 4 on the wiring board thus formed, a chip component 9 having a large amount of heat generation is mounted, and a chip component 10 having a small amount of heat generation is formed on the copper foil pattern 3 formed on the insulating plate 2. High density packaging.

As a result, components conventionally mounted on two or more wiring boards according to the amount of heat generated by the components can be mounted on the same wiring board, and the number of man-hours for mounting is reduced accordingly. It is possible to reduce costs. In this embodiment, the insulating plates 1 and 11 are the first insulating plates and the insulating plate 2 is the second insulating plate.

FIG. 2 is a sectional view of an embodiment according to the second invention. This embodiment corresponds to the insulating plate 11 in the embodiment of FIG.
Is replaced with a metal base 6 for heat dissipation. Since other parts are common to those in FIG. 1, common parts are given the same numbers and their explanations are omitted.

In this embodiment, since the metal base 6 is provided, the heat dissipation is improved as compared with the embodiment of FIG. As a result, the chip component 9 mounted on the copper block 4
It is possible to efficiently dissipate and cool the heat generated by the above, and also to dissipate and cool the heat generated by the chip component 10 mounted on the copper foil pattern 3 to some extent, thereby extending the component life.

As an application of this embodiment, the insulating plate 1
By partially changing the characteristics of, the above effect can be made more remarkable. For example, in the lower part of the chip component 9 which is required to have heat resistance, epoxy resin containing glass filler having good thermal conductivity is used to accelerate the diffusion of heat. Further, a resin having an excellent withstand voltage characteristic is used in the lower part of the chip component 10 to improve the withstand voltage characteristic of the entire wiring board. In this embodiment, the insulating plate 1 is the first insulating plate and the insulating plate 2 is
Is the second insulating plate.

FIG. 3 is a sectional view of an embodiment according to the third invention. In this embodiment, the lower portion of the insulating plate 2 where the copper foil pattern 3 is formed in the embodiment of FIG. 2 is replaced with a copper block 7, and a prepreg is provided between the copper block 7 and the copper foil pattern 3. It is insulated by the insulating layer 8 made of. The insulating plate 2 around the copper block 7 is made of epoxy resin containing glass filler having high hardness. The insulating plates 1 and 2, the insulating layer 8 and the copper blocks 4 and 7 are integrally bonded by heat pressing. Since other parts are common to those in FIG. 2, common parts are given the same reference numerals and description thereof is omitted.

In this embodiment, since the copper block 7 is also installed in the high-density component mounting portion, the heat radiation and cooling effects are increased accordingly. In this embodiment, the insulating plate 1 is the first insulating plate and the insulating layer 8 is the second insulating plate.
Further, the configuration in which the lower portion of the position where the copper foil pattern 3 of the insulating plate 2 is formed is replaced with the copper block 7 can be applied to the embodiment of FIG.

[0019]

As described above, according to the first invention,
Since the mounting portion for high heat-generating components and the mounting portion for high-density components are formed on the upper surface of the single first insulating plate, both heat resistance and high-density mounting characteristics are provided on the same wiring board. At the same time, the number of man-hours required for mounting the parts is reduced. As a result, the total cost of the wiring board can be reduced.

According to the second invention, the metal base for heat radiation is further bonded to the lower surface of the first insulating plate. Therefore, the heat resistance is further improved.

According to the third invention, the metal base for heat dissipation is further bonded to the lower surface of the second insulating plate. Therefore, the heat resistance of the high-density component mounting portion is also improved.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of an embodiment according to the first invention.

FIG. 2 is a sectional view of an embodiment according to the second invention.

FIG. 3 is a sectional view of an embodiment according to the third invention.

FIG. 4 is a cross-sectional view showing a conventional example.

[Explanation of symbols]

 1 Insulation Plate 2 Insulation Plate 3 Copper Foil Pattern 4 Copper Block 5 Bonding Wire 6 Metal Base 7 Copper Block 8 Insulation Layer 9 Chip Component 10 Chip Component 11 Insulation Plate

Claims (3)

[Claims] 1. A heat-dissipating copper block, which also serves as a component mounting conductor, is adhered to a part of the upper surface of the first insulating plate to form a mounting portion for a component that generates a large amount of heat, and the first insulating plate A second insulating plate is adhered to another portion of the upper surface, and a copper foil pattern is formed on the upper surface so as to be at substantially the same level as the copper block to form a high-density component mounting portion. Wiring board. 2. The wiring board according to claim 1, wherein
A wiring board having a metal base for heat dissipation adhered to the lower surface of the insulating plate. 3. The wiring board according to claim 1, wherein a copper block for heat dissipation is adhered to the lower surface of the second insulating plate.