JPH06151626A - Semiconductor package - Google Patents

Abstract

PURPOSE:To provide a semiconductor package which improves electromagnetic noise radiation property and stable operation property under electromagnetic noise circumstance easily and cheaply. CONSTITUTION:This is a semiconductor package 10 for accommodating a semiconductor element and other elements, and the semiconductor package body 11 consists of plastic resin wherein magnetic powder is mixed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package that accommodates elements (chips) such as semiconductor elements, and is particularly designed to improve electromagnetic noise emission characteristics and stable operability in an electromagnetic noise environment. is there.

[0002]

2. Description of the Related Art Semiconductor elements and other elements (chips) are housed in a semiconductor package in order to shield them from the external atmosphere, and retain their initial characteristic values, as well as thermal / electrical derivation and insulation between electrodes. The distance is secured.

Conventionally, as the material of the package body used in this semiconductor package, metal, ceramics, plastic resin, etc. have been used according to the application.

[0004]

Among the materials mentioned above for the semiconductor package body, plastic resin is often used because of its mass productivity and low cost.
Since it is extremely difficult to shield due to its structure, there are problems in terms of radiation of electromagnetic noise and stable operation in an electromagnetic noise environment.

For this reason, conventionally, an inductance element is added for stabilization, and there is a problem in that it cannot be manufactured inexpensively while taking up space for its installation.

In view of the above problems, it is an object of the present invention to provide a semiconductor package which improves the electromagnetic noise emission characteristics and the stable operability in an electromagnetic noise environment easily and inexpensively.

[0007]

The structure of a semiconductor package according to the present invention which achieves the above object is a semiconductor package containing a semiconductor element and other elements,
The semiconductor package body is made of a plastic resin mixed with magnetic powder.

[0008]

[Function] By molding a semiconductor element or the like with plastic mixed with a magnetic material, an effect equivalent to adding inductance to all leads entering and leaving a semiconductor package can be obtained. It is possible to improve stable operability in.

[0009]

The preferred embodiments of the present invention will be described in detail below.

FIG. 1 is a perspective view of a plastic mold IC using a semiconductor package according to this embodiment. As shown in the figure, the plastic mold IC 10 is
Elements (chips) such as C and LSI are housed in a semiconductor package 11, and leads (pins) 12 for electrically connecting with peripheral circuits are formed.

The semiconductor package 11 is made of plastic resin, and magnetic powder such as ferrite or amorphous alloy is mixed in the resin. Further, it is preferable that the mixed amount thereof is about 30 to 60% by weight.
This is because the addition of less than 30% by weight cannot improve the electromagnetic noise characteristics, and the addition of more than 60% by weight has no effect of increasing the amount and both are not preferable. As a result, unlike the conventional case, the electromagnetic noise emission characteristics can be easily and inexpensively added without adding a special inductance element. It was possible to improve the stable operation under the electromagnetic noise environment.

In this embodiment, as shown in FIG. 1, a plastic mold IC 10 is a single in-line P of a pin insertion mounting type.
Although the ackage (SIP) has been described as an example, the DIP (Dual In-line Packa) shown in FIG.
ge) or PGA (Pin Gried Arry) or the like. In the case of the surface mount type, the SOP (Small Out-line Package) or L as shown in FIG. 3 is used.
CC (Lead less Chip Carrier), SOP (Small Out-
linePackage), SOJ (Small Out-line J-lead Packa)
ge), QFJ (Quad Flat J-lead Package) and the like.

[0013]

As described in connection with the above embodiments, the semiconductor package according to the present invention is made by mixing the magnetic powder in the resin package body, so that no special inductance element like the conventional one is added. Easy and cheap,
In addition, the electromagnetic noise emission characteristics can be improved without impairing the high-density mounting property.

[Brief description of drawings]

FIG. 1 is a perspective view of a SIP plastic mold IC.

FIG. 2 is a perspective view of a DIP plastic mold IC.

FIG. 3 is a perspective view of an SOP plastic mold IC.

[Explanation of symbols]

 10 Plastic mold IC 11 Semiconductor package 12 Lead (pin)

Claims (1)

[Claims] 1. A semiconductor package for housing a semiconductor element and other elements, wherein the semiconductor package body is made of a plastic resin mixed with magnetic powder.