JPH06146068A - Method for electroplating and device therefor - Google Patents
Method for electroplating and device thereforInfo
- Publication number
- JPH06146068A JPH06146068A JP30116792A JP30116792A JPH06146068A JP H06146068 A JPH06146068 A JP H06146068A JP 30116792 A JP30116792 A JP 30116792A JP 30116792 A JP30116792 A JP 30116792A JP H06146068 A JPH06146068 A JP H06146068A
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- electroplating
- pulsating flow
- metal strip
- feeding means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、電気めっき方法及び電
気めっき装置に関し、詳細には、電気めっき槽内のめっ
き液中にめっき液を噴出すると共に、該めっき液中に金
属帯を陰極として走行させ、該金属帯に電気めっきを施
す電気めっき方法及び電気めっき装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroplating method and an electroplating apparatus. More specifically, the plating solution is jetted into a plating solution in an electroplating tank and a metal strip is used as a cathode in the plating solution. TECHNICAL FIELD The present invention relates to an electroplating method and an electroplating apparatus for running and electroplating the metal strip.
【0002】[0002]
【従来の技術】金属帯への電気めっき方法として、電気
めっき槽内のめっき液中に金属帯を陰極として走行させ
ながら、該金属帯に電気めっきを施す電気めっき方法が
ある。この電気めっき方法において、高速度化のために
電流密度は可能な限り大きいことが望まれるが、電流密
度を大きくすると、めっき液中の金属イオンが金属帯表
面(被めっき面)に充分拡散できず、金属帯の表面近傍
の金属イオン濃度が低下し、めっき表面にピット等の欠
陥が発生する等の支障が生じ易くなる。2. Description of the Related Art As a method for electroplating a metal strip, there is an electroplating method in which the metal strip is electroplated while running in a plating solution in an electroplating tank as a cathode. In this electroplating method, it is desirable that the current density be as high as possible in order to increase the speed, but if the current density is increased, the metal ions in the plating solution will be able to diffuse sufficiently to the surface of the metal strip (surface to be plated). In addition, the concentration of metal ions near the surface of the metal strip is reduced, and problems such as the occurrence of defects such as pits on the plated surface are likely to occur.
【0003】この対策としてめっき液の攪拌が有効であ
るとされており、その攪拌の手段として空気攪拌、プロ
ペラ等による機械的攪拌、めっき液の連続濾過による強
制対流等が知られており、特に上記の如き金属帯への電
気めっき方法においては、強制対流による攪拌が主とし
て行われている。しかし、これらの場合には各々問題点
があり、例えば強制対流による攪拌を採用する場合には
流速を大きくするためにポンプ容量を大きくする必要が
あり、機械的攪拌では方向性があったり、局部的な攪拌
となったりするという問題点がある。そこで、かかる問
題点の解決策が検討され、その結果、図3に示す如き電
気めっき装置が提案されている(特開昭63-118094 号公
報)。以下、この特開昭63-118094 号公報に記載の電気
めっき装置(以降、従来装置という)について説明す
る。As a countermeasure against this, it is said that stirring of the plating solution is effective. As means of stirring, air stirring, mechanical stirring by a propeller or the like, forced convection by continuous filtration of the plating solution, etc. are known. In the electroplating method for a metal strip as described above, stirring by forced convection is mainly performed. However, there are problems in each of these cases. For example, when agitation by forced convection is adopted, it is necessary to increase the pump capacity in order to increase the flow rate. There is a problem that it becomes agitating. Therefore, a solution to this problem has been studied, and as a result, an electroplating apparatus as shown in FIG. 3 has been proposed (Japanese Patent Laid-Open No. 63-118094). Hereinafter, the electroplating apparatus described in Japanese Patent Laid-Open No. 63-118094 (hereinafter referred to as a conventional apparatus) will be described.
【0004】この従来装置は、電気めっき槽2の内部に
陽極3Jを配し、該めっき槽2の側壁にめっき液噴出孔5J
を設け、該噴出孔5Jにめっき液送給手段8を管接続し、
これによりめっき液の強制対流を可能とした電気めっき
装置であって、前記陽極3J-1の上方及び陽極3J-2の下方
に超音波振動子11を備えた振動板12を配すると共に、前
記陽極3J-1及び3J-2に小透孔13を穿孔して設けたもので
ある。尚、図3の装置の場合、上記めっき液送給手段8
はポンプであり、めっき液循環ラインLの途中に管接続
されている。In this conventional apparatus, an anode 3J is arranged inside the electroplating tank 2 and a plating solution jetting hole 5J is formed on a side wall of the plating tank 2.
Is provided, and the plating solution feeding means 8 is pipe-connected to the ejection hole 5J,
This is an electroplating device that enables forced convection of the plating solution, and a diaphragm 12 having an ultrasonic transducer 11 is arranged above the anode 3J-1 and below the anode 3J-2, and The anodes 3J-1 and 3J-2 are provided with small through holes 13 perforated. In the case of the apparatus shown in FIG. 3, the plating solution feeding means 8 is used.
Is a pump, which is connected to the middle of the plating solution circulation line L by a pipe.
【0005】この装置によれば、めっき液送給手段8に
より電気めっき槽2内のめっき液S中にめっき液を噴出
する一方、超音波振動子11を作動させると共に、コンダ
クターロール4によりめっき液S中に金属帯1を陰極と
して走行させ、陽極3J-1及び3J-2との間に通電し、該金
属帯1に電気めっきを施す。ここで、超音波振動子11の
作動により、超音波が振動板12から発射され、前記陽極
の小透孔13を介して金属帯1の表面に照射され、これに
より金属帯表面(被めっき面)への金属イオンの拡散が
促進され、金属帯表面近傍の金属イオン濃度の低下が抑
制され、その結果ピット等の欠陥を生じることなく、高
電流密度での電気めっきが可能となり、高速度化が図れ
る。尚、図3において、14はオーバフローするめっき液
を示すものであり、このめっき液は濾過器(図示してい
ない)により濾過された後、前記めっき液循環ラインL
及びめっき液噴出孔5Jを介して電気めっき槽2内に循環
される。According to this apparatus, the plating solution feeding means 8 ejects the plating solution into the plating solution S in the electroplating tank 2, while the ultrasonic transducer 11 is operated, and the conductor roll 4 causes the plating solution to flow. The metal strip 1 is run as a cathode in S, and an electric current is applied between the metal strip 1 and the anodes 3J-1 and 3J-2 to electroplate the metal strip 1. Here, by the operation of the ultrasonic transducer 11, ultrasonic waves are emitted from the diaphragm 12 and radiated to the surface of the metal strip 1 through the small through holes 13 of the anode, whereby the surface of the metal strip (the surface to be plated) is irradiated. ) Is promoted, the decrease of the metal ion concentration near the surface of the metal strip is suppressed, and as a result, electroplating at high current density is possible without causing defects such as pits, and high speed is achieved. Can be achieved. In FIG. 3, reference numeral 14 indicates an overflowing plating solution, which is filtered by a filter (not shown) and then the plating solution circulation line L
And is circulated in the electroplating bath 2 through the plating solution ejection holes 5J.
【0006】[0006]
【発明が解決しようとする課題】このように前記従来装
置によれば、ピット等の欠陥を生じることなく、高電流
密度での電気めっきが可能となり、高速度化が図れる。
ところが、そのためには振動板12の全体から超音波を発
射する必要があるので、振動板12には多数の超音波振動
子11を備えることが必要であり、従って超音波振動子11
のメンテナンスが容易でなく大変であると共に、装置的
に高価になってランニングコストが大幅に増大するとい
う問題点があり、その解決が望まれるところである。As described above, according to the conventional apparatus, electroplating can be performed at a high current density without causing defects such as pits, and high speed can be achieved.
However, in order to do so, it is necessary to emit ultrasonic waves from the entire vibrating plate 12, and therefore it is necessary to provide the vibrating plate 12 with a large number of ultrasonic transducers 11.
However, there is a problem that the maintenance is difficult and difficult, and the apparatus becomes expensive, and the running cost greatly increases, and a solution thereof is desired.
【0007】本発明はこの様な事情に着目してなされた
ものであって、その目的は、メンテナンスの困難化及び
ランニングコストの大幅な増大を招くことなく、前記従
来技術の有する問題点を解消し、ピット等の欠陥を生じ
ることなく高電流密度での電気めっきが可能であり、電
気めっきの高速度化が図れる電気めっき方法及び電気め
っき装置を提供しようとするものである。The present invention has been made in view of such circumstances, and an object thereof is to solve the problems of the prior art without causing difficulty in maintenance and a significant increase in running cost. However, it is an object of the present invention to provide an electroplating method and an electroplating apparatus that can perform electroplating at a high current density without causing defects such as pits and can increase the speed of electroplating.
【0008】[0008]
【課題を解決するための手段】上記目的を達成するため
に、本発明に係る電気めっき方法及び電気めっき装置は
次のような構成としている。即ち、請求項1記載の方法
は、電気めっき槽内のめっき液中にめっき液を噴出する
と共に、該めっき液中に金属帯を陰極として走行させ、
該金属帯に電気めっきを施す電気めっき方法において、
前記噴出するめっき液の流速を脈動的に変化させ、電気
めっき槽内のめっき液中に脈動流を生じさせることを特
徴とする電気めっき方法である。In order to achieve the above object, the electroplating method and electroplating apparatus according to the present invention have the following configurations. That is, in the method according to claim 1, the plating solution is jetted into the plating solution in the electroplating tank, and the metal strip is made to run in the plating solution as a cathode.
In an electroplating method for electroplating the metal strip,
The electroplating method is characterized in that the pulsating flow velocity of the jetting plating solution is changed to generate a pulsating flow in the plating solution in the electroplating tank.
【0009】又、請求項2記載の装置は、電気めっき槽
の内部に陽極を配し、該めっき槽の側壁にめっき液噴出
孔を設け、該噴出孔にめっき液送給手段を管接続した電
気めっき装置において、前記めっき液送給手段とめっき
液噴出孔との間に、該噴出孔から噴出するめっき液の流
速を脈動的に変化させ、電気めっき槽内のめっき液中に
脈動流を生じさせる脈動流発生機構を設けたことを特徴
とする電気めっき装置である。請求項3記載の装置は、
前記脈動流発生機構が、前記めっき液送給手段とめっき
液噴出孔との間の管路の途中に設けられている請求項2
記載の電気めっき装置である。Further, in the apparatus according to the second aspect, an anode is arranged inside the electroplating bath, a plating solution jetting hole is provided on a side wall of the electroplating bath, and a plating solution feeding means is pipe-connected to the jetting hole. In the electroplating apparatus, between the plating solution feeding means and the plating solution jetting hole, the flow velocity of the plating solution jetted from the jetting hole is changed in a pulsating manner to create a pulsating flow in the plating solution in the electroplating tank. The electroplating apparatus is provided with a pulsating flow generating mechanism for generating the pulsating flow. The device according to claim 3 is
3. The pulsating flow generation mechanism is provided in the middle of a pipe line between the plating solution feeding means and the plating solution ejection hole.
The electroplating apparatus described.
【0010】[0010]
【作用】本発明に係る電気めっき方法は、前記の如く、
電気めっき槽内のめっき液中にめっき液を噴出すると共
に、該めっき液中に金属帯を陰極として走行させ、該金
属帯に電気めっきを施す電気めっき方法において、前記
噴出するめっき液の流速を脈動的に変化させ、電気めっ
き槽内のめっき液中に脈動流を生じさせるようにしてい
る。かかる脈動流は、従来装置において照射される超音
波の作用と同様に金属帯表面(被めっき面)への金属イ
オンの拡散を促進する作用を有する。従って、金属帯表
面近傍の金属イオン濃度の低下が抑制され、その結果ピ
ット等の欠陥を生じることなく、高電流密度での電気め
っきが可能となり、高速度化が図れるようになる。The electroplating method according to the present invention, as described above,
In the electroplating method in which the plating solution is jetted into the plating solution in the electroplating tank, the metal strip is made to run in the plating solution as a cathode, and the metal strip is electroplated, the flow rate of the jetting plating solution is The pulsation is changed to generate a pulsating flow in the plating solution in the electroplating tank. The pulsating flow has a function of promoting diffusion of metal ions to the surface of the metal band (surface to be plated), similarly to the effect of ultrasonic waves applied in the conventional apparatus. Therefore, a decrease in the metal ion concentration near the surface of the metal strip is suppressed, and as a result, electroplating can be performed at a high current density without causing defects such as pits, and high speed can be achieved.
【0011】即ち、液体中に固体が浸漬されていると
き、該固体表面への超音波の照射により、液体と固体表
面との間の熱移動が促進されるが、液体に脈動流を生じ
させることによっても、このような熱移動は促進され
る。これは化学工学分野等で知られていることであり、
例えば技術雑誌の化学工学,第49巻,第45号(1985)26
9〜275 に記載されている。一方、かかる熱移動と物質
移動との間にはアナロジーが成立する。故に、固体表面
への超音波照射により物質移動が促進されるが、液体の
脈動流によっても物質移動が促進される。このことは、
液体をめっき液、固体を金属帯とし、物質移動を金属イ
オンの拡散とした場合でも成立する。従って、金属帯表
面(被めっき面)への超音波照射によって金属イオンの
拡散が促進されると同様に、めっき液中に脈動流を生じ
させることによって金属帯表面(被めっき面)への金属
イオンの拡散が促進される。That is, when a solid is immersed in a liquid, heat transfer between the liquid and the solid surface is promoted by irradiation of ultrasonic waves on the surface of the solid, but a pulsating flow is generated in the liquid. This also facilitates such heat transfer. This is known in the field of chemical engineering,
For example, Chemical Engineering in Technical Magazine, Vol. 49, No. 45 (1985) 26.
9-275. On the other hand, an analogy holds between the heat transfer and the mass transfer. Therefore, although the mass transfer is promoted by the irradiation of ultrasonic waves on the solid surface, the mass transfer is also promoted by the pulsating flow of the liquid. This is
It holds even when the liquid is a plating solution, the solid is a metal strip, and the mass transfer is diffusion of metal ions. Therefore, in the same manner that the ultrasonic irradiation on the surface of the metal strip (the surface to be plated) promotes the diffusion of the metal ions, the pulsating flow is generated in the plating solution, so that the metal to the surface of the metal strip (the surface to be plated) is generated. The diffusion of ions is promoted.
【0012】本発明に係る電気めっき方法では、かかる
脈動流をめっき液中に生じさせるようにしている。故
に、金属帯表面(被めっき面)への金属イオンの拡散が
促進され、そのため金属帯表面近傍の金属イオン濃度の
低下が抑制され、従ってピット等の欠陥を生じることな
く、高電流密度での電気めっきが可能となり、その結果
電気めっきの高速度化が図れるようになる。In the electroplating method according to the present invention, such a pulsating flow is generated in the plating solution. Therefore, the diffusion of metal ions to the surface of the metal strip (the surface to be plated) is promoted, and the decrease in the concentration of metal ions near the surface of the metal strip is suppressed, so that defects such as pits do not occur and high current density Electroplating becomes possible, and as a result, the speed of electroplating can be increased.
【0013】本発明に係る電気めっき装置は、前述のよ
うに、電気めっき槽の内部に陽極を配し、該めっき槽の
側壁にめっき液噴出孔を設け、該噴出孔にめっき液送給
手段を管接続した電気めっき装置において、前記めっき
液送給手段とめっき液噴出孔との間に、該噴出孔から噴
出するめっき液の流速を脈動的に変化させ、電気めっき
槽内のめっき液中に脈動流を生じさせる脈動流発生機構
を設けるようにしている。従って、上記の如き本発明に
係る電気めっき方法を行い得る。即ち、上記脈動流発生
機構により、めっき液中に脈動流を生じさせることがで
き、かかる条件下で電気めっきをすることができる。故
に、ピット等の欠陥を生じることなく、高電流密度での
電気めっきが可能となり、その結果電気めっきの高速度
化が図れるようになる。In the electroplating apparatus according to the present invention, as described above, the anode is arranged inside the electroplating tank, the plating solution jetting hole is provided on the side wall of the electroplating tank, and the plating solution feeding means is provided in the jetting hole. In the electroplating apparatus in which the flow rate of the plating solution jetted from the jetting hole is pulsatingly changed between the plating solution feeding means and the plating solution jetting hole, A pulsating flow generation mechanism for generating a pulsating flow is provided in the. Therefore, the electroplating method according to the present invention as described above can be performed. That is, the pulsating flow generation mechanism can generate a pulsating flow in the plating solution, and electroplating can be performed under such conditions. Therefore, electroplating at a high current density is possible without causing defects such as pits, and as a result, electroplating can be speeded up.
【0014】ここで、めっき液送給手段とめっき液噴出
孔との間とは、ポンプ等のめっき液送給手段とめっき液
噴出孔との間に存する管路(流路)のみならず、めっき
液送給手段及びめっき液噴出孔を含むものをいう。即
ち、めっき液送給手段と、めっき液噴出孔と、両者間の
管路(流路)とを含むものであると定義する。Here, between the plating solution feeding means and the plating solution jetting hole is not limited to a pipe line (flow passage) existing between the plating solution feeding means such as a pump and the plating solution jetting hole. It includes a plating solution feeding means and a plating solution jetting hole. That is, it is defined to include a plating solution feeding means, a plating solution ejection hole, and a conduit (flow path) between the two.
【0015】従って、上記脈動流発生機構は、上記管路
(流路)、又は、めっき液噴出孔、或いは、めっき液送
給手段に設けられることになる。このいづれに脈動流発
生機構を設けるかは、場合により適宜選定すればよく、
限定されないが、殆どの場合、上記管路(流路)の途
中、即ち、めっき液送給手段とめっき液噴出孔との間の
管路の途中に設ける方が、簡単である等の利点があるの
で、脈動流発生機構はかかる管路の途中に設けることが
望ましい。この場合、脈動流発生機構としては、例えば
ピストンの往復動により脈動流を発生させるシリンダ
や、開度を周期的に変化させるようにした流量調整弁を
使用すればよい。尚、前記めっき液送給手段として通
常、ポンプを使用すればよい。Therefore, the pulsating flow generating mechanism is provided in the pipe line (flow passage), the plating solution jetting hole, or the plating solution feeding means. Whether to provide the pulsating flow generating mechanism in any of these may be appropriately selected depending on the case.
Although not limited, in most cases, it is easier to provide the pipe (flow passage) in the middle, that is, in the pipe between the plating solution supply means and the plating solution ejection hole. Therefore, it is desirable to provide the pulsating flow generation mechanism in the middle of such a pipeline. In this case, as the pulsating flow generating mechanism, for example, a cylinder that generates a pulsating flow by the reciprocating motion of a piston, or a flow rate adjusting valve that cyclically changes the opening degree may be used. A pump may be usually used as the plating solution feeding means.
【0016】このように本発明に係る電気めっき装置
は、振動板に多数の超音波振動子を備えることが必要な
従来装置と異なり、脈動流発生機構を設けたものであっ
て、かかる脈動流発生機構の付設は、簡単にでき、メン
テナンスが極めて容易であり、又、装置的なコスト上昇
も小さい。又、本発明に係る電気めっき方法は、かかる
利点を有する装置を使用して電気めっきを行うものであ
るから、同様の利点がもたらされる。As described above, the electroplating apparatus according to the present invention is provided with a pulsating flow generating mechanism, unlike the conventional apparatus which requires the diaphragm to have a large number of ultrasonic vibrators. The generation mechanism can be easily attached, the maintenance is extremely easy, and the increase in the cost of the apparatus is small. Further, since the electroplating method according to the present invention performs electroplating using the apparatus having such advantages, the same advantages are brought about.
【0017】以上より、本発明に係る電気めっき方法又
は電気めっき装置によれば、メンテナンスの困難化及び
ランニングコストの大幅な増大を招くことなく、前記従
来技術の有する問題点を解消し、ピット等の欠陥を生じ
ることなく高電流密度での電気めっきが可能であり、電
気めっきの高速度化が図れるようになることが判る。As described above, according to the electroplating method or the electroplating apparatus of the present invention, the problems of the prior art can be solved and the pits and the like can be solved without making maintenance difficult and significantly increasing running cost. It can be seen that the electroplating at a high current density is possible without causing the defects of 1) and the speed of the electroplating can be increased.
【0018】[0018]
【実施例】本発明の実施例に係る電気めっき装置及び電
気めっき状況の概要を、図1に示す。この装置は、電気
めっき槽2の内部に陽極3を配し、該めっき槽2の側壁
にめっき液噴出孔5を設け、該噴出孔5にめっき液送給
手段8を管接続した電気めっき装置であって、前記めっ
き液送給手段8とめっき液噴出孔5との間に存する管路
(流路)の途中に、該噴出孔5から噴出するめっき液の
流速を脈動的に変化させ、電気めっき槽内のめっき液中
に脈動流を生じさせる脈動流発生機構Mを設けたもので
ある。EXAMPLE An outline of an electroplating apparatus and an electroplating situation according to an example of the present invention is shown in FIG. This apparatus is an electroplating apparatus in which an anode 3 is arranged inside an electroplating tank 2, a plating solution jetting hole 5 is provided on a side wall of the plating tank 2, and a plating solution feeding means 8 is pipe-connected to the jetting hole 5. The flow velocity of the plating solution ejected from the ejection hole 5 is pulsatingly changed in the middle of a pipe line (flow path) existing between the plating solution feeding means 8 and the plating solution ejection hole 5. A pulsating flow generation mechanism M for generating a pulsating flow in the plating solution in the electroplating tank is provided.
【0019】ここで、脈動流発生機構Mとしては、図1
から判る如く、ピストン7の往復動により脈動流を発生
させる脈動発生シリンダ6を使用した。このシリンダ6
は上記管路(流路)の途中に2本設けられている。即
ち、その1本は、上記管路(流路)の一部を形成してい
る液溜め部Nに設けられ、他の1本はその上方に設けら
れている。尚、上記めっき液送給手段8はポンプであ
り、めっき液循環ラインLの途中に管接続されている。Here, the pulsating flow generating mechanism M is shown in FIG.
As can be seen from the above, the pulsation generating cylinder 6 for generating the pulsating flow by the reciprocating movement of the piston 7 was used. This cylinder 6
Are provided in the middle of the above-mentioned pipeline (flow path). That is, one of them is provided in the liquid reservoir portion N forming a part of the pipe (flow passage), and the other one is provided above it. The plating solution feeding means 8 is a pump, and is connected to the middle of the plating solution circulation line L by a pipe.
【0020】上記電気めっき装置を用い、長尺の金属帯
についての電気めっきを下記の如く行った。めっき液送
給手段8及び脈動流発生機構Mを作動させ、電気めっき
槽2内のめっき液S中にめっき液を、その流速を脈動的
に変化させて噴出し、これにより電気めっき槽2内のめ
っき液中に脈動流を生じさせる一方、コンダクターロー
ル4によりめっき液S中に金属帯1を陰極として走行さ
せ、陽極3との間に通電し、該金属帯1に電気めっきを
施した。尚、電気めっき槽2からオーバフローするめっ
き液は濾過器(図示していない)により濾過された後、
めっき液循環ラインL、めっき液送給手段8、脈動流発
生機構M、及びめっき液噴出孔5を介して電気めっき槽
2内に脈動的に循環される。Using the above electroplating apparatus, electroplating of a long metal strip was carried out as follows. The plating solution feeding means 8 and the pulsating flow generation mechanism M are operated, and the plating solution is jetted into the plating solution S in the electroplating tank 2 while pulsatingly changing the flow rate of the plating solution. While a pulsating flow was generated in the plating solution, the metal strip 1 was run in the plating solution S by the conductor roll 4 as a cathode, and an electric current was applied between the metal strip 1 and the anode 3 to electroplate the metal strip 1. After the plating solution overflowing from the electroplating tank 2 is filtered by a filter (not shown),
The plating solution circulation line L, the plating solution feeding means 8, the pulsating flow generation mechanism M, and the plating solution ejection hole 5 are pulsatedly circulated in the electroplating bath 2.
【0021】その結果、ピット等の欠陥を生じることな
く、高電流密度での電気めっきをすることができ、電気
めっきの高速度化を実現できた。即ち、高速度化が果た
せる高電流密度の条件で電気めっきを行っても、ピット
等の欠陥の無いめっき層が連続して得られた。As a result, electroplating can be performed at a high current density without causing defects such as pits, and high speed electroplating can be realized. That is, even when electroplating was performed under the conditions of high current density capable of achieving high speed, a plating layer without defects such as pits was continuously obtained.
【0022】尚、脈動流発生機構Mとして、上記実施例
では前記の如き脈動発生シリンダ6を使用したが、これ
に代えて、図2に示す如く開度を周期的に変化させるよ
うにした流量調整弁9を使用した場合でも、上記と同様
に高電流密度の条件でピット等の欠陥を生じることなく
電気めっきをすることができた。As the pulsating flow generating mechanism M, the pulsating generating cylinder 6 as described above is used in the above embodiment, but instead of this, the flow rate is such that the opening degree is periodically changed as shown in FIG. Even when the adjusting valve 9 was used, electroplating could be performed under the condition of high current density without causing defects such as pits as in the above.
【0023】[0023]
【発明の効果】本発明に係る電気めっき方法によれば、
電気めっきの高速度化を果たし得る高電流密度の条件で
電気めっきを行っても、ピット等の欠陥の無いめっき層
を得ることができ、又、メンテナンスの困難化及びラン
ニングコストの大幅な増大を招くものではない。従っ
て、メンテナンスの困難化及びランニングコストの大幅
な増大を招くことなく、又、ピット等の欠陥を生じるこ
となく、高電流密度での電気めっきが可能となり、電気
めっきの高速度化が図れるようになる。According to the electroplating method of the present invention,
Even if electroplating is performed under conditions of high current density that can achieve high speed of electroplating, a plating layer without defects such as pits can be obtained, and maintenance becomes difficult and running cost is greatly increased. It does not invite. Therefore, it is possible to perform electroplating at a high current density without causing difficulty in maintenance and a significant increase in running cost, and without causing defects such as pits. Become.
【0024】又、本発明に係る電気めっき装置によれ
ば、上記の如く優れた電気めっきを行うことができるの
で、メンテナンスの困難化及びランニングコストの大幅
な増大を招くことなく、又、ピット等の欠陥を生じるこ
となく、電気めっきの高速度化を果たし得るようにな
る。Further, according to the electroplating apparatus of the present invention, excellent electroplating can be performed as described above, so that maintenance is not made difficult and running cost is not significantly increased, and pits and the like are not generated. It becomes possible to achieve high speed of electroplating without causing defects of.
【図1】本発明の実施例に係る電気めっき装置の概要を
示す側断面図である。FIG. 1 is a side sectional view showing an outline of an electroplating apparatus according to an embodiment of the present invention.
【図2】本発明の他の実施例に係る電気めっき装置の概
要を示す側断面図である。FIG. 2 is a side sectional view showing an outline of an electroplating apparatus according to another embodiment of the present invention.
【図3】提案されている従来装置(特開昭63-118094 号
公報に記載の電気めっき装置)の概要を示す側断面図で
ある。FIG. 3 is a side sectional view showing an outline of a proposed conventional apparatus (electroplating apparatus described in JP-A-63-118094).
1--金属帯、 2--電気めっき槽、 3--陽極、 3J-
1,3J-2--陽極、4--コンダクターロール、 5--めっ
き液噴出孔、 6--脈動発生シリンダ、7--ピストン、
8--めっき液送給手段、 11--超音波振動子、12--振
動板、13--小透孔、 14--オーバフローするめっき液、
M--脈動流発生機構、N--液溜め部、 L--めっき液
循環ライン、 S--めっき液。1--metal strip, 2--electroplating bath, 3--anode, 3J-
1,3J-2--Anode, 4--Conductor roll, 5--Plating solution jetting hole, 6--Pulse generation cylinder, 7--Piston,
8--plating solution feeding means, 11--ultrasonic transducer, 12--vibration plate, 13--small through hole, 14--overflowing plating solution,
M--Pulsating flow generation mechanism, N--Liquid reservoir, L--Plating solution circulation line, S--Plating solution.
Claims (3)
を噴出すると共に、該めっき液中に金属帯を陰極として
走行させ、該金属帯に電気めっきを施す電気めっき方法
において、前記噴出するめっき液の流速を脈動的に変化
させ、電気めっき槽内のめっき液中に脈動流を生じさせ
ることを特徴とする電気めっき方法。1. An electroplating method in which a plating solution is jetted into a plating solution in an electroplating tank, a metal strip is made to run in the plating solution as a cathode, and the metal strip is electroplated. An electroplating method characterized by pulsatingly changing the flow rate of a plating solution to generate a pulsating flow in the plating solution in an electroplating tank.
っき槽の側壁にめっき液噴出孔を設け、該噴出孔にめっ
き液送給手段を管接続した電気めっき装置において、前
記めっき液送給手段とめっき液噴出孔との間に、該噴出
孔から噴出するめっき液の流速を脈動的に変化させ、電
気めっき槽内のめっき液中に脈動流を生じさせる脈動流
発生機構を設けたことを特徴とする電気めっき装置。2. An electroplating apparatus in which an anode is arranged inside an electroplating tank, a plating solution jetting hole is provided on a side wall of the plating tank, and a plating solution feeding means is pipe-connected to the jetting hole. A pulsating flow generation mechanism for pulsatingly changing the flow velocity of the plating solution jetted from the jetting hole to generate a pulsating flow in the plating solution in the electroplating tank is provided between the feeding means and the plating solution jetting hole. An electroplating device characterized in that
給手段とめっき液噴出孔との間の管路の途中に設けられ
ている請求項2記載の電気めっき装置。3. The electroplating apparatus according to claim 2, wherein the pulsating flow generating mechanism is provided in the middle of a pipe line between the plating solution feeding means and the plating solution jetting hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30116792A JPH06146068A (en) | 1992-11-11 | 1992-11-11 | Method for electroplating and device therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30116792A JPH06146068A (en) | 1992-11-11 | 1992-11-11 | Method for electroplating and device therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06146068A true JPH06146068A (en) | 1994-05-27 |
Family
ID=17893603
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30116792A Withdrawn JPH06146068A (en) | 1992-11-11 | 1992-11-11 | Method for electroplating and device therefor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06146068A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013040395A (en) * | 2011-08-19 | 2013-02-28 | Ebara Corp | Substrate processing device and substrate processing method |
-
1992
- 1992-11-11 JP JP30116792A patent/JPH06146068A/en not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013040395A (en) * | 2011-08-19 | 2013-02-28 | Ebara Corp | Substrate processing device and substrate processing method |
US9556533B2 (en) | 2011-08-19 | 2017-01-31 | Ebara Corporation | Substrate processing apparatus and substrate processing method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6261435B1 (en) | Plating method | |
US4081347A (en) | Apparatus for electroplating metal surfaces, in particular cut edges formed by stacking sheet metal panels cut to size | |
US5925231A (en) | Method for electroplating rotogravure cylinder using ultrasonic energy | |
JP2008266670A (en) | Electroplating apparatus | |
JPH06146068A (en) | Method for electroplating and device therefor | |
JPH11508644A (en) | Method and apparatus for chemical electrolytic treatment of conductive plates and foils | |
US4132609A (en) | Method of and apparatus for electrolytic treatment of metal | |
US6016817A (en) | Method and device for the treatment of plate-shaped workpieces having small holes | |
JPH0354887A (en) | Method and apparatus for treatment of fine hole in printed board | |
JP6552485B2 (en) | Plating equipment and storage tank | |
JPS62297495A (en) | Method for plating semiconductor wafer | |
CN110777407A (en) | Ultrasonic electroplating device | |
JPS5845395A (en) | Electroplating or electrolyzing method | |
CN110670113A (en) | Stirring device of electroplating system | |
JPS63118094A (en) | Electroplating equipment | |
JPS5818798B2 (en) | Through-hole plating method and device for printed wiring board | |
JPH03145793A (en) | Electroplating bubble stripping device of printed wiring board | |
JP2980561B2 (en) | Electroplating method and apparatus | |
JP2541481B2 (en) | Jet plating equipment | |
JP2001200394A (en) | Plating treatment device | |
JPS60165390A (en) | Plating treatment of metallic wire | |
JPH0356696A (en) | Wet electroplating device | |
JP2003129281A (en) | Device and process for electrolytic treatment | |
JPS62202099A (en) | Plating device for printed circuit board | |
JPS59133399A (en) | Method and device for continuous surface treatment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20000201 |