JPH06145471A - Molding material of resol type phenol resin - Google Patents

Molding material of resol type phenol resin

Info

Publication number
JPH06145471A
JPH06145471A JP30340492A JP30340492A JPH06145471A JP H06145471 A JPH06145471 A JP H06145471A JP 30340492 A JP30340492 A JP 30340492A JP 30340492 A JP30340492 A JP 30340492A JP H06145471 A JPH06145471 A JP H06145471A
Authority
JP
Japan
Prior art keywords
phenol resin
molding material
type phenol
molding
resol type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30340492A
Other languages
Japanese (ja)
Other versions
JP3140868B2 (en
Inventor
Yoichi Kubota
洋一 久保田
Masanori Minamihama
政則 南浜
Kunihiro Toba
邦広 鳥羽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP04303404A priority Critical patent/JP3140868B2/en
Publication of JPH06145471A publication Critical patent/JPH06145471A/en
Application granted granted Critical
Publication of JP3140868B2 publication Critical patent/JP3140868B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE:To obtain a molding material of resol type phenol resin suitable for producing thin moldings, moldings of complicated shape and moldings of multi- cavity mold. CONSTITUTION:100 pts.wt. molding material of resol type phenol resin is blended with 10-100 pts.wt. cured material of melamine resin as a filler. Molding can be carried out in the absence of ammonia by a resol type phenol resin. Moldability is improved by blending of the cured material of melamine resin.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、射出成形等の成形材料
として用いられるレゾール型フェノール樹脂成形材料に
関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resol type phenol resin molding material used as a molding material for injection molding and the like.

【0002】[0002]

【従来の技術】射出成形等の成形材料としてフェノール
樹脂組成物を用いる場合、ノボラック型のフェノール樹
脂を使用することが多いが、ノボラック型フェノール樹
脂はヘキサメチレンテトラミン等の硬化剤を用いて硬化
させる必要がある。しかしヘキサメチレンテトラミンは
反応の際にアンモニアに分解するために、アンモニア臭
によって作業環境を悪化させたり、金型が腐食されて曇
ったりするおそれがあり、特にコイルボビンや電源ケー
ス、マイクロスイッチ等の電気・電子部品を成形する場
合には、成形品中にアンモニウムイオン等が不純イオン
として含有されることになるために、電気的特性に悪影
響を及ぼすおそれがある。
2. Description of the Related Art When a phenol resin composition is used as a molding material for injection molding or the like, a novolac type phenol resin is often used. The novolac type phenol resin is cured by using a curing agent such as hexamethylenetetramine. There is a need. However, since hexamethylenetetramine decomposes into ammonia during the reaction, it may deteriorate the working environment due to the smell of ammonia, or the mold may be corroded and clouded. -In the case of molding an electronic component, ammonium ions and the like are contained as impure ions in the molded product, which may adversely affect the electrical characteristics.

【0003】そこで、コイルボビンや電源ケース、マイ
クロスイッチ等の電気・電子部品を成形する場合には、
ノンアンモニアのフェノール樹脂としてレゾール型フェ
ノール樹脂を用いた成形材料を使用することがおこなわ
れている。
Therefore, when molding electric / electronic parts such as a coil bobbin, a power supply case, and a micro switch,
A molding material using a resol-type phenol resin as a non-ammonia phenol resin is used.

【0004】[0004]

【発明が解決しようとする課題】これらコイルボビンや
電源ケース、マイクロスイッチ等の電気・電子部品は最
近の軽薄短小、部品の複合化によって、薄肉で形状が複
雑になっており、また生産性を高めるために多数個取り
の成形をおこなうことが要求されている。しかし、薄肉
で複雑形状の成形品を多数個取りで成形する場合、成形
性に各種の問題が発生するものであった。すなわち、成
形材料の流動性を調整して成形の連続安定性や成形性を
高めるように検討がなされているが、成形材料が硬いと
(後述のモノホールフローが100秒以上程度に大き
く、スパイラルフローが45cm以下程度に小さい)、
流動性が悪くなってスプルーに近い側のキャビティには
充填するが遠い側のキャビティへの充填性が悪くなり、
またスプルーの回りにおいてパーティングライン(P
L)にバリが大きく発生して成形品の寸法安定性が欠け
る等の問題が発生し、逆に成形材料を柔らかくして(後
述のモノホールフローが小さく、スパイラルフローが大
きい)、流動性を良くすると、スプルーから遠いキャビ
ティまで流れるが細部への充填性が悪くなり、また硬化
が遅くなって成形品の熱剛性が低下する等の問題が発生
するものである。
The electric and electronic parts such as the coil bobbin, the power supply case, and the micro switch have become thin, thin and small in size due to the recent combination of parts, and the productivity is improved. Therefore, it is required to carry out molding of a large number of pieces. However, when molding a large number of thin-walled and complicated-shaped molded products, various problems occur in moldability. That is, studies have been made to adjust the fluidity of the molding material to improve the continuous stability and moldability of molding, but if the molding material is hard (the monohole flow described below is large for about 100 seconds or more, spiral The flow is as small as 45 cm or less),
The fluidity deteriorates and the cavity on the side closer to the sprue is filled, but the ability to fill the cavity on the far side deteriorates.
Also, the parting line (P
L) causes a large amount of burrs and lacks in dimensional stability of the molded product, and on the contrary, softens the molding material (the monohole flow described later is small and the spiral flow is large) to improve fluidity. If it is improved, problems such as flowing from the sprue to a cavity far away but impairing the filling of details and slowing the curing and lowering the thermal rigidity of the molded product occur.

【0005】本発明は上記の点に鑑みてなされたもので
あり、薄肉、複雑形状、多数個取りの成形品の成形に適
したレゾール型フェノール樹脂成形材料を提供すること
を目的とするものである。
The present invention has been made in view of the above points, and an object of the present invention is to provide a resol-type phenol resin molding material suitable for molding thin-walled, complex-shaped, multi-cavity molded articles. is there.

【0006】[0006]

【課題を解決するための手段】本発明に係るレゾール型
フェノール樹脂成形材料は、レゾール型フェノール樹脂
組成物100重量部に、メラミン樹脂硬化物を充填剤と
して10〜100重量部配合して成ることを特徴とする
ものである。また本発明にあって、メラミン樹脂硬化物
はDSC硬化度が60〜100%のものであり、平均粒
子径が20〜130μmであることが好ましい。
The resole type phenolic resin molding material according to the present invention comprises 100 parts by weight of a resole type phenolic resin composition and 10 to 100 parts by weight of a cured melamine resin as a filler. It is characterized by. Further, in the present invention, the cured melamine resin preferably has a DSC curing degree of 60 to 100% and an average particle diameter of 20 to 130 μm.

【0007】以下、本発明を詳細に説明する。メラミン
樹脂硬化物としてはメラミン樹脂成形品を粉砕したもの
を用いることができるものであり、成形工程で出る不良
品やバリ等の廃棄されるものを用いるのが廃プラスチッ
クの再生利用の上で好ましい。またこのメラミン樹脂硬
化物はDSC硬化度が60〜100%のものを用いるの
が好ましい。DSC(Differential Sc
anning Calorimetry:走査示差熱量
計)は試料と基準物質(アルミナ等)の温度を一定速度
で変化させながら両者に対するエネルギー入力の差ΔQ
を温度Tの関数として測定するようにした装置であり、
熱分析手法の一つとしてDTAに比べて精度良く物質の
吸・発熱量をDSC曲線にとって定量することができ
る。そして樹脂の硬化度が高まるに従ってDSC曲線の
発熱ピークは小さくなり、完全硬化すると発熱ピークは
なくなってしまうので、硬化物の発熱ピークの発熱量を
未硬化樹脂の発熱ピークの発熱量で割った数値を1から
減じた数値の百分率としてDSC硬化度を求めることが
できる。メラミン樹脂硬化剤のDSC硬化度が60%未
満であると、メラミンが充填剤として作用する以上にフ
ェノール樹脂と反応して流動性を低下させるおそれがあ
る。さらに、メラミン樹脂硬化物は平均粒子径が20〜
130μmの範囲の粒子であることが好ましい。メラミ
ン樹脂硬化物の平均粒子径が20μmより小さくなると
粉体に近くなって自動計量が困難になるなど取扱い難く
なり、また平均粒子径が130μmより大きくなると、
粒子が大きくなり過ぎて金型のゲートを詰まらせてキャ
ビティに成形材料を送ることができなくなるおそれがあ
る。
The present invention will be described in detail below. As the melamine resin cured product, a product obtained by crushing a melamine resin molded product can be used, and it is preferable to use a discarded product such as a defective product or burr that appears in the molding process for recycling waste plastics. . The cured melamine resin preferably has a DSC curing degree of 60 to 100%. DSC (Differential Sc)
The anning calorimeter: a scanning differential calorimeter) changes the temperature of the sample and the reference substance (alumina, etc.) at a constant rate, and changes the energy input ΔQ to the two.
Is a device adapted to measure as a function of temperature T,
As one of the thermal analysis methods, it is possible to quantify the amount of absorption and heat generation of a substance with a DSC curve more accurately than with DTA. The exothermic peak of the DSC curve becomes smaller as the degree of cure of the resin increases, and the exothermic peak disappears when completely cured. Therefore, the exothermic amount of the exothermic peak of the cured product is divided by the exothermic amount of the exothermic peak of the uncured resin. The DSC degree of cure can be determined as a percentage of the value obtained by subtracting from 1. When the DSC degree of curing of the melamine resin curing agent is less than 60%, the melamine may react with the phenol resin more than acting as a filler and may lower the fluidity. Further, the cured melamine resin has an average particle size of 20 to
Particles in the range of 130 μm are preferred. If the average particle size of the cured melamine resin is less than 20 μm, it becomes powdery and difficult to handle, such as automatic weighing becomes difficult, and if the average particle size exceeds 130 μm,
The particles can become too large to plug the mold gate and prevent the molding material from being delivered to the cavity.

【0008】レゾール型フェノール樹脂組成物はレゾー
ル型フェノール樹脂にアルミナ、シリカ、炭酸カルシウ
ム、タルク、クレー、硫酸バリウム、水酸化アルミニウ
ム等の無機充填剤、水酸化カルシウムや水酸化マグネシ
ウム等の硬化助剤、ステアリン酸亜鉛、ステアリン酸マ
グネシウム、カルナバワックス等の離型剤、その他顔
料、難燃剤、改質剤等を配合することによって調製され
るものであり、このレゾール型フェノール樹脂組成物に
上記メラミン樹脂硬化物を充填剤として配合することに
よって、レゾール型フェノール樹脂成形材料を調製する
ことができるものである。メラミン樹脂硬化物の配合量
は、レゾール型フェノール樹脂組成物100重量部に対
して10〜100重量部の範囲に設定される。メラミン
樹脂硬化物の配合量が10重量部未満ではメラミン樹脂
硬化物を充填剤として配合して成形性を高める効果を十
分に得ることができない。またメラミン樹脂硬化物の配
合量が100重量部を超えると、充填剤の量が過多にな
って流動性が低下し、却って成形性が悪くなる。
The resol type phenol resin composition is a resol type phenol resin containing inorganic fillers such as alumina, silica, calcium carbonate, talc, clay, barium sulfate and aluminum hydroxide, and curing aids such as calcium hydroxide and magnesium hydroxide. , A zinc stearate, a magnesium stearate, a carnauba wax, and other release agents, and other pigments, flame retardants, modifiers, and the like. By blending the cured product as a filler, a resol type phenol resin molding material can be prepared. The blending amount of the cured melamine resin is set in the range of 10 to 100 parts by weight with respect to 100 parts by weight of the resol-type phenol resin composition. If the blended amount of the cured melamine resin is less than 10 parts by weight, the effect of enhancing the moldability by blending the cured melamine resin as a filler cannot be sufficiently obtained. On the other hand, if the blended amount of the cured melamine resin is more than 100 parts by weight, the amount of the filler will be excessive and the fluidity will be lowered, and the moldability will be rather deteriorated.

【0009】上記のように調製されるレゾール型フェノ
ール樹脂成形材料は、射出成形等に用いられるものであ
り、ノボラック型フェノール樹脂の場合のようにヘキサ
メチレンテトラミン等の硬化剤を必要としないために、
ノンアンモニア成形をおこなうことができる。
The resole-type phenol resin molding material prepared as described above is used for injection molding and the like, and does not require a curing agent such as hexamethylenetetramine as in the case of novolac-type phenol resin. ,
Non-ammonia molding can be performed.

【0010】[0010]

【実施例】次に、本発明を実施例によって例証する。 (実施例1)レゾール型フェノール樹脂45重量部に無
機充填剤としてタルクを10重量部、硬化助剤として水
酸化カルシウム3重量部、離型剤としてステアリン酸亜
鉛を2重量部、その他顔料や難燃剤や改質剤を5重量部
配合してレゾール型フェノール樹脂組成物を調製した。
そしてこのレゾール型フェノール樹脂組成物100重量
部に対して、DSC硬化度が60%、平均粒子径が20
μmのメラミン樹脂硬化物の粉粒体を10重量部配合し
て、混合・混練することによってレゾール型フェノール
樹脂成形材料を調製した。
The invention will now be illustrated by the examples. (Example 1) 45 parts by weight of a resol type phenol resin, 10 parts by weight of talc as an inorganic filler, 3 parts by weight of calcium hydroxide as a curing aid, 2 parts by weight of zinc stearate as a release agent, other pigments and difficult A resol type phenolic resin composition was prepared by blending 5 parts by weight of a flame retardant and a modifier.
And, with respect to 100 parts by weight of this resol type phenol resin composition, the degree of DSC curing is 60% and the average particle diameter is 20.
A resol-type phenol resin molding material was prepared by mixing 10 parts by weight of a powder of the melamine resin cured product having a size of μm, and mixing and kneading the mixture.

【0011】(実施例2,3)メラミン樹脂硬化物とし
て表2に示すDSC硬化度と平均粒子径を有するものを
用い、表1に示す配合量でレゾール型フェノール樹脂組
成物に配合して、レゾール型フェノール樹脂成形材料を
調製した。 (比較例1)メラミン樹脂硬化物を配合しないでレゾー
ル型フェノール樹脂成形材料を調製した。
(Examples 2 and 3) As the melamine resin cured product, one having a DSC curing degree and an average particle size shown in Table 2 was used, and the compounded amount shown in Table 1 was added to the resol type phenol resin composition. A resol type phenol resin molding material was prepared. (Comparative Example 1) A resol-type phenol resin molding material was prepared without blending a melamine resin cured product.

【0012】(比較例2)メラミン樹脂硬化物として表
1に示すDSC硬化度と平均粒子径を有するものを用
い、120重量部の配合量でレゾール型フェノール樹脂
組成物に配合して、レゾール型フェノール樹脂成形材料
を調製した。 (比較例3〜5)メラミン樹脂硬化物の替わりに、表2
に示すDSC硬化度と平均粒子径を有するフェノール樹
脂硬化物を充填剤として配合して、レゾール型フェノー
ル樹脂成形材料を調製した。ここで、比較例3〜5にお
いては樹脂成形材料を調製する際の混練条件を変えるこ
とによって、モノホールフローやスパイラルフローの特
性を変えるようにした。
Comparative Example 2 A cured melamine resin having a DSC curing degree and an average particle diameter shown in Table 1 was blended in a resol type phenol resin composition in an amount of 120 parts by weight to prepare a resol type resin. A phenolic resin molding material was prepared. (Comparative Examples 3 to 5) Instead of the cured melamine resin, Table 2
A resol type phenol resin molding material was prepared by blending a phenol resin cured product having a DSC curing degree and an average particle diameter shown in (1) as a filler. Here, in Comparative Examples 3 to 5, the characteristics of monohole flow and spiral flow were changed by changing the kneading conditions at the time of preparing the resin molding material.

【0013】上記実施例1〜3及び比較例1〜5におい
て調製したレゾール型フェノール樹脂成形材料のモノホ
ールフロー及びスパイラルフローを測定した。モノホー
ルフローの測定は、押出試験機を用いて、モノホールを
設けた金型に40gの試料を入れ、120±2℃の温度
に加熱しつつ62kg/cm2 の成形圧力で50mmφ
のプランジャーによって試料をモノホールから押し出
し、金型内の試料が流出しきる時間を計測することによ
っておこなった。またスパイラルフローの測定は、EM
MI1−60規格に準拠して、試料6gを金型温度15
0℃、成形圧力90kg/cm2 、90秒の条件でトラ
ンスファー成形をおこなったときの、スパイラルフロー
金型に流れた成形品の長さを計測することによっておこ
なった。結果を表1及び表2に示す。
The monohole flow and spiral flow of the resole type phenolic resin molding materials prepared in Examples 1 to 3 and Comparative Examples 1 to 5 were measured. The measurement of the monohole flow was carried out by using an extrusion tester, placing 40 g of the sample in a mold provided with a monohole, and heating at a temperature of 120 ± 2 ° C. and a molding pressure of 62 kg / cm 2 and a pressure of 50 mmφ.
The sample was extruded from the monohole by the plunger of No. 1 and the time taken for the sample to completely flow out in the mold was measured. For spiral flow measurement, use EM
In accordance with the MI1-60 standard, a sample temperature of 6 g is applied to a mold temperature of 15
This was performed by measuring the length of the molded product that flowed into the spiral flow mold when transfer molding was performed under the conditions of 0 ° C., molding pressure of 90 kg / cm 2 and 90 seconds. The results are shown in Tables 1 and 2.

【0014】またこれらのレゾール型フェノール樹脂成
形材料を用い、プレス圧150トン、シリンダー温度前
部80℃、後部60℃、金型温度固定側180〜190
℃、可動側175〜185℃、射出圧力ゲージ130k
g/cm2 、スクリュー回転数45rpm、射出時間5
秒、硬化時間20秒、ゲート方式サイドゲートの条件で
コイルボビンを射出成形した。この成形の際の成形性を
評価し、結果を表1及び表2に示す。
Using these resol type phenolic resin molding materials, a pressing pressure of 150 tons, a cylinder temperature of 80 ° C. at the front, 60 ° C. at the rear, and a mold temperature fixed side 180 to 190.
℃, movable side 175-185 ℃, injection pressure gauge 130k
g / cm 2 , screw rotation speed 45 rpm, injection time 5
Second, the curing time was 20 seconds, and the coil bobbin was injection molded under the conditions of the gate side gate. The moldability during this molding was evaluated, and the results are shown in Tables 1 and 2.

【0015】[0015]

【表1】 [Table 1]

【0016】[0016]

【表2】 [Table 2]

【0017】表1及び表2において、成形性の「連続
性」は、成形が連続して可能かどうかを測定したもので
あり、連続成形1時間でシリンダー硬化により成形がス
トップしたものを「×」、1時間以上8時間未満で成形
がストップしたものを「△」、8時間以上連続して成形
できたものを「○」として評価した。成形性の「充填
性」は、コイルボビンのピン圧入部の充填性を見ること
によって評価した。各実施例のものはいずれも良好であ
ったが、比較例1,3,4のものは、総てのキャビティ
に一応充填するが細部の充填性が悪く欠肉が発生し、比
較例5のものは、スプルーより近いキャビティには細部
迄充填するが遠いキャビティには流れきらずキャビティ
に充填しなかった。また、熱硬化性樹脂の成形には金型
に必ずエアーベントを設けてキャビティ内のエアーや硬
化反応ガスを抜く必要があるが、連続ショット内でエア
ーベントのバリが毎回離型されないとエアーベントから
のガス抜き効果がなくなり、成形品中にガスが残って欠
肉となる。成形性の「バリ離型性」はこのエアーベント
からバリが離型されるか否かを測定したものであり、バ
リが毎回離型されるものを「○」、時々離型されないも
のを「△」、離型されないものを「×」として評価し
た。「バリの均一性」は、各キャビティに均等にバリが
張るものを「○」、「各キャビティ」に生じるバリにバ
ラツキがあるものを「×」として評価した。また、「熱
剛性」は、成形直後に剛性があってスプルーを自動取り
出しチャックで挟んで成形品を取り出すことができたも
のを「○」、自動取り出しチャックでスプルーを挟んで
も成形品を取り出すことができなかったものを「×」と
して評価した。
In Tables 1 and 2, the "continuity" of moldability is a measurement of whether molding is possible continuously, and the one in which molding is stopped by cylinder curing in 1 hour of continuous molding is "x". “A” was evaluated when the molding was stopped for 1 hour or more and less than 8 hours, and “◯” was evaluated when the molding was continuously performed for 8 hours or more. The "fillability" of the moldability was evaluated by observing the fillability of the pin press-fitting portion of the coil bobbin. All of the examples were good, but all of the comparative examples 1, 3 and 4 were filled in all the cavities, but the filling property of the details was poor and a thin wall was generated. In the cavities, the cavities closer to the sprue were filled with details, but the distant cavities did not flow and did not fill the cavities. In addition, for molding thermosetting resin, it is necessary to always provide an air vent in the mold to release air and curing reaction gas in the cavity, but if the burr of the air vent is not released every time in continuous shots, the air vent The effect of degassing from is lost, and gas remains in the molded product resulting in lack of thickness. The moldability "burr releasability" is a measure of whether or not burrs are released from this air vent. "○" means that the burrs are released every time, and "sometimes" does not. “Fair” was evaluated, and those that were not released were evaluated as “x”. The "uniformity of burr" was evaluated as "○" when the burr was evenly spread in each cavity, and "x" when the burr generated in the "cavities" varied. "Thermal rigidity" is "○" when there is rigidity immediately after molding and the sprue can be sandwiched by the automatic take-out chuck to take out the molded product. Those that could not be evaluated were evaluated as "x".

【0018】各実施例の表1及び各比較例の表2にみら
れるように、メラミン樹脂硬化物を充填剤として10〜
100重量部の範囲で配合した各実施例のものは、成形
性が向上していることが確認される。
As can be seen from Table 1 of each Example and Table 2 of each Comparative Example, a cured melamine resin was used as a filler in an amount of 10 to 10.
It is confirmed that the moldability of each of the examples compounded in the range of 100 parts by weight is improved.

【0019】[0019]

【発明の効果】上記のように本発明は、レゾール型フェ
ノール樹脂組成物100重量部に、メラミン樹脂硬化物
を充填剤として10〜100重量部を配合したので、レ
ゾール型フェノール樹脂によってノンアンモニアで成形
をおこなうことができると共に、メラミン樹脂硬化物の
配合で成形性が高まって、薄肉、複雑形状、多数個取り
の成形品を成形性良く成形することができるものであ
る。
As described above, according to the present invention, 100 parts by weight of the resol-type phenol resin composition is mixed with 10 to 100 parts by weight of the cured melamine resin as a filler. In addition to being capable of being molded, the compoundability of the cured melamine resin is enhanced to enhance the moldability, and it is possible to mold thin-walled, complex-shaped, multi-cavity molded products with good moldability.

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成5年3月8日[Submission date] March 8, 1993

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0004[Correction target item name] 0004

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0004】[0004]

【発明が解決しようとする課題】これらコイルボビンや
電源ケース、マイクロスイッチ等の電気・電子部品は最
近の軽薄短小、部品の複合化によって、薄肉で形状が複
雑になっており、また生産性を高めるために多数個取り
の成形をおこなうことが要求されている。しかし、薄肉
で複雑形状の成形品を多数個取りで成形する場合、成形
性に各種の問題が発生するものであった。すなわち、成
形材料の流動性を調整して成形の連続安定性や成形性を
高めるように検討がなされているが、成形材料を低フロ
ーにすると(後述のモノホールフローが100秒以上程
度に大きく、スパイラルフローが45cm以下程度に小
さい)、流動性が悪くなってスプルーに近い側のキャビ
ティには充填するが遠い側のキャビティへの充填性が悪
くなり、またスプルーの回りにおいてパーティングライ
ン(PL)にバリが大きく発生して成形品の寸法安定性
が欠ける等の問題が発生し、逆に成形材料を高フローに
して(後述のモノホールフローが小さく、スパイラルフ
ローが大きい)、流動性を良くすると、スプルーから遠
いキャビティまで流れるが細部への充填性が悪くなり、
また硬化が遅くなって成形品の熱剛性が低下する等の問
題が発生するものである。
The electric and electronic parts such as the coil bobbin, the power supply case, and the micro switch have become thin, thin and small in size due to the recent combination of parts, and the productivity is improved. Therefore, it is required to carry out molding of a large number of pieces. However, when molding a large number of thin-walled and complicated-shaped molded products, various problems occur in moldability. In other words, although studies have been conducted to adjust the fluidity of the molding material to improve the continuous stability and moldability of molding, use a molding material with a low flow rate.
If it is set to a large value (the monohole flow described later is large for about 100 seconds or more and the spiral flow is small for about 45 cm or less), the fluidity deteriorates and the cavity near the sprue is filled, but to the cavity on the far side. <br filling becomes poor, and burr parting line (PL) is increased occurs to problems such as dimensional stability of the molded article lacks occurs at around the sprue, the molding material at a high flow in the opposite /> (Small monohole flow described later is small, spiral flow is large), and if the fluidity is improved, it will flow from the sprue to the cavity farther, but the filling property into the details will deteriorate,
Further, there is a problem that the curing is delayed and the thermal rigidity of the molded product is lowered.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 レゾール型フェノール樹脂組成物100
重量部に、メラミン樹脂硬化物を充填剤として10〜1
00重量部配合して成ることを特徴とするレゾール型フ
ェノール樹脂成形材料。
1. A resol type phenolic resin composition 100.
10 to 1 parts by weight of a cured melamine resin as a filler.
A resol-type phenol resin molding material characterized by being mixed in an amount of 00 parts by weight.
【請求項2】 メラミン樹脂硬化物はDSC硬化度が6
0〜100%のものであり、平均粒子径が20〜130
μmであることを特徴とする請求項1に記載のレゾール
型フェノール樹脂成形材料。
2. The cured melamine resin has a DSC curing degree of 6.
0 to 100% with an average particle size of 20 to 130
The resole-type phenolic resin molding material according to claim 1, which has a thickness of μm.
JP04303404A 1992-11-13 1992-11-13 Resol type phenolic resin molding material Expired - Lifetime JP3140868B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP04303404A JP3140868B2 (en) 1992-11-13 1992-11-13 Resol type phenolic resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04303404A JP3140868B2 (en) 1992-11-13 1992-11-13 Resol type phenolic resin molding material

Publications (2)

Publication Number Publication Date
JPH06145471A true JPH06145471A (en) 1994-05-24
JP3140868B2 JP3140868B2 (en) 2001-03-05

Family

ID=17920623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP04303404A Expired - Lifetime JP3140868B2 (en) 1992-11-13 1992-11-13 Resol type phenolic resin molding material

Country Status (1)

Country Link
JP (1) JP3140868B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6300042B1 (en) 1998-11-24 2001-10-09 Motorola, Inc. Lithographic printing method using a low surface energy layer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6300042B1 (en) 1998-11-24 2001-10-09 Motorola, Inc. Lithographic printing method using a low surface energy layer
US6562553B2 (en) 1998-11-24 2003-05-13 Motorola, Inc. Lithographic printing method using a low surface energy layer

Also Published As

Publication number Publication date
JP3140868B2 (en) 2001-03-05

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