JPH05163417A - Phenolic resin molding material - Google Patents

Phenolic resin molding material

Info

Publication number
JPH05163417A
JPH05163417A JP32881791A JP32881791A JPH05163417A JP H05163417 A JPH05163417 A JP H05163417A JP 32881791 A JP32881791 A JP 32881791A JP 32881791 A JP32881791 A JP 32881791A JP H05163417 A JPH05163417 A JP H05163417A
Authority
JP
Japan
Prior art keywords
molding material
phenolic resin
molding
parts
resol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32881791A
Other languages
Japanese (ja)
Inventor
Tamotsu Ishida
保 石田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP32881791A priority Critical patent/JPH05163417A/en
Publication of JPH05163417A publication Critical patent/JPH05163417A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a phenolic resin molding material having excellent fluidity and generating little burr in molding by using a resol phenolic resin, a trinuclear or polynuclear phenol compound, a hardener and a filler as main components. CONSTITUTION:The objective molding material can be produced by using (A) a resol-type phenolic resin, (B) a trinuclear or polynuclear phenol compound such as the compound of formula I to formula IV at an (A:B) ratio of 95:5 to 5:95, preferably 90:10 to 10:90, especially 70:30 to 50:50, (C) a hardener (e.g. hexamethylenetetramine) and (D) an organic or inorganic filler (e.g. wood flour or calcium carbonate) as main components, kneading the compounding components by extruder, Henschel mixer, etc., in molten state and crushing the kneaded product. If necessary, the material is heated during or after the production of the molding material to accelerate the reaction. The molding material is quickly gelatinized in melting and hardening to suppress the generation of burr.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、レゾール型フェノール
樹脂と3核体以上の多核体フェノール化合物を結合剤と
した熱硬化性成形材料に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermosetting molding material containing a resol type phenol resin and a polynuclear phenol compound having 3 or more nuclei as a binder.

【0002】[0002]

【従来の技術】熱硬化性樹脂成形材料の代表的なものと
してフェノール樹脂成形材料がある。フェノール樹脂成
形材料は機械的強度、耐熱性、電気特性などが優れてい
るため、機械部品、電気部品、自動車部品など広範囲の
用途に利用されている。
2. Description of the Related Art A phenolic resin molding material is a typical thermosetting resin molding material. Phenolic resin molding materials have excellent mechanical strength, heat resistance, electrical characteristics, and the like, and are therefore used in a wide range of applications such as mechanical parts, electric parts, and automobile parts.

【0003】フェノール樹脂成形材料を成形する場合、
フェノール樹脂が縮合タイプの熱硬化性樹脂であるた
め、通常の熱可塑性樹脂の成形には見られない次のよう
な問題点がある。 (1)硬化時において、成形材料は溶融した後、溶融粘
度が高くなりゲル化し硬化に至るまで一定の時間が必要
であるため、その間に金型のパーティング面などからの
バリの発生が避けられない。 (2)硬化時にアンモニアなどのガスが発生するので、
金型のパーティング面にエアベントを設ける必要があ
り、ここでのバリの発生が特に大きい。 (3)成形材料は溶融してからゲル化まで粘度上昇し、
その時間は数十秒以上であるので成形サイクルが長くな
る。 特に、成形品に発生したバリは、その除去のために多大
の労力を要するため、この成形品のコストアップにな
り、フェノール樹脂成形材料が優れた特性を有しなが
ら、その需要拡大の大きな障害となっていた。
When molding a phenolic resin molding material,
Since the phenolic resin is a condensation type thermosetting resin, there are the following problems that cannot be found in the usual molding of thermoplastic resins. (1) During curing, after the molding material has melted, the melt viscosity increases and it takes a certain amount of time for it to gel and harden, so avoid burrs from the parting surface of the mold during that time. I can't. (2) Since gas such as ammonia is generated during curing,
Since it is necessary to provide an air vent on the parting surface of the mold, the occurrence of burrs here is particularly large. (3) The viscosity of the molding material increases from melting to gelling,
Since the time is several tens of seconds or more, the molding cycle becomes long. In particular, burrs generated in molded products require a great deal of labor for their removal, which increases the cost of this molded product, and while phenolic resin molding materials have excellent properties, they are a major obstacle to the expansion of demand. It was.

【0004】[0004]

【発明が解決しようとする課題】従って、本発明は、成
形時のバリの発生を減少させることを主たる目的として
種々検討して完成されたもので、成形材料の溶融硬化時
において、急速にゲル化することによりバリの発生を抑
えることができたものである。
Therefore, the present invention has been completed by various studies with the main purpose of reducing the occurrence of burrs during molding. When the molding material is melt-cured, the gel is rapidly formed. It was possible to suppress the generation of burrs.

【0005】[0005]

【課題を解決するための手段】本発明は、レゾール型フ
ェノール樹脂、3核体以上の多核体フェノール化合物、
硬化剤、及び有機質または無機質の充填材を主成分とす
るフェノール樹脂成形材料を要旨とするものである。本
発明において、レゾール型フェノール樹脂は通常のフェ
ノール樹脂成形材料に使用されているものであればよ
く、特に限定されない。3核体以上の多核体フェノール
化合物としては次のようなものがあるが、これらに限定
されない。これらの多核体フェノール化合物は、ノボラ
ック型のフェノール樹脂と同様にヘキサメチレンテトラ
ミン(以下、ヘキサミンという)などの硬化剤と縮合反
応し硬化する。
The present invention provides a resol type phenol resin, a trinuclear or higher polynuclear phenol compound,
The gist is a phenol resin molding material containing a curing agent and an organic or inorganic filler as main components. In the present invention, the resol type phenolic resin is not particularly limited as long as it is used in a usual phenolic resin molding material. Examples of the trinuclear or higher polynuclear phenol compound include, but are not limited to, the following compounds. These polynuclear phenol compounds undergo a condensation reaction with a curing agent such as hexamethylenetetramine (hereinafter referred to as hexamine) and are cured in the same manner as a novolac type phenol resin.

【0006】[0006]

【化1】 [Chemical 1]

【0007】レゾール型フェノール樹脂と多核体フェノ
ール化合物との配合割合は、特に限定されるものではな
いが、通常95対5ないし5対95である。好ましい配
合割合は90対10ないし30対70である。レゾール
型フェノール樹脂の割合が90%より多いと多核体フェ
ノール化合物配合の効果が小さく、30%より少ないと
硬化までに時間がかかり成形サイクルが長くなることが
ある。さらに好ましい範囲は70対30ないし50対5
0である。本発明の成形材料を得るには、レゾール型フ
ェノール樹脂と多核体フェノール化合物、硬化剤及び充
填材等を混合し、通常の方法、即ちロール、押出機、あ
るいはヘンシェルミキサーなどにより溶融混練した後粉
砕することにより成形材料が得られる。しかし、多核体
フェノール化合物の割合が多い場合、融点が高く、成形
材料化が困難なこともあるので、多核体フェノール化合
物の種類及び量を適当に選択して、結合剤成分の融点を
低下させることにより成形材料化が容易になる。
The mixing ratio of the resol type phenol resin and the polynuclear phenol compound is not particularly limited, but is usually 95: 5 to 5:95. A preferred mixing ratio is 90:10 to 30:70. If the proportion of the resol-type phenol resin is more than 90%, the effect of blending the polynuclear phenol compound is small, and if it is less than 30%, it takes time to cure and the molding cycle may become long. A more preferred range is 70:30 to 50: 5.
It is 0. In order to obtain the molding material of the present invention, a resol type phenolic resin and a polynuclear phenolic compound, a curing agent, a filler and the like are mixed and melted and kneaded by an ordinary method, that is, a roll, an extruder or a Henschel mixer, and then pulverized. By doing so, a molding material is obtained. However, when the proportion of the polynuclear phenol compound is high, the melting point is high and it may be difficult to form a molding material. Therefore, the melting point of the binder component is lowered by appropriately selecting the type and amount of the polynuclear phenol compound. As a result, molding material becomes easy.

【0008】多核体フェノール化合物は結晶性であるの
で、レゾール型フェノール樹脂にこれを配合した成形材
料は成形時加熱により溶融し、流動性のよい液状物にな
る。そして一定時間後速やかにに硬化反応が起こり、ゲ
ル化し硬化に至る。このことから、特に多核体フェノー
ル化合物の割合が多い場合、通常のフェノール樹脂成形
材料と同様にして成形材料化すると成形時低粘度の流動
状態が一定時間続くので、成形圧力を低くすることによ
りバリの発生を防止することができる。一方、硬化が遅
く、成形時低粘度の流動状態が長く続く場合、成形材料
化するとき、あるいは成形材料化した後加熱によりレゾ
ール型フェノール樹脂と多核体フェノール化合物と硬化
剤との反応を進ませ、硬化反応開始の少し前の段階で停
止させておけば、この成形材料を成形するとき加熱によ
り低粘度の液状物となり、その後速やかに硬化反応が開
始され、ゲル化に至る。従って、低い圧力で成形しても
充填が短時間で終了し、速やかな硬化によりバリの発生
を防止することができる。さらに、成形サイクルの短縮
をも行うことができる。
Since the polynuclear phenolic compound is crystalline, the molding material obtained by blending this with the resol type phenolic resin is melted by heating during molding and becomes a liquid material having good fluidity. Then, after a certain period of time, a curing reaction occurs promptly, gelling and curing. From this, especially when the proportion of polynuclear phenolic compound is high, if a molding material is formed in the same manner as a normal phenolic resin molding material, a low-viscosity fluid state during molding continues for a certain period of time. Can be prevented. On the other hand, when curing is slow and the low-viscosity fluid state during molding continues for a long time, the reaction between the resole-type phenol resin, the polynuclear phenol compound and the curing agent proceeds when the material is used as a molding material or by heating after molding. If it is stopped at a stage slightly before the start of the curing reaction, when the molding material is molded, it becomes a low-viscosity liquid substance by heating, and then the curing reaction is promptly started to lead to gelation. Therefore, even if the molding is performed at a low pressure, the filling is completed in a short time, and the burrs can be prevented from being generated by the rapid curing. Further, the molding cycle can be shortened.

【0008】一方、レゾール型フェノール樹脂の割合が
多い場合は通常のフェノール樹脂成形材料と同様にして
製造することができるが、場合によっては、成形材料化
するとき、あるいは成形材料化した後加熱により反応を
進ませてもよい。
On the other hand, when the proportion of the resol-type phenol resin is high, it can be produced in the same manner as a usual phenol resin molding material, but depending on the case, it may be heated at the time of forming the molding material or after forming the molding material. The reaction may proceed.

【0009】本発明の使用する充填材は、木粉、パルプ
粉、各種織物粉砕物、熱硬化性樹脂積層板・成形品の粉
砕物等の有機質の物、シリカ、アルミナ、ガラス、タル
ク、クレー、炭酸カルシウム、カーボン等の粉末、ガラ
ス繊維、カーボン繊維、マイカなどの無機質の物が使用
される。
The filler used in the present invention is an organic substance such as wood powder, pulp powder, various crushed fabrics, crushed thermosetting resin laminates and molded products, silica, alumina, glass, talc, clay. Powders such as calcium carbonate and carbon, and inorganic substances such as glass fiber, carbon fiber and mica are used.

【0010】[0010]

【実施例】以下、本発明を実施例及び比較例により説明
する。ここにおいて、「部」は重量部を示す。 [実施例1]レゾール型フェノール樹脂(数平均分子量
850、以下の実施例も同じ)23部、トリスフェノール
PA23部、ヘキサミン5部、水酸化カルシウム3部、
木粉32部、炭酸カルシウム11部、離型剤3部を混合
し、ロールにて溶融混練し、冷却後粉砕して成形材料を
得た。 [実施例2]レゾール型フェノール樹脂39部、トリス
フェノールPA10部、ヘキサミン2部、水酸化カルシ
ウム3部、木粉32部、炭酸カルシウム11部、離型剤
3部を混合し、ロールにて溶融混練し、冷却後粉砕して
成形材料を得た。
EXAMPLES The present invention will be described below with reference to Examples and Comparative Examples. Here, "parts" indicate parts by weight. [Example 1] Resol-type phenol resin (number average molecular weight
850, the same applies to the following examples) 23 parts, trisphenol PA 23 parts, hexamine 5 parts, calcium hydroxide 3 parts,
32 parts of wood powder, 11 parts of calcium carbonate and 3 parts of a release agent were mixed, melt-kneaded with a roll, cooled and pulverized to obtain a molding material. [Example 2] 39 parts of a resol type phenol resin, 10 parts of trisphenol PA, 2 parts of hexamine, 3 parts of calcium hydroxide, 32 parts of wood powder, 11 parts of calcium carbonate and 3 parts of a releasing agent were mixed and melted by a roll. The mixture was kneaded, cooled, and then pulverized to obtain a molding material.

【0011】[実施例3]レゾール型フェノール樹脂1
3部、トリスフェノールPA32部、ヘキサミン6部、
水酸化カルシウム3部、木粉32部、炭酸カルシウム1
1部、離型剤3部を混合し、ロールにて溶融混練した
後、150℃で10分間加熱し、冷却後粉砕して成形材
料を得た。 [比較例1]レゾール型フェノール樹脂51部、水酸化
カルシウム3部、木粉32部、炭酸カルシウム11部、
離型剤3部を混合し、ロールにて溶融混練し、冷却後粉
砕して成形材料を得た。
[Example 3] Resol type phenol resin 1
3 parts, trisphenol PA 32 parts, hexamine 6 parts,
3 parts calcium hydroxide, 32 parts wood flour, 1 calcium carbonate
1 part and 3 parts of a release agent were mixed, melt-kneaded with a roll, heated at 150 ° C. for 10 minutes, cooled and pulverized to obtain a molding material. Comparative Example 1 51 parts of resol type phenol resin, 3 parts of calcium hydroxide, 32 parts of wood flour, 11 parts of calcium carbonate,
3 parts of the release agent was mixed, melt-kneaded with a roll, cooled and pulverized to obtain a molding material.

【0012】得られた成形材料について、それぞれ流動
性(高化式フローテスターによる粘度)を測定した。更
に、以下の条件にてトランスファ成形し、バリ発生の有
無を測定した。結果を表1に示す。 (トランスファ成形条件)タブレット化した20gの成
形材料を約100℃に余熱し、図1に示す形状のトラン
スファ成形金型を用い、ゲージ圧 25kg/cm2(実施例
2及び比較例1は50kg/cm2)、温度200℃で3分間
成形した。バリの有無は金型エアベント部におけるバリ
を目視して判定した。
The fluidity (viscosity measured by a Koka type flow tester) was measured for each of the obtained molding materials. Furthermore, transfer molding was performed under the following conditions, and the presence or absence of burrs was measured. The results are shown in Table 1. (Transfer molding conditions) 20 g of the tabletted molding material was preheated to about 100 ° C. and a transfer molding die having the shape shown in FIG. 1 was used to obtain a gauge pressure of 25 kg / cm 2 (50 kg / cm in Example 2 and Comparative Example 1 cm 2 ), and the temperature was 200 ° C. for 3 minutes. The presence or absence of burrs was determined by visually observing burrs in the mold air vent.

【0013】[0013]

【表1】 [Table 1]

【0014】表1から、各実施例で得られた成形材料
は、比較例の従来のフェノール樹脂成形材料に比較して
流動性が良好である。成形時のバリは発生しないか非常
に少ないことがわかる。
From Table 1, the molding materials obtained in the respective examples have better fluidity than the conventional phenol resin molding materials of the comparative examples. It can be seen that burrs do not occur or are extremely small during molding.

【0015】[0015]

【発明の効果】以上の実施例からも明らかなように、本
発明のフェノール樹脂成形材料は流動性が優れ、成形時
のバリの発生もないか少ないので、成形性の良好な成形
材料として幅広い利用が可能である。
As is clear from the above examples, the phenol resin molding material of the present invention has excellent fluidity and has little or no burrs during molding, so that it can be widely used as a molding material having good moldability. It is available.

【図面の簡単な説明】[Brief description of drawings]

【図1】実施例で使用するトランスファ成形金型の概略
断面図。
FIG. 1 is a schematic cross-sectional view of a transfer molding die used in an example.

【図2】図1のA−A断面図。FIG. 2 is a sectional view taken along line AA of FIG.

【符号の説明】 1 円形キャビティ 2 角形キャビティ 3,4,5 エアベント 6 ポット 7 プランジャ[Explanation of reference numerals] 1 circular cavity 2 square cavity 3, 4, 5 air vent 6 pot 7 plunger

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 レゾール型フェノール樹脂、3核体以上
の多核体フェノール化合物、硬化剤、及び有機質または
無機質の充填材を主成分とするフェノール樹脂成形材
料。
1. A phenol resin molding material comprising a resol-type phenol resin, a trinuclear or higher polynuclear phenol compound, a curing agent, and an organic or inorganic filler as main components.
【請求項2】 レゾール型フェノール樹脂と3核体以上
の多核体フェノール化合物との割合が90対10ないし
30対70である請求項1記載のフェノール樹脂成形材
料。
2. The phenol resin molding material according to claim 1, wherein the ratio of the resol type phenol resin to the polynuclear phenol compound having 3 or more nuclei is 90:10 to 30:70.
JP32881791A 1991-12-12 1991-12-12 Phenolic resin molding material Pending JPH05163417A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32881791A JPH05163417A (en) 1991-12-12 1991-12-12 Phenolic resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32881791A JPH05163417A (en) 1991-12-12 1991-12-12 Phenolic resin molding material

Publications (1)

Publication Number Publication Date
JPH05163417A true JPH05163417A (en) 1993-06-29

Family

ID=18214429

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32881791A Pending JPH05163417A (en) 1991-12-12 1991-12-12 Phenolic resin molding material

Country Status (1)

Country Link
JP (1) JPH05163417A (en)

Similar Documents

Publication Publication Date Title
JPH05156121A (en) Molding material of phenol resin
JPH0610246B2 (en) Heat resistant epoxy resin mold composition
JPH05163417A (en) Phenolic resin molding material
JPH05156123A (en) Molding material of phenol resin
JPH05163416A (en) Phenolic resin molding material
JPH07113035A (en) Phenolic resin molding material
JP5682625B2 (en) Phenolic resin molding material
JPH05156122A (en) Thermosetting molding material
JP2667753B2 (en) Thermosetting molding material molding method
JPH05156120A (en) Thermosetting molding material
JPH07278409A (en) Phenolic resin molding material
JPH05156119A (en) Thermosetting molding material
JPS59191715A (en) Production of epoxy resin composition
JPH0657098A (en) Phenol resin molding material for low-pressure molding
JPH08302158A (en) Phenol resin molding material
JP3121675B2 (en) Phenolic resin molding material for low pressure molding
JP3140868B2 (en) Resol type phenolic resin molding material
JPH0625509A (en) Phenol resin molding material for low-pressure molding
JP3573565B2 (en) Epoxy resin composition tablet
JP3121674B2 (en) Phenolic resin molding material for low pressure molding
JPH0925390A (en) Phenol resin molding material
JPH06145472A (en) Molding material of thermosetting resin
JP2003342444A (en) Phenol resin molding material
JPH06329765A (en) Preparation of epoxy resin composition, and sealed semiconductor device
JP2001189333A (en) Semiconductor device and manufacturing method therefor