JPH0613735A - Printed-circuit board - Google Patents

Abstract

PURPOSE:To enclose the plating scraps produced during press fitting a connector to avoide scattering of the scraps by a method wherein both surfaces of thin plastic films laminated on the printed-circuit board whose through hole is press fitted with a connector having compliant part for solderless connection. CONSTITUTION:Both surfaces of the printed board 1 are laminated with thin plastic films 2. A connector 7 is press fitted into a through hole 5 part so as to penetrate the compliant part 6 into the through hole 5 part. The plastic films 2 are made of a soft material so as to block the gaps between the molds 8 of the connector 7 and the printed board 1 on the component mounting side of the printed substrate. Besides, on the lead terminal side, the plastic film 2 is bonded onto the gap between the lead terminal 3 and the through hole 5 so as to block the gap. Through these procedures, the plating scraps 4 produced during press fitting step of the connector 7 adhering to the patterns and lead arranged around at narrow pitch can avoid the development of defective short circuit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board in which a press-fit connector is used to make a solderless connection of the connector, which is suitable for preventing the scattering of plating chips generated when the connector is press-fitted. .

[0002]

2. Description of the Related Art Conventionally, a printed circuit board in which a press-fit connector is used to make a solderless connection of a connector has no mechanism for preventing scattering of plating scraps generated when a connector is press-fitted.

FIG. 4 shows an example of the structure. When the press-fit connector 7 is press-fitted into the printed board 1,
The compliant part 6 scrapes the inner surface of the through hole 5,
Plating chips 4 are generated. Since the plating scraps 4 are easily scattered by cooling air, vibration, etc., they adhere to the narrow-pitch patterns and leads mounted in the periphery and cause a short circuit defect.

[0004]

In the above-mentioned prior art, since there is no mechanism for preventing the scattering of the plating chips generated when the connector is press-fitted, the plating chips are easily scattered by the cooling air, vibration, etc. There is a problem in that a short circuit defect is caused by being attached to the formed narrow pitch pattern or lead.

An object of the present invention is to provide a structure of a printed circuit board which can prevent scattering of plating scraps generated when a connector is press-fitted and prevent short-circuit defects caused by the plating scraps adhering to narrow pitch patterns or leads. To do.

[0006]

In order to achieve the above object, the present invention is to laminate a thin plastic film on both sides of a printed circuit board so that plating scraps generated when a connector is press-fitted do not fall off from the printed circuit board. This is to prevent the plating scraps from scattering by enclosing them in the.

[0007]

The thin plastic film laminated on both sides of the printed circuit board is broken by the lead terminals of the connector when the connector is press-fitted. At this time, the plastic film is made of a soft material so as not to be broken into a size larger than the diameter of the lead terminal. As a result, as the connector is press-fitted, the compliant part of the lead terminal comes into contact with the inner wall of the through hole to generate plating scraps. Is closed by the plastic film, and on the lead terminal side of the printed circuit board, the plastic film is brought into close contact with the gap between the lead terminal and the through hole, so that the plating waste generated when the connector is press-fitted can be trapped in the through hole.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.
Will be described.

FIG. 1 is a vertical sectional view showing an initial state of an embodiment of the present invention. In FIG. 1, both sides of the printed circuit board 1 are laminated with a thin plastic film 2 and the through holes 5 are closed.

FIG. 2 is a vertical sectional view showing a state in which the connector is being press-fitted. In FIG. 2, as the connector 7 is press-fitted, the compliant portion 6 of the lead terminal 3 scrapes the inner surface of the through hole 5 to generate plating scrap 4. At the same time, the plastic film 2 laminated on both sides of the printed circuit board 1 is broken by the lead terminals 3, but by using a soft material, the plastic film 2 on the lead terminal surface is adhered between the lead terminals 3 and the through holes 5. , Through the lead terminal 3 without making a gap.

FIG. 3 is a vertical sectional view showing a state in which press fitting of the connector is completed.

When the press-fitting of the connector is completed, the plastic film 2 closes the gap between the mold 8 of the connector and the printed circuit board 1 on the component mounting side of the printed circuit board 1, and leads on the lead terminal side of the printed circuit board 1. The plastic film 2 adheres tightly between the terminal 3 and the through hole 5 to close the gap. As a result, the plating waste 4 generated by press fitting the connector is confined in the through hole 5,
It is possible to prevent scattering to the surroundings.

[0013]

As is clear from the above description, according to the present invention, the plating scraps generated when the connector is press-fitted can be confined in the through holes and prevented from scattering to the surroundings. It is possible to prevent a short circuit defect from being caused by being attached to a narrow pitch pattern or leads arranged in the periphery.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing an initial state of a printed circuit board according to the present invention.

FIG. 2 is a vertical cross-sectional view showing a state where a printed circuit board according to the present invention is being pressed into a connector.

FIG. 3 is a vertical cross-sectional view showing a state of the printed circuit board according to the present invention when connector press-fitting is completed.

FIG. 4 is a vertical cross-sectional view showing a state in which a connector is press-fitted into a conventional printed circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Printed circuit board, 2 ... Plastic film, 3 ... Lead terminal, 4 ... Plating waste, 5 ... Through hole, 6 ... Compliant part, 7 ... Connector, 8 ... Mold.

Claims (1)

[Claims] 1. A printed circuit board using a press-fit connector, in which a contact having a compliant portion having a diagonal dimension slightly larger than the inner diameter of the through hole is press-fitted into the through hole to perform electrical / mechanical connection without soldering. 2. A printed circuit board characterized in that both sides of the printed circuit board are laminated with a thin plastic film.