JP2024003333A - Terminal member board connection structure and terminal member board connection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a terminal member board connection structure and a terminal member board connection method that can prevent foreign matter generated when press-fitting a terminal member into a through hole of a board from adhering to other conductor parts, while minimizing the complexity of the manufacturing process and manufacturing equipment.

SOLUTION: An electrical device 100 includes a terminal member 20 having a connecting portion 23 that is press-fitted into a through hole of a substrate 10 and is electrically connected by contacting an inner surface conductor portion 12 of the through hole while being elastically deformed. The substrate 10 includes a pad portion 14 that is a conductor that extends along the main surface 10a from a portion of the peripheral edge of the through hole 11 on the main surface 10a which is contacted by the connecting portion 23 when the terminal member 20 is press-fitted. A solder material 50 is placed in the pad portion 14.

SELECTED DRAWING: Figure 4

COPYRIGHT: (C)2024,JPO&INPIT

Description

The present invention relates to a substrate connection structure for a terminal member and a method for connecting a terminal member to a substrate, and particularly to a substrate connection structure for a terminal member press-fitted into a through hole of a substrate and a method for connecting a terminal member to a substrate.

Conventionally, a board connection structure in which a terminal member is press-fitted into a through hole of a board is known (for example, see Patent Document 1).

The above-mentioned Patent Document 1 describes a printed wiring board assembly (board connection structure) including a press-fit type terminal (terminal member). The printed wiring board assembly includes a printed wiring board and a press-fit connector. A printed wiring board has a conductor pattern formed on an insulating substrate and a through hole connected to the conductor pattern. Press-fit connectors have press-fit terminals. A press-fit terminal is connected to a conductive pattern on a printed wiring board by being press-fitted into a through hole.

Here, when the press-fit type terminal is press-fitted into the through hole, the plating layer formed on the surface of the press-fit type terminal is scraped off, and scraps of the plating layer may be generated. In this case, it is conceivable that a short circuit may occur due to adhesion of scraps to other conductor parts. Therefore, in the printed wiring board assembly described in Patent Document 1, the through holes are filled with synthetic resin. This synthetic resin is filled into the through-hole after the press-fit terminal is press-fitted into the through-hole, and is solidified while taking in scraps of the plating layer.

Japanese Patent Application Publication No. 2007-311092

However, in the printed wiring board assembly described in Patent Document 1, press-fit terminals (terminal members) are installed in the through holes in order to prevent scraping scum (conductive foreign matter) from adhering to other conductor parts. Since the through holes are filled with synthetic resin after press-fitting, the process and equipment for manufacturing printed wiring boards (substrates) become more complicated as the work for filling the synthetic resin increases. Therefore, while suppressing the complexity of the manufacturing process and manufacturing equipment caused by filling with synthetic resin, it also suppresses conductive foreign matter that is generated when press-fitting the terminal member into the through-hole of the board from adhering to other conductive parts. The problem is that it is difficult to do so.

This invention was made to solve the above-mentioned problems, and one object of the invention is to press-fit a terminal member into a through hole of a board while suppressing the complexity of the manufacturing process and manufacturing equipment. It is an object of the present invention to provide a terminal member substrate connection structure and a terminal member substrate connection method capable of suppressing the adhesion of foreign matter generated when the terminal member is attached to other conductor portions.

In order to achieve the above object, a substrate connection structure of a terminal member according to a first aspect of the present invention includes a substrate including a hole-shaped through hole having an inner surface conductor portion provided on the inner surface, and a through hole of the substrate. a terminal member having a connection portion press-fitted into the inner surface of the through hole and electrically connected by contacting the inner surface conductor portion of the through hole while being elastically deformed; It has a pad portion that is a conductor that extends along the main surface from the portion where the connection portion comes into contact when the terminal member is press-fitted, and a conductive bonding material is disposed in the pad portion.

In the terminal member substrate connection structure according to the first aspect of the present invention, as described above, the substrate is connected from the portion of the peripheral edge of the through hole on the main surface where the connecting portion comes into contact when the terminal member is press-fitted. , has a pad portion that is a conductor extending along the main surface, and a conductive bonding material is disposed in the pad portion. As a result, at the timing when the electronic components mounted on the board are connected to the conductive pattern of the board using the conductive bonding material, the terminal member is press-fitted into the through hole of the board by the conductive bonding material placed on the pad part. It is possible to bond conductive foreign matter generated during the process. Therefore, conductive foreign matter can also be bonded during the process of bonding electronic components to the board, so synthetic resin is filled in to prevent conductive foreign matter from adhering to other conductor parts. It is possible to suppress the need for additional steps such as. As a result, while suppressing the complexity of the manufacturing process and manufacturing equipment, it is possible to prevent foreign matter generated when the terminal member is press-fitted into the through hole of the board from adhering to other conductor parts.

In the terminal member substrate connection structure according to the first aspect, preferably, the substrate includes a land portion that is an annular conductor provided along the periphery of the through hole on the main surface of the substrate, and the pad portion includes: The conductor is a conductor that is formed integrally with the land portion and extends along the main surface so as to protrude outward from the outer periphery of the land portion, and the conductive bonding material is disposed on the pad portion and the land portion.

Here, when the terminal member is press-fitted into the through hole, the surface of the terminal member may be scraped by the conductor forming the annular land portion provided along the periphery of the through hole. In that case, it is conceivable that the terminal member scraped by the conductor forming the land portion may adhere to other conductor portions as conductive foreign matter. In consideration of this point, in the present invention, the pad portion is a conductor that is formed integrally with the land portion and extends along the main surface so as to protrude outward from the outer periphery of the land portion, and has a conductive bond. The material is arranged on the pad portion and the land portion. With this configuration, the terminal member that has been shaved off by the conductor forming the land portion can be bonded to the conductive bonding material disposed on the pad portion and the land portion. The attached terminal member can be prevented from adhering to other conductor parts as a conductive foreign substance. Therefore, when a land portion is provided at the periphery of a through hole, it is possible to suppress the complication of the manufacturing process and manufacturing equipment while preventing foreign matter generated when press-fitting the terminal member into the through hole of the board to the other conductor portions. It is possible to effectively suppress adhesion to

In the terminal member board connection structure according to the first aspect, preferably, the terminal member is press-fitted while the connecting portion is in contact with a predetermined portion that is a part of the peripheral edge of the through hole, and the pad portion is preferably It is provided so as to extend along the main surface from a predetermined portion of the peripheral edge of the through hole on the surface.

Here, when placing other conductor parts or electronic components on the main surface of the board near the through-hole into which the terminal member is press-fitted, the active part of the through-hole including the pad part and the inner surface conductor part It is necessary to place other conductor parts or electronic components in consideration of the insulation distance from the In contrast, in the present invention, the pad portion is provided so as to extend along the main surface from a predetermined portion that is a part of the periphery of the through hole on the main surface. It is possible to avoid providing the pad section in parts other than the predetermined parts. As a result, other conductor parts or electronic components can be placed closer to the through-holes in areas other than the predetermined part of the peripheral edge where the pad part is not provided. Therefore, the mounting area of the board can be reduced compared to the case where the pad portion is provided all around the through hole. As a result, while reducing the complexity of the manufacturing process and manufacturing equipment, the mounting area of the board has been reduced in order to prevent foreign matter generated when press-fitting the terminal member into the through hole of the board from adhering to other conductor parts. It is possible to suppress the increase.

Further, a method for connecting a terminal member to a substrate according to a second aspect of the present invention has an inner surface conductor portion provided on the inner surface, and the inner surface conductor portion of the through hole is connected to a hole-shaped through hole provided in the substrate. a step of press-fitting a terminal member having a connecting part that is electrically connected by contacting the part while being elastically deformed; and a step of press-fitting the terminal member in the peripheral part of the through hole on the main surface of the board. and a step of disposing a conductive bonding material on a pad portion that is a conductor extending along the main surface from a portion where the connection portion contacts.

In the method for connecting a terminal member to a board according to the second aspect of the present invention, as described above, the main surface of the main surface of the board is moved from the part of the peripheral edge of the through hole where the connecting part comes into contact when the terminal member is press-fitted. The method includes a step of disposing a conductive bonding material on a pad portion that is a conductor extending along the surface. As a result, at the timing when the electronic components mounted on the board are connected to the conductive pattern of the board using the conductive bonding material, the terminal member is press-fitted into the through hole of the board by the conductive bonding material placed on the pad part. It is possible to bond conductive foreign matter generated during the process. Therefore, conductive foreign matter can also be bonded during the process of bonding electronic components to the board, so synthetic resin is filled in to prevent conductive foreign matter from adhering to other conductor parts. It is possible to suppress the need for additional steps such as. As a result, we have developed a method for connecting a terminal member to a board that can prevent foreign matter from adhering to other conductor parts when the terminal member is press-fitted into the through hole of the board, while reducing the complexity of the manufacturing process and manufacturing equipment. can be provided.

Further, in the method for connecting a terminal member to a board according to the second aspect, the step of disposing the conductive bonding material may include a conductive bonding material containing a paste-like solder material in the pad portion before the step of press-fitting the terminal member. After the step of press-fitting the terminal member, the method further includes a step of heating and melting the paste-like solder material in a reflow oven, and cooling and hardening the paste-like solder material.

With this configuration, the paste-like solder material applied to the pad part can adsorb conductive foreign matter that is generated when the terminal member is press-fitted, and the paste-like solder material applied to the pad part can also be absorbed. By heating and melting the solder material and cooling and hardening it, the adsorbed conductive foreign matter can be melted and joined together with the solder material. In addition, when using a paste-like solder material to mount electronic components on a board, in the process of applying the solder material to the pad part, the paste-like solder material is applied to the mounting position of the electronic component on the board together with the pad part. Solder material can be applied. In the process of heating and melting the paste-like solder material in a reflow oven, and cooling and hardening it, it is applied to the mounting position of the electronic component in order to electrically connect the conductor pattern of the board and the electronic component. The pasty solder material and the solder material applied to the pad portion can be simultaneously melted and hardened in a reflow oven. Therefore, a reflow oven is used to mount electronic components on a board using a paste-like solder material, and to bond conductive foreign matter that is generated when a terminal member is press-fitted into a through-hole on a board to a pad part. This can be done by a common process. As a result, it is possible to suppress the increase in the number of processes due to the use of paste-like solder material, effectively suppressing the complexity of the manufacturing process and manufacturing equipment, while press-fitting the terminal member into the through-hole of the board. It is possible to provide a method for connecting a terminal member to a substrate, which can effectively prevent foreign matter generated during the process from adhering to other conductor parts.

In addition, in the terminal member substrate connection structure according to the first aspect and the terminal member substrate connection method according to the second aspect, the following configurations may also be considered.

(Additional note 1)
That is, in the substrate connection structure of the terminal member in which the pad portion is integrally formed with the land portion, the inner surface conductor portion of the through hole, the land portion, and the pad portion are integrally formed.

With this configuration, by forming the pad portion integrally with the inner surface conductor portion of the through hole and the land portion, the number of parts can be reduced to prevent conductive foreign matter from adhering to other conductor portions. can be suppressed from increasing, and also from making the structure complicated.

(Additional note 2)
Further, in the board connection structure in which the pad portion is provided so as to extend from a predetermined portion of the peripheral edge of the through hole along the main surface, the terminal member is provided at the portions of the peripheral edge of the through hole that are opposite to each other. The connecting portions are press-fitted in the first portion and the second portion while being in contact with each other, and the pad portion is inserted along the main surface from each of the first portion and the second portion that are opposed to each other among the peripheral edges of the through hole on the main surface. It is set to extend.

With this configuration, since the pad portion is provided so as to extend from each of the first portion and the second portion facing each other in the peripheral portion of the through hole, the first portion The pad portion may not be provided in the portion in the direction perpendicular to the direction in which the first portion and the second portion face each other. Therefore, other conductor parts or electronic components can be placed close to the through hole in a direction perpendicular to the direction in which the first part and the second part face each other. As a result, while reducing the complexity of the manufacturing process and manufacturing equipment, the mounting area of the board has been reduced in order to prevent foreign matter generated when press-fitting the terminal member into the through hole of the board from adhering to other conductor parts. It is possible to suppress the increase.

(Additional note 3)
Further, in the terminal member substrate connection structure according to the first aspect, the conductive bonding material is bonded to the pad portion by melting and hardening a paste-like solder material applied to the pad portion.

With this configuration, the paste-like solder material applied to the pad part can adsorb conductive foreign matter that is generated when the terminal member is press-fitted, and the paste-like solder material applied to the pad part can also be absorbed. By heating and melting the solder material and cooling and hardening it, the adsorbed conductive foreign matter can be melted and joined together with the solder material. In addition, when using a paste-like solder material to mount electronic components on a board, in the process of applying the solder material to the pad part, the paste-like solder material is applied to the mounting position of the electronic component on the board together with the pad part. Solder material can be applied. In the process where the paste solder material is heated and melted and then cooled and hardened, the paste is applied to the mounting position of the electronic component in order to electrically connect the conductor pattern of the board and the electronic component. The shaped solder material and the solder material applied to the pad portion can be simultaneously melted and hardened. Therefore, a common process is used to mount electronic components on a board using a paste-like solder material and to bond conductive foreign matter that is generated when press-fitting a terminal member into a through-hole on a board to a pad part. be able to. As a result, it is possible to suppress the increase in the number of processes due to the use of paste-like solder material, effectively suppressing the complexity of the manufacturing process and manufacturing equipment, while press-fitting the terminal member into the through-hole of the board. It is possible to effectively prevent foreign matter generated during this process from adhering to other conductor parts.

FIG. 1 is a perspective view showing the overall configuration of an electrical device provided with a terminal member board connection structure according to the present embodiment. FIG. 2 is a cross-sectional view schematically showing a cross section of the electric device along the YZ plane. FIG. 2 is a perspective view for explaining the configuration of a terminal member and a board, showing a state before the terminal member is connected to the board. FIG. 3 is a cross-sectional view for explaining the connection between the terminal member and the board. FIG. 3 is a diagram for explaining a pad section provided on a substrate. It is a figure showing an example of a plurality of through holes for connecting a plurality of terminal members. FIG. 3 is a flowchart for explaining a method for connecting a terminal member to a substrate. FIG. 6 is a diagram for explaining a state in which a solder material is applied to a pad portion. FIG. 2 is a top view illustrating a substrate coated with solder material. FIG. 3 is a diagram for explaining a state in which electronic components and terminal members are arranged on a board coated with a solder material. FIG. 3 is a diagram for explaining a state in which solder material is hardened by heating and cooling.

Embodiments of the present invention will be described below based on the drawings.

With reference to FIGS. 1 to 6, the configuration of an electrical device 100 provided with a board connection structure for terminal members 20 according to this embodiment will be described.

(Overall configuration of electrical equipment)
As shown in FIG. 1, the electrical device 100 includes a substrate 10, a plurality of terminal members 20, and a housing 30. The electrical device 100 is a component configured as an ECU (Electronic Control Unit). The electrical device 100 is a microcontroller including a CPU (Central Processing Unit) and the like. The electric device 100 is provided in a vehicle (not shown), and controls the operation of each part of the vehicle by inputting and outputting predetermined electrical signals to and from each part of the vehicle. Note that the term "electrical device" refers to a device that includes a board and a terminal, and is electrically connected to a connector of an external device through the terminal that is arranged on the board and is electrically connected to the board.

Here, in each figure, the thickness direction, which is a direction perpendicular to the main surface 10a of the substrate 10, is defined as the Z direction. In the Z direction, the direction in which the rod-shaped (convex) terminal member 20 disposed on the substrate 10 protrudes from the substrate 10 is defined as the Z1 direction, and the direction opposite to the Z1 direction is defined as the Z2 direction. Further, in each figure, two directions perpendicular to each other along the main surface 10a of the substrate 10 are referred to as an X direction and a Y direction.

As shown in FIGS. 1 and 2, in the electrical device 100, a board 10 and a plurality of terminal members 20 are housed inside a housing 30. As shown in FIGS. Each of the plurality of terminal members 20 is electrically connected to a conductive pattern (not shown) provided inside the substrate 10. The plurality of terminal members 20 are electrically connected to unillustrated terminals of the connector 101 in order to input and output electrical signals to the outside of the electrical device 100. That is, the connector 101 is electrically connected to the board 10 via the plurality of terminal members 20. Note that FIGS. 1 and 2 show a state before the connector 101 is connected to the terminal member 20.

The housing 30 is a box-shaped member. Furthermore, the housing 30 has a hole 31 to which the connector 101 is connected. The hole 31 is provided so that the surface of the housing 30 on the Z1 direction side is recessed in the Z2 direction. Further, a plurality of through holes are provided in the bottom surface (Z2 direction side surface) of the hole portion 31 so as to correspond to the plurality of terminal members 20 . By arranging the upper surface side (Z1 direction side) of the housing 30 so as to overlap from the Z1 direction side toward the Z2 direction, the plurality of terminal members 20 can be connected to the plurality of through holes provided on the bottom surface of the hole 31. It protrudes from the hole in the Z1 direction. Therefore, the plurality of terminal members 20 are exposed to the outside of the housing 30 so as to be connectable to the connector 101.

(Configuration of board and terminal members)
As described above, the substrate 10 is formed into a thin plate shape with the thickness direction in the Z direction. Furthermore, a plurality of electronic components 40 including surface mount devices (SMD) such as chip resistors or chip capacitors are mounted on the substrate 10. In the board 10, the conductor pattern provided inside the board 10 and each of the plurality of electronic components 40 mounted on the main surface 10a, which is the surface on the Z1 direction side of the board 10, are soldered to each other, so that electricity is generated. connected.

As shown in FIG. 3, the substrate 10 has a plurality of through holes 11 to which the terminal members 20 are connected. Each of the plurality of terminal members 20 is a press-fit terminal that is connected to the substrate 10 by being press-fitted into the through hole 11 of the substrate 10. Note that FIG. 3 shows a connection between one through hole 11 among the plurality of through holes 11 and one terminal member 20 among the plurality of terminal members 20. Each of the plurality of through holes 11 is a hole that penetrates the substrate 10 from the Z1 direction to the Z2 direction. Further, each of the plurality of through holes 11 has an inner surface conductor portion 12. Inner surface conductor portion 12 is provided on the inner surface of each of the plurality of through holes 11 . Further, the inner surface conductor portion 12 is electrically connected to the conductor pattern on the substrate 10. Further, the inner surface conductor portion 12 is provided in a cylindrical shape along the entire circumference of the inner surface of the through hole 11 from the end on the Z1 direction side to the end on the Z2 direction side of the through hole 11. . The inner surface conductor portion 12 is formed of, for example, copper plating.

As shown in FIGS. 3 and 4, the terminal member 20 is a rod-shaped member that extends along the Z direction, which is the direction in which the through hole 11 passes. Further, the terminal member 20 has a main body portion 21 , a shoulder portion 22 , and a connecting portion 23 .

The main body portion 21 is a rod-shaped portion that is provided on the Z1 direction side and extends along the Z direction. The terminal member 20 is connected to the connector 101 at the main body portion 21 . That is, the rod-shaped main body portion 21 includes a portion exposed to the outside of the housing 30. Further, the end portion of the main body portion 21 on the Z1 direction side is formed in a shape that tapers toward the Z1 direction.

The shoulder portion 22 has a shape that projects in the X1 direction and the X2 direction with respect to the main body portion 21 extending along the Z direction. The size of the shoulder portion 22 from the X1 direction side to the X2 direction side is larger than the width of the through hole 11 in the X direction. The shoulder portion 22 is provided so that the tip of a tool that holds the terminal member 20 comes into contact with the shoulder portion 22 when the terminal member 20 is press-fitted into the through hole 11 . That is, when the terminal member 20 is press-fitted into the through hole 11, the shoulder portion 22 is pressed down from the Z1 direction side toward the Z2 direction side.

The connecting portion 23 is electrically connected by contacting the inner surface conductor portion 12 of the through hole 11 while being elastically deformed. That is, the terminal member 20 is press-fitted into the through hole 11 while the connecting portion 23 is in contact with the inner surface conductor portion 12 . The connecting portion 23 has a hole 23a penetrating in the Y direction. When the terminal member 20 is press-fitted into the through hole 11, the connecting portion 23 is inserted into the through hole while being in contact with the X1 direction side portion and the X2 direction side portion of the inner surface conductor portion 12 while the hole portion 23a is being crushed. 11. Further, the connecting portion 23 is arranged within the through hole 11 in a state where an elastic force is applied to the inner surface conductor portion 12.

As shown in FIG. 5, the terminal member 20 has a connecting portion 23 in a portion 11a on the X1 direction side, which is a part of the peripheral edge of the through hole 11 on the main surface 10a, and a portion 11b on the X2 direction side. They are press-fitted into the through hole 11 while making contact with each other. The portion 11a and the portion 11b are portions of the peripheral edge of the through hole 11 that face each other along the X direction. Note that the portion 11a and the portion 11b are an example of a "predetermined portion" in the claims. That is, the terminal member 20 is press-fitted while the connecting portion 23 is elastically deformed, so that the connecting portion 23 applies a force in the X1 direction to the inner surface conductor portion 12 in the portion 11a, and the connecting portion 23 applies a force in the X1 direction to the inner surface conductor portion 12 in the portion 11b. The portion 23 is inserted into the through hole 11 while applying a force to the inner surface conductor portion 12 in the X2 direction. Further, the surface of the terminal member 20 is formed by tin plating, and the base inside the tin plating is formed of nickel. Further, when the terminal member 20 is press-fitted into the through hole 11, the tin plating on the surface of the terminal member 20 is scraped by the portions 11a and 11b, which are part of the peripheral edge of the through hole 11, so that the conductive Plating debris 60 (see FIG. 10) is generated as foreign matter.

Further, as shown in FIGS. 3 and 5, the substrate 10 includes a land portion 13 and a pad portion 14. Land portion 13 is an annular conductor provided along the periphery of through hole 11 on main surface 10 a of substrate 10 . The pad portion 14 is provided on the X1 direction side and the X2 direction side of the peripheral edge of the through hole 11. Pad portion 14 is a flat conductor provided along main surface 10 a of substrate 10 . Land portion 13 is electrically connected to inner surface conductor portion 12 of through hole 11 . Further, the pad portion 14 is electrically connected to the land portion 13 and the inner surface conductor portion 12. Specifically, pad portion 14 is integrally formed with land portion 13 and inner surface conductor portion 12 . For example, the land portion 13 and the pad portion 14 are formed integrally with the inner surface conductor portion 12 by copper plating.

Specifically, pad portion 14 is a conductor that extends along main surface 10a so as to protrude outward from the outer periphery of land portion 13. Further, the pad portion 14 is a conductor that extends along the main surface 10a from a portion of the peripheral edge of the through hole 11 on the main surface 10a that is contacted by the connecting portion 23 when the terminal member 20 is press-fitted. That is, pad portion 14 is provided to extend along main surface 10a from portions 11a and 11b that are part of the peripheral edge of through hole 11. Note that the pad portion 14 is not provided near the portion of the peripheral edge of the through hole 11 that is not contacted by the connecting portion 23 when the terminal member 20 is press-fitted. That is, the pad portion 14 is not provided on the Y1 direction side and the Y2 direction side with respect to the through hole 11, but is provided on the X1 direction side and the X2 direction side. Therefore, the width W1 of the conductor from the portions (portions 11a and 11b) that the connecting portion 23 contacts during press-fitting is compared to the width W2 of the conductor from the portions that do not contact (portions other than the portions 11a and 11b). It's big. That is, the width of the conductor extending along main surface 10a from the peripheral edge of through hole 11 including land portion 13 and pad portion 14 is not constant. The pad portion 14 has a size that allows plating waste 60 (see FIG. 10) generated when the terminal member 20 is press-fitted to be bonded thereto. The pad portion 14 is, for example, a rectangular flat conductor. The pad portion 14 is arranged outside the land portion 13 in the X direction. Further, the width W3 of the pad portion 14 in the Y direction is larger than the width W4 of the land portion 13 in the Y direction. Further, the land portion 13 and the pad portion 14 that are integrally formed have a shape such that a portion of the annular shape of the land portion 13 and a portion of the rectangular shape of the pad portion 14 overlap.

Further, as shown in FIGS. 4 and 5, a solder material 50 (an example of a conductive bonding material) is disposed on the pad portion 14. Specifically, the solder material 50 is placed on a portion of the pad portion 14 and the land portion 13 . For example, the solder material 50 is placed in the shaded area in FIG. The solder material 50 is a paste-like solder material 50 applied to a portion of the pad portion 14 and the land portion 13, which is heated and melted, and then cooled and hardened. The solder material 50 is bonded to the pad portion 14 and a portion of the land portion 13 by being melted and hardened. Plating waste 60 (see FIG. 10), which is a conductive foreign substance generated when the terminal member 20 is press-fitted into the through hole 11, is sealed and bonded with the solder material 50. Further, the solder material 50 is also bonded to a portion of the terminal member 20 (a portion of the connecting portion 23). Further, the solder material 50 is also bonded to the end portion of the terminal member 20 on the Z2 direction side.

As shown in FIG. 6, in the substrate 10, the plurality of through holes 11 are arranged in a grid pattern. At this time, in each of the plurality of through holes 11, the pad portion 14 is arranged along the X direction common to each of the plurality of through holes 11. Further, in each of the plurality of through holes 11, pad portions 14 are not provided on the Y1 direction side and the Y2 direction side. Therefore, in consideration of the insulation distance without the pad portion 14, the distance D1 between the centers of through holes 11 adjacent to each other in the Y direction is smaller than the distance D2 between the centers of through holes 11 adjacent to each other in the X direction. In addition, in each of the plurality of through holes 11, the directions of the connecting portions 23 of the terminal members 20 that are press-fitted are also the same direction. That is, the connecting portions 23 of each of the plurality of terminal members 20 come into contact with the peripheral edge of the through hole 11 on the X1 direction side and the X2 direction side that face each other when each of the plurality of terminal members 20 is press-fitted.

(Method for connecting terminal member to board according to this embodiment)
Next, a method for connecting the terminal member 20 to a substrate according to this embodiment will be described with reference to FIGS. 7 to 11. Note that FIG. 7 shows a flowchart showing a method for connecting the terminal member 20 to a substrate. Further, although FIGS. 8 to 11 illustrate an example in which one terminal member 20 and one electronic component 40 are connected to the board 10, the electrical device 100 includes a plurality of terminal members 20 and a plurality of electronic components. 40 are provided. The plurality of terminal members 20 and the plurality of electronic components 40 are collectively connected to the substrate 10 through a common process using the terminal member 20 substrate connection method according to the present embodiment.

First, as shown in FIGS. 8 and 9, in step S1, a paste-like solder material 50 (an example of a conductive bonding material) is placed on the pad portion 14 of the substrate 10. As shown in FIGS. The paste-like solder material 50 is, for example, cream solder (solder paste) containing solder powder and flux. Specifically, a paste-like solder material 50 is applied to a portion of the land portion 13 and the pad portion 14 by solder printing. At this time, the solder material 50 is also applied to the pad portion 15 on which the electronic component 40 is placed. That is, in solder printing, by using a metal mask that has openings in both a portion corresponding to a part of the land portion 13 and the pad portion 14, and a portion corresponding to the pad portion 15 where the electronic component 40 is arranged. A paste-like solder material 50 is placed on a portion of the land portion 13, the pad portion 14, and the pad portion 15 at the same timing.

Note that, as shown in FIG. 9, the solder material 50 applied to a portion of the land portion 13 and the pad portion 14 is arranged in a rectangular shape along the main surface 10a of the substrate 10. The size of the solder material 50 along the main surface 10a (XY plane) is approximately the same size as the pad portion 14. Note that the pad section 15 is a rectangular flat plate provided along the main surface 10a of the substrate 10 in order to electrically connect the electronic component 40 mounted on the substrate 10 and the conductor pattern of the substrate 10. It is a conductor.

Next, as shown in FIG. 10, the terminal member 20 is placed on the substrate 10 in step S2. Specifically, the terminal member 20 is press-fitted into the through hole 11 of the board 10. Note that when the terminal member 20 is press-fitted, the connecting portion 23 of the terminal member 20 comes into contact with the inner surface conductor portion 12 while being elastically deformed, so that plating waste 60 is generated. That is, the tin plating on the surface of the connecting portion 23 of the terminal member 20 is scraped off by coming into contact with the peripheral edge of the through hole 11 . The scraped tin plating on the terminal member 20 becomes plating waste 60, which is a conductive foreign substance. The plating debris 60 is then attracted to the paste-like solder material 50 applied to the pad portion 14 . Moreover, the paste-like solder material 50 applied to a part of the land portion 13 and the pad portion 14 also adheres to the end portion of the terminal member 20 in the Z2 direction during press-fitting. Note that the land portion 13 or the inner surface conductor portion 12 may be shaved off when the terminal member 20 is press-fitted. Therefore, the solder material 50 applied to the pad portion 14 may attract the plating waste 60 including the copper plating forming the land portion 13 or the inner surface conductor portion 12.

Next, in step S3, the electronic component 40 is placed on the board 10. Specifically, electronic component 40 is placed on pad portion 15 of substrate 10 . That is, each of the plurality of electronic components 40 is arranged at a predetermined position on the substrate 10 such that the terminal of each of the plurality of electronic components 40 is connected to each of the plurality of pad sections 15 provided on the substrate 10. .

Next, as shown in FIG. 11, in step S4, the paste-like solder material 50 is heated and melted in a reflow oven, and is also cooled and hardened. That is, the substrate 10 on which the terminal member 20 and the electronic component 40 are arranged is heated in a reflow oven of a reflow apparatus (not shown). By heating the substrate 10, the paste-like solder material 50 is melted. At this time, the plating scraps 60 generated in step S2 are melted similarly to the solder material 50. Alternatively, the plating scraps 60 are encapsulated in the molten solder material 50. As the substrate 10 is cooled, the solder material 50 is also cooled and hardened. Thereby, the plating scraps 60 are in a state of being joined to the solder material 50. Further, the paste-like solder material 50 applied to the pad portion 15 is also melted and hardened in the same process. Therefore, the electronic component 40 is soldered to the pad portion 15 in the same process as the process in which the plating scrap 60 is bonded. That is, in step S4, the plating waste 60, which is a conductive foreign substance generated when the terminal member 20 is press-fitted into the through hole 11, is bonded with the solder material 50, and the electronic component 40 is mounted on the board 10. .

Note that the solder material 50 that was placed on a portion of the pad portion 14 and the land portion 13 is placed on the lower side (Z2 direction side) of the shoulder portion 22 of the terminal member 20, and on a portion of the land portion 13 and the pad portion 14. The bonded state is cooled and hardened. Further, a part of the solder material 50 enters the inside of the through hole 11, and is cooled and hardened in a state where the terminal member 20 and the inner surface conductor portion 12 are joined. Therefore, the hardened solder material 50 increases the connection strength of the terminal member 20 to the through hole 11. In addition, in step S2, the solder material 50 attached to the end of the terminal member 20 on the Z2 direction side is melted and hardened, thereby spreading over the surface of the terminal member 20 on the Z2 direction side. Therefore, the surface of the terminal member 20 on the Z2 direction side has a rounded shape due to the solder material 50.

Note that either the press-fitting of the terminal member 20 in step S2 or the arrangement of the electronic component 40 in step S3 may be performed first. Note that if step S3 is performed before step S2, the electronic component 40 that is not fixed to the board 10 may move (fall off) when the terminal member 20 is press-fitted. It is preferable to perform step S2 before step S3.

(Effects of this embodiment)
The board connection structure of the terminal member 20 of this embodiment can provide the following effects.

In this embodiment, as described above, the substrate 10 extends along the main surface 10a from the portion of the peripheral edge of the through hole 11 on the main surface 10a where the connecting portion 23 comes into contact when the terminal member 20 is press-fitted. The solder material 50 (conductive bonding material) is disposed in the pad portion 14, which is a conductor extending from the pad portion 14 to the pad portion 14. As a result, at the timing when the electronic component 40 mounted on the board 10 is connected to the conductor pattern of the board 10 using the solder material 50, the terminal member 20 is connected to the board 10 by the solder material 50 disposed on the pad portion 14. Conductive foreign matter (plating waste 60) generated when press-fitting into the through hole 11 can be bonded. Therefore, during the step of bonding the electronic component 40 to the substrate 10 (step S4), conductive foreign matter can also be bonded, so that it is possible to prevent the conductive foreign matter from adhering to other conductor parts. It is possible to suppress the need for additional steps such as filling the plastic with synthetic resin. As a result, while suppressing the complexity of the manufacturing process and manufacturing equipment, it is possible to prevent foreign matter generated when the terminal member 20 is press-fitted into the through hole 11 of the substrate 10 from adhering to other conductor parts.

Further, when the terminal member 20 is press-fitted into the through hole 11, the surface of the terminal member 20 may be scraped by the conductor forming the annular land portion 13 provided along the periphery of the through hole 11. In that case, it is conceivable that the terminal member 20 scraped by the conductor forming the land portion 13 may adhere to other conductor portions as conductive foreign matter. In consideration of this point, in the present embodiment, as described above, the pad portion 14 is formed integrally with the land portion 13 and is attached to the main surface 10a so as to protrude outward from the outer periphery of the land portion 13. A solder material 50 (conductive bonding material), which is a conductor extending along the pad portion 14 and the land portion 13, is disposed on the pad portion 14 and the land portion 13. As a result, the terminal member 20 that has been shaved by the conductor forming the land portion 13 can be joined to the pad portion 14 and the solder material 50 disposed on the land portion 13. The attached terminal member 20 can be prevented from adhering to other conductor parts as a conductive foreign substance. Therefore, when the land portion 13 is provided at the periphery of the through hole 11, foreign particles generated when the terminal member 20 is press-fitted into the through hole 11 of the substrate 10 can be prevented while suppressing the complication of the manufacturing process and manufacturing equipment. It is possible to effectively suppress adhesion of other conductor parts to other conductor parts.

Note that when the land portion 13 is formed by copper plating and tin plating is formed on the surface of the terminal member 20 as in the above embodiment, the relatively soft tin plating is scraped by the copper. Therefore, by providing the pad part 14 so as to protrude from the outer periphery of the land part 13 and by arranging the solder material 50 on the land part 13 and the pad part 14, the scraped tin plating of the terminal member 20 can be exposed to conductive foreign matter. As a result, adhesion to other conductor parts can be effectively suppressed. Further, the copper plating forming the land portion 13 may be scraped off by the nickel base of the terminal member 20 . In that case as well, by providing the pad portion 14 so as to protrude from the outer periphery of the land portion 13 and arranging the solder material 50 on the land portion 13 and the pad portion 14, the scraped copper plating on the land portion 13 can be made conductive. It is possible to effectively prevent the conductor from adhering to other conductor parts as a foreign substance.

Further, in the present embodiment, as described above, the terminal member 20 is press-fitted while the connecting portion 23 is in contact with the predetermined portion (the portion 11a and the portion 11b) that is a part of the peripheral edge of the through hole 11, Pad portion 14 is provided to extend along main surface 10a from a predetermined portion of the peripheral edge of through hole 11 on main surface 10a. Here, in the case where other conductor parts or electronic components 40 are arranged on the main surface 10a of the substrate 10 near the through hole 11 into which the terminal member 20 is press-fitted, the pad part 14 and the inner surface conductor part 12 are arranged. It is necessary to arrange other conductor portions or electronic components 40 in consideration of the insulation distance from the active part of the through hole 11 included therein. On the other hand, in this embodiment, the pad portion 14 is provided so as to extend along the main surface 10a from a predetermined portion that is a part of the peripheral edge of the through hole 11 on the main surface 10a. The pad portion 14 may not be provided in a portion other than a predetermined portion of the peripheral portion. As a result, other conductor parts or electronic components 40 can be placed closer to through-holes 11 in areas other than the predetermined part of the peripheral edge where pad parts 14 are not provided. Therefore, the mounting area of the substrate 10 can be reduced compared to the case where the pad portion 14 is provided over the entire circumference of the through hole 11. As a result, while suppressing the complexity of the manufacturing process and manufacturing equipment, the substrate 10 is It is possible to suppress the mounting area from increasing.

(Effects of terminal member board connection method)
The method for connecting the terminal member 20 to a substrate according to this embodiment can provide the following effects.

In the method for connecting the terminal member 20 to a substrate according to the present embodiment, as described above, the portion of the peripheral edge of the through hole 11 on the main surface 10a of the substrate 10 that is in contact with the connecting portion 23 when the terminal member 20 is press-fitted. The method includes a step of disposing a solder material 50 (conductive bonding material) on the pad portion 14, which is a conductor, extending from the main surface 10a along the main surface 10a. As a result, at the timing when the electronic component 40 mounted on the board 10 is connected to the conductor pattern of the board 10 using the solder material 50, the terminal member 20 is connected to the board 10 by the solder material 50 disposed on the pad portion 14. Conductive foreign matter (plating waste 60) generated when press-fitting into the through hole 11 can be bonded. Therefore, during the step of bonding the electronic component 40 to the substrate 10 (step S4), conductive foreign matter can also be bonded, so that it is possible to prevent the conductive foreign matter from adhering to other conductor parts. It is possible to suppress the need for additional steps such as filling the plastic with synthetic resin. As a result, the terminal member 20 is capable of suppressing the adhesion of foreign matter generated when the terminal member 20 is press-fitted into the through hole 11 of the substrate 10 from adhering to other conductor parts while suppressing the complexity of the manufacturing process and manufacturing equipment. A substrate connection method can be provided.

In addition, in the board connection method of this embodiment, as described above, the paste-like solder material 50 applied to the pad portion 14 causes conductive foreign matter (plating debris 60) that is generated when the terminal member 20 is press-fitted. The paste-like solder material 50 applied to the pad portion 14 is heated and melted, and is also cooled and hardened, thereby removing the adsorbed conductive foreign matter (plating scraps 60). can be melted and joined together with the solder material 50. Furthermore, in the case where a paste-like solder material 50 is used to mount the electronic component 40 on the board 10, in the process of applying the solder material 50 to the pad portion 14, the electronic component 40 on the board 10 is attached to the pad portion 14. Paste-like solder material 50 can be applied all at once to the mounting position (pad portion 15). Then, in a step (step S4) in which the paste-like solder material 50 is heated and melted in a reflow oven and is cooled and hardened, the conductor pattern of the substrate 10 and the electronic component 40 are electrically connected. The paste-like solder material 50 applied to the mounting position (pad portion 15) of the electronic component 40 and the solder material 50 applied to the pad portion 14 can be simultaneously melted and hardened in a reflow oven. Therefore, it is necessary to mount the electronic component 40 on the board 10 using the paste-like solder material 50 and to bond conductive foreign matter generated when the terminal member 20 is press-fitted into the through hole 11 of the board 10 to the pad portion 14. can be performed by a common process using a reflow oven. As a result, it is possible to suppress the increase in the number of processes due to the use of the paste-like solder material 50, so that the terminal member 20 can be inserted through the board 10 while effectively suppressing the complexity of the manufacturing process and manufacturing equipment. It is possible to provide a method for connecting the terminal member 20 to a substrate, which can effectively prevent foreign matter generated when press-fitting into the hole 11 from adhering to other conductor parts.

[Modified example]
The above-described embodiments disclosed this time should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is indicated by the claims rather than the description of the above embodiments, and further includes all changes (modifications) within the meaning and scope equivalent to the claims.

For example, in the above embodiment, an example was shown in which the land portion 13, which is an annular conductor, is provided along the peripheral edge of the through hole 11, but the present invention is not limited to this. In the present invention, it is not necessary for the substrate to have a land portion at the peripheral edge of the through hole. That is, only the pad portion may be provided at the periphery of the through hole.

Further, in the above embodiment, an example is shown in which the pad portion 14 is provided along the main surface 10a from each of the two opposing portions 11a and 11b of the peripheral edge of the through hole 11. However, the present invention is not limited to this. In the present invention, when the terminal member is press-fitted, if the connecting portion abuts at three or more places on the peripheral edge of the through hole, the pad portion is attached at three locations corresponding to the portions where the connecting portion abuts. It is also possible to provide more than one location.

Further, in the above embodiment, an example was shown in which the board 10 and the terminal member 20 are provided in the electrical device 100 mounted on a vehicle, but the present invention is not limited to this. In the present invention, the board and the terminal member constituting the terminal member board connection structure may be provided in a stationary electric device.

Further, in the above embodiment, an example is shown in which the solder material 50 is used as the conductive bonding material disposed on the pad portion 14, but the present invention is not limited to this. In the present invention, a conductive adhesive, which is a mixture of an adhesive and conductive particles, may be disposed on the pad portion as the conductive bonding material.

Further, in the above embodiment, an example is shown in which the shape of the pad portion 14 is rectangular (rectangular), but the present invention is not limited to this. In the present invention, the shape of the pad portion may be a shape other than a rectangle such as a circle, a semicircle, or a trapezoid. Further, when the pad portion is rectangular, the width in the direction perpendicular to the direction in which the pad portion protrudes may be smaller than the width of the land portion.

Further, in the above embodiment, an example was shown in which the plating waste 60 of the terminal member 20 is bonded as a conductive foreign substance by the solder material 50 (conductive bonding material) disposed on the pad portion 14. Not limited to. In the present invention, foreign matter adhering to the terminal member, the inner surface conductor portion of the through hole, or the land portion may be bonded using a conductive bonding material disposed on the pad portion.

10 Substrate 10a Main surface 11 Through hole 11a First portion (predetermined portion)
11b Second part (predetermined part)
12 Inner surface conductor portion 13 Land portion 14 Pad portion 20 Terminal member 23 Connection portion 50 Solder material (conductive bonding material)

Claims (5)

a substrate including a hole-shaped through hole having an inner surface conductor portion provided on the inner surface;
a terminal member having a connecting portion that is press-fitted into the through hole of the substrate and electrically connected by abutting against the inner surface conductor portion of the through hole while being elastically deformed;
The substrate has a pad portion that is a conductor that extends along the main surface from a portion of the peripheral edge of the through hole on the main surface that the connection portion comes into contact with when the terminal member is press-fitted,
A board connection structure for a terminal member, wherein a conductive bonding material is disposed in the pad portion. The substrate includes a land portion that is an annular conductor provided along the peripheral edge of the through hole on the main surface of the substrate,
The pad portion is a conductor that is integrally formed with the land portion and extends along the main surface so as to protrude outward from the outer peripheral portion of the land portion,
2. The terminal member substrate connection structure according to claim 1, wherein the conductive bonding material is disposed on the pad portion and the land portion. The terminal member is press-fitted while the connecting portion is in contact with a predetermined portion that is a part of the peripheral edge of the through hole;
3. The terminal member substrate according to claim 1, wherein the pad portion is provided to extend along the main surface from the predetermined portion of the peripheral edge of the through hole on the main surface. connection structure. It has an inner surface conductor portion provided on the inner surface, and is electrically connected to a hole-shaped through hole provided in the substrate by contacting the inner surface conductor portion of the through hole while being elastically deformed. a step in which a terminal member having a connecting portion is press-fitted;
A conductive bonding material is provided in a pad portion, which is a conductor, extending along the main surface from a portion of the peripheral edge of the through-hole on the main surface of the substrate that is in contact with the connection portion when the terminal member is press-fitted. A method for connecting a terminal member to a substrate, comprising: arranging a terminal member. The step of disposing the conductive bonding material includes a step of applying the conductive bonding material containing a paste-like solder material to the pad portion before the step of press-fitting the terminal member,
5. The terminal member substrate according to claim 4, further comprising a step of heating and melting the paste-like solder material in a reflow oven and cooling and hardening the paste-like solder material after the step of press-fitting the terminal member. Connection method.

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