JPH06136092A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPH06136092A
JPH06136092A JP4312835A JP31283592A JPH06136092A JP H06136092 A JPH06136092 A JP H06136092A JP 4312835 A JP4312835 A JP 4312835A JP 31283592 A JP31283592 A JP 31283592A JP H06136092 A JPH06136092 A JP H06136092A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
curing agent
hbe
dme
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4312835A
Other languages
Japanese (ja)
Other versions
JP3339083B2 (en
Inventor
Masahiko Yamanaka
正彦 山中
Hideo Fukuda
英男 福田
Shoji Tani
昭二 谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Japan Chemical Co Ltd
Original Assignee
New Japan Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to JP31283592A priority Critical patent/JP3339083B2/en
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  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE:To provide an epoxy resin composition containing two kinds of diglycidyl ether compounds having specific structures as an epoxy resin, highly improved in weather resistance, and suitable for outdoor coatings, LED-sealing resins loaded on automobiles, etc. CONSTITUTION:The epoxy resin composition contains (A) an epoxy resin comprising the mixture of 1,4-cyclohexanedimethanol diglycidyl ether (DME) and hydrogenated bisphenol A diglycidyl ether (HBE). The DME and HBE in the component A is preferably mixed in a DME/HBE weight ratio of 30/70 to 60/40. The component B is preferably an aliphatic polyamine curing agent such as ethylene diamine when the ordinary temperature curing reactivity is required for outside coatings, and is also preferably an acid anhydride curing agent such as phthalic acid anhydride when used for sealing light emitting diodes, etc.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、エポキシ樹脂組成物に
関し、詳しくは耐候性に優れたエポキシ樹脂組成物に関
する。
TECHNICAL FIELD The present invention relates to an epoxy resin composition, and more particularly to an epoxy resin composition having excellent weather resistance.

【0002】[0002]

【従来の技術】一般に、エポキシ樹脂組成物は、機械
的、電気的特性に優れ、接着性、耐溶剤性、耐水性、耐
熱性等が良好であることが知られており、電気・電子部
品の絶縁材料、接着剤、塗料、土木建築用に広く用いら
れている。かかる組成物の主剤であるエポキシ樹脂とし
ては、ビスフェノールAのジグリシジルエーテル(以下
「DGEBA」と略記する。)が汎用されてきた。
2. Description of the Related Art Epoxy resin compositions are generally known to have excellent mechanical and electrical properties, as well as good adhesiveness, solvent resistance, water resistance, heat resistance, etc. Widely used in insulation materials, adhesives, paints, civil engineering and construction. Diglycidyl ether of bisphenol A (hereinafter abbreviated as "DGEBA") has been widely used as an epoxy resin which is a main component of such a composition.

【0003】近年、エポキシ樹脂組成物で封止された発
光ダイオードが自動車搭載用や屋外表示用として使用さ
れ、一方、塗料分野では、屋外貯蔵タンクやパイプ類の
防蝕用としてエポキシ樹脂組成物が使用される方向にあ
る。
In recent years, light emitting diodes encapsulated with an epoxy resin composition have been used for automobiles and for outdoor displays, while in the paint field, epoxy resin compositions have been used for corrosion protection of outdoor storage tanks and pipes. There is a direction to be.

【0004】DGEBAは、エポキシ樹脂特有の優れた
物性を具備しているものの、耐候性において、改善の余
地がある。かかる欠点を解消する目的で、紫外線吸収剤
や光安定剤等の添加や水素化ビスフェノールAジグリシ
ジルエーテル、脂環式エポキシ樹脂への代替が行われて
いる。
Although DGEBA has excellent physical properties peculiar to epoxy resins, there is room for improvement in weather resistance. For the purpose of eliminating such drawbacks, addition of an ultraviolet absorber, a light stabilizer, or the like, or replacement with hydrogenated bisphenol A diglycidyl ether or an alicyclic epoxy resin has been carried out.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、紫外線
吸収剤や光安定剤等を添加した汎用DGEBA配合系の
硬化物を屋外に放置した場合には、短期的には変色や光
沢の低下が抑制されるものの、長期の曝露によって、分
解、揮散、降雨による溶出等によりその効力を失うこと
となり、著しい黄変色やチョーキングによる光沢の低下
を起こす。
However, when a general-purpose DGEBA-containing cured product containing an ultraviolet absorber, a light stabilizer, etc. is left outdoors, discoloration and deterioration of gloss are suppressed in the short term. However, due to long-term exposure, it loses its efficacy due to decomposition, volatilization, elution due to rainfall, etc., causing remarkable yellowing and a decrease in gloss due to chalking.

【0006】一方、水素化ビスフェノールAジグリシジ
ルエーテルを使用した場合にあっては、紫外線による黄
変色は殆ど起こさないが、長期の屋外曝露では、徐々に
光沢の低下を起こす。
On the other hand, when hydrogenated bisphenol A diglycidyl ether is used, yellowing due to ultraviolet rays hardly occurs, but the gloss gradually decreases with long-term outdoor exposure.

【0007】又、脂環式エポキシ樹脂を使用した場合に
あっては、硬化物の耐クラック性が著しく劣るととも
に、樹脂中に残存するシクロヘキセン骨格により、紫外
線による黄変色を起こす。このため、エポキシ樹脂組成
物の硬化物性を低下させることなく耐候性を改良する処
方の開発が強く望まれていた。
When an alicyclic epoxy resin is used, the cured product is significantly inferior in crack resistance and the cyclohexene skeleton remaining in the resin causes yellowing due to ultraviolet rays. Therefore, it has been strongly desired to develop a formulation that improves the weather resistance without deteriorating the cured physical properties of the epoxy resin composition.

【0008】本発明の目的は、耐候性が改良され、特に
屋外用塗料や屋外・自動車搭載用のLED封止樹脂等に
適した新規有用なエポキシ樹脂組成物を提供するにあ
る。
An object of the present invention is to provide a novel and useful epoxy resin composition having improved weather resistance, which is particularly suitable for outdoor coatings and LED sealing resins for outdoor and automobile mounting.

【0009】[0009]

【課題を解決するための手段】本発明者らは、かかる欠
点を解決すべく鋭意検討の結果、エポキシ樹脂として特
定の構造を有する2種類のジグリシジルエーテルを選択
併用することにより、硬化物の耐候性が著しく向上する
ことを見い出し、かかる知見に基づいて本発明を完成す
るに至った。
Means for Solving the Problems As a result of intensive studies to solve such a drawback, the present inventors have found that a cured product can be obtained by selectively using two kinds of diglycidyl ethers having a specific structure as an epoxy resin. It has been found that the weather resistance is remarkably improved, and the present invention has been completed based on such findings.

【0010】即ち、本発明に係るエポキシ樹脂組成物
は、エポキシ樹脂及び硬化剤を含む常温で液状の組成物
において、エポキシ樹脂が1,4−シクロヘキサンジメ
タノールジグリシジルエーテル(以下「DME」と略記
する。)と水素化ビスフェノールAジグリシジルエーテ
ル(以下「HBE」と略記する。)の混合物であること
を特徴とする。
That is, the epoxy resin composition according to the present invention is a composition which contains an epoxy resin and a curing agent and is liquid at room temperature, wherein the epoxy resin is 1,4-cyclohexanedimethanol diglycidyl ether (hereinafter abbreviated as "DME"). And hydrogenated bisphenol A diglycidyl ether (hereinafter abbreviated as “HBE”).

【0011】かかるエポキシ樹脂成分の配合割合は、本
発明の所定の効果が得られる限り特に限定されるもので
はないが、通常、DME/HBE(重量比)=20/8
0〜80/20、好ましくは30/70〜60/40で
ある。
The mixing ratio of the epoxy resin component is not particularly limited as long as the predetermined effects of the present invention can be obtained, but usually DME / HBE (weight ratio) = 20/8.
It is 0 to 80/20, preferably 30/70 to 60/40.

【0012】DMEを使用しない場合には、長期の屋外
曝露により硬化物表面の光沢の低下を起こし、一方、H
BEを使用しない場合には、硬化物の耐熱性、機械的特
性、耐湿性等が不十分となり実用に難があるばかりでな
く、長期の屋外曝露により著しいチョーキングを引き起
こす。
When DME is not used, the gloss of the surface of the cured product is deteriorated by long-term outdoor exposure, while H
When BE is not used, the cured product has insufficient heat resistance, mechanical properties, moisture resistance and the like, which is not practical and causes remarkable chalking due to long-term outdoor exposure.

【0013】更に、本発明にかかるエポキシ樹脂組成物
には、脂環式エポキシ樹脂、グリシジルエステル型エポ
キシ樹脂、長鎖ポリオールのグリシジルエーテル型エポ
キシ樹脂、ビスフェノールA、ビスフェノールF等の二
価フェノールとエピクロルヒドリンより得られるビスフ
ェノール型エポキシ樹脂、ノボラック型エポキシ樹脂、
ポリオレフィン型エポキシ樹脂等の樹脂成分、比較的低
粘度のモノエポキサイドやポリエポキサイド等の反応性
希釈剤等のエポキシ化合物を本発明の所定の効果に悪影
響を及ぼさない範囲内で適宜配合することができる。
Further, the epoxy resin composition according to the present invention includes alicyclic epoxy resin, glycidyl ester type epoxy resin, glycidyl ether type epoxy resin of long-chain polyol, dihydric phenol such as bisphenol A and bisphenol F, and epichlorohydrin. Bisphenol type epoxy resin, novolac type epoxy resin,
A resin component such as a polyolefin-type epoxy resin and an epoxy compound such as a relatively low-viscosity reactive diluent such as monoepoxide or polyepoxide can be appropriately blended within a range that does not adversely affect the predetermined effects of the present invention. .

【0014】本発明に係る硬化剤としては、主としてポ
リアミン又は酸無水物が使用されるが、これまでに知ら
れている化合物(例えば、垣内弘編著、「新エポキシ樹
脂」第164頁、(株)昭晃堂、昭和60年)の内、常
温で液状のエポキシ樹脂組成物を構成し得るものである
限り特に限定されるものではない。
As the curing agent according to the present invention, a polyamine or an acid anhydride is mainly used, and a compound known so far (for example, Hiroshi Kakiuchi, "New Epoxy Resin", page 164, (stock) ) Shokoido, 1985) is not particularly limited as long as it can form an epoxy resin composition which is liquid at room temperature.

【0015】かかる硬化剤は、用途に応じて適宜選択さ
れ、例えば、屋外塗料用として、特に常温硬化反応性を
必要とする場合には脂肪族ポリアミン系硬化剤が好適で
あり、一方、発光ダイオードの封止等、加熱硬化が可能
で、より高度な耐熱性や機械的、電気的、光学的特性が
要求されるような場合には酸無水物系硬化剤が使用され
る。
Such a curing agent is appropriately selected according to the application. For example, for outdoor coating, an aliphatic polyamine curing agent is suitable especially when room temperature curing reactivity is required, while a light emitting diode is used. An acid anhydride-based curing agent is used when heat curing is possible, such as in sealing, and where higher heat resistance and mechanical, electrical, or optical characteristics are required.

【0016】ポリアミン系硬化剤としては、具体的に
は、エチレンジアミン、テトラメチレンジアミン、ヘキ
サメチレンジアミン、ジエチレントリアミン、イミノビ
スプロピルアミン、ビス(ヘキサメチレン)トリアミ
ン、トリエチレンテトラミン、テトラエチレンペンタミ
ン、ペンタエチレンヘキサミン、1,3,6−トリスア
ミノメチルヘキサン、N−ベンジルエチレンジアミン、
トリメチルヘキサメチレンジアミン、ジメチルアミノプ
ロピルアミン、ジエチルアミノプロピルアミン、アミノ
エチルエタノールアミン、ジエチレングリコール・ビス
プロピレンジアミン、メンセンジアミン、イソフォロン
ジアミン、
Specific examples of the polyamine-based curing agent include ethylenediamine, tetramethylenediamine, hexamethylenediamine, diethylenetriamine, iminobispropylamine, bis (hexamethylene) triamine, triethylenetetramine, tetraethylenepentamine and pentaethylene. Hexamine, 1,3,6-trisaminomethylhexane, N-benzylethylenediamine,
Trimethylhexamethylenediamine, dimethylaminopropylamine, diethylaminopropylamine, aminoethylethanolamine, diethylene glycol / bispropylenediamine, menthenediamine, isophoronediamine,

【0017】N−アミノエチルピペラジン、ジアミノジ
シクロヘキシルメタン、ビス(4−アミノ−3−メチル
シクロヘキシル)メタン、1,3−ビス(アミノメチ
ル)シクロヘキサン、3,9−ビス(3−アミノプロピ
ル)−2,4,8,10−テトラオキサスピロ[5,
5]ウンデカン及びそれらの混合物や、カルボン酸類、
エポキシ化合物、メタクリル酸メチル、フェノール・ホ
ルムアルデヒド、アクリロニトリル等による変性物が例
示される。
N-aminoethylpiperazine, diaminodicyclohexylmethane, bis (4-amino-3-methylcyclohexyl) methane, 1,3-bis (aminomethyl) cyclohexane, 3,9-bis (3-aminopropyl) -2 , 4,8,10-Tetraoxaspiro [5,
5] Undecane and mixtures thereof, carboxylic acids,
Examples include modified products of epoxy compounds, methyl methacrylate, phenol / formaldehyde, acrylonitrile and the like.

【0018】ポリアミン系硬化剤の配合量は、所定の効
果が得られる限り特に限定されるものではないが、通
常、エポキシ基に対する硬化剤中の活性水素の当量比が
0.5〜1.2、好ましくは0.7〜1.0程度であ
る。
The blending amount of the polyamine-based curing agent is not particularly limited as long as a predetermined effect is obtained, but usually, the equivalent ratio of active hydrogen in the curing agent to the epoxy group is 0.5 to 1.2. , Preferably about 0.7 to 1.0.

【0019】酸無水物系硬化剤としては、具体的には、
ヘキサヒドロ無水フタル酸、テトラヒドロ無水フタル
酸、無水フタル酸、3−メチルヘキサヒドロ無水フタル
酸、4−メチルヘキサヒドロ無水フタル酸、3−メチル
テトラヒドロ無水フタル酸、4−メチルテトラヒドロ無
水フタル酸、無水メチルナジック酸、ドデセニル無水コ
ハク酸、α−テルピネンやアロオシメン等のデカトリエ
ンと無水マレイン酸とのディールス・アルダー反応物及
びそれらの水素添加物、構造異性体若しくは幾何異性体
をはじめ、それらの混合変性物が例示される。
Specific examples of the acid anhydride-based curing agent include:
Hexahydrophthalic anhydride, tetrahydrophthalic anhydride, phthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, 3-methyltetrahydrophthalic anhydride, 4-methyltetrahydrophthalic anhydride, methylanhydride Nadesic acid, dodecenyl succinic anhydride, Diels-Alder reaction products of decatrienes such as α-terpinene and alloocimene and maleic anhydride, and hydrogenated products thereof, structural isomers or geometric isomers, and their mixed modifications are It is illustrated.

【0020】酸無水物系硬化剤の配合量は、所定の効果
が得られる限り特に限定されないものの、通常、エポキ
シ基に対する酸無水物基の当量比が0.7〜1.2、好
ましくは0.8〜1.1程度である。
The amount of the acid anhydride-based curing agent to be compounded is not particularly limited as long as a predetermined effect can be obtained, but usually, the equivalent ratio of the acid anhydride group to the epoxy group is 0.7 to 1.2, preferably 0. It is about 8 to 1.1.

【0021】本発明に係る硬化剤は、必要により硬化促
進剤を併用することができる。かかる硬化促進剤として
は、従来公知の化合物、例えばベンジルジメチルアミ
ン、トリス(ジメチルアミノメチル)フェノール、ジメ
チルシクロヘキシルアミン等の第三級アミン類;2−エ
チル−4−メチルイミダゾール、2−メチルイミダゾー
ル、1−ベンジル−2−メチルイミダゾール等のイミダ
ゾール類;1,8−ジアザビシクロ(5,4,0)ウン
デセン−7等のジアザビシクロアルケン類及びそれらの
塩類、オクチル酸亜鉛、オクチル酸錫やアルミニウムア
セチルアセトン錯体等の有機金属化合物;
If desired, the curing agent according to the present invention may be used in combination with a curing accelerator. As such a curing accelerator, conventionally known compounds, for example, tertiary amines such as benzyldimethylamine, tris (dimethylaminomethyl) phenol, and dimethylcyclohexylamine; 2-ethyl-4-methylimidazole, 2-methylimidazole, Imidazoles such as 1-benzyl-2-methylimidazole; diazabicycloalkenes such as 1,8-diazabicyclo (5,4,0) undecene-7 and salts thereof, zinc octylate, tin octylate and aluminum acetylacetone. Organometallic compounds such as complexes;

【0022】第四級アンモニウム化合物;トリフェニル
ホスフィン、亜リン酸トリフェニル等の有機リン系化合
物;三フッ化ホウ素、トリフェニルボレート等のホウ素
系化合物;塩化亜鉛、塩化第二錫等の金属ハロゲン化物
等が掲げられる。
Quaternary ammonium compounds; organic phosphorus compounds such as triphenylphosphine and triphenyl phosphite; boron compounds such as boron trifluoride and triphenylborate; metal halogens such as zinc chloride and stannic chloride. Compounds are listed.

【0023】硬化促進剤の配合量は、硬化剤の種類によ
って適宜選択することが可能であり、エポキシ樹脂10
0重量部に対し、通常、0.01〜10重量部程度用い
られる。
The compounding amount of the curing accelerator can be appropriately selected depending on the kind of the curing agent.
Usually, 0.01 to 10 parts by weight is used with respect to 0 parts by weight.

【0024】当該硬化促進剤は、硬化剤組成物の構成成
分として適用することもできるし、エポキシ樹脂組成物
を調製するときに他の添加剤と共に配合することもでき
る。
The curing accelerator can be applied as a constituent of the curing agent composition, or can be blended with other additives when preparing the epoxy resin composition.

【0025】かかる他の添加剤としては、可塑剤、染
料、顔料、離型剤、抗酸化剤、紫外線吸収剤、光安定
剤、難燃剤、充填剤、レベリング剤、消泡剤、たれ止
剤、溶剤等の各種の添加剤や基材が例示され、その適用
量は、本発明の所定の効果に悪影響を及ぼさない限り、
特に限定されるものではない。
Examples of such other additives include plasticizers, dyes, pigments, release agents, antioxidants, ultraviolet absorbers, light stabilizers, flame retardants, fillers, leveling agents, defoaming agents, anti-sag agents. , Various additives such as solvents and base materials are exemplified, and the application amount thereof, unless adversely affecting the predetermined effects of the present invention,
It is not particularly limited.

【0026】かくして得られるエポキシ樹脂組成物は、
ポリアミン系硬化剤を使用する場合には、屋外で使用さ
れる貯蔵タンクやパイプ類の耐候性防触塗料として特に
有用であり、酸無水物系硬化剤を使用する場合には、自
動車搭載用や屋外表示用の発光ダイオード等の耐候性封
止材料として特に有用である。
The epoxy resin composition thus obtained is
When using a polyamine-based curing agent, it is particularly useful as a weather-resistant anticorrosion coating for storage tanks and pipes used outdoors, and when using an acid anhydride-based curing agent, it is suitable for use in automobiles and It is particularly useful as a weather-resistant sealing material for light-emitting diodes for outdoor display.

【0027】[0027]

【実施例】以下に実施例及び比較例を掲げ、本発明を詳
説する。尚、各例において得られるエポキシ樹脂組成物
の特性は、次の方法により測定し評価した。
EXAMPLES The present invention will be described in detail below with reference to Examples and Comparative Examples. The properties of the epoxy resin composition obtained in each example were measured and evaluated by the following methods.

【0028】ガラス転移温度:硬化物から切りだした試
料について、示差走査熱量分析装置((株)島津製作所
製、DSC−30)を用いて測定する。
Glass transition temperature : A sample cut out from a cured product is measured using a differential scanning calorimeter (manufactured by Shimadzu Corporation, DSC-30).

【0029】ロックウェル硬度(Mスケール):JIS K-
6911に準じて測定する。
Rockwell hardness (M scale) : JIS K-
Measure according to 6911.

【0030】シャルピー衝撃強度:JIS K-6911に準じて
測定する。
Charpy impact strength : Measured according to JIS K-6911.

【0031】促進耐候性試験:ウェザオメータ((株)東
洋精機製作所製)を使用し、キセノンバーナ0.39wa
tt/cm2、ブラックパネル温度63℃、湿度60%R.
H.、18分間散水/120分間の条件下に所定時間曝露
した試験片について、以下の評価を行う。
Accelerated weather resistance test : A weatherometer (manufactured by Toyo Seiki Seisakusho Co., Ltd.) was used, and a xenon burner of 0.39 wa was used.
tt / cm 2 , black panel temperature 63 ° C, humidity 60% R.
H., 18 minutes of water spraying / 120 minutes, the following evaluation is performed on the test piece exposed for a predetermined time.

【0032】光沢保持率:鋼板上に作成した厚さ0.7
〜0.8mmの塗膜について、促進耐候性試験後の表面光
沢をグロスメータ((株)村上色彩技術研究所製、GM−
3)により測定し、促進耐候性試験前の表面光沢に対す
る保持率で表す。
Gloss retention : Thickness 0.7 created on steel plate
About 0.8 mm coating film, the surface gloss after accelerated weathering test is measured by gloss meter (GM-Murakami Color Research Laboratory, GM-
It is measured according to 3) and is represented by the retention rate with respect to the surface gloss before the accelerated weather resistance test.

【0033】光線透過率:内面が鏡面仕上げの鉄製鋳型
を用いて硬化した厚さ5mmの板状試験片について、促進
耐候性試験前後の光線(波長400nm)透過率をJIS K-
7105に準じて測定する。
Light transmittance : With respect to a plate-like test piece having a thickness of 5 mm, which was cured by using an iron mold whose inner surface was mirror-finished, the light transmittance (wavelength 400 nm) before and after the accelerated weathering test was measured according to JIS K-
Measure according to 7105.

【0034】実施例1 エポキシ樹脂として、HBE(エポキシ当量215)、
DME(エポキシ当量155)、ポリアミン系硬化剤と
してN−ベンジルエチレンジアミン、その他の添加剤と
してルチル型酸化チタン、CAB551−0.2(EAST
MAN CHEMICAL社製、酪酸酢酸セルロース)、トルエン、
酢酸ブチル、イソプロパノール、KS−603(信越シ
リコーン(株)製、シリコーン系消泡剤)、Seesor
b 100(シプロ化成(株)製、ベンゾフェノン系紫外
線吸収剤)、Sanol LS−770(Ciba-Geigy社
製、ヒンダードアミン系光安定剤)を所定量配合してエ
ポキシ樹脂組成物を調製した。このものを25℃×7日
間の条件で硬化させた塗膜について、促進耐候性試験下
の光沢保持率を測定した。得られた結果を第1表に示
す。
Example 1 As an epoxy resin, HBE (epoxy equivalent 215),
DME (epoxy equivalent 155), N-benzylethylenediamine as a polyamine curing agent, rutile titanium oxide as another additive, CAB551-0.2 (EAST
Manufactured by MAN CHEMICAL, cellulose butyrate acetate), toluene,
Butyl acetate, isopropanol, KS-603 (Shin-Etsu Silicone Co., Ltd., silicone defoamer), Seesor
b100 (manufactured by Cipro Kasei Co., Ltd., benzophenone-based ultraviolet absorber) and Sanol LS-770 (manufactured by Ciba-Geigy, hindered amine-based light stabilizer) were mixed in predetermined amounts to prepare an epoxy resin composition. The gloss retention rate under the accelerated weather resistance test was measured for the coating film obtained by curing this under the condition of 25 ° C. × 7 days. The results obtained are shown in Table 1.

【0035】実施例2 エポキシ樹脂の配合割合を変化させ、紫外線吸収剤や光
安定剤を使用せずに塗膜を作成し、光沢保持率を測定し
た。得られた結果を表1に示す。
Example 2 By changing the compounding ratio of the epoxy resin, a coating film was prepared without using an ultraviolet absorber or a light stabilizer, and the gloss retention rate was measured. The results obtained are shown in Table 1.

【0036】比較例1〜2 実施例1において、DME又はHBEを配合せずに得た
組成物の光沢保持率を測定した。得られた結果を第1表
に示す。
Comparative Examples 1 to 2 In Example 1, the gloss retention of the composition obtained without blending DME or HBE was measured. The results obtained are shown in Table 1.

【0037】比較例3 実施例1において、HBEに替えてDGEBA(エポキ
シ当量188)を使用した場合の光沢保持率を測定した。
得られた結果を第1表に示す。
Comparative Example 3 In Example 1, the gloss retention was measured when DGEBA (epoxy equivalent 188) was used instead of HBE.
The results obtained are shown in Table 1.

【表1】 [Table 1]

【0038】実施例3 エポキシ樹脂としてHBE、DME及びERL−422
1(UCC社製、脂環式エポキシ樹脂、エポキシ当量1
41)、酸無水物系硬化剤としてリカシッドMH(新日
本理化(株)製、4−メチルヘキサヒドロ無水フタル
酸)、硬化促進剤としてUcat SA102(サンア
プロ(株)製、1,8−ジアザビシクロ(5,4,0)ウ
ンデセン−7の2−エチルヘキサン酸塩)を所定量配合
してエポキシ樹脂組成物を調製した。このものを100
℃×3h+130℃×3hの条件で硬化させた硬化物の
ガラス転移温度、ロックウェル硬度、シャルピー衝撃強
度、促進耐候性試験下の光線透過率及び外観を測定し
た。得られた結果を第2表に示す。
Example 3 HBE, DME and ERL-422 as epoxy resins
1 (UCC, alicyclic epoxy resin, epoxy equivalent 1
41), RIKACID MH (produced by Shin Nippon Rika Co., Ltd., 4-methylhexahydrophthalic anhydride) as an acid anhydride curing agent, and Ucat SA102 (produced by San Apro Co., Ltd., 1,8-diazabicyclo ( 5,4,0) Undecene-7 2-ethylhexanoate) was mixed in a predetermined amount to prepare an epoxy resin composition. This one 100
The glass transition temperature, the Rockwell hardness, the Charpy impact strength, the light transmittance and the appearance under the accelerated weather resistance test of the cured product cured under the conditions of ℃ × 3h + 130 ℃ × 3h were measured. The results obtained are shown in Table 2.

【0039】比較例4〜6 実施例3において、DME又はHBEを配合しなかった
場合の硬化物物性を評価した。得られた結果を第2表に
示す。
Comparative Examples 4 to 6 In Example 3, the physical properties of the cured product without DME or HBE were evaluated. The results obtained are shown in Table 2.

【0040】比較例7 実施例3において、HBEに代えてDGEBAを使用し
た場合の硬化物物性を評価した。得られた結果を第2表
に示す。
Comparative Example 7 In Example 3, the physical properties of the cured product were evaluated when DGEBA was used instead of HBE. The results obtained are shown in Table 2.

【表2】 [Table 2]

【0041】[0041]

【発明の効果】本発明に係るエポキシ樹脂組成物は、紫
外線の曝露による硬化物の黄変色やチョーキングによる
表面光沢の低下を抑制し得る結果、硬化物の耐熱性、機
械的特性、耐湿性等の諸特性を損なうことなく、耐候性
の著しい改良を図ることが可能となる。
The epoxy resin composition according to the present invention can suppress the yellowing of the cured product due to exposure to ultraviolet rays and the reduction of the surface gloss due to chalking. As a result, the cured product has heat resistance, mechanical properties, moisture resistance and the like. It is possible to significantly improve the weather resistance without deteriorating the various characteristics.

【手続補正書】[Procedure amendment]

【提出日】平成5年10月7日[Submission date] October 7, 1993

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0008[Correction target item name] 0008

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0008】 本発明の目的は、耐候性が改良され、特
に屋外用塗料や屋外・自動車搭載用のLED封止樹脂等
に適した新規有用なエポキシ樹脂組成物を提供すること
にある。
An object of the present invention, weather resistance is improved, especially <br/> to provide novel useful epoxy resin compositions suitable for LED encapsulation resins for outdoor paints and outdoor, automotive mounted is there.

【手続補正2】[Procedure Amendment 2]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0035[Correction target item name] 0035

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0035】 実施例2 エポキシ樹脂の配合割合を変化させ、紫外線吸収剤や光
安定剤を使用せずに塗膜を作成し、光沢保持率を測定し
た。得られた結果を第1表に示す。
Example 2 A coating film was prepared by changing the compounding ratio of the epoxy resin and using no ultraviolet absorber or light stabilizer, and the gloss retention rate was measured. The results obtained are shown in Table 1 .

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 エポキシ樹脂及び硬化剤を含む常温で液
状のエポキシ樹脂組成物において、エポキシ樹脂が1,
4−シクロヘキサンジメタノールジグリシジルエーテル
と水素化ビスフェノールAジグリシジルエーテルとの混
合物であることを特徴とするエポキシ樹脂組成物。
1. In an epoxy resin composition which is liquid at room temperature and contains an epoxy resin and a curing agent, the epoxy resin is 1,
An epoxy resin composition, which is a mixture of 4-cyclohexanedimethanol diglycidyl ether and hydrogenated bisphenol A diglycidyl ether.
JP31283592A 1992-10-27 1992-10-27 Epoxy resin composition Expired - Fee Related JP3339083B2 (en)

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Application Number Priority Date Filing Date Title
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Country Status (1)

Country Link
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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0812741A (en) * 1994-07-04 1996-01-16 New Japan Chem Co Ltd Liquid epoxy resin composition
JPH11172078A (en) * 1997-12-09 1999-06-29 Terukichi Sakai Weather-resistant epoxy resin composition
JP2000143769A (en) * 1998-11-10 2000-05-26 Nippon Kayaku Co Ltd Liquid epoxy resin, production of liquid epoxy resin, epoxy resin composition and its cured material
WO2000079582A1 (en) * 1999-06-17 2000-12-28 Loctite Corporation Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent
JP2003012896A (en) * 2001-06-29 2003-01-15 Stanley Electric Co Ltd Uv-resistant epoxy resin, and light emitting diode or wavelength conversion element sealed by using the epoxy resin
US7012120B2 (en) 2000-03-31 2006-03-14 Henkel Corporation Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
JP2007277401A (en) * 2006-04-06 2007-10-25 Dainippon Ink & Chem Inc Epoxy resin composition and its cured product
WO2008035514A1 (en) * 2006-09-20 2008-03-27 Maruzen Petrochemical Co., Ltd. Liquid curable composition and cured product thereof
JP2009108301A (en) * 2007-10-09 2009-05-21 Hitachi Chem Co Ltd Epoxy resin composition for sealing and electronic component device
US8053587B2 (en) 2000-03-31 2011-11-08 Henkel Corporation Reworkable thermosetting resin composition
JP2016164234A (en) * 2015-03-06 2016-09-08 東ソー株式会社 Curing agent for epoxy resin
JP2020200359A (en) * 2019-06-06 2020-12-17 三菱瓦斯化学株式会社 Curing agent for epoxy resin, epoxy resin composition and cured product thereof and fiber-reinforced composite material

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110256990B (en) * 2019-07-03 2021-07-06 无锡嘉联电子材料有限公司 High-transparency UV-resistant epoxy resin adhesive and preparation method thereof

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JPS5676448A (en) * 1979-11-29 1981-06-24 Hitachi Chem Co Ltd Epoxy resin composition
JPS56135517A (en) * 1980-02-12 1981-10-23 Gen Electric Coating epoxy composition
JPS58214225A (en) * 1982-06-07 1983-12-13 三菱電機株式会社 Method of producing resin coated electric device
JPH02215824A (en) * 1988-12-29 1990-08-28 Shell Internatl Res Maatschappij Bv Modified epoxy resin
JPH02296820A (en) * 1989-04-17 1990-12-07 Ciba Geigy Ag Curable composition made of alicyclic epoxy resin as base material

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5676448A (en) * 1979-11-29 1981-06-24 Hitachi Chem Co Ltd Epoxy resin composition
JPS56135517A (en) * 1980-02-12 1981-10-23 Gen Electric Coating epoxy composition
JPS58214225A (en) * 1982-06-07 1983-12-13 三菱電機株式会社 Method of producing resin coated electric device
JPH02215824A (en) * 1988-12-29 1990-08-28 Shell Internatl Res Maatschappij Bv Modified epoxy resin
JPH02296820A (en) * 1989-04-17 1990-12-07 Ciba Geigy Ag Curable composition made of alicyclic epoxy resin as base material

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0812741A (en) * 1994-07-04 1996-01-16 New Japan Chem Co Ltd Liquid epoxy resin composition
JPH11172078A (en) * 1997-12-09 1999-06-29 Terukichi Sakai Weather-resistant epoxy resin composition
JP2000143769A (en) * 1998-11-10 2000-05-26 Nippon Kayaku Co Ltd Liquid epoxy resin, production of liquid epoxy resin, epoxy resin composition and its cured material
JP4718070B2 (en) * 1999-06-17 2011-07-06 ヘンケル コーポレイション Underfill sealing and repair method
WO2000079582A1 (en) * 1999-06-17 2000-12-28 Loctite Corporation Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent
EP1194953A4 (en) * 1999-06-17 2002-09-04 Loctite Corp Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent
JP2003502484A (en) * 1999-06-17 2003-01-21 ヘンケル ロックタイト コーポレイション Controllable degradable compositions of heteroatom carbocyclic or epoxy resins and curing agents
US8053587B2 (en) 2000-03-31 2011-11-08 Henkel Corporation Reworkable thermosetting resin composition
US7012120B2 (en) 2000-03-31 2006-03-14 Henkel Corporation Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
JP2003012896A (en) * 2001-06-29 2003-01-15 Stanley Electric Co Ltd Uv-resistant epoxy resin, and light emitting diode or wavelength conversion element sealed by using the epoxy resin
JP2007277401A (en) * 2006-04-06 2007-10-25 Dainippon Ink & Chem Inc Epoxy resin composition and its cured product
WO2008035514A1 (en) * 2006-09-20 2008-03-27 Maruzen Petrochemical Co., Ltd. Liquid curable composition and cured product thereof
JP5642930B2 (en) * 2006-09-20 2014-12-17 丸善石油化学株式会社 Liquid curable composition and cured product thereof
JP2009108301A (en) * 2007-10-09 2009-05-21 Hitachi Chem Co Ltd Epoxy resin composition for sealing and electronic component device
JP2016164234A (en) * 2015-03-06 2016-09-08 東ソー株式会社 Curing agent for epoxy resin
JP2020200359A (en) * 2019-06-06 2020-12-17 三菱瓦斯化学株式会社 Curing agent for epoxy resin, epoxy resin composition and cured product thereof and fiber-reinforced composite material

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