JPH06134802A - Injection molded article - Google Patents

Injection molded article

Info

Publication number
JPH06134802A
JPH06134802A JP31104892A JP31104892A JPH06134802A JP H06134802 A JPH06134802 A JP H06134802A JP 31104892 A JP31104892 A JP 31104892A JP 31104892 A JP31104892 A JP 31104892A JP H06134802 A JPH06134802 A JP H06134802A
Authority
JP
Japan
Prior art keywords
primary
injection
molded product
molding
polyphenylene sulfide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31104892A
Other languages
Japanese (ja)
Inventor
Katsuaki Ouchi
勝明 大内
Toshiaki Ichige
敏明 市毛
Kiyoshi Nihei
潔 仁平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP31104892A priority Critical patent/JPH06134802A/en
Publication of JPH06134802A publication Critical patent/JPH06134802A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a novel injection molded article remarkably improved in resistance to water absorption from a boundary between a primary injection molded item and a secondary injection molded item. CONSTITUTION:In an injection molded article formed by conducting an injection molding twice, i.e., a primary molding and a secondary molding, a polyphenylene sulfide resin (PPS resin) is used as a material to be primarily and secondarily molded. The polyphenylene sulfide resin (PPS resin) is injection molded into a primary molded item around a lead frame 3. An electrical part 4 is connected to the ends of the lead frame 3 of the primary molded items by soldering or spot welding. A range of the connecting part over the primary molded items 8 is covered with the same polyphenylene sulfide resin (PPS resin) as the material of the primary molded item 8 by secondary injection molding.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は成形品、特に、エンジ
ニアリングプラスチックを使用した射出成形品に関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molded article, and more particularly to an injection molded article using an engineering plastic.

【0002】[0002]

【従来の技術】従来の技術を図面を参照して説明する。
図4および図5は、2回射出成形品の一例を示す横断面
図である。即ち、図4はリードフレーム3の周りにビニ
ル,ポリエチレン,ポリカーボネイト(PC),ポリブ
チレンテレフタレート(PBT),ABS樹脂,ポリア
ミド(PA)などの成形材料を1次射出成形を行って形
成した2本の1次成形品のリードフレームのそれぞれの
先端に電気部品4を半田付けまたはスポット溶接して直
線状に接続し、これらの周りに1次成形品に亘り上記1
次成形品と同じ材料で2次射出成形行い2次成形品2を
形成して被覆したものである。そして、1次成形品と2
次成形品との間の接着面(境界)から水または湿気の浸
入を防止するために、ビニル粘着テープの絶縁テープ5
をテープ巻きしてさらに完全な防水構造を構成してい
る。
2. Description of the Related Art A conventional technique will be described with reference to the drawings.
4 and 5 are cross-sectional views showing an example of a two-time injection molded product. That is, FIG. 4 shows two pieces formed around the lead frame 3 by primary injection molding of a molding material such as vinyl, polyethylene, polycarbonate (PC), polybutylene terephthalate (PBT), ABS resin, polyamide (PA). The electrical components 4 are soldered or spot-welded to the respective ends of the lead frame of the primary molded product of No. 1 and connected in a straight line, and the above-mentioned 1
A secondary molded product 2 is formed by performing secondary injection molding with the same material as that of the next molded product and covered. And the primary molded product and 2
Insulation tape 5 of vinyl adhesive tape to prevent water or moisture from entering from the adhesive surface (boundary) between the next molded product
Is wrapped with tape to form a more complete waterproof structure.

【0003】図5は上記図4のものと同様にビニル,ポ
リエチレン,ポリカーボネイト(PC),ポリブチレン
テレフタレート(PBT),ABS樹脂,ポリアミド
(PA)などの成形材料を1次射出成形した1次成形品
のリードフレーム3の先端を相互を半田付けまたはスポ
ット溶接して接続した後に同じ材料の2次成形品2を射
出成形を行い2次成形品2を形成したもので、これら1
次成形品1,2次成形品2の境界面の接着面からの水ま
たは湿気の浸入を防止するために、ビニル塗料,エポキ
シ樹脂などの接着剤7を塗布して形成されたものであ
る。
FIG. 5 is a primary molding in which molding materials such as vinyl, polyethylene, polycarbonate (PC), polybutylene terephthalate (PBT), ABS resin, polyamide (PA), etc. are subjected to primary injection molding like FIG. After the lead frame 3 of the product is connected to each other by soldering or spot welding, the secondary molded product 2 of the same material is injection-molded to form the secondary molded product 2.
It is formed by applying an adhesive agent 7 such as a vinyl paint or an epoxy resin in order to prevent water or moisture from entering from the bonding surface of the boundary surface between the secondary molded product 1 and the secondary molded product 2.

【0004】[0004]

【発明が解決しようとする課題】このように、特に耐吸
水性を必要とする用途のもので、図4および図5に示す
ようにビニルなどの上述した成形材料で射出成形した成
形品では、1次成形品および2次成形品の接着面におい
て十分な粘着を得ることができないので、その境界に絶
縁テープをテープ巻きしたり接着剤を塗布して補強を行
い、吸水,吸湿を防止する必要があった。また、これら
の材料は耐熱性も不十分で製品の信頼性が劣る欠点があ
る。さらに、成形加工を行うので価格も上昇し、人手に
よる加工となるので均一な信頼性が得られないという問
題点もあった。
As described above, in the case of the application requiring particularly the water absorption resistance, as shown in FIG. 4 and FIG. 5, in the molded article injection-molded with the above-mentioned molding material such as vinyl, Since sufficient adhesion cannot be obtained on the bonding surface of the primary molded product and the secondary molded product, it is necessary to wrap the boundary with insulating tape or apply adhesive to reinforce it to prevent water and moisture absorption. was there. In addition, these materials also have a drawback that heat resistance is insufficient and product reliability is poor. Further, since the molding process is performed, the price is increased and the process is performed manually, so that there is a problem that uniform reliability cannot be obtained.

【0005】この発明の目的は、上述した従来技術の欠
点を解消し、1次射出成形品と2次射出成形品の境界か
らの耐吸水性を大幅に改良することができる新規な射出
成形品を提供することにある。
An object of the present invention is to solve the above-mentioned drawbacks of the prior art and to greatly improve the water absorption resistance from the boundary between the primary injection molded product and the secondary injection molded product. To provide.

【0006】[0006]

【課題を解決するための手段】この発明は、1次成形お
よび2次成形の2回の射出成形により形成する射出成形
品において、上記1次成形および2次成形する材料とし
てポリフェニレンサルファイド樹脂(PPS)を使用し
て形成したことを特徴とする射出成形品である。
SUMMARY OF THE INVENTION The present invention provides an injection-molded article formed by two injection molding processes, a primary molding process and a secondary molding process, wherein a polyphenylene sulfide resin (PPS) is used as the material for the primary molding process and the secondary molding process. ) Is used to form an injection-molded article.

【0007】[0007]

【作用】1次成形および2次成形の材料としてポリフェ
ニレンサルファイド樹脂(PPS)を使用したので、1
次成形品,2次成形品相互の密着性が良く接着が強固で
あり、1次成形品および2次成形品の境界からの吸水性
を大幅に改良することができた。
[Function] Since polyphenylene sulfide resin (PPS) is used as a material for the primary molding and the secondary molding,
The secondary molded product and the secondary molded product had good adhesion and strong adhesion, and the water absorption from the boundary between the primary molded product and the secondary molded product could be greatly improved.

【0008】[0008]

【実施例】以下、図面に基づいてこの発明の実施例を説
明する。図1は、一実施例の射出成形品の構成を示す横
断面図である。即ち、リードフレーム3の周りにポリフ
ェニレンサルファイド樹脂(PPS)を使用して1次射
出成形を行い、1次成形品8を形成する。次にこの1次
成形品8のリードフレーム3相互間に電気部品4を半田
またはスポット溶接により直線状に接続する。続いて上
記接続された電気部品4の周りに上記リードフレーム3
に亘る1次成形品8まで被覆するように2次の射出成形
をポリフェニレンサルファイド樹脂(PPS)を使用し
て行い、一体化した2次成形品9を形成する。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing the structure of an injection-molded product according to an embodiment. That is, primary injection molding is performed around the lead frame 3 using polyphenylene sulfide resin (PPS) to form a primary molded product 8. Next, the electrical components 4 are linearly connected between the lead frames 3 of the primary molded product 8 by soldering or spot welding. Then, the lead frame 3 is formed around the connected electrical component 4.
The secondary injection molding is performed using polyphenylene sulfide resin (PPS) so as to cover the primary molded product 8 extending over the entire length, to form an integrated secondary molded product 9.

【0009】このとき、1次射出成形は成形金型の温度
を50〜110℃で行い、2次射出成形は成形金型の温
度を130〜160℃で行う。これにより、1次成形品
8と2次成形品9との境界の密着性は極めて強固なもの
となり、常温水中で1000時間浸して吸水性の試験を
行った結果、1000Vの耐圧試験に合格した。また、
−55℃で30分、+125℃で30分のサイクルを5
00回繰り返し行う熱衝撃試験を実施した後に、水中に
浸して1000Vの耐圧試験を行った結果、製品には異
常が見られなかった。
At this time, the temperature of the molding die is 50 to 110 ° C. for the primary injection molding, and the temperature of the molding die is 130 to 160 ° C. for the secondary injection molding. As a result, the adhesiveness at the boundary between the primary molded product 8 and the secondary molded product 9 became extremely strong, and the water absorption test was carried out by immersing the molded product in normal temperature water for 1000 hours. . Also,
5 cycles of 30 minutes at -55 ° C and 30 minutes at + 125 ° C
After carrying out a thermal shock test repeatedly performed 00 times, the product was immersed in water and subjected to a withstand voltage test of 1000 V. As a result, no abnormality was found in the product.

【0010】図2は他の実施例を示す横断面図である。
この例の場合もリードフレーム3の周りにポリフェニレ
ンサルファイド樹脂(PPS)を使用して1次射出成形
を行い、1次成形品8を形成する。これを向かい合わ
せ、リードフレーム3の端部を半田6により接続する。
この接続部を1次成形品8に亘り被覆するようにポリフ
ェニレンサルファイド樹脂(PPS)を使用して2次射
出成形を行い、一体化した2次成形品9を形成する。
FIG. 2 is a transverse sectional view showing another embodiment.
Also in the case of this example, primary injection molding is performed around the lead frame 3 using polyphenylene sulfide resin (PPS) to form a primary molded product 8. These are opposed to each other, and the end portions of the lead frame 3 are connected by the solder 6.
Secondary injection molding is performed using a polyphenylene sulfide resin (PPS) so as to cover this connection portion over the primary molded product 8 to form an integrated secondary molded product 9.

【0011】この場合も、上記例と同様に常温水中で1
000時間浸して吸水性の試験を行った結果、1000
Vの耐圧試験に合格した。また、−55℃で30分、+
125℃で30分のサイクルを500回繰り返し行う熱
衝撃試験を実施した後に、水中に浸して1000Vの耐
圧試験を行った結果、製品には異常が見られなかった。
Also in this case, as in the above example, 1
As a result of water absorption test after immersion for 000 hours, 1000
Passed the V withstand voltage test. Also, at -55 ° C for 30 minutes, +
After conducting a thermal shock test in which a cycle of 30 minutes at 125 ° C. was repeated 500 times, the product was immersed in water and subjected to a withstand voltage test of 1000 V. As a result, no abnormality was found in the product.

【0012】次に、図3に基づいて変形例を説明する。
リードフレーム3の周りに汎用樹脂を使用して1次射出
成形を行い、1次成形品1を形成する。次にこの1次成
形品1の周りにポリフェニレンサルファイド樹脂(PP
S)を使用して2次射出成形を行い、2次成形品8を形
成する。次に、この2次成形品8のリードフレーム3相
互間に電気部品4を半田またはスポット溶接により接続
する。続いて上記接続された電気部品4の周りに上記リ
ードフレーム3の周りの1次成形品8まで被覆するよう
に3次の射出成形をポリフェニレンサルファイド樹脂
(PPS)を使用して行い、一体化した3次成形品9を
形成するのである。
Next, a modification will be described with reference to FIG.
Primary injection molding is performed by using a general-purpose resin around the lead frame 3 to form a primary molded product 1. Next, the polyphenylene sulfide resin (PP
Secondary injection molding is performed using S) to form a secondary molded product 8. Next, the electrical components 4 are connected between the lead frames 3 of the secondary molded product 8 by soldering or spot welding. Subsequently, a tertiary injection molding was performed using a polyphenylene sulfide resin (PPS) so as to cover the connected electrical components 4 up to the primary molded product 8 around the lead frame 3, and integrated. The tertiary molded product 9 is formed.

【0013】[0013]

【発明の効果】以上説明したとおり、この発明の射出成
形品によれば、1次成形による1次成形品と2次成形に
よる2次成形品とが密着して高度の耐水性、耐吸湿性が
得られる射出成形品となる。これは、ポリフェニレンサ
ルファイド樹脂(PPS)同志の密着性が極めて優れて
いるからである。
As described above, according to the injection-molded product of the present invention, the primary molded product obtained by the primary molding and the secondary molded product obtained by the secondary molding are in close contact with each other, and the high water resistance and moisture absorption resistance are obtained. Is an injection molded product. This is because the adhesion between polyphenylene sulfide resins (PPS) is extremely excellent.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の一実施例の射出成形品の構成を示す
横断面図、
FIG. 1 is a cross-sectional view showing the structure of an injection-molded article according to an embodiment of the present invention,

【図2】この発明の他の実施例の射出成形品の構成を示
す横断面図、
FIG. 2 is a cross-sectional view showing the structure of an injection-molded article according to another embodiment of the present invention,

【図3】この発明の変形例の射出成形品の構成を示す横
断面図、
FIG. 3 is a cross-sectional view showing the structure of an injection-molded article according to a modified example of the present invention,

【図4】従来の射出成形品の一例を示す横断面図、FIG. 4 is a cross-sectional view showing an example of a conventional injection molded product,

【図5】従来の射出成形品の他の例を示す横断面図であ
る。
FIG. 5 is a cross-sectional view showing another example of a conventional injection molded product.

【符号の説明】[Explanation of symbols]

1 汎用樹脂1次成形品 2 汎用樹脂2次成形品 3 リードフレーム 4 電気部品 5 絶縁テープ 6 半田付け 7 接着剤 8 PPS1次成形品 9 PPS2次成形品 1 General-purpose resin primary molded product 2 General-purpose resin secondary molded product 3 Lead frame 4 Electrical component 5 Insulating tape 6 Soldering 7 Adhesive 8 PPS primary molded product 9 PPS secondary molded product

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 // B29K 81:00 B29L 31:34 4F ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location // B29K 81:00 B29L 31:34 4F

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 1次成形および2次成形の2回の射出成
形により形成する射出成形品において、上記1次成形お
よび2次成形する材料としてポリフェニレンサルファイ
ド樹脂(PPS樹脂)を使用して形成したことを特徴と
する射出成形品。
1. An injection-molded article formed by two injection-molding steps of primary molding and secondary molding, using a polyphenylene sulfide resin (PPS resin) as the material for the primary molding and secondary molding. An injection molded product characterized by the following.
【請求項2】 リードフレームの周りにポリフェニレン
サルファイド樹脂(PPS樹脂)を射出成形した1次成
形品のリードフレームの端部に電気部品を相互に半田付
けまたはスポット溶接で接続し、この接続部を1次成形
品に亘り1次成形品と同じポリフェニレンサルファイド
樹脂(PPS樹脂)で2次射出成形して被覆して形成し
たことを特徴とする射出成形品。
2. An electrical component is mutually soldered or spot-welded to an end of a lead frame of a primary molded product in which a polyphenylene sulfide resin (PPS resin) is injection-molded around the lead frame, and this connecting portion is connected. An injection-molded product, characterized by being formed by secondary injection-molding and coating the same polyphenylene sulfide resin (PPS resin) as the primary-molded product over the primary-molded product.
【請求項3】 リードフレームの周りにポリフェニレン
サルファイド樹脂(PPS樹脂)を射出成形した1次成
形品のリードフレームの端部を相互に半田付けまたはス
ポット溶接で接続し、この接続部を1次成形品に亘り1
次成形品と同じポリフェニレンサルファイド樹脂(PP
S樹脂)で2次射出成形して被覆して形成したことを特
徴とする射出成形品。
3. The lead frame ends of a primary molded product obtained by injection molding a polyphenylene sulfide resin (PPS resin) around the lead frame are connected to each other by soldering or spot welding, and this connecting part is primary molded. 1 across items
Polyphenylene sulfide resin (PP same as the next molded product
An injection-molded article characterized by being formed by secondary injection molding with S resin) and coating.
JP31104892A 1992-10-28 1992-10-28 Injection molded article Pending JPH06134802A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31104892A JPH06134802A (en) 1992-10-28 1992-10-28 Injection molded article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31104892A JPH06134802A (en) 1992-10-28 1992-10-28 Injection molded article

Publications (1)

Publication Number Publication Date
JPH06134802A true JPH06134802A (en) 1994-05-17

Family

ID=18012485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31104892A Pending JPH06134802A (en) 1992-10-28 1992-10-28 Injection molded article

Country Status (1)

Country Link
JP (1) JPH06134802A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010137401A (en) * 2008-12-10 2010-06-24 Sakae Riken Kogyo Co Ltd Method for insert injection molding to base member of decorative member and base member
JP2015153838A (en) * 2014-02-13 2015-08-24 トヨタ自動車株式会社 semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010137401A (en) * 2008-12-10 2010-06-24 Sakae Riken Kogyo Co Ltd Method for insert injection molding to base member of decorative member and base member
JP2015153838A (en) * 2014-02-13 2015-08-24 トヨタ自動車株式会社 semiconductor device

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