JPH11144913A - Thermistor temperature sensor - Google Patents

Thermistor temperature sensor

Info

Publication number
JPH11144913A
JPH11144913A JP31016397A JP31016397A JPH11144913A JP H11144913 A JPH11144913 A JP H11144913A JP 31016397 A JP31016397 A JP 31016397A JP 31016397 A JP31016397 A JP 31016397A JP H11144913 A JPH11144913 A JP H11144913A
Authority
JP
Japan
Prior art keywords
thermistor
insulating resin
resin
thermistor element
temperature sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31016397A
Other languages
Japanese (ja)
Inventor
Hidefumi Sasaki
英文 佐々木
Minoru Ouchi
実 大内
Katsuji Shibuya
勝治 渋谷
Tsunemasa Hashimoto
常正 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP31016397A priority Critical patent/JPH11144913A/en
Publication of JPH11144913A publication Critical patent/JPH11144913A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To improve a thermal shock resistance and an environment resistance, by coating a thermistor element and a terminal board with an insulating resin, then covering the surface thereof with a thermal contraction insulator and then covering the insulator with a mold resin. SOLUTION: After iron terminal boards 2a and 2b on which corrosion-proof processing is performed are connected at connections 3a and 3b by soldering to an electrode surface of a thermistor element 1 having an electrode formed on its main plane, an epoxy-based insulating resin 4 is applied to cover the thermistor element 1, the connections 3a and 3b of the terminal boards 2a and 2b and a part of the terminal boards 2a and 2b, and then hardened at a temperature of 120 deg.C, thus carrying out coating. Next, the coating part of the insulating resin 4 is covered with a double-layer thermal contraction insulator 5 having an inner layer made of a polyamide-based insulating adhesive and having an outer layer made of a silicon resin, and contraction and fixation are carried out at 150 deg.C, thus producing a thermistor unit. After that, the entire thermistor unit including a part of the terminal boards 2a and 2b is covered with a PBT- based mold resin 6 by injection molding, thus providing a thermistor sensor.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、サーミスタ特性を
応用した温度センサの中でも、例えば−40℃から16
5℃間のように高温、湿度、高蒸気圧が加わる厳しい使
用環境下で温度を検出し、温度警報あるいはシステム制
御を行うサーミスタ温度センサに関するものである。
The present invention relates to a temperature sensor utilizing thermistor characteristics, for example, from -40.degree.
The present invention relates to a thermistor temperature sensor that detects a temperature in a severe use environment where a high temperature, humidity, and high vapor pressure are applied, such as between 5 ° C., and performs a temperature alarm or system control.

【0002】[0002]

【従来の技術】図3に従来のサーミスタ温度センサの構
造を示しており、サーミスタ素子1の電極に、ビッカー
ス硬さHv:135〜180の端子板2a,2bをそれ
ぞれ接続部3a,3bで接続し、サーミスタ素子1及び
端子板2a,2bとの接続部3a,3bをエポキシ系の
絶縁性樹脂4で厚さ0.2mm程度にコーティングした
後、モールド樹脂5で射出成形した構造であった。
2. Description of the Related Art FIG. 3 shows the structure of a conventional thermistor temperature sensor. Terminal plates 2a and 2b having Vickers hardness Hv: 135 to 180 are connected to electrodes of the thermistor element 1 at connection portions 3a and 3b, respectively. The connection portions 3a and 3b to be connected to the thermistor element 1 and the terminal plates 2a and 2b were coated with an epoxy-based insulating resin 4 to a thickness of about 0.2 mm, and injection-molded with a molding resin 5.

【0003】[0003]

【発明が解決しようとする課題】前記サーミスタ温度セ
ンサは、−40℃から165℃間の温度の苛酷な熱衝撃
負荷の加わる使用環境下で構成部材の熱膨張、収縮に起
因する応力がサーミスタ素子1及び端子板2a,2bと
の接続部3a,3b部分に集中することにより、接続部
3a,3bが破断し、サーミスタ素子1との電気的導通
が損なわれるという問題点があった。
In the thermistor temperature sensor, the stress caused by the thermal expansion and contraction of the components in a use environment where a severe thermal shock load at a temperature between -40.degree. There is a problem that the connection portions 3a and 3b are broken by concentrating on the connection portions 3a and 3b between the first and the terminal plates 2a and 2b, and the electrical conduction with the thermistor element 1 is impaired.

【0004】本発明は、耐熱衝撃性、耐環境性に優れた
サーミスタ温度センサを提供することを目的とする。
An object of the present invention is to provide a thermistor temperature sensor having excellent thermal shock resistance and environmental resistance.

【0005】[0005]

【課題を解決するための手段】前記課題を解決するため
に本発明は、サーミスタ素子及び端子板を絶縁性樹脂で
コーティングし、更にその表面を熱収縮絶縁体で被覆し
た後、モールド樹脂で覆うことにより所期の目的を達成
するものである。
In order to solve the above-mentioned problems, the present invention provides a method for coating a thermistor element and a terminal plate with an insulating resin, further covering the surfaces with a heat-shrinkable insulator, and then covering with a mold resin. By doing so, the intended purpose is achieved.

【0006】[0006]

【発明の実施の形態】本発明の請求項1に記載の発明
は、一対の電極を有するサーミスタ素子と、その電極に
それぞれ接続された端子板と、前記サーミスタ素子及び
端子板をコーティングした絶縁性樹脂と、前記絶縁性樹
脂及び前記絶縁性樹脂から突出した端子板の一部を被覆
した熱収縮絶縁体と、この熱収縮絶縁体を覆ったモール
ド樹脂とを備えたサーミスタ温度センサであって、絶縁
性樹脂の表面を更に熱収縮絶縁体で被覆保護することに
より、熱衝撃の激しい油中や、高温、高湿、高蒸気圧の
厳しい雰囲気等の使用環境下において、構成部材の熱膨
張、収縮に起因する応力を吸収してサーミスタ素子と端
子板の接続部への応力集中を抑制し、サーミスタ素子と
端子板の電気的導通を確保する。
DETAILED DESCRIPTION OF THE INVENTION The invention according to claim 1 of the present invention is directed to a thermistor element having a pair of electrodes, a terminal plate connected to each of the electrodes, and an insulating member coated with the thermistor element and the terminal plate. A thermistor temperature sensor comprising a resin, a heat-shrinkable insulator covering a part of the insulating resin and a terminal plate protruding from the insulating resin, and a mold resin covering the heat-shrinkable insulator, By further protecting the surface of the insulating resin with a heat-shrinkable insulating material, the thermal expansion of the components can be improved in the use environment such as oil with severe thermal shock, high temperature, high humidity and severe atmosphere with high vapor pressure. The stress caused by the shrinkage is absorbed to suppress the concentration of stress at the connection between the thermistor element and the terminal plate, thereby ensuring the electrical conduction between the thermistor element and the terminal plate.

【0007】本発明の請求項2に記載の発明は、端子板
の硬度をビッカース硬さHv:100未満に調質したも
のを用いる請求項1に記載のサーミスタ温度センサであ
って、端子板材料を軟質化したものを用いることによ
り、モールド用絶縁性樹脂と端子板との接合面、及びサ
ーミスタ素子と端子板との接続部に加わる熱膨張、収縮
の応力の一部を端子板で吸収し、前記接合面、及び接続
部に応力が集中するのを緩和する。
According to a second aspect of the present invention, there is provided a thermistor temperature sensor according to the first aspect, wherein the hardness of the terminal plate is adjusted to a Vickers hardness of less than 100. The terminal board absorbs part of the thermal expansion and contraction stress applied to the joint surface between the insulating resin for molding and the terminal board, and the connection between the thermistor element and the terminal board. The concentration of stress on the joint surface and the connection portion is reduced.

【0008】本発明の請求項3に記載の発明は、サーミ
スタ素子及び端子板との接続部を0.5mm以上の厚さの
絶縁性樹脂でコーティングしたことを特徴とする請求項
1または請求項2に記載のサーミスタ温度センサであっ
て、これによりサーミスタ素子及びサーミスタ素子と端
子板の接続部を強固に保護すると共に、苛酷な熱衝撃に
より端子板が受ける応力を絶縁性樹脂で一部吸収し、サ
ーミスタ素子と端子板の接続部に応力が集中することを
緩和する。
According to a third aspect of the present invention, the connecting portion between the thermistor element and the terminal plate is coated with an insulating resin having a thickness of 0.5 mm or more. 2. The thermistor temperature sensor according to 2 above, which firmly protects the thermistor element and the connection between the thermistor element and the terminal board, and partially absorbs the stress applied to the terminal board by severe thermal shock with the insulating resin. This alleviates the concentration of stress at the connection between the thermistor element and the terminal plate.

【0009】以下本発明の一実施形態について説明す
る。 (実施の形態1)図1に本発明の一実施形態のサーミス
タ温度センサを示す。図1において、1はサーミスタ素
子、2a,2bは端子板、3a,3bは接続部、4はコ
ーティング用の絶縁性樹脂、5は内層が絶縁性接着剤か
らなる二層式の熱収縮絶縁体、6はモールド樹脂であ
る。
An embodiment of the present invention will be described below. (Embodiment 1) FIG. 1 shows a thermistor temperature sensor according to an embodiment of the present invention. In FIG. 1, 1 is a thermistor element, 2a and 2b are terminal plates, 3a and 3b are connection parts, 4 is an insulating resin for coating, and 5 is a two-layer type heat-shrinkable insulator whose inner layer is made of an insulating adhesive. , 6 are mold resins.

【0010】次に製造方法について説明する。先ず、主
平面に電極を形成したサーミスタ素子1を準備する。
Next, the manufacturing method will be described. First, a thermistor element 1 having an electrode formed on a main plane is prepared.

【0011】次にサーミスタ素子1の電極面に、防錆処
理を施した鉄(SPCC)製の端子板2a,2bをそれ
ぞれ半田付により接続部3a,3bで接続した後、サー
ミスタ素子1、端子板2a,2bの接続部3a,3b、
及び端子板2a,2bの一部にエポキシ系の絶縁性樹脂
4を塗布して覆い、120℃の温度で硬化しコーティン
グを行う。尚、端子板2a,2bはHv硬度100と1
50に調質した材料を、またコーティング用絶縁性樹脂
4は0.2mmと0.5mmの厚さでそれぞれ作製した。
Next, terminal plates 2a, 2b made of rust-proof iron (SPCC) are connected to the electrode surfaces of the thermistor element 1 by soldering at connecting portions 3a, 3b, respectively. Connecting portions 3a, 3b of the plates 2a, 2b,
Further, an epoxy-based insulating resin 4 is applied to cover a part of the terminal plates 2a and 2b, and the epoxy resin is cured at a temperature of 120 ° C. to perform coating. The terminal plates 2a and 2b have Hv hardness of 100 and 1 respectively.
The material tempered to 50, and the insulating resin for coating 4 were prepared with a thickness of 0.2 mm and 0.5 mm, respectively.

【0012】次いで、絶縁性樹脂4のコーティング部を
内層がポリアミド系絶縁性接着剤、外層がシリコン樹脂
の二層式の熱収縮絶縁体5で覆い、150℃の温度で収
縮固定しサーミスタユニットを作製する。
Next, the coated portion of the insulating resin 4 is covered with a two-layer heat-shrinkable insulator 5 whose inner layer is a polyamide-based insulating adhesive and whose outer layer is a silicone resin, and is shrunk and fixed at a temperature of 150 ° C. to form a thermistor unit. Make it.

【0013】その後、図1に示すように端子板2a,2
bの一部を含むサーミスタユニット全体をPBT系モー
ルド樹脂6で射出成形を行いサーミスタセンサを完成さ
せた。
Thereafter, as shown in FIG.
The entire thermistor unit including part b was injection-molded with PBT-based mold resin 6 to complete the thermistor sensor.

【0014】得られた本発明のサーミスタ温度センサ
と、従来方法で作製したサーミスタ温度センサ(端子板
2a,2bのHv硬さ150、樹脂コーティング4の厚
さ0.2mmで作製した。)について、実施した耐熱衝撃
サイクル試験の結果を(表1)に、耐湿サイクル試験の
結果を図2に示した。
The obtained thermistor temperature sensor of the present invention and a thermistor temperature sensor manufactured by a conventional method (made with a terminal plate 2a, 2b having an Hv hardness of 150 and a resin coating 4 having a thickness of 0.2 mm) are described. The results of the implemented thermal shock cycle test are shown in Table 1 and the results of the humidity cycle test are shown in FIG.

【0015】尚、熱衝撃サイクル条件は−40℃の油中
5分間→大気中室温10秒間→165℃の油中5分間→
大気中室温10秒間を1サイクルとして1000サイク
ル、耐湿サイクル条件は−20℃、85Rh%、1分間
保持と、+80℃、85Rh%1分間保持を1サイクル
として2000サイクルの耐久試験を行った。
The thermal shock cycle conditions are as follows: oil in -40 ° C. for 5 minutes → room temperature in air for 10 seconds → oil in 165 ° C. for 5 minutes →
A durability test was performed for 1,000 cycles with one cycle of 10 seconds at room temperature in the atmosphere, and a 2,000 cycle durability test with holding at -20 ° C and 85Rh% for 1 minute and holding at + 80 ° C and 85Rh% for 1 minute under moisture-resistant cycle conditions.

【0016】[0016]

【表1】 [Table 1]

【0017】(表1)に示したように、従来品は500
サイクル経過後から急激にサーミスタ素子1と端子板2
a,2bとの接続部3a,3bの破断が発生し、100
0サイクルでは全試料が破断する。これに対し本発明品
の端子板2a,2b硬度を100に調質し、絶縁性樹脂
4を0.5mm厚さに施したものは1000サイクル経過
後も破断は認められない。一方、端子2a,2b硬度を
100に調質し、絶縁性樹脂4を0.2mm厚さに施した
ものは1000サイクル経過後2個の破断が認められ
た。他方、端子板2a,2b硬度を150に調質したも
のは、樹脂コーティング4の厚さに関係無く500サイ
クルまでは接続部3a,3bに異常は認められないが、
1000サイクルでは破断が発生している。これは、モ
ールド樹脂6射出成形の際、二層式の熱収縮絶縁体5の
絶縁性接着剤が、モールド樹脂6成形時の射出圧力を吸
収しサーミスタ素子1、及び接続部3a,3bに応力が
集中することを緩和すると共に、−40℃から165℃
間の温度でのモールド樹脂6成形体の熱膨張、収縮の応
力を吸収し、サーミスタ素子1、及び接続部3a,3b
応力が集中することを緩和する効果があることを示して
いる。
As shown in (Table 1), the conventional product is 500
Thermistor element 1 and terminal plate 2
The connection portions 3a and 3b with the a and 2b are broken, and 100
At 0 cycles, all samples break. On the other hand, when the terminal boards 2a and 2b of the present invention were tempered to have a hardness of 100 and the insulating resin 4 was applied to a thickness of 0.5 mm, no breakage was observed even after 1000 cycles. On the other hand, when the hardness of the terminals 2a and 2b was adjusted to 100 and the insulating resin 4 was applied to a thickness of 0.2 mm, two breaks were observed after 1000 cycles. On the other hand, when the terminal plates 2a, 2b have been hardened to a hardness of 150, no abnormality is found in the connection portions 3a, 3b up to 500 cycles regardless of the thickness of the resin coating 4.
Breakage has occurred at 1000 cycles. This is because, at the time of injection molding of the molding resin 6, the insulating adhesive of the two-layer heat-shrinkable insulator 5 absorbs the injection pressure at the time of molding the molding resin 6, and stresses the thermistor element 1 and the connecting portions 3a and 3b. -40 ° C to 165 ° C
The thermal expansion and contraction stresses of the molded resin 6 at the temperature between them are absorbed, and the thermistor element 1 and the connecting portions 3a and 3b are absorbed.
This indicates that there is an effect of alleviating concentration of stress.

【0018】また、図2に示すように、本発明サーミス
タ温度センサは2000サイクルの耐湿試験経過後もサ
ーミスタ素子1の抵抗値変化が殆ど無いのに対し、従来
品はサイクル数が多くなるに従ってサーミスタ素子1の
抵抗値が徐々に大きくなっていることが分かる。これは
熱収縮絶縁体5の絶縁性接着剤が絶縁性樹脂4と端子板
2a,2bとの接合部を強固に包み込んで保護し、端子
板2a,2bと絶縁性樹脂4との熱膨張差によって生じ
る界面の隙間から、湿分やサーミスタ素子1の特性を劣
化させる異物の侵入を防ぎ、サーミスタ温度センサとし
て耐久性能を安定させる効果があることを示している。
As shown in FIG. 2, the thermistor temperature sensor of the present invention has almost no change in the resistance value of the thermistor element 1 even after a lapse of 2000 cycles of the moisture resistance test, whereas the conventional thermistor element 1 has a larger number of thermistors as the cycle number increases. It can be seen that the resistance value of the element 1 gradually increases. This is because the insulating adhesive of the heat-shrinkable insulator 5 firmly wraps and protects the joint between the insulating resin 4 and the terminal plates 2a and 2b, and the difference in thermal expansion between the terminal plates 2a and 2b and the insulating resin 4. This indicates that moisture and foreign substances that degrade the characteristics of the thermistor element 1 are prevented from entering from the interface gap generated by this, and that there is an effect of stabilizing the durability performance as a thermistor temperature sensor.

【0019】以上の結果から−40℃〜165℃の苛酷
な熱衝撃をクリヤーするには、端子板2a,2b硬度を
100未満の硬さに調質したものを用い、サーミスタ素
子1と端子板2a,2bとの接続部3a,3bを少なく
とも0.5mm以上の厚さの絶縁性樹脂4で覆い、耐湿性
を向上させるためには、絶縁性樹脂4と端子板2a,2
bの接合部を更に熱収縮絶縁体5で覆うことが必要とな
ることが分かる。これにより耐久性能のすぐれたサーミ
スタ温度センサを提供することができる。
From the above results, in order to clear a severe thermal shock of -40.degree. C. to 165.degree. C., a terminal plate 2a, 2b having a hardness of less than 100 is used. In order to cover the connection portions 3a and 3b with the insulating resin 4 having a thickness of at least 0.5 mm or more and improve the moisture resistance, the insulating resin 4 and the terminal plates 2a and 2b are required.
It can be seen that it is necessary to further cover the joint b with the heat-shrinkable insulator 5. Thereby, a thermistor temperature sensor having excellent durability performance can be provided.

【0020】[0020]

【発明の効果】以上の本発明によれば、サーミスタ素
子、及びサーミスタ素子と端子板を絶縁性樹脂で覆い、
その表面部分と端子板の一部を更に熱収縮絶縁体で覆
い、さらにその外方をモールド樹脂で覆うことにより、
耐熱衝撃性、耐湿性の優れた、信頼性の高いサーミスタ
温度センサを提供することが可能となる。
According to the present invention, the thermistor element and the thermistor element and the terminal plate are covered with an insulating resin.
By further covering the surface and part of the terminal board with a heat shrink insulator, and further covering the outside with a mold resin,
A highly reliable thermistor temperature sensor having excellent thermal shock resistance and moisture resistance can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施形態のサーミスタ温度センサの
断面図
FIG. 1 is a sectional view of a thermistor temperature sensor according to an embodiment of the present invention.

【図2】(a)(b)は本発明品と従来品の耐湿サイク
ル試験グラフ
FIGS. 2 (a) and (b) are graphs of a moisture resistance cycle test of a product of the present invention and a conventional product.

【図3】従来例のサーミスタ温度センサの断面図FIG. 3 is a cross-sectional view of a conventional thermistor temperature sensor.

【符号の説明】 1 サーミスタ素子 2a,2b 端子板 4 絶縁性樹脂 5 熱収縮絶縁体 6 モールド樹脂[Explanation of Signs] 1 Thermistor element 2a, 2b Terminal plate 4 Insulating resin 5 Heat-shrink insulator 6 Mold resin

フロントページの続き (72)発明者 橋本 常正 大阪府門真市大字門真1006番地 松下電器 産業株式会社内Continued on the front page (72) Inventor Tsunemasa Hashimoto 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 一対の電極を有するサーミスタ素子と、
その電極にそれぞれ接続された端子板と、前記サーミス
タ素子及び端子板をコーティングした絶縁性樹脂と、前
記絶縁性樹脂及び前記絶縁性樹脂から突出した端子板の
一部を被覆した熱収縮絶縁体と、この熱収縮絶縁体を覆
ったモールド樹脂とを備えたサーミスタ温度センサ。
A thermistor element having a pair of electrodes;
A terminal plate connected to each of the electrodes, an insulating resin coating the thermistor element and the terminal plate, and a heat-shrinkable insulator covering a part of the insulating resin and the terminal plate protruding from the insulating resin. And a mold resin covering the heat-shrinkable insulator.
【請求項2】 端子板の硬度をビッカース硬さHv:1
00未満に調質したものを用いる請求項1に記載のサー
ミスタ温度センサ。
2. The hardness of the terminal plate is Vickers hardness Hv: 1.
2. The thermistor temperature sensor according to claim 1, wherein the temperature of the thermistor is less than 00.
【請求項3】 サーミスタ素子及び端子板との接続部を
0.5mm以上の厚さの絶縁性樹脂でコーティングしたこ
とを特徴とする請求項1または請求項2に記載のサーミ
スタ温度センサ。
3. The thermistor temperature sensor according to claim 1, wherein a connection portion between the thermistor element and the terminal plate is coated with an insulating resin having a thickness of 0.5 mm or more.
JP31016397A 1997-11-12 1997-11-12 Thermistor temperature sensor Pending JPH11144913A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31016397A JPH11144913A (en) 1997-11-12 1997-11-12 Thermistor temperature sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31016397A JPH11144913A (en) 1997-11-12 1997-11-12 Thermistor temperature sensor

Publications (1)

Publication Number Publication Date
JPH11144913A true JPH11144913A (en) 1999-05-28

Family

ID=18001927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31016397A Pending JPH11144913A (en) 1997-11-12 1997-11-12 Thermistor temperature sensor

Country Status (1)

Country Link
JP (1) JPH11144913A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100475214B1 (en) * 2002-07-29 2005-03-10 유니썸테크놀로지 주식회사 High Reliability Chip-in-Epoxy Type NTC Thermistor and Fabricating Method Therefor
JP2011007612A (en) * 2009-06-25 2011-01-13 Mitsubishi Cable Ind Ltd Sensor with terminals
JP2011222737A (en) * 2010-04-09 2011-11-04 Ngk Spark Plug Co Ltd Thermistor element and temperature sensor
EP2411778A1 (en) * 2009-03-27 2012-02-01 Epcos AG Sensor arrangement and method for production
US20170016777A1 (en) * 2014-03-07 2017-01-19 Shibaura Electronics Co., Ltd. Temperature sensor and temperature sensor manufacturing method

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100475214B1 (en) * 2002-07-29 2005-03-10 유니썸테크놀로지 주식회사 High Reliability Chip-in-Epoxy Type NTC Thermistor and Fabricating Method Therefor
EP2411778A1 (en) * 2009-03-27 2012-02-01 Epcos AG Sensor arrangement and method for production
US20120057617A1 (en) * 2009-03-27 2012-03-08 Epcos Ag Sensor arrangement and method for production
US9086329B2 (en) * 2009-03-27 2015-07-21 Epcos Ag Sensor arrangement and method for production
US20150285664A1 (en) * 2009-03-27 2015-10-08 Epcos Ag Sensor arrangements and methods of production thereof
EP2411778B1 (en) * 2009-03-27 2020-01-15 TDK Electronics AG Sensor arrangement and method for production
JP2011007612A (en) * 2009-06-25 2011-01-13 Mitsubishi Cable Ind Ltd Sensor with terminals
JP2011222737A (en) * 2010-04-09 2011-11-04 Ngk Spark Plug Co Ltd Thermistor element and temperature sensor
US20170016777A1 (en) * 2014-03-07 2017-01-19 Shibaura Electronics Co., Ltd. Temperature sensor and temperature sensor manufacturing method
US10156483B2 (en) * 2014-03-07 2018-12-18 Shibaura Electronics Co., Ltd. Temperature sensor and temperature sensor manufacturing method

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