JPH0613189U - Circuit board fastening mechanism - Google Patents
Circuit board fastening mechanismInfo
- Publication number
- JPH0613189U JPH0613189U JP5297292U JP5297292U JPH0613189U JP H0613189 U JPH0613189 U JP H0613189U JP 5297292 U JP5297292 U JP 5297292U JP 5297292 U JP5297292 U JP 5297292U JP H0613189 U JPH0613189 U JP H0613189U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- fastening
- fastening mechanism
- tubular portion
- receiving member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】
【目的】 締結部材を突出させない。
【構成】 回路基板締結機構は、貫通孔１ａ，５ａが形
成された基板支持体１と回路基板５とを締結するための
機構である。この機構は、貫通孔１ａ，５ａに挿入され
る受け部材８，９と、受け部材８，９内に挿入されるボ
ルト１０及びナット１１とを備えている。受け部材８，
９は、貫通孔１ａ，５ａに挿入され得る筒状部１２と、
筒状部１２の一端に形成された外向きフランジ１３と、
筒状部１２の他端に形成された内向きフランジ１４とを
有している。
(57) [Summary] [Purpose] Do not project the fastening members. [Structure] The circuit board fastening mechanism is a mechanism for fastening the circuit board 5 and the board support 1 in which the through holes 1a and 5a are formed. This mechanism includes receiving members 8 and 9 inserted into the through holes 1a and 5a, and bolts 10 and nuts 11 inserted into the receiving members 8 and 9. Receiving member 8,
9 is a cylindrical portion 12 that can be inserted into the through holes 1a and 5a,
An outward flange 13 formed at one end of the tubular portion 12,
It has an inward flange 14 formed at the other end of the tubular portion 12.
Description
【０００１】[0001]
本考案は、回路基板締結機構に関し、特に貫通する孔が形成された回路基板と 基板支持体とを締結するための回路基板締結機構に関する。 The present invention relates to a circuit board fastening mechanism, and more particularly to a circuit board fastening mechanism for fastening a circuit board having a through hole formed therein and a board support.
【０００２】[0002]
図３に示す従来の回路基板締結機構は、回路パターン等を有する回路基板２０ と板状の基板支持体２１とを締結するためのものである。 この締結機構は、回路基板２０及び基板支持体２１の互いに離れた面に配置さ れた円板状の受け金具２２と、回路基板２０、基板支持体２１及び受け金具２２ を貫通するボルト２３と、ボルト２３の先端部に螺合するナット２４とを備えて いる。 The conventional circuit board fastening mechanism shown in FIG. 3 is for fastening a circuit board 20 having a circuit pattern and the like to a plate-like board support 21. This fastening mechanism includes a disc-shaped receiving metal fitting 22 arranged on the surfaces of the circuit board 20 and the board supporting body 21 which are separated from each other, and a bolt 23 penetrating the circuit board 20, the board supporting body 21 and the receiving metal fitting 22. , And a nut 24 screwed onto the tip of the bolt 23.
【０００３】[0003]
前記従来の回路基板締結機構では、締結された回路基板２０及び基板支持体２ １の表面からボルト２３及びナット２４が突出している。このため、この従来の 構成では、締結された回路基板２０及び基板支持体２１の全体の高さが実質的に 高くなる。また、この構成では、突出する締結部材により表面実装が不可能にな る場合が生じる。 In the conventional circuit board fastening mechanism, bolts 23 and nuts 24 project from the surfaces of the fastened circuit board 20 and board support 21. Therefore, in this conventional configuration, the overall height of the fastened circuit board 20 and board support 21 is substantially increased. In addition, in this configuration, the protruding fastening member may make surface mounting impossible.
【０００４】 本考案の目的は、締結部材を突出させないことにある。An object of the present invention is to prevent the fastening member from protruding.
【０００５】[0005]
本考案に係る回路基板締結機構は、貫通する孔が形成された回路基板と基板支 持体とを締結するための機構である。この機構は、前記孔に挿入される受け部材 と、その受け部材内に挿入される締結部材とを備えている。前記受け部材は、前 記孔に挿入され得る筒状部と、筒状部の一端に形成された外向きフランジと、筒 状部の他端に形成された内向きフランジとを有している。 A circuit board fastening mechanism according to the present invention is a mechanism for fastening a circuit board having a through hole formed therein and a board support. This mechanism includes a receiving member that is inserted into the hole and a fastening member that is inserted into the receiving member. The receiving member has a tubular portion that can be inserted into the hole, an outward flange formed at one end of the tubular portion, and an inward flange formed at the other end of the tubular portion. .
【０００６】[0006]
本考案に係る回路基板締結機構では、回路基板及び基板支持体の貫通孔に受け 部材の筒状部を挿入し、その受け部材内に締結部材を挿入して、回路基板及び基 板支持体を締結する。ここでは、締結部材は受け部材内に挿入された状態にある ので、締結部材は突出しない。 In the circuit board fastening mechanism according to the present invention, the tubular portion of the receiving member is inserted into the through holes of the circuit board and the substrate support, and the fastening member is inserted into the receiving member to secure the circuit board and the substrate support. To conclude. Here, since the fastening member is inserted in the receiving member, the fastening member does not project.
【０００７】[0007]
図１及び図２は、本考案の一実施例が採用された電子部品組立体を示している 。この電子部品組立体は、導電性ケースの一部である基板支持体１と、回路パタ ーン２が表面に形成されるとともに電子部品４が搭載された回路基板５と、基板 支持体１及び回路基板４を締結する締結機構６とを有している。なお、基板支持 体１と回路基板５との間にははんだ層７が介在している。 1 and 2 show an electronic component assembly to which an embodiment of the present invention is applied. This electronic component assembly includes a substrate support 1 which is a part of a conductive case, a circuit board 5 on which a circuit pattern 2 is formed and an electronic component 4 is mounted, a substrate support 1 and And a fastening mechanism 6 for fastening the circuit board 4. A solder layer 7 is interposed between the substrate support 1 and the circuit board 5.
【０００８】 回路基板５は、ガラスセラミック製であり、基板締結位置に相当する箇所には 貫通孔５ａが形成されている。回路基板５の各貫通孔５ａに対応する位置におい て、基板支持体１及びはんだ層７にはそれぞれ貫通孔１ａ，７ａが形成されてい る。なお、回路基板５の表面において、貫通孔５ａの周縁部には、回路パターン ２のうちのアースパターンが延びている。The circuit board 5 is made of glass ceramic, and a through hole 5a is formed at a position corresponding to the board fastening position. Through holes 1a and 7a are formed in the substrate support 1 and the solder layer 7 at positions corresponding to the through holes 5a of the circuit board 5, respectively. In addition, on the surface of the circuit board 5, a ground pattern of the circuit pattern 2 extends in the peripheral portion of the through hole 5a.
【０００９】 各締結機構６は、貫通孔５ａに図上側から挿入される第１受け部材８と、貫通 孔１ａに図下側から挿入される第２受け部材９と、両受け部材８，９間を連結す るボルト１０及びナット１１とを備えている。両受け部材８，９は同一形状であ り、貫通孔１ａ，５ａに挿入され得る筒状部１２と、筒状部１２の一端に形成さ れた外向きフランジ１３と、筒状部１２の他端に形成された内向きフランジ１４ とを有している。Each fastening mechanism 6 includes a first receiving member 8 which is inserted into the through hole 5a from the upper side of the drawing, a second receiving member 9 which is inserted into the through hole 1a from the lower side of the drawing, and both receiving members 8 and 9. It is provided with a bolt 10 and a nut 11 that connect the two. Both receiving members 8 and 9 have the same shape, and have a tubular portion 12 that can be inserted into the through holes 1 a and 5 a, an outward flange 13 formed at one end of the tubular portion 12, and the tubular portion 12. And an inward flange 14 formed at the other end.
【００１０】 筒状部１２は、貫通孔１ａ，５ａの内径よりも僅かに小さい外径を有している 。また、筒状部１２の内径は、ボルト１０のヘッド１０ａ及びナット１１の外径 よりも大きく設定されている。 外向きフランジ１３は、筒状部１２から一体に外周側に突出しており、貫通孔 １ａ，５ａよりも大きい外径を有している。また、外向きフランジ１３は、基板 支持体１及び回路基板５の表面側に突出する突起１３ａを有している。突起１３ ａは、外向きフランジ１３を切り起こすことにより形成されている。また、突起 １３ａは、円環状の外向きフランジ１３の周方向に等間隔に４個形成されている 。The tubular portion 12 has an outer diameter slightly smaller than the inner diameters of the through holes 1a and 5a. The inner diameter of the tubular portion 12 is set to be larger than the outer diameters of the head 10a of the bolt 10 and the nut 11. The outward flange 13 integrally projects from the tubular portion 12 to the outer peripheral side and has an outer diameter larger than that of the through holes 1a and 5a. Further, the outward flange 13 has a protrusion 13 a protruding toward the front surface side of the board support 1 and the circuit board 5. The protrusion 13 a is formed by cutting and raising the outward flange 13. Further, four protrusions 13a are formed at equal intervals in the circumferential direction of the annular outward flange 13.
【００１１】 内向きフランジ１４は、筒状部１２から内周側に延びており、その中心に孔１ ５を有している。孔１５の直径は、ボルト１０を挿通し得る程度に設定されてい るが、ボルト１０のヘッド１０ａ及びナット１１の外径よりも小さく設定されて いる。 次に、上述の実施例の組立工程を説明する。The inward flange 14 extends from the tubular portion 12 toward the inner peripheral side and has a hole 15 at the center thereof. The diameter of the hole 15 is set so that the bolt 10 can be inserted, but is set smaller than the outer diameters of the head 10a and the nut 11 of the bolt 10. Next, the assembly process of the above embodiment will be described.
【００１２】 まず、基板支持体１に対し、はんだ層７を介して回路基板５を重ね合わせる。 そして、締結機構６の第１受け部材８を回路基板５の貫通孔５ａに挿入し、第２ 受け部材９を基板支持体１の貫通孔１ａに挿入する。次に、ボルト１０を第１受 け部材８と第２受け部材９とに挿入し、貫通孔１ａ，５ａ，７ａ内においてボル ト１０及びナット１１を用いて両受け部材８，９を締めつける。この結果、ボル ト１０及びナット１１が、受け部材８，９を介して基板支持体１と回路基板５と を一体的に締結する。First, the circuit board 5 is superposed on the board support 1 with the solder layer 7 interposed therebetween. Then, the first receiving member 8 of the fastening mechanism 6 is inserted into the through hole 5 a of the circuit board 5, and the second receiving member 9 is inserted into the through hole 1 a of the substrate support 1. Next, the bolt 10 is inserted into the first receiving member 8 and the second receiving member 9, and both receiving members 8 and 9 are tightened using the bolt 10 and the nut 11 in the through holes 1a, 5a and 7a. As a result, the bolt 10 and the nut 11 integrally fasten the board support 1 and the circuit board 5 via the receiving members 8 and 9.
【００１３】 ここでは、ボルト１０のヘッド１０ａが第１受け部材８の筒状部１２内に配置 され、ナット１１が第２受け部材９の筒状部１２内に配置されるので、締結機構 ６は基板支持体１及び回路基板５の表面からは突出しない。この結果、締結機構 ６が実質的に電子部品組立体の高さを高めるという問題が解消されるとともに、 締結機構６が表面実装時の障害になるという問題も解消される。Here, since the head 10 a of the bolt 10 is arranged in the cylindrical portion 12 of the first receiving member 8 and the nut 11 is arranged in the cylindrical portion 12 of the second receiving member 9, the fastening mechanism 6 Does not protrude from the surfaces of the substrate support 1 and the circuit board 5. As a result, the problem that the fastening mechanism 6 substantially increases the height of the electronic component assembly is solved, and the problem that the fastening mechanism 6 becomes an obstacle during surface mounting is also solved.
【００１４】 なお、締結機構６が基板支持体１と回路基板５とを締結した状態では、回路パ ターン２が基板支持体１に締結機構６を介して電気的に接続される。すなわち、 この締結機構６は、回路基板５の表面の回路パターン２と基板支持体１とを電気 的に接続する機能も有している。 〔他の実施例〕 （ａ） １対の受け部材のうち、一方を従来の受け金具とし、もう一方を本考案 に係る受け部材として、片側のみ締結機構の突出を防止することによっても、本 考案を実施できる。 （ｂ） ナットが挿入される受け部材の筒状部１２を変形させて、ナットの回り 留めとしてもよい。In the state where the fastening mechanism 6 fastens the substrate support 1 and the circuit board 5, the circuit pattern 2 is electrically connected to the substrate support 1 via the fastening mechanism 6. That is, the fastening mechanism 6 also has a function of electrically connecting the circuit pattern 2 on the surface of the circuit board 5 and the board support 1. [Other Embodiments] (a) Of the pair of receiving members, one is a conventional receiving metal fitting, and the other is a receiving member according to the present invention. Can devise. (B) The tubular portion 12 of the receiving member into which the nut is inserted may be deformed so that the nut can be locked.
【００１５】[0015]
本考案に係る回路基板締結機構では、筒状部を有する受け部材と、その受け部 材内に挿入される締結部材とを備えているので、締結部材が突出しなくなる。 Since the circuit board fastening mechanism according to the present invention comprises the receiving member having the tubular portion and the fastening member inserted into the receiving member, the fastening member does not project.
【図１】本考案の一実施例が採用された電子部品組立体
の縦断面図。FIG. 1 is a vertical cross-sectional view of an electronic component assembly according to an embodiment of the present invention.
【図２】その分解斜視部分図。FIG. 2 is an exploded perspective partial view thereof.
【図３】従来例の図１に相当する図。FIG. 3 is a diagram corresponding to FIG. 1 of a conventional example.
１ 基板支持体 １ａ，５ａ 貫通孔 ５ 回路基板 ６ 締結機構 ８，９ 受け部材 １０ ボルト １１ ナット １２ 筒状部 １３ 外向きフランジ １４ 内向きフランジ DESCRIPTION OF SYMBOLS 1 Board support 1a, 5a Through hole 5 Circuit board 6 Fastening mechanism 8,9 Receiving member 10 Bolt 11 Nut 12 Cylindrical part 13 Outward flange 14 Inward flange
───────────────────────────────────────────────────── フロントページの続き (72)考案者 田中 康行 鹿児島県国分市山下町１−１ 京セラ株式 会社鹿児島国分工場内 (72)考案者 中村 成男 鹿児島県国分市山下町１−１ 京セラ株式 会社鹿児島国分工場内 (72)考案者 藤井 靖人 鹿児島県国分市山下町１−１ 京セラ株式 会社鹿児島国分工場内 (72)考案者 田中 省悟 鹿児島県国分市山下町１−１ 京セラ株式 会社鹿児島国分工場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasuyuki Tanaka 1-1 Yamashita Town, Kokubun City, Kagoshima Prefecture Kyocera Stock Company, Kagoshima Kokubun Plant (72) Inventor Shigeo Nakamura 1-1 Yamashita Town, Kokubun City, Kagoshima Prefecture Kyocera Stock Company Kagoshima Kokubun Plant (72) Inventor Yasuhito Fujii 1-1 Yamashita-cho, Kokubun-shi, Kagoshima Prefecture Kyocera Stock Company Kagoshima Kokubun Plant (72) Satoru Satoru 1-1 1-1 Yamashita-cho, Kokubun-shi, Kagoshima Kagoshima Kokubu Plant Within
Claims (1)
持体とを締結するための回路基板締結機構において、 前記孔に挿入され得る筒状部と、前記筒状部の一端に形
成された外向きフランジと、前記筒状部の他端に形成さ
れた内向きフランジとを有する受け部材と、 前記受け部材内に挿入される締結部材と、 を備えたことを特徴とする回路基板締結機構。1. A circuit board fastening mechanism for fastening a circuit board having a through hole formed therein and a board support body, wherein a tubular portion that can be inserted into the hole and one end of the tubular portion are formed. And a fastening member having an inward flange formed on the other end of the tubular portion, and a fastening member inserted into the receiving member. mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1992052972U JP2574913Y2 (en) | 1992-07-28 | 1992-07-28 | Circuit board fastening mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1992052972U JP2574913Y2 (en) | 1992-07-28 | 1992-07-28 | Circuit board fastening mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0613189U true JPH0613189U (en) | 1994-02-18 |
| JP2574913Y2 JP2574913Y2 (en) | 1998-06-18 |
Family
ID=12929811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1992052972U Expired - Lifetime JP2574913Y2 (en) | 1992-07-28 | 1992-07-28 | Circuit board fastening mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2574913Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006019362A (en) * | 2004-06-30 | 2006-01-19 | Sanyo Electric Co Ltd | Circuit module |
| JP2006041410A (en) * | 2004-07-30 | 2006-02-09 | Sanyo Electric Co Ltd | Circuit module and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6338393U (en) * | 1986-08-27 | 1988-03-11 | ||
| JPS6436719U (en) * | 1987-08-31 | 1989-03-06 | ||
| JPH0425281U (en) * | 1990-06-21 | 1992-02-28 |
-
1992
- 1992-07-28 JP JP1992052972U patent/JP2574913Y2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6338393U (en) * | 1986-08-27 | 1988-03-11 | ||
| JPS6436719U (en) * | 1987-08-31 | 1989-03-06 | ||
| JPH0425281U (en) * | 1990-06-21 | 1992-02-28 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006019362A (en) * | 2004-06-30 | 2006-01-19 | Sanyo Electric Co Ltd | Circuit module |
| JP4514530B2 (en) * | 2004-06-30 | 2010-07-28 | 三洋電機株式会社 | Circuit modules and precision equipment built into precision equipment |
| JP2006041410A (en) * | 2004-07-30 | 2006-02-09 | Sanyo Electric Co Ltd | Circuit module and electronic equipment |
| JP4636827B2 (en) * | 2004-07-30 | 2011-02-23 | 三洋電機株式会社 | Circuit module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2574913Y2 (en) | 1998-06-18 |
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