JPH0613109U - Multilayer electronic components for noise suppression - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a multilayer electronic component for noise suppression that can obtain an excellent noise removal effect over a high frequency range. [Structure] An inductor 3 is formed of a sintered body in which a magnetic body 6 and a coil forming conductor 7 are laminated, and at least two coil portions 10 to 13 are arranged side by side or stacked vertically. At least two coil portions 10 and 11, 12 and 13 are electrically conductive, and the coil portions 10 and 11 and 12 and 13 which are electrically conductive adjacent to each other have a magnetic flux generated by a current flowing through the coil portion. They are connected so as to add to each other at the center of the section. The multilayer capacitor 2 may be superimposed on at least one surface of the multilayer inductor 3.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a laminated inductor composed of a sintered body having a laminated structure, or a laminated electronic component for noise suppression which is formed by superposing a laminated capacitor on the laminated inductor.

[0002]

[Problems to be solved by conventional techniques and devices]

 FIG. 5 (A) is a cross-sectional view showing an example of a conventional multilayer inductor as a noise countermeasure multilayer electronic component. Reference numeral 1 is a multilayer body in which a multilayer capacitor 2 and a multilayer inductor 3 are superposed. The body 1 is manufactured by stacking the dielectric 4 and the electrode conductor 5, and the magnetic body 6 and the coil conductor 7 by a printing method or by stacking a green sheet, and sintering them. Reference numeral 8 denotes a terminal electrode formed by applying a conductive paste on the side surface of the laminated body 1 and sintering it. This laminated electronic component may be composed of only the laminated body 1 or may be mounted with the electronic component 9 for use.

Conventionally, FIG. 5B is an example of a circuit of an LC filter configured by such a conventional laminated electronic component, and a capacitor C And inductor L₁, L₂Are formed inside the multilayer capacitor 2 and the multilayer inductor 3, respectively.

In such a conventional multilayer electronic component, one or more inductors L ₁ and L ₂ formed in the multilayer inductor 3 are each composed of one coil portion, and the impedance of the coil is The noise removal effect was weak because it was used only to remove the noise, so the present invention has a problem that the noise removal effect is excellent in the high-frequency range. The purpose is to provide electronic components.

[0005]

[Means for Solving the Problems]

 In order to achieve this object, the present invention comprises a sintered body in which a magnetic body and a coil-forming conductor are laminated, and at least two coil portions are formed side by side or vertically to form an inductor, The two coil parts are electrically conductive, and the coil parts adjacent to each other and electrically connected are connected so that the magnetic fluxes generated by the current flowing through the coil parts add to each other at the center of the coil part. Is characterized by. A multilayer capacitor may be superimposed on one side or both sides of the multilayer inductor.

[0006]

[Action]

 Since the multilayer electronic component of the present invention has the above-mentioned structure, the magnetic flux generated in one coil portion forming one inductor passes through another coil portion electrically connected to the coil portion, It acts to prevent noise energy.

[0007]

【Example】

FIG. 1 (A) is a cross-sectional view showing an embodiment of the noise countermeasure multilayer electronic component according to the present invention, and the same reference numerals as those in FIG. In the laminated inductor L ₁ , a plurality of coil portions 10 and 11 are arranged side by side, and the coil portions 10 and 11 are connected by a conductor 14. Similarly, in the laminated inductor L ₂ , the coil portions 12 and 13 are arranged side by side, and the coil portions 12 and 13 are connected by the conductor 15. 1B is a perspective view showing the circuit of the inductor L ₁ , and FIG. 1C is a perspective view showing the wire connection structure of the conductors 7 forming the adjacent coil portions 10 and 11. As shown in these figures, in the inductor L ₁ , a part of the magnetic flux Φ _a (or Φ _b ) Φ _X generated in one coil portion 10 (or 11) by the current i flowing through the coil forming conductor 7 Has _a winding direction set so as to be added to the magnetic flux Φ _b (or Φ _a ) generated in the other coil portion 11 (or 10). The relationship between the magnetic fluxes Φ _c and Φ _d generated by the coil portions 12 and 13 of the inductor L ₂ is set similarly to the winding direction of the coil portions in the coil portions 10 and 11.

According to this structure, the noise current i can be effectively reduced to a high frequency range.

Such a composite inductor is an external connection made up of a magnetic paste made of ferrite powder and a binder and a conductor paste made of a binder mixed with metal powder such as Ag, Ag-Pd, Cu, Ni and Pd. It is produced by alternately printing and sintering the conductors for use 7. The terminal electrode 8 is retrofitted as described above. In addition, it can be realized by stacking a green raw sheet of a magnetic material and a green raw sheet of a conductor, followed by firing. When a raw sheet is used, it is prepared by forming through holes for coil connection in advance and stacking a magnetic material sheet on the surface of which, for example, a conductor for a coil is formed, and integrally forming and firing. To do.

FIG. 1D shows a circuit as shown in FIG. 4B, for example, by stacking the multilayer capacitor 2 on the multilayer inductor configured as shown in FIG. The laminated capacitor 2 may be formed on the front and back surfaces of the laminated inductor.

FIG. 2 is a process diagram for manufacturing another embodiment of the laminated inductor according to the present invention. In this embodiment, as shown in (a), a lower base 6a made of an electrically insulating magnetic paste containing ferrite powder mixed in a binder is printed on an insulator or a multilayer capacitor.

Next, as shown in (b), eight sets of half coils (beginning of coil winding) 7a made of a conductor paste are printed. Reference numerals 7b and 7c are connecting portions between the half coils 7a.

Next, as shown in (c), an inductor interlayer magnetic material 6b made of an electrically insulating magnetic material paste is printed between the half coils 7a, and subsequently, as shown in (d), The half coil 7d connected to the half coil 7a is printed.

Next, as shown in (e), the inductor interlayer magnetic material 6c is printed, and as shown in (f), the half coil 7e connected to the half coil 7d and the connecting portions 7f, 7g, 7h are formed. Print.

FIG. 2G shows a magnetic flux generation direction in this embodiment. That is, each frame in FIG. 2 (g) shows a coil portion formed by the half coils 7a to 7e shown in FIGS. 2 (b) to (f), and the x mark in the frame indicates from the connecting portion 7f. When an electric current flows at 7 h, magnetic flux is generated from the front side of the paper surface to the back surface, and ● indicates that it is generated from the back surface of the paper surface to the front surface. In this way, the directions of the generated magnetic flux are opposite in the adjacent coil portions.

FIG. 3A shows a chip having a size of 3.2 mm in width × 1.6 mm in length, in which two coil parts are formed horizontally and the number of turns of each coil part is 2.5. Fig. 2 (g) is a frequency characteristic diagram of noise attenuation when a high-frequency noise is added with the length of one turn of the coil being 2.59 mm and the pitch between each coil being 1.45 mm. When the directions of the magnetic flux are alternately reversed, the dotted line shows the case where the directions of the generated magnetic flux are the same in all the coil parts. As is clear from FIG. 3A, the noise reduction effect is higher in the case of the present embodiment in which the directions of the magnetic flux are reversed.

Further, FIG. 3 (B) shows that an inductor having the characteristics shown in FIG. 3 (A) is laminated with a 100 pF multilayer capacitor in an integrated structure, and the capacitor is connected to the connection part between two coil parts. 4B is a frequency characteristic diagram of the noise attenuation amount when the circuit of FIG. 4B is configured as shown in FIG. 4, the solid line shows the case of the embodiment of FIG. 2, and the dotted line shows the case where the directions of the generated magnetic fluxes are the same. . As is apparent from FIG. 3B, noise can be reduced to a higher frequency in the case of this embodiment.

FIG. 4A is a perspective view showing a structure of a coil portion according to another embodiment of the present invention. In the present embodiment, a plurality of (two in this example) electrically connected to each other. The coil portions 10 and 11 are vertically stacked, and the magnetic fluxes Φ _a and Φ _b generated in the coil portions 10 and 11 are added to each other. FIG. 4 (B) is an application example of FIG. 4 (A), in which two sets (10 and 11, 12 and 13) of the vertically stacked coil section are provided inside the inductor 3. In addition, even in the case of vertical stacking, the improvement in characteristics can be achieved as described above.

[0019]

[Effect of device]

 According to the present invention, a plurality of coil portions connected to each other are formed side by side or vertically stacked so that the magnetic fluxes generated by the adjacent coil portions are added to each other, so that a laminated layer having an excellent noise reduction effect in the high frequency range is formed. Molded electronic components are obtained.

[Brief description of drawings]

1A is a sectional view showing an embodiment of a laminated electronic component according to the present invention, FIG. 1B is a circuit diagram thereof, FIG. 1C is a perspective view showing the structure of its coil portion, and FIG. 5 is a cross-sectional view showing another embodiment of the present invention.

2A to 2F are manufacturing process diagrams of another embodiment of the present invention, and FIG. 2G is an explanatory diagram of the generated magnetic flux.

3A is a frequency characteristic diagram of noise attenuation amount of the embodiment of FIG. 2, FIG. 3B is a frequency characteristic diagram of noise attenuation amount of an electronic component in which a capacitor is combined with the embodiment of FIG. FIG. 9 is a frequency characteristic diagram of noise attenuation when the directions of magnetic flux generation are the same.

FIG. 4A is a perspective view showing a configuration of a coil portion of another embodiment of the present invention, and FIG. 4B is a sectional view showing another embodiment of the present invention.

FIG. 5A is a cross-sectional view showing a conventional laminated electronic component,
(B) is a circuit diagram thereof.

[Explanation of symbols]

 2 Multilayer capacitor 3 Multilayer inductor 4 Dielectrics 5 and 7 Conductor 6 Magnetic substance 8 Terminal electrode 10-13 Coil part C  Capacitor L₁, L₂ Inductor

Claims (2)

[Scope of utility model registration request] 1. A sintered body in which a magnetic material and a coil-forming conductor are laminated, and an inductor is formed so that at least two coil portions are arranged side by side or vertically, and at least two coil portions are formed. For noise countermeasures, the coil parts that are electrically conductive and are adjacent to each other are connected so that the magnetic flux generated by the current flowing through the coil part adds to each other at the center of the coil part. Multi-layer electronic component. 2. A multilayer electronic component for noise suppression, comprising a multilayer capacitor superposed on at least one surface of the inductor according to claim 1.