JPH0612711B2 - Electroluminescence and method for manufacturing the same - Google Patents
Electroluminescence and method for manufacturing the sameInfo
- Publication number
- JPH0612711B2 JPH0612711B2 JP1024497A JP2449789A JPH0612711B2 JP H0612711 B2 JPH0612711 B2 JP H0612711B2 JP 1024497 A JP1024497 A JP 1024497A JP 2449789 A JP2449789 A JP 2449789A JP H0612711 B2 JPH0612711 B2 JP H0612711B2
- Authority
- JP
- Japan
- Prior art keywords
- transparent
- light emitting
- emitting layer
- transparent electrode
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005401 electroluminescence Methods 0.000 title claims description 27
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000000034 method Methods 0.000 title claims description 11
- 239000000758 substrate Substances 0.000 claims description 43
- 239000006096 absorbing agent Substances 0.000 claims description 19
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229920002799 BoPET Polymers 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- -1 fluororesin Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 229920006352 transparent thermoplastic Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電界の発生により発光する発光層を備えたエ
レクトロルミネッセンスおよびその製造方法に関するも
のである。TECHNICAL FIELD The present invention relates to electroluminescence having a light emitting layer that emits light when an electric field is generated, and a method for manufacturing the same.
上記のようなエレクトロルミネッセンスにおいて、所望
の発光パターンを得ようとする場合、上記発光パターン
をくり抜いた遮光フィルムをエレクトロルミネッセンス
に配設するといった手段があるが、このような構造の場
合、遮光部分で無駄な発光を行わなければならず、電力
の浪費につながる不都合がある。そこで従来は、上記発
光パターンに対応する形状に背面電極をエッチングし、
希望の発光領域にのみ電流を流すといった手段がとられ
ている。In electroluminescence as described above, when trying to obtain a desired light emission pattern, there is a means of disposing a light shielding film having the light emission pattern cut out in electroluminescence, but in the case of such a structure, in the light shielding portion Since unnecessary light emission must be performed, there is a disadvantage that power is wasted. Therefore, conventionally, the back electrode is etched into a shape corresponding to the above light emitting pattern,
Means have been taken such that an electric current is passed only to a desired light emitting region.
ところが、最近では非発光部分の透明性が重要視されて
きている。すなわち、発光部分以外の領域を透明とする
ことにより、エレクトロルミネッセンスがオフの状態で
も不透明の発光層が浮き上がって文字、図等を表示する
ことが可能となり、さらにオン状態にすればより一層の
インパクトが与えられる利点が生じる。このような構造
は、窓ガラス等に取付けた場合、一層効果的となる。However, recently, the transparency of the non-light emitting portion has been emphasized. That is, by making the area other than the light emitting part transparent, the opaque light emitting layer can be lifted to display characters, figures, etc. even when the electroluminescence is in the off state. The advantage is given. Such a structure becomes even more effective when attached to a window glass or the like.
そこで、近年は、第９図〜第１４図に示されるようなエ
レクトロルミネッセンスの製造方法が提案されるに至っ
ている。Therefore, in recent years, methods of manufacturing electroluminescence as shown in FIGS. 9 to 14 have been proposed.
まず、第９図（ａ）（ｂ）に示されるように、ガラス等
からなる第１の透明基板１０上に、ＩＴＯ（Ｉｎ
２Ｏ３，ＳｎＯ３）等からなる第１の透明電極１２を蒸
着し、この第１の透明電極１２に、第１０図（ａ）
（ｂ）に示されるようなリード線１１を配設する。次
に、第１１図（ａ）（ｂ）に示されるように、上記第１
の透明電極１２の表面に発光層１４を所望の形状に印刷
し、この発光層１４の周囲の部分に、第１２図（ａ）
（ｂ）に示される透明絶縁層１６を印刷する。一方、上
記第１０図（ａ）（ｂ）に示されたものと同様に、第１
３図に示されるような第２の透明基板１８上に第２の透
明電極２０を蒸着したものを製造し、この第２の透明電
極２０と上記発光層１４および透明絶縁層１６とを対向
させた状態で加熱加圧して両者を圧接させ、固定するこ
とにより、第１４図（ａ）（ｂ）に示されるような、非
発光部分が透明のエレクトロルミネッセンスを製造する
ことができる。First, as shown in FIGS. 9 (a) and 9 (b), ITO (In) is formed on the first transparent substrate 10 made of glass or the like.
The first transparent electrode 12 made of 2 O 3 , SnO 3 ) or the like is vapor-deposited, and the first transparent electrode 12 is deposited on the first transparent electrode 12 as shown in FIG.
The lead wire 11 as shown in (b) is arranged. Next, as shown in FIGS. 11A and 11B, the first
The light-emitting layer 14 is printed in a desired shape on the surface of the transparent electrode 12 of FIG.
The transparent insulating layer 16 shown in (b) is printed. On the other hand, in the same way as the one shown in FIGS. 10 (a) and (b) above, the first
A second transparent electrode 20 is vapor-deposited on a second transparent substrate 18 as shown in FIG. 3, and the second transparent electrode 20 is opposed to the light emitting layer 14 and the transparent insulating layer 16. By heating and pressurizing them in such a state to bring them into pressure contact with each other and fixing them, electroluminescence having a transparent non-light emitting portion as shown in FIGS. 14 (a) and 14 (b) can be manufactured.
なお、上記工程において第２の透明基板１８側に第２の
透明電極２０を蒸着しているのは、例えば発光層１４側
に蒸着すると、第２の透明電極２０を構成する分子が発
光層１４に形成されたピンホールを通って該発光層１４
を通過してしまう不都合があり、また、上記第２の透明
電極２０を印刷により配設するようにすると、この透明
電極２０の層厚が大きくなって透明度が低下する不都合
があるためである。In the above step, the second transparent electrode 20 is vapor-deposited on the second transparent substrate 18 side. For example, when vapor-deposited on the light-emitting layer 14 side, the molecules forming the second transparent electrode 20 are emitted from the light-emitting layer 14 side. Through the pinhole formed in the luminescent layer 14
This is because there is an inconvenience of passing through the second transparent electrode 20, and when the second transparent electrode 20 is arranged by printing, the layer thickness of the transparent electrode 20 becomes large and the transparency is lowered.
このような製造方法の他、例えば特開昭５７−２０２５
９１号公報には、上記第１の透明電極上に所望に形状の
透孔を設けた絶縁フィルムを接着し、上記透孔内に発光
層１４を塗布する方法が示されている。In addition to such a manufacturing method, for example, JP-A-57-2025
Japanese Patent No. 91 discloses a method in which an insulating film having a through hole having a desired shape is adhered onto the first transparent electrode and the light emitting layer 14 is applied in the through hole.
上記図面や公報に示される製造工程において、第１の透
明電極１２上に配設される発光層１４の表面、および第
２の透明基板１８上に配設される第２の透明電極２０の
表面には、それぞれ第１５図に示されるような微小の凹
凸１４１，２０１が形成されている。従って、同図に示
されるように上記発光層１４および透明絶縁層１６と第
２の透明電極２０とを接触させた状態で、両者の間に隙
間２２が生じる。しかも、第２の透明電極２０は硬質の
透明基板１８側に突出変形することができないため、両
者を圧接させても上記隙間２２を滅することはできな
い。このような隙間２２は、発光ムラや発光層１４の劣
化の原因となり易く、その除去が課題となっている。こ
れは、透明絶縁層１６と第２の透明電極２０との間につ
いても言えることである。In the manufacturing process shown in the drawings and the publication, the surface of the light emitting layer 14 provided on the first transparent electrode 12 and the surface of the second transparent electrode 20 provided on the second transparent substrate 18. The minute irregularities 141 and 201 as shown in FIG. Therefore, as shown in the figure, in the state where the light emitting layer 14 and the transparent insulating layer 16 are in contact with the second transparent electrode 20, a gap 22 is formed between them. Moreover, since the second transparent electrode 20 cannot project and deform toward the hard transparent substrate 18 side, the gap 22 cannot be destroyed even when both are pressed. Such a gap 22 is likely to cause unevenness in light emission and deterioration of the light emitting layer 14, and removal thereof is a problem. This is also true between the transparent insulating layer 16 and the second transparent electrode 20.
なお、上記隙間２２を除去する手段として、圧着時の加
熱温度を高め、上記第２の透明電極２０を一部融解変形
させることにより上記凹凸１４１，２０１を吸収するこ
とが考えられるが、第２の透明電極２０を構成する透明
導電物質は比較的融点が高いため、上記凹凸１４１，２
０１を吸収する前に発光層１４における発光素子のバイ
ンダーや透明絶縁層１６が熱分解を起こすおそれがあ
る。As a means for removing the gap 22, it is conceivable to raise the heating temperature at the time of pressure bonding and partially melt and deform the second transparent electrode 20 to absorb the irregularities 141 and 201. Since the transparent conductive material forming the transparent electrode 20 has a relatively high melting point,
Before absorbing 01, the binder of the light emitting element in the light emitting layer 14 and the transparent insulating layer 16 may be thermally decomposed.
本発明は、このような事情に鑑み、非発光部分が透明
で、かつ、発光層および透明絶縁層と透明電極との間の
隙間を不都合なく除去することができるエレクトロルミ
ネッセンスおよびその製造方法を提供することを目的と
する。In view of the above circumstances, the present invention provides an electroluminescence device in which the non-light emitting portion is transparent, and a gap between the light emitting layer and the transparent insulating layer and the transparent electrode can be removed without any inconvenience, and a manufacturing method thereof. The purpose is to do.
本発明は、第１の透明基板と、第１の透明電極と、所望
の形状に配設された発光層およびこの発光層と略等しい
厚さを有し該発光層の周囲に配設される透明絶縁層と、
第２の透明電極と、第２の透明基板とが順次積層される
エレクトロルミネッセンスの製造方法であって、第１の
透明基板上に第１の透明電極を蒸着し、この第１の透明
電極上に発光層を所望の形状に配設し、この発光層の周
囲の部分に該発光層と略等しい厚さで透明絶縁層を配設
する一方、凹凸吸収体の一方の面に第２の透明電極を蒸
着し、他方の面を第２の透明基板に接着し、次いで、上
記発光層および透明絶縁層と第２の透明電極とを圧接さ
せた状態で固定するものである。この方法では、凹凸吸
収体の一方の面に第２の透明電極を蒸着した後、この第
２の透明電極を上記発光層および透明絶縁層に対向させ
ながらこれら発光層および透明絶縁層の上に上記第２の
透明電極及び凹凸吸収体を載せ、この凹凸吸収体の他方
の面を第２の透明基板に接着し、次いで、上記発光層お
よび透明絶縁層の第２の透明電極とを圧接させた状態で
固定するようにしてもよいし、凹凸吸収体の一方の面に
第２の透明電極を蒸着し、他方の面を第２の透明基板に
接着した後、上記第２の透明電極を上記発光層および透
明絶縁層に対向させながらこれら発光層および透明絶縁
層の上に上記第２の透明電極および凹凸吸収体を載せ、
次いで、上記発光層および透明絶縁層と第２の透明電極
とを圧接させた状態で固定するようにしてもよい。According to the present invention, a first transparent substrate, a first transparent electrode, a light emitting layer arranged in a desired shape, and a light emitting layer having a thickness substantially equal to that of the light emitting layer and arranged around the light emitting layer. A transparent insulating layer,
A method of manufacturing an electroluminescence in which a second transparent electrode and a second transparent substrate are sequentially laminated, wherein a first transparent electrode is vapor-deposited on the first transparent substrate, and the first transparent electrode is deposited on the first transparent electrode. A light-emitting layer in a desired shape, and a transparent insulating layer having a thickness approximately equal to that of the light-emitting layer is provided around the light-emitting layer, while a second transparent material is formed on one surface of the uneven absorber. The electrode is vapor-deposited, the other surface is adhered to the second transparent substrate, and then the light emitting layer and the transparent insulating layer and the second transparent electrode are fixed in pressure contact. In this method, after depositing a second transparent electrode on one surface of the unevenness absorber, the second transparent electrode is placed on the light emitting layer and the transparent insulating layer while facing the light emitting layer and the transparent insulating layer. The second transparent electrode and the irregularity absorber are placed, the other surface of the irregularity absorber is adhered to a second transparent substrate, and then the second transparent electrode of the light emitting layer and the transparent insulating layer is brought into pressure contact with each other. The second transparent electrode may be deposited on one surface of the unevenness absorber and the other surface may be bonded to a second transparent substrate, and then the second transparent electrode may be fixed. The second transparent electrode and the unevenness absorber are placed on the light emitting layer and the transparent insulating layer while facing the light emitting layer and the transparent insulating layer,
Then, the light emitting layer and the transparent insulating layer and the second transparent electrode may be fixed in a state of being in pressure contact with each other.
また本発明は、第１の透明基板と、第１の透明電極と、
所望の形状に配設された発光層およびこの発光層と略等
しい厚さを有し該発光層の周囲に配設される透明絶縁層
と、第２の透明電極と、第２の透明基板が順次積層され
たエレクトロルミネッセンスにおいて、上記第２の透明
電極と第２の透明基板との間に透明な凹凸吸収体を配設
したものである。The present invention also includes a first transparent substrate, a first transparent electrode,
A light emitting layer arranged in a desired shape, a transparent insulating layer having a thickness substantially equal to that of the light emitting layer and arranged around the light emitting layer, a second transparent electrode, and a second transparent substrate are provided. In electroluminescence that is sequentially laminated, a transparent unevenness absorber is arranged between the second transparent electrode and the second transparent substrate.
上記構成によれば、第２の透明電極の凹凸が凹凸吸収体
により吸収されるので、第２の透明電極は、発光層およ
び透明絶縁層と第２の透明電極とを圧接するときに、発
光層および透明絶縁層の表面形状に応じて自由に変形す
ることができる。従って、大きな圧力や温度が加えられ
なくても両者の間の隙間が除去される。According to the above configuration, since the unevenness of the second transparent electrode is absorbed by the unevenness absorber, the second transparent electrode emits light when the light emitting layer and the transparent insulating layer are pressed against the second transparent electrode. It can be freely deformed depending on the surface shape of the layer and the transparent insulating layer. Therefore, the gap between the two is removed even if a large pressure or temperature is not applied.
本発明のエレクトロルミネッセンスの製造方法の一例を
第１図〜第８図に基づいて説明する。なお、上記第９図
〜第１５図に図示されたものと同等のものについては同
じ参照符を付す。An example of the method for manufacturing electroluminescence according to the present invention will be described with reference to FIGS. 1 to 8. The same parts as those shown in FIGS. 9 to 15 are designated by the same reference numerals.
まず、第１図（ａ）（ｂ）に示されるように、ガラス等
からなる第１の透明基板１０の片面に、光透過性を有す
る第１の透明電極１２を蒸着し、この第１の透明電極１
２にリード線１１を接続する。上記第１の透明電極１２
は、上述のＩＴＯや二酸化スズ（ＳｎＯ２；スズネサ）
等の透明導電物質を温度400〜500℃の下で蒸着法やスパ
ッタ法により第１の透明基板１０に付着させたものが好
適である。First, as shown in FIGS. 1A and 1B, a first transparent electrode 12 having a light-transmitting property is vapor-deposited on one surface of a first transparent substrate 10 made of glass or the like. Transparent electrode 1
The lead wire 11 is connected to 2. The first transparent electrode 12
Is the above-mentioned ITO or tin dioxide (SnO 2 ; tinnesa)
It is preferable that a transparent conductive material such as the above is attached to the first transparent substrate 10 at a temperature of 400 to 500 ° C. by a vapor deposition method or a sputtering method.
次に、第２図（ａ）（ｂ）に示されるように、上記第１
の透明電極１２の上に、発光層１４を印刷によって所望
の発光パターンに対応する形状に配設する。この発光層
１４としては、硫化亜鉛（ＺｎＳ）等の蛍光体粒子を適
当なバインダー中に配設したものが好適であり、厚さは
４０μｍ程度が望ましい。Next, as shown in FIGS. 2A and 2B, the first
The light emitting layer 14 is arranged on the transparent electrode 12 by printing in a shape corresponding to a desired light emitting pattern. The light emitting layer 14 is preferably made by disposing phosphor particles such as zinc sulfide (ZnS) in a suitable binder, and the thickness is preferably about 40 μm.
この発光層１４の配設部分以外の領域には、上記発光層
１４と同様にして該発光層１４と略等しい厚さに透明絶
縁層１６を印刷により配設する（第３図（ａ）
（ｂ））。この透明絶縁層１６としては、透明シリコン
やフッ素樹脂、ワニス類のもの等が好適であるが、透明
で発光層１４等に影響を与えないものであれば、その材
質を問わない。In a region other than the portion where the light emitting layer 14 is provided, a transparent insulating layer 16 having a thickness substantially equal to that of the light emitting layer 14 is provided by printing similarly to the light emitting layer 14 (FIG. 3 (a)).
(B)). The transparent insulating layer 16 is preferably made of transparent silicon, fluororesin, varnish, or the like, but may be made of any material as long as it is transparent and does not affect the light emitting layer 14 or the like.
一方、これとは別に、第４図（ａ）（ｂ）に示されるよ
うに、ＰＥＴフィルム（ポリエステル樹脂フィルム；透
明な凹凸吸収体）２４の片面に上記第１の透明電極１２
と同様の第２の透明電極２０を蒸着し、これにリード線
２６を接続する。なお、本発明における凹凸吸収体は上
記ＰＥＴフィルム２４に限らず、他の透明な合成樹脂等
からなるものでもよいが、ある程度の耐熱性と、第２の
透明電極２０の蒸着容易性が必要とされ、具体的にはポ
リカーボネイト、ＰＥＳ（ポリエーテルサルホン）等が
適用可能である。Separately from this, as shown in FIGS. 4A and 4B, the first transparent electrode 12 is formed on one side of a PET film (polyester resin film; transparent uneven absorber) 24.
The second transparent electrode 20 similar to the above is vapor-deposited, and the lead wire 26 is connected thereto. The unevenness absorber in the present invention is not limited to the PET film 24, and may be made of another transparent synthetic resin or the like, but it is necessary that it has heat resistance to some extent and that the second transparent electrode 20 is easily deposited. Specifically, polycarbonate, PES (polyether sulfone), etc. are applicable.
次に、上記第４図（ａ）（ｂ）に示されたものを、第５
図に示されるように、上記第２の透明電極２０と発光層
１４および透明絶縁層１６とを対向させるようにしなが
ら、上記第３図（ａ）（ｂ）に示されたものの上に載
せ、さらに、上記ＰＥＴフィルム２４の上面に透明な熱
可塑性の接着剤を塗布して、上記第１の透明基板１０と
同様の第２の透明基板１８を接着する。Next, the one shown in FIG.
As shown in the figure, while placing the second transparent electrode 20 and the light emitting layer 14 and the transparent insulating layer 16 so as to face each other, the second transparent electrode 20 is placed on the one shown in FIGS. 3 (a) and 3 (b). Further, a transparent thermoplastic adhesive is applied to the upper surface of the PET film 24, and the second transparent substrate 18 similar to the first transparent substrate 10 is bonded.
この状態のものを約50〜200℃、１〜３気圧の下で加熱
加圧することにより、上記第２の透明電極２０と発光層
１４および透明絶縁層１６とを圧接させる（第６図
（ａ）（ｂ））。そして、４つの各側面（小口）をフッ
素系接着剤もしくは低融点ガラスでカバーして固定する
ことにより、発光層１４以外の部分が透明なエレクトロ
ルミネッセンスを製造することができる。The second transparent electrode 20 and the light emitting layer 14 and the transparent insulating layer 16 are brought into pressure contact with each other by heating and pressurizing the one in this state at about 50 to 200 ° C. under 1 to 3 atmospheres (see FIG. ) (B)). Then, by covering and fixing each of the four side surfaces (edges) with a fluorine-based adhesive or a low-melting glass, it is possible to manufacture electroluminescence in which the portion other than the light emitting layer 14 is transparent.
第７図および第８図は、加熱加圧前および加熱加圧後の
ＰＥＴフィルム２４、第２の透明電極２０、および発光
層１４の状態をそれぞれ示したものである。FIG. 7 and FIG. 8 show the states of the PET film 24, the second transparent electrode 20, and the light emitting layer 14 before and after heating and pressing, respectively.
上記第１５図に示されるように、第２の透明電極２０が
第２の透明基板１８に直接蒸着されている構造では、こ
の第２の透明電極２０と発光層１４とを対向させて押付
けても、上記第２の透明基板１８が硬質であるために第
２の透明電極２０が変形できず、両者の隙間２２は除去
され得ない。これに対し、第７図および第８図に示され
るように軟質のＰＥＴフィルム２４が配設されている
と、このＰＥＴフィルム２４により第２の透明電極２０
の凹凸が吸収されるため、第２の透明電極２０は上記発
光層１４の凹凸に沿って自在に変形する。従って、比較
的低い温度および圧力で加熱するだけでも、発光層１４
と第２の透明電極２０との間に形成される隙間を十分に
除去することができ、両者を良好に圧接させることがで
きる。これは、透明絶縁層１６と第２の透明電極２０と
の間についても同じであることは言うまでもない。As shown in FIG. 15 above, in the structure in which the second transparent electrode 20 is directly vapor-deposited on the second transparent substrate 18, the second transparent electrode 20 and the light emitting layer 14 are pressed against each other. However, since the second transparent substrate 18 is hard, the second transparent electrode 20 cannot be deformed and the gap 22 between the two cannot be removed. On the other hand, when the soft PET film 24 is provided as shown in FIGS. 7 and 8, the second transparent electrode 20 is provided by the PET film 24.
Since the irregularities of the second transparent electrode 20 are absorbed, the second transparent electrode 20 is freely deformed along the irregularities of the light emitting layer 14. Therefore, even by heating at a relatively low temperature and pressure, the light emitting layer 14
The gap formed between the second transparent electrode 20 and the second transparent electrode 20 can be sufficiently removed, and both can be satisfactorily pressed against each other. It goes without saying that this is the same between the transparent insulating layer 16 and the second transparent electrode 20.
このような観点から、上記ＰＥＴフィルム２４の層厚は
約75〜200μｍが妥当である。From this point of view, it is appropriate that the layer thickness of the PET film 24 is approximately 75 to 200 μm.
上記エレクトロルミネッセンスの好適な使用例として
は、例えば、高層ビルの窓に配設される赤色の正三角形
のシールの代わりに用いることが挙げられる。上記シー
ルは、火事の場合に消防隊員が突入できる箇所を示すも
のであるが、これに上記エレクトロルミネッセンスを代
用することにより、火事の煙に覆われた時や夜中でも上
記箇所を鮮明に表示することができる。A preferable example of the use of the electroluminescence is, for example, use in place of a red regular triangular seal disposed in a window of a high-rise building. The above-mentioned sticker shows the place where the firefighters can rush in case of fire, but by substituting the electroluminescence for this, the place is clearly displayed even when covered by fire smoke or at night. be able to.
なお、このようなエレクトロルミネッセンスを両面発光
体ではなく片面発光体として利用する場合には、発光層
１４の裏側にチタン酸バリウム等の誘電体物質を印刷等
で配設してもよい。この誘電体物質は光反射性をもつも
のであるため、片側に強力な光を照射することが必要な
場合は特に効果的である。また、上記誘電体物質の層の
表面にニッケルや銀等の導電率の大きな物質を印刷する
ことにより、透明電極と誘電体物質が完全に接触してい
ないときの発光ムラを抑制することができる。When such electroluminescence is used as a single-sided light emitting body instead of a double-sided light emitting body, a dielectric substance such as barium titanate may be provided on the back side of the light emitting layer 14 by printing or the like. Since this dielectric substance has light reflectivity, it is particularly effective when it is necessary to irradiate one side with strong light. Further, by printing a material having a large electric conductivity such as nickel or silver on the surface of the layer of the dielectric material, it is possible to suppress light emission unevenness when the transparent electrode and the dielectric material are not completely in contact with each other. .
また、前記実施例では、発光層１４および透明絶縁層１
６の上に第２の透明電極２０を載せた後に、ＰＥＴフィ
ルム２４の上面に第２の透明基板１８を接着するように
しているが、先にＰＥＴフィルム２４と第２の透明基板
１８とを接着し、その後に第２の透明電極２０を発光層
１４および透明絶縁層１６の上に載せるようにしてもよ
い。In addition, in the above-described embodiment, the light emitting layer 14 and the transparent insulating layer 1
After the second transparent electrode 20 is placed on 6, the second transparent substrate 18 is adhered to the upper surface of the PET film 24. The PET film 24 and the second transparent substrate 18 are first attached to each other. The second transparent electrode 20 may be adhered and then placed on the light emitting layer 14 and the transparent insulating layer 16.
また、前記実施例において、ＰＥＴフィルム２４、第２
の透明電極２０、および絶縁層１６の面積を第２の透明
基板１８の面積よりも小さくし、この第２の透明基板１
８と第２の透明電極２０とを接着させるための接着剤を
第１の透明電極１２の表面まで流すようにすれば、第２
の透明電極２０と発光層１４および絶縁層１６とを圧接
させた後の固定をより確実に行うことができる。Also, in the above embodiment, the PET film 24, the second
The area of the transparent electrode 20 and the insulating layer 16 is smaller than the area of the second transparent substrate 18, and the second transparent substrate 1
If the adhesive for adhering the second transparent electrode 20 and the second transparent electrode 20 is made to flow to the surface of the first transparent electrode 12,
After the transparent electrode 20 and the light emitting layer 14 and the insulating layer 16 are brought into pressure contact with each other, they can be more reliably fixed.
以上のように本発明は、第２の透明電極と第２の透明基
板との間に凹凸吸収体を配設し、上記第２の透明電極と
発光層および透明絶縁層とを圧着する時の第２の透明電
極に発生する凹凸を上記凹凸吸収体で吸収するようにし
たものであるので、僅かな圧力や温度を加えるだけで上
記第２の透明電極と発光層および透明絶縁層との間に形
成される隙間を除去することができ、これによって、非
発光部分が透明で、かつ発光層の劣化や発光ムラの少な
いエレクトロルミネッセンスを得ることができる。As described above, according to the present invention, when the unevenness absorber is disposed between the second transparent electrode and the second transparent substrate and the second transparent electrode and the light emitting layer and the transparent insulating layer are pressure-bonded to each other, Since the unevenness generated in the second transparent electrode is absorbed by the unevenness absorber, the unevenness between the second transparent electrode and the light emitting layer and the transparent insulating layer can be achieved by applying a slight pressure or temperature. It is possible to remove the gap formed in the above, whereby it is possible to obtain the electroluminescence in which the non-light emitting portion is transparent, and the light emitting layer is less deteriorated and the light emission is less uneven.
第１図（ａ）（ｂ）は第１の透明基板上に第１の透明電
極を蒸着した状態を示す平面図および断面図、第２図
（ａ）（ｂ）は上記第１の透明電極上に発光層を配設し
た状態を示す平面図および断面図、第３図（ａ）（ｂ）
は上記発光層の周囲に透明絶縁層を配設した状態を示す
平面図および断面図、第４図（ａ）（ｂ）はＰＥＴフィ
ルムに第２の透明電極を蒸着した状態を示す平面図およ
び断面図、第５図は上記第３図（ａ）（ｂ）に示される
ものと第４図（ａ）（ｂ）に示されるものと第２の透明
基板とを積層順に示した断面図、第６図（ａ）（ｂ）は
上記第３図（ａ）（ｂ）に示されるものと第４図（ａ）
（ｂ）に示されるものと第２の透明基板とを順に積層し
た状態を示す平面図および断面図、第７図は圧着前のＰ
ＥＴフィルムと第２の透明電極と発光層の断面図、第８
図は圧着後のＰＥＴフィルムと第２の透明電極と発光層
の断面図、第９図（ａ）（ｂ）は従来のエレクトロルミ
ネッセンスの製造工程において第１の透明基板にリード
線を取付けた状態を示す平面図および断面図、第１０図
（ａ）（ｂ）は上記第１の透明基板に第１の透明電極を
蒸着した状態を示す平面図および断面図、第１１図
（ａ）（ｂ）は上記第１の透明電極上に発光層を配設し
た状態を示す平面図および断面図、第１２図（ａ）
（ｂ）は上記発光層の周囲に透明絶縁層を配設した状態
を示す平面図および断面図、第１３図は第１２図（ａ）
（ｂ）に示されたものと第９図（ａ）（ｂ）に示された
ものとを積層する前の状態を示す断面図、第１４図
（ａ）（ｂ）は従来の製造工程により製造されたエレク
トロルミネッセンスを示す平面図および断面図、第１５
図は同エレクトロルミネッセンスにおいて発光層と第２
の透明電極との間に形成された隙間を示す断面図であ
る。 １０…第１の透明基板、１２…第１の透明電極、１４…
発光層、１６…透明絶縁層、１８…第２の透明基板、２
０…第２の透明電極、２４…ＰＥＴフィルム（凹凸吸収
体）。1 (a) and 1 (b) are a plan view and a cross-sectional view showing a state in which a first transparent electrode is vapor-deposited on a first transparent substrate, and FIGS. 2 (a) and 2 (b) are the first transparent electrode. The top view and sectional drawing which show the state which has arrange | positioned the light emitting layer on it, FIG.3 (a) (b)
Is a plan view and a sectional view showing a state in which a transparent insulating layer is provided around the light emitting layer, and FIGS. 4 (a) and 4 (b) are plan views showing a state in which a second transparent electrode is vapor-deposited on a PET film and A sectional view, FIG. 5 is a sectional view showing the one shown in FIGS. 3 (a) and (b), the one shown in FIGS. 4 (a) and (b), and the second transparent substrate in the order of lamination, FIGS. 6 (a) and 6 (b) are the same as those shown in FIGS. 3 (a) and 3 (b) and FIG. 4 (a).
The top view and sectional drawing which show the state which laminated | stacked what was shown to (b) and the 2nd transparent substrate in order, FIG. 7: P before pressure bonding
Sectional view of ET film, second transparent electrode and light emitting layer, 8th
The figure shows a cross-sectional view of the PET film, the second transparent electrode, and the light emitting layer after pressure bonding, and FIGS. 9 (a) and 9 (b) show a state in which the lead wire is attached to the first transparent substrate in the conventional electroluminescence manufacturing process. And (a) and (b) are plan views and sectional views showing a state in which the first transparent electrode is vapor-deposited on the first transparent substrate, and FIGS. 11 (a) and (b). ) Is a plan view and a cross-sectional view showing a state in which a light emitting layer is disposed on the first transparent electrode, FIG. 12 (a).
(B) is a plan view and a sectional view showing a state in which a transparent insulating layer is provided around the light emitting layer, and FIG. 13 is FIG. 12 (a).
FIG. 14A and FIG. 14B are sectional views showing a state before laminating the one shown in FIG. 9B and the one shown in FIGS. Plan view and sectional view showing the manufactured electroluminescence, 15th
The figure shows the second layer and the light-emitting layer in the same electroluminescence.
FIG. 6 is a cross-sectional view showing a gap formed between the transparent electrode and the transparent electrode. 10 ... 1st transparent substrate, 12 ... 1st transparent electrode, 14 ...
Light-emitting layer, 16 ... Transparent insulating layer, 18 ... Second transparent substrate, 2
0 ... 2nd transparent electrode, 24 ... PET film (unevenness absorber).
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭57−165996（ＪＰ，Ａ) 特開 昭58−165291（ＪＰ，Ａ) 特開 昭57−101376（ＪＰ，Ａ) 実開 昭62−171199（ＪＰ，Ｕ) 実開 平２−62697（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-57-165996 (JP, A) JP-A-58-165291 (JP, A) JP-A-57-101376 (JP, A) Actual development Sho-62- 171199 (JP, U) Actual development flat 2-62697 (JP, U)
Claims (4)
望の形状に配設された発光層およびこの発光層と略等し
い厚さを有し該発光層の周囲に配設される透明絶縁層
と、第２の透明電極と、第２の透明基板とが順次積層さ
れるエレクトロルミネッセンスの製造方法であって、第
１の透明基板上に第１の透明電極を蒸着し、この第１の
透明電極上に発光層を所望の形状に配設し、この発光層
の周囲の部分に該発光層と略等しい厚さで透明絶縁層を
配設する一方、凹凸吸収体の一方の面に第２の透明電極
を蒸着し、他方の面を第２の透明基板に接着し、次い
で、上記発光層および透明絶縁層と第２の透明電極とを
圧接させた状態で固定することを特徴とするエレクトロ
ルミネッセンスの製造方法。1. A first transparent substrate, a first transparent electrode, a light emitting layer arranged in a desired shape, and a light emitting layer having a thickness substantially equal to that of the light emitting layer and arranged around the light emitting layer. A method of manufacturing an electroluminescence in which a transparent insulating layer, a second transparent electrode, and a second transparent substrate are sequentially laminated, wherein a first transparent electrode is vapor-deposited on the first transparent substrate. A light emitting layer is arranged in a desired shape on the first transparent electrode, and a transparent insulating layer is arranged in a peripheral portion of the light emitting layer with a thickness substantially equal to that of the light emitting layer. The second transparent electrode is vapor-deposited on the surface, the other surface is adhered to the second transparent substrate, and then the light emitting layer and the transparent insulating layer and the second transparent electrode are fixed in a state of being pressed against each other. A method for producing a characteristic electroluminescence.
の製造方法において、第１の透明基板上に第１の透明電
極を蒸着し、この第１の透明電極上に発光層を所望の形
状に配設し、この発光層の周囲の部分に該発光層と略等
しい厚さで透明絶縁層を配設する一方、凹凸吸収体の一
方の面に第２の透明電極を蒸着した後、この第２の透明
電極を上記発光層および透明絶縁層に対向させながらこ
れら発光層および透明絶縁層の上に上記第２の透明電極
及び凹凸吸収体を載せ、この凹凸吸収体の他方の面を第
２の透明基板に接着し、次いで、上記発光層および透明
絶縁層と第２の透明電極とを圧接させた状態で固定する
ことを特徴とするエレクトロルミネッセンスの製造方
法。2. The method for manufacturing electroluminescence according to claim 1, wherein a first transparent electrode is vapor-deposited on the first transparent substrate, and the light-emitting layer is arranged in a desired shape on the first transparent electrode. Then, a transparent insulating layer having a thickness substantially equal to that of the light emitting layer is provided around the light emitting layer, while a second transparent electrode is vapor-deposited on one surface of the unevenness absorber, and then the second transparent electrode is deposited. The second transparent electrode and the uneven absorber are placed on the light emitting layer and the transparent insulating layer while the transparent electrode is opposed to the light emitting layer and the transparent insulating layer, and the other surface of the uneven absorber is the second transparent layer. A method for manufacturing electroluminescence, which comprises adhering to a substrate, and then fixing the light-emitting layer and the transparent insulating layer and the second transparent electrode in pressure contact with each other.
の製造方法において、第１の透明基板上に第１の透明電
極を蒸着し、この第１の透明電極上に発光層を所望の形
状に配設し、この発光層の周囲の部分に該発光層と略等
しい厚さで透明絶縁層を配設する一方、凹凸吸収体の一
方の面に第２の透明電極を蒸着し、他方の面を第２の透
明基板に接着した後、上記第２の透明電極を上記発光層
および透明絶縁層に対向させながらこれら発光層および
透明絶縁層の上に上記第２の透明電極及び凹凸吸収体を
載せ、次いで、上記発光層および透明絶縁層の第２の透
明電極とを圧接させた状態で固定することを特徴とする
エレクトロルミネッセンスの製造方法。3. The method for manufacturing electroluminescence according to claim 1, wherein a first transparent electrode is vapor-deposited on the first transparent substrate, and a light emitting layer is arranged in a desired shape on the first transparent electrode. Then, a transparent insulating layer having a thickness substantially equal to that of the light emitting layer is arranged around the light emitting layer, while a second transparent electrode is vapor-deposited on one surface of the unevenness absorber and the other surface is covered with a second transparent electrode. After adhering to the second transparent substrate, the second transparent electrode and the uneven absorber are placed on the light emitting layer and the transparent insulating layer while facing the second transparent electrode to the light emitting layer and the transparent insulating layer, Next, a method for manufacturing electroluminescence, which comprises fixing the light emitting layer and the second transparent electrode of the transparent insulating layer in a state of being in pressure contact with each other.
望の形状に配設された発光層およびこの発光層と略等し
い厚さを有し該発光層の周囲に配設される透明絶縁層
と、第２の透明電極と、第２の透明基板が順次積層され
たエレクトロルミネッセンスにおいて、上記第２の透明
電極と第２の透明基板との間に透明な凹凸吸収体を配設
したことを特徴とするエレクトロルミネッセンス。4. A first transparent substrate, a first transparent electrode, a light emitting layer arranged in a desired shape, and a light emitting layer having a thickness substantially equal to that of the light emitting layer and arranged around the light emitting layer. In the electroluminescence in which the transparent insulating layer, the second transparent electrode, and the second transparent substrate are sequentially laminated, a transparent unevenness absorber is arranged between the second transparent electrode and the second transparent substrate. Electroluminescence characterized by being installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1024497A JPH0612711B2 (en) | 1989-02-01 | 1989-02-01 | Electroluminescence and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1024497A JPH0612711B2 (en) | 1989-02-01 | 1989-02-01 | Electroluminescence and method for manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02204995A JPH02204995A (en) | 1990-08-14 |
| JPH0612711B2 true JPH0612711B2 (en) | 1994-02-16 |
Family
ID=12139815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1024497A Expired - Lifetime JPH0612711B2 (en) | 1989-02-01 | 1989-02-01 | Electroluminescence and method for manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0612711B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0963686B1 (en) * | 1997-09-24 | 2001-12-12 | Koninklijke Philips Electronics N.V. | Organic electroluminescent device |
| JP4736952B2 (en) * | 2006-05-25 | 2011-07-27 | パナソニック電工株式会社 | Double-sided light-emitting panel lighting fixture |
| JP5593620B2 (en) | 2009-03-05 | 2014-09-24 | セイコーエプソン株式会社 | Illumination device and display device |
| US8285463B2 (en) * | 2009-08-11 | 2012-10-09 | GM Global Technology Operations LLC | Method and system for calibrating a pressure sensor for an automatic transmission |
-
1989
- 1989-02-01 JP JP1024497A patent/JPH0612711B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02204995A (en) | 1990-08-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0224992A (en) | Film el panel | |
| JPH06203954A (en) | Electroluminescent element | |
| JPH06267654A (en) | Manufacture of electroluminescence panel | |
| JPH02153318A (en) | Patterned dimming material and its production | |
| JPH0612711B2 (en) | Electroluminescence and method for manufacturing the same | |
| JPH06223966A (en) | Organic dispersion type el panel | |
| JPH06283265A (en) | Electroluminescent lamp and manufacture thereof and equipment for manufacture thereof | |
| JPH074793Y2 (en) | EL element structure | |
| JPH0540501Y2 (en) | ||
| JPH05290972A (en) | El element and manufacture thereof | |
| JPH07302685A (en) | Manufacture of electroluminescent lamp | |
| JP2003068447A (en) | El lamp and its manufacturing method | |
| JPH05299178A (en) | El element | |
| JPH06338393A (en) | Thin electroluminescence lamp and manufacture thereof | |
| JPH0568803B2 (en) | ||
| JP2505173Y2 (en) | Electroluminescent lamp | |
| JP3542019B2 (en) | Electroluminescent lamp | |
| WO2005057986A1 (en) | Surface luminance and manufacturing method thereof | |
| JPH04126224U (en) | dimming panel | |
| JPS6310637Y2 (en) | ||
| JP3218104B2 (en) | Electroluminescence element | |
| JPH0115117Y2 (en) | ||
| JPH0824073B2 (en) | Electroluminescent device and method of manufacturing the same | |
| JPH0410075B2 (en) | ||
| JP2000164348A (en) | El panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090216 Year of fee payment: 15 |
|
| EXPY | Cancellation because of completion of term |