JPH06125167A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH06125167A JPH06125167A JP27579892A JP27579892A JPH06125167A JP H06125167 A JPH06125167 A JP H06125167A JP 27579892 A JP27579892 A JP 27579892A JP 27579892 A JP27579892 A JP 27579892A JP H06125167 A JPH06125167 A JP H06125167A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- mounting
- adhesive
- bond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、プリント配線基板に
面実装ＩＣを取付ける構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for mounting a surface mounting IC on a printed wiring board.
【０００２】[0002]
【従来の技術】図２は従来のプリント配線基板に面実装
ＩＣが取付けられた状態を表わす図である。図におい
て、１はプリント配線基板の基材、２は銅箔、３はレジ
ストインク、４は面実装ＩＣ、５は面実装ＩＣ４を基材
１に取付けるためのボンド等の接着剤、６は面実装ＩＣ
４の端子である。2. Description of the Related Art FIG. 2 is a view showing a state in which a surface mounting IC is attached to a conventional printed wiring board. In the figure, 1 is a base material of a printed wiring board, 2 is a copper foil, 3 is a resist ink, 4 is a surface-mounting IC, 5 is an adhesive such as a bond for attaching the surface-mounting IC 4 to the base material 1, and 6 is a surface. Mounting IC
4 terminals.
【０００３】次にその取付け工程について説明する。プ
リント配線基板の基材１に面実装ＩＣ４を取付ける際、
まずプリント配線基板の基材１にボンド５を面実装ＩＣ
４の本体の下部に当る所に塗布し、その上に面実装ＩＣ
４を密着させ、熱硬化炉等の工程を通過させ、ボンド５
を硬化させることによってプリント配線基板の基材１上
に面実装ＩＣ４を固定させ、その後フロー半田工程を経
ることによって、面実装ＩＣ４を半田付けしていた。Next, the mounting process will be described. When mounting the surface mount IC 4 on the substrate 1 of the printed wiring board,
First, the bond 5 is mounted on the base material 1 of the printed wiring board by the surface mounting IC.
4 is applied to the bottom of the main body, and then the surface-mount IC
4 are brought into close contact with each other, passed through a process such as a heat curing furnace, and bonded 5
The surface mounting IC 4 was fixed on the base material 1 of the printed wiring board by curing, and then the surface mounting IC 4 was soldered by a flow soldering process.
【０００４】[0004]
【発明が解決しようとする課題】従来、プリント配線基
板の基材１に面実装ＩＣ４を取付けるとき、図３に示す
ように面実装ＩＣ４のスタンドオフ寸法Ｈが大きい場
合、ボンド５の塗布による良好な取付力が得られず、振
動などで面実装ＩＣ４が脱落するなどの問題点があっ
た。Conventionally, when the surface mounting IC 4 is mounted on the substrate 1 of the printed wiring board, if the standoff dimension H of the surface mounting IC 4 is large as shown in FIG. However, there is a problem in that the surface mounting IC 4 may drop off due to vibration or the like.
【０００５】この発明は上記のような問題点を解消する
ためになされたもので、面実装ＩＣをプリント配線基板
の基材に取付ける際に良好な取付力が得られるプリント
配線基板を得ることを目的とする。The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to obtain a printed wiring board which can obtain a good mounting force when mounting a surface-mount IC on a base material of the printed wiring board. To aim.
【０００６】[0006]
【課題を解決するための手段】この発明に係るプリント
配線基板は、基板の面実装ＩＣの下部に少なくともボン
ド等の接着剤を塗布するのに十分な面積を持ったシルク
印刷を施したものである。A printed wiring board according to the present invention is silk-screen printed with an area sufficient to at least apply an adhesive such as a bond to a lower portion of a surface mounting IC of the board. is there.
【０００７】[0007]
【作用】この発明においては、面実装ＩＣをプリント配
線基板に取付ける際、面実装ＩＣのスタンドオフ寸法が
大きいものでもボンド等の接着剤の厚みの他に、シルク
印刷の厚みが加わり、面実装ＩＣのスタンドオフ寸法を
吸収することによって、ボンド等の接着剤の保持力を強
化する。According to the present invention, when the surface mounting IC is mounted on the printed wiring board, the thickness of silk printing is added to the surface mounting IC in addition to the thickness of the adhesive such as a bond even if the standoff dimension of the surface mounting IC is large. Absorbing IC standoff dimensions enhances the retention of adhesives such as bonds.
【０００８】[0008]
【実施例】この発明の一実施例を図１について説明す
る。図中従来のものと同一または相当部分には同一符号
を付して説明を省略する。図において、７はプリント配
線基板の基材１上に印刷されたシルク印刷で、面実装Ｉ
Ｃ４の本体を固定するためのボンド等の接着剤５を塗布
するのに十分な面積を持ったものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described with reference to FIG. In the figure, the same or corresponding parts as those of the conventional one are designated by the same reference numerals and the description thereof will be omitted. In the figure, 7 is silk printing printed on the base material 1 of the printed wiring board, which is surface-mounted I
It has an area sufficient to apply an adhesive 5 such as a bond for fixing the body of C4.
【０００９】次にその作用について説明する。プリント
配線基板の基材１に面実装ＩＣ４を取付ける際は、従来
と同様に、プリント配線基板の基材１上にボンド等の接
着剤５を塗布して面実装ＩＣ４を密着させ、熱硬化炉の
工程を経るが、その際プリント配線基板の基材１上に少
なくともボンド等の接着剤５を塗布するのに十分な面積
を持ったシルク印刷７を施しているためにシルク印刷７
の厚み分スタンドオフ寸法Ｈを吸収でき、ボンド等の接
着剤５が適正量面実装ＩＣ４の本体に接合でき、プリン
ト配線基板の基材１に面実装ＩＣ４を十分保持すること
ができる。Next, the operation will be described. When mounting the surface-mounting IC 4 on the base material 1 of the printed wiring board, the adhesive 5 such as a bond is applied to the base material 1 of the printed wiring board to adhere the surface-mounting IC 4 to the surface mounting IC 4, and the thermosetting furnace However, since the silk printing 7 having a sufficient area for at least applying the adhesive 5 such as a bond is applied on the base material 1 of the printed wiring board, the silk printing 7
The thickness of the stand-off dimension H can be absorbed, an appropriate amount of the adhesive 5 such as a bond can be bonded to the body of the surface-mounting IC 4, and the surface-mounting IC 4 can be sufficiently held on the substrate 1 of the printed wiring board.
【００１０】[0010]
【発明の効果】以上のように、この発明によれば簡単な
構成で容易に面実装ＩＣの脱落を防止できる効果があ
る。また面実装ＩＣを交換する必要が発生した場合、プ
リント配線基板へのシルク印刷の接着強度をレジストイ
ンクの接着強度より低くすることで、交換時にレジスト
インクが剥れることなくプリント配線基板の銅箔の露出
を防止できるという効果もある。As described above, according to the present invention, the surface mounting IC can be easily prevented from falling off with a simple structure. Further, when it becomes necessary to replace the surface-mount IC, the adhesive strength of silk printing on the printed wiring board is made lower than the adhesive strength of the resist ink, so that the resist ink does not peel off at the time of replacement and the copper foil of the printed wiring board is removed. There is also an effect that it is possible to prevent the exposure of.
【図１】この発明の一実施例によるプリント配線基板の
断面図である。FIG. 1 is a sectional view of a printed wiring board according to an embodiment of the present invention.
【図２】従来のプリント配線基板の断面図である。FIG. 2 is a cross-sectional view of a conventional printed wiring board.
【図３】スタンドオフ寸法の説明図である。FIG. 3 is an explanatory diagram of standoff dimensions.
１ プリント配線基板の基材 ２ 銅箔 ３ レジストインク ４ 面実装ＩＣ ５ 接着剤 ６ 面実装ＩＣの端子 ７ シルク印刷 1 Base Material of Printed Wiring Board 2 Copper Foil 3 Resist Ink 4 Surface Mounted IC 5 Adhesive 6 Surface Mounted IC Terminal 7 Silk Printing
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成５年３月３０日[Submission date] March 30, 1993
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００４[Correction target item name] 0004
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００４】[0004]
【発明が解決しようとする課題】従来、プリント配線基
板の基材１に面実装ＩＣ４を取付けるとき、図３に示す
ように面実装ＩＣ４のスタンドオフ寸法Ｈが大きい場
合、ボンド５の塗布による良好な取付力が得られず、フ
ロー半田工程前またはフロー半田工程中振動などで面実
装ＩＣ４が脱落するなどの問題点があった。Conventionally, when the surface mounting IC 4 is mounted on the substrate 1 of the printed wiring board, if the standoff dimension H of the surface mounting IC 4 is large as shown in FIG. such attachment force can not be obtained, full
There is a problem that the surface-mounting IC 4 may drop off due to vibration before the low soldering process or during the flow soldering process .
Claims (1)
配線基板上にボンド等の接着剤を塗布して面実装ＩＣを
保持しフロー半田付けを行なうプリント配線基板におい
て、面実装ＩＣの本体が位置する基板表面にシルク印刷
を施し、前記接着剤の保持力を強化することを特徴とす
るプリント配線基板。1. A main body of a surface mounting IC is located in a printed wiring board for holding a surface mounting IC and performing flow soldering by applying an adhesive such as a bond on a printed wiring board for mounting the surface mounting IC. A printed wiring board, characterized in that the surface of the board is silk-printed to enhance the holding power of the adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27579892A JPH06125167A (en) | 1992-10-14 | 1992-10-14 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27579892A JPH06125167A (en) | 1992-10-14 | 1992-10-14 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06125167A true JPH06125167A (en) | 1994-05-06 |
Family
ID=17560563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27579892A Pending JPH06125167A (en) | 1992-10-14 | 1992-10-14 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06125167A (en) |
-
1992
- 1992-10-14 JP JP27579892A patent/JPH06125167A/en active Pending
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