JPH06121232A - 赤外像の可視または近赤外像への変換システム - Google Patents
赤外像の可視または近赤外像への変換システムInfo
- Publication number
- JPH06121232A JPH06121232A JP11736593A JP11736593A JPH06121232A JP H06121232 A JPH06121232 A JP H06121232A JP 11736593 A JP11736593 A JP 11736593A JP 11736593 A JP11736593 A JP 11736593A JP H06121232 A JPH06121232 A JP H06121232A
- Authority
- JP
- Japan
- Prior art keywords
- light
- circuit
- infrared
- substrate
- detector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/10—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices
- H10F55/15—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/20—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/184—Infrared image sensors
- H10F39/1843—Infrared image sensors of the hybrid type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/191—Photoconductor image sensors
- H10F39/193—Infrared image sensors
- H10F39/1935—Infrared image sensors of the hybrid type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/10—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices
- H10F55/15—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
- H10F55/155—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices wherein the radiation-sensitive devices and the electric light source are all semiconductor devices formed in, or on, a common substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Closed-Circuit Television Systems (AREA)
- Telescopes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9206209 | 1992-05-21 | ||
| FR9206209A FR2691579A1 (fr) | 1992-05-21 | 1992-05-21 | Système de conversion d'une image infrarouge en image visible ou proche infrarouge. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06121232A true JPH06121232A (ja) | 1994-04-28 |
Family
ID=9430036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11736593A Withdrawn JPH06121232A (ja) | 1992-05-21 | 1993-05-19 | 赤外像の可視または近赤外像への変換システム |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5332899A (https=) |
| EP (1) | EP0571268B1 (https=) |
| JP (1) | JPH06121232A (https=) |
| DE (1) | DE69319964T2 (https=) |
| FR (1) | FR2691579A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10354366B2 (en) | 2015-01-16 | 2019-07-16 | Nec Corporation | Image processing device, image processing method, and recording medium |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2715250B1 (fr) * | 1994-01-19 | 1996-04-05 | Commissariat Energie Atomique | Dispositif tridimensionnel de détection de rayonnement et procédé de fabrication de ce dispositif. |
| US5567955A (en) * | 1995-05-04 | 1996-10-22 | National Research Council Of Canada | Method for infrared thermal imaging using integrated gasa quantum well mid-infrared detector and near-infrared light emitter and SI charge coupled device |
| US5751344A (en) * | 1995-07-05 | 1998-05-12 | Schnee; Robert Alan | Navigation system for a marine vessel in low light conditions |
| US5710428A (en) * | 1995-08-10 | 1998-01-20 | Samsung Electronics Co., Ltd. | Infrared focal plane array detecting apparatus having light emitting devices and infrared camera adopting the same |
| US5703363A (en) * | 1996-04-25 | 1997-12-30 | He Holdings, Inc. | Infrared to visible light image conversion device |
| US6157854A (en) | 1999-01-13 | 2000-12-05 | Bales Scientific Inc. | Photon irradiation human pain treatment monitored by thermal imaging |
| AU2002241794A1 (en) * | 2000-11-15 | 2002-06-18 | The Johns Hopkins University | Method and structure for minimizing error sources in image and position sensing detectors |
| WO2010023408A1 (fr) * | 2008-08-25 | 2010-03-04 | Commissariat A L'energie Atomique | Imageur biface |
| FR3039926A1 (fr) * | 2015-08-04 | 2017-02-10 | Commissariat Energie Atomique | Procede d'assemblage de dispositifs electroniques |
| US10754142B2 (en) * | 2017-06-07 | 2020-08-25 | The United States Of America, As Represented By The Secretary Of The Navy | Electronic up-conversions of a scene using a pixelated detector array |
| CN111916469B (zh) * | 2020-08-31 | 2022-06-28 | 山西国惠光电科技有限公司 | 一种新型双色InGaAs红外焦平面探测器的制备方法 |
| FR3149130A1 (fr) * | 2023-05-24 | 2024-11-29 | Airbus Defence And Space Sas | Circuit de lecture pour capteur hybride |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR373807A (fr) * | 1906-01-22 | 1907-05-28 | Emile Adrien Vignes | Jeu |
| FR371868A (fr) * | 1906-11-28 | 1907-03-18 | Eugene De Dorlodot | Bandage élastique |
| US3649838A (en) * | 1968-07-25 | 1972-03-14 | Massachusetts Inst Technology | Semiconductor device for producing radiation in response to incident radiation |
| US4205227A (en) * | 1976-11-26 | 1980-05-27 | Texas Instruments Incorporated | Single junction emitter array |
| US4067104A (en) * | 1977-02-24 | 1978-01-10 | Rockwell International Corporation | Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components |
| GB2014395B (en) * | 1978-02-14 | 1982-08-18 | Emi Ltd | Infra-red imager |
| US4362938A (en) * | 1980-11-14 | 1982-12-07 | The United States Of America As Represented By The Secretary Of The Army | Infrared viewing system |
| DE3133641A1 (de) * | 1981-08-26 | 1983-03-10 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Ir-sichtgeraet |
| DE3531666A1 (de) * | 1985-09-05 | 1987-03-12 | Zeiss Carl Fa | Vorrichtung zur erzeugung eines bildes einer szene, vorzugsweise eines waermebildes |
| US4914296A (en) * | 1988-04-21 | 1990-04-03 | The Boeing Company | Infrared converter |
| FR2639784B1 (fr) * | 1988-11-29 | 1991-01-11 | Commissariat Energie Atomique | Structure monolithique de detection ou d'imagerie infrarouge et son procede de fabrication |
| GB8829035D0 (en) * | 1988-12-13 | 1989-07-05 | Emi Plc Thorn | Thermal imaging device |
| US4998688A (en) * | 1989-06-29 | 1991-03-12 | Hughes Aircraft Company | Operating temperature hybridizing for focal plane arrays |
| US4943491A (en) * | 1989-11-20 | 1990-07-24 | Honeywell Inc. | Structure for improving interconnect reliability of focal plane arrays |
-
1992
- 1992-05-21 FR FR9206209A patent/FR2691579A1/fr active Granted
-
1993
- 1993-05-18 EP EP19930401270 patent/EP0571268B1/fr not_active Expired - Lifetime
- 1993-05-18 DE DE69319964T patent/DE69319964T2/de not_active Expired - Fee Related
- 1993-05-19 US US08/063,333 patent/US5332899A/en not_active Expired - Fee Related
- 1993-05-19 JP JP11736593A patent/JPH06121232A/ja not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10354366B2 (en) | 2015-01-16 | 2019-07-16 | Nec Corporation | Image processing device, image processing method, and recording medium |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2691579B1 (https=) | 1994-07-13 |
| DE69319964D1 (de) | 1998-09-03 |
| FR2691579A1 (fr) | 1993-11-26 |
| US5332899A (en) | 1994-07-26 |
| DE69319964T2 (de) | 1999-03-04 |
| EP0571268B1 (fr) | 1998-07-29 |
| EP0571268A1 (fr) | 1993-11-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20000801 |