JPH0611960U - Lap surface plate - Google Patents

Lap surface plate

Info

Publication number
JPH0611960U
JPH0611960U JP5258492U JP5258492U JPH0611960U JP H0611960 U JPH0611960 U JP H0611960U JP 5258492 U JP5258492 U JP 5258492U JP 5258492 U JP5258492 U JP 5258492U JP H0611960 U JPH0611960 U JP H0611960U
Authority
JP
Japan
Prior art keywords
plate
lapping
lap
face plate
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5258492U
Other languages
Japanese (ja)
Inventor
守 安部
博行 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Metals Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP5258492U priority Critical patent/JPH0611960U/en
Publication of JPH0611960U publication Critical patent/JPH0611960U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】 【目的】 被加工物をラップ加工にて高精度に加工する
ことを目的とする。 【構成】 熱膨張係数の異なる異種材質を組み合わせた
ラップ定盤において、その接着剤にヤング率E=0.3
5kgf/mm2のもの用い、厚みが1mmになる構成
とする。
(57) [Summary] [Purpose] The purpose is to process a work piece with high precision by lapping. [Constitution] In a lapping plate made of a combination of different materials having different thermal expansion coefficients, the adhesive has Young's modulus E = 0.3.
It is configured to have a thickness of 1 mm by using 5 kgf / mm 2 .

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は半導体、光学、磁気、電子関連等の高脆性材料のラッピングに適用さ れるラップ定盤に係わり、高脆性材料を高精度にラッピングすることを図ったラ ップ定盤に関する。 The present invention relates to a lapping plate applied to lapping highly brittle materials such as semiconductor, optical, magnetic and electronic materials, and relates to a lapping plate designed to accurately lapping highly brittle materials.

【0002】[0002]

【従来の技術】[Prior art]

従来、磁気ヘッド等の高精度加工としてラッピングが知られている。ラッピン グは、回転駆動されるラップ定盤上へ、砥粒を含んだラップ液を滴下しながら、 被加工物を搭載して押圧揺動させることにより、前記ラップ定盤と被加工物の間 に供給されるラップ液によって研磨を行うものである。このラッピングではラッ プ定盤の面形状がそのまま被加工物に転写されることから、ラップ定盤の面形状 と加工精度には密接な関係がある。 Conventionally, lapping is known as high-precision machining of magnetic heads and the like. Lapping is performed by dropping the lapping liquid containing abrasive grains onto the rotationally driven lapping plate, mounting the workpiece, and rocking the lapping plate so that the lapping between the lapping plate and the workpiece. The polishing is performed by the lapping liquid supplied to the. In this lapping, the surface shape of the lap surface plate is transferred as it is to the workpiece, so there is a close relationship between the surface shape of the lapping surface plate and the processing accuracy.

【0003】 従来のラップ定盤は、ラップ面板として御影石や軟質金属が用いられており、 ラップ定盤を回転駆動する駆動部と連結するために、下板が組み合わされた構造 である。尚、ラップ面板と下板は異種材質である。A conventional lapping plate uses granite or a soft metal as a lapping plate, and has a structure in which a lower plate is combined in order to connect with a driving unit that rotationally drives the lapping plate. The lap face plate and the lower plate are made of different materials.

【0004】[0004]

【考案が解決しようとする課題】[Problems to be solved by the device]

熱膨張係数の異なる異種材質のラップ面板と回転可能に取り付けられた下板と を接合している前記ラップ定盤では、上記ラッピングにおいて発生する研磨熱及 び駆動源の発熱により温度上昇が起こり、前記ラップ面板と回転可能に取り付け られた下板の熱膨張の差によって、ラップ面板の熱膨張量が下板の熱膨張量より も大きい場合にはラップ面板表面が凸状となる変形が生じ、ラップ面板の熱膨張 量が下板の熱膨張量よりも小さい場合にはラップ面板表面が凹状となる変形が生 じる。即ち、ラップ定盤の平面度は、ラップ定盤の温度変化の影響を受けて変化 する。 In the lap surface plate, in which the lap face plates of different materials having different thermal expansion coefficients are joined to the lower plate rotatably attached, a temperature rise occurs due to the polishing heat generated in the lapping and the heat generated by the driving source. Due to the difference in thermal expansion between the lap face plate and the rotatably attached lower plate, when the amount of thermal expansion of the lap face plate is larger than the amount of thermal expansion of the lower plate, the lap face plate surface is deformed to be convex, When the amount of thermal expansion of the lap face plate is smaller than the amount of thermal expansion of the lower plate, deformation occurs in which the surface of the lap face plate is concave. That is, the flatness of the lapping plate changes under the influence of the temperature change of the lapping plate.

【0005】 例えば、図1に示すラップ面板1に、形状が外径φ300mm、内径φ60m m、厚さ50mm、線膨張係数α1が9×10-6/℃、ヤング率が10×104k gf/mm2のグラナイト製ものを用い、下板2に形状が外径φ300mm、厚 さ10mmであり、線膨張係数α2が22×10-6/℃、ヤング率が6.8×1 03kgf/mm2のアルミニウム製ものを用い、ラップ面板1と下板2を貼り合 わせる接着剤の材質として、線膨張係数α3が16×10-5/℃、ヤング率が8 kgf/mm2のエポキシ系の接着剤を厚さ1mmで用いたラップ定盤において 、ラッピング時の温度上昇により、図3において示すようにラップ面板1の平面 度は約2μm/℃で変化し、被加工物4を一定寸法に加工できず、さらに平面度 も一定以上に高めることが出来ないなどラップ加工精度の問題があった。For example, the lap face plate 1 shown in FIG. 1 has an outer diameter of 300 mm, an inner diameter of 60 mm, a thickness of 50 mm, a coefficient of linear expansion α 1 of 9 × 10 −6 / ° C., and a Young's modulus of 10 × 10 4 k. used as gf / mm 2 made of granite, the lower plate 2 to shape the outer diameter [phi] 300 mm, and a thickness of 10 mm, the linear expansion coefficient alpha 2 is 22 × 10 -6 / ℃, Young's modulus of 6.8 × 1 0 An aluminum material of 3 kgf / mm 2 was used as a material for the adhesive agent for bonding the lap face plate 1 and the lower plate 2 with a linear expansion coefficient α 3 of 16 × 10 -5 / ° C and a Young's modulus of 8 kgf / In a lapping plate using a mm 2 epoxy adhesive with a thickness of 1 mm, the flatness of the lapping plate 1 changes by about 2 μm / ° C as shown in Fig. 3 due to the temperature rise during lapping. Object 4 cannot be machined to a certain size, and the flatness is also more than There was a problem with the lapping accuracy, such as not being able to raise it further.

【0006】 本考案は、上記した問題点を考慮して、ラップ定盤の温度が変化しても、ラ ップ面板表面形状が変化せず、被加工物を高精度に加工することを可能にしたラ ップ定盤を提供することを目的とする。In consideration of the above problems, the present invention makes it possible to process a workpiece with high accuracy without changing the surface shape of the lapping plate even when the temperature of the lapping plate changes. The purpose is to provide a lap plate that has

【0007】[0007]

【課題を解決するための手段】[Means for Solving the Problems]

本考案のラップ定盤は、熱膨張係数の異なる異種材質を組み合わせて構成する ラップ定盤において、その接合方法にヤング率E=0.1kgf/mm2〜0. 4kgf/mm2である接着剤を用い、接着剤の厚みを1mm〜10mmもたせ るように弾性緩衝帯を設けて貼り合わせる。The lapping plate of the present invention is formed by combining different kinds of materials having different thermal expansion coefficients. In the lapping plate, Young's modulus E = 0.1 kgf / mm 2 to 0. An adhesive of 4 kgf / mm 2 is used, and an elastic buffer band is provided so that the adhesive has a thickness of 1 mm to 10 mm, and the adhesive is attached.

【0008】[0008]

【作用】[Action]

ラッピング時にラップ定盤が温度上昇すると、熱膨張係数の異なる異種材質は 、それぞれ異なった量だけ熱膨張し、異種材質間に厚み1mm〜10mmで設け たヤング率E=0.1kgf/mm2〜0.4kgf/mm2である接着剤には、 熱膨張により張力が加わり弾性変形するが、異種材質間に設けた接着剤のヤング 率がE=0.1kgf/mm2〜0.4kgf/mm2と非常に小さいために、異 種材質を拘束することなく弾性変形を行うために、ラップ定盤の表面形状の変化 を抑え、ラップ定盤の平面度を維持する。When the temperature of the lapping plate rises during lapping, different materials having different coefficients of thermal expansion expand by different amounts, and Young's modulus E = 0.1 kgf / mm 2 ~ provided between the different materials with a thickness of 1 mm to 10 mm. An adhesive having 0.4 kgf / mm 2 is elastically deformed by being applied with tension due to thermal expansion, but the Young's modulus of the adhesive provided between different materials is E = 0.1 kgf / mm 2 to 0.4 kgf / mm 2. Since it is as small as 2 , elastic deformation is performed without restraining different materials, so changes in the surface shape of the lapping plate are suppressed and the flatness of the lapping plate is maintained.

【0009】[0009]

【実施例】【Example】

以下、本考案の一実施例を図1によって説明する。 図1において、貫通穴を有する平坦に仕上げられたラップ面板1下方には、中 央部に貫通穴を設けた下板2がある厚みを持った接着剤3で固定して一体とし、 下板2はボルト6を用いてスピンドル5に固定支持する。 An embodiment of the present invention will be described below with reference to FIG. In FIG. 1, below the flat-finished lap face plate 1 having a through hole, there is a lower plate 2 having a through hole in the center, and fixed with an adhesive 3 having a thickness to form a lower plate. The bolt 2 is fixedly supported on the spindle 5 using bolts 6.

【0010】 本実施例では、ラップ面板1に形状が外径φ300mm、内径φ60mm、厚 さ50mmで材質がグラナイト製のものを用い、このグラナイトの線膨張係数α 1 は9×10-6/℃、ヤング率は10×104kgf/mm2である。 また、下板2には形状が外径φ300mm、厚さ10mmで、中央部にφ11 mmの貫通穴が設けてあり、材質がアルミニウム製のものを用い、このアルミニ ウムの線膨張係数α2は22×10-6/℃、ヤング率は6.8×103kgf/m m2である。 さらに、ラップ面板1と下板2を貼り合わせる接着剤3の材質として、線膨張 係数α3が16×10-5/℃、ヤング率が0.35kgf/mm2の弾性接着剤を 厚さ2mmで用いた。尚、下板2はM10のボルト6によりスピンドル5に固定 支持する。In the present embodiment, the lap face plate 1 has a shape of outer diameter φ300 mm, inner diameter φ60 mm, thickness 50 mm, and is made of granite. The linear expansion coefficient α of this granite is used. 1 Is 9 × 10-6/ ° C, Young's modulus is 10 × 10Fourkgf / mm2Is. The lower plate 2 has an outer diameter of 300 mm, a thickness of 10 mm, and a through hole of 11 mm in the center, and the material is made of aluminum. The linear expansion coefficient α of this aluminum is2Is 22 × 10-6/ ° C, Young's modulus is 6.8 × 103kgf / mm2Is. Further, as a material of the adhesive 3 for bonding the lap face plate 1 and the lower plate 2, a linear expansion coefficient α3Is 16 × 10-Five/ ° C, Young's modulus is 0.35 kgf / mm2Elastic adhesive of 2 mm thickness was used. The lower plate 2 is fixed to and supported by the spindle 5 with M6 bolts 6.

【0011】 被加工物4をラップ面板1上に設け、ラップ面板1を矢印8方向に回転数49 rpmで回転させると、被加工物4はラップ面板1の回転力により矢印9方向に 回転する。この状態で、矢印8方向に回転するラップ面板1上へ、砥粒を含んだ ラップ液を滴下をすると、ラップ面板1と被加工物4の間で、砥粒が転動し、被 加工物4を研磨する。When the workpiece 4 is provided on the lap face plate 1 and the lap face plate 1 is rotated in the direction of arrow 8 at a rotation speed of 49 rpm, the workpiece 4 is rotated in the direction of arrow 9 by the rotational force of the lap face plate 1. . In this state, when a lap liquid containing abrasive grains is dropped onto the lap face plate 1 which rotates in the direction of the arrow 8, the abrasive grains roll between the lap face plate 1 and the work piece 4, and the work piece is processed. Polish 4.

【0012】 この時、ラップ面板1上面と被加工物4との間で発生する研磨熱、また、回転 駆動部のモータ(図示せず)などから発生する熱の影響を受け、ラップ定盤は温 度変化を生じる。 これらの熱の影響により、ラップ面板1及び下板2は、ラッピング前、それぞ れ23℃、24℃であったものが、ラッピング時間30分間で、それぞれ29℃ 、28℃に温度上昇した。 この温度上昇により、ラップ面板1と下板2は熱膨張を生じるが、線膨張係数 が異なるために熱膨張量に差が生じる。 この場合、下板2に用いているアルミニウムの線膨張係数が、ラップ面板1に 用いているグラナイトの線膨張係数よりも大きいために、下板2の熱膨張量が大 きくなり、ラップ面板1と下板2を接着剤3により貼り合わせた構造では、ラッ プ面板1の下面が下板2の熱膨張量だけ変形することにより、ラップ面板1の上 面は凹状呈することとなるが、ラップ面板1と下板2をヤング率が0.35kg f/mm2の弾性接着剤を厚さ2mmで用いることにより、この接着層で熱膨張 量の差を吸収し、ラップ面板1の平面度は温度上昇後もラッピング前と変わらな い。 これにより、被加工物4を一定寸法に高精度に加工することが可能であり、被 加工物の平面度を高めることが可能となった。 尚、図2において、上記実施例のラップ定盤の温度とラップ面板1の平面度の 関係を示している。 上記実施例においては、ラップ面板1の温度による平面度変化率は0.07μ m/℃である。At this time, the lap surface plate is affected by the polishing heat generated between the upper surface of the lap face plate 1 and the workpiece 4 and the heat generated by the motor (not shown) of the rotary drive unit. It causes a temperature change. Under the influence of these heats, the lap face plate 1 and the lower plate 2 were at 23 ° C. and 24 ° C. before lapping, respectively, but the temperature was increased to 29 ° C. and 28 ° C. in the lapping time of 30 minutes, respectively. Due to this temperature rise, the lap face plate 1 and the lower plate 2 cause thermal expansion, but since the linear expansion coefficients are different, the thermal expansion amount is different. In this case, since the linear expansion coefficient of aluminum used for the lower plate 2 is larger than the linear expansion coefficient of granite used for the lap face plate 1, the thermal expansion amount of the lower plate 2 becomes large and the lap face plate 1 In the structure in which the lower plate 2 and the lower plate 2 are bonded together with the adhesive 3, the lower surface of the lap face plate 1 is deformed by the amount of thermal expansion of the lower plate 2, so that the upper surface of the lap face plate 1 has a concave shape. By using an elastic adhesive having a Young's modulus of 0.35 kgf / mm 2 with a thickness of 2 mm for the face plate 1 and the lower plate 2, this adhesive layer absorbs the difference in the amount of thermal expansion, and the flatness of the lap face plate 1 is Even after the temperature rises, it is the same as before wrapping. As a result, the work piece 4 can be machined to a certain size with high accuracy, and the flatness of the work piece can be increased. Incidentally, FIG. 2 shows the relationship between the temperature of the lapping plate of the above-described embodiment and the flatness of the lapping plate 1. In the above example, the flatness change rate with temperature of the lap face plate 1 is 0.07 μm / ° C.

【0013】 また、上記実施例において、接着剤3の厚さを1mmとすると、ラップ面板1 の温度による平面度変化率は0.15μm/℃であり、この場合も、ラッピング 時のラップ定盤の温度上昇においては、ラップ面板1の平面度変化には影響する ことはなく、被加工物4を一定寸法に高精度に加工することが可能であり、被加 工物の平面度を高めることが可能となった。Further, in the above-mentioned embodiment, when the thickness of the adhesive 3 is 1 mm, the flatness change rate due to the temperature of the lap face plate 1 is 0.15 μm / ° C. In this case also, the lap platen at the time of lapping is used. The increase in the temperature does not affect the flatness change of the lap face plate 1, and the work piece 4 can be machined to a certain size with high accuracy, and the flatness of the work piece can be increased. Became possible.

【0014】 以上の比較で明らかなように、上記実施例のラップ定盤によれば、従来のラッ プ定盤に比べて極めて高精度のラッピング加工が可能である。As is clear from the above comparison, the lapping plate of the above-described embodiment enables extremely high-precision lapping as compared with the conventional lapping plate.

【0015】 尚、上記実施例ではラップ面板1の材質としてグラナイトを用い、下板2の材 質としてアルミニウムを用いたが、本考案はこれに限らず、ラップ面板1及び下 板2の材質に、鋳鉄、軟鋼、銅、錫、セラミック、樹脂など種々の材料を適用し ても構わない。In the above embodiment, granite was used as the material of the lap face plate 1 and aluminum was used as the material of the lower plate 2. However, the present invention is not limited to this, and the material of the lap face plate 1 and the lower plate 2 is not limited to this. Various materials such as cast iron, mild steel, copper, tin, ceramics and resins may be applied.

【0016】 また、上記実施例ではラップ面板1と下板2の2種類の組合せを用いたが、本 考案はこれに限らず、3種類及び4種類の異種材質の組合せでもよい。Further, although two kinds of combinations of the lap face plate 1 and the lower plate 2 are used in the above embodiment, the present invention is not limited to this, and combinations of three kinds and four kinds of different materials may be used.

【0017】 更に、上記実施例ではラップ面板1の形状が外径φ300mm、内径φ60m m、厚さ50mmのもとを用い、下板2の形状が外径φ300mm、厚さ10m mのものを用いたが、本考案はこれに限らない。Further, in the above embodiment, the shape of the lap face plate 1 has an outer diameter of φ300 mm, an inner diameter of φ60 mm and a thickness of 50 mm, and the lower plate 2 has an outer diameter of φ300 mm and a thickness of 10 mm. However, the present invention is not limited to this.

【0018】[0018]

【考案の効果】[Effect of device]

熱膨張係数の異なる異種材質を組み合わせて構成するラップ定盤において、そ の接合方法にヤング率E=0.1kgf/mm2〜0.4kgf/mm2である接 着剤を用い、接着剤の厚みを1mm〜10mmもたせるように貼り合わせたラッ プ定盤によれば、ラッピング時のラップ定盤の温度上昇に伴う熱膨張によるそり を無くし、被加工物を一定寸法に高精度に加工することが可能であり、被加工物 の平面度を高めることが可能である。In a lapping plate made of a combination of different materials having different thermal expansion coefficients, a bonding agent having Young's modulus E = 0.1 kgf / mm 2 to 0.4 kgf / mm 2 was used for the bonding method. By using a lapping plate that is laminated to have a thickness of 1 mm to 10 mm, it is possible to eliminate warpage due to thermal expansion due to the temperature rise of the lapping plate during lapping, and to machine the work piece to a certain size with high accuracy. It is possible to increase the flatness of the work piece.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案の一実施例を示すラップ定盤の概略図FIG. 1 is a schematic view of a lap surface plate showing an embodiment of the present invention.

【図2】本考案の一実施例を示すラップ定盤の温度によ
る平面度変化を示す図
FIG. 2 is a diagram showing a change in flatness according to temperature of a lapping plate showing an embodiment of the present invention.

【図3】従来のラップ面板の温度による平面度変化を示
す図
FIG. 3 is a diagram showing a change in flatness of a conventional lap face plate due to temperature.

【符号の説明】[Explanation of symbols]

1 ラップ面板 2 下板 3 接着剤 4 被加工物 5 スピンドル 6 ボルト 1 Lap face plate 2 Lower plate 3 Adhesive 4 Workpiece 5 Spindle 6 Bolt

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 熱膨張係数の異なる材料を接合して構成
するラップ定盤において、その接合はヤング率E=0.
1kgf/mm2〜0.4kgf/mm2である接着剤を
用い、この接着剤の厚みを1mm〜10mmとしたこと
を特徴とするラップ定盤。
1. A lapping plate constituted by joining materials having different thermal expansion coefficients, the joining being performed by Young's modulus E = 0.
1kgf / mm 2 ~0.4kgf / mm 2 the adhesive used is, lap plate, characterized in that the thickness of the adhesive and 1 mm to 10 mm.
JP5258492U 1992-07-27 1992-07-27 Lap surface plate Pending JPH0611960U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5258492U JPH0611960U (en) 1992-07-27 1992-07-27 Lap surface plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5258492U JPH0611960U (en) 1992-07-27 1992-07-27 Lap surface plate

Publications (1)

Publication Number Publication Date
JPH0611960U true JPH0611960U (en) 1994-02-15

Family

ID=12918848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5258492U Pending JPH0611960U (en) 1992-07-27 1992-07-27 Lap surface plate

Country Status (1)

Country Link
JP (1) JPH0611960U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002273652A (en) * 2001-03-14 2002-09-25 Fujikoshi Mach Corp Double-sided polishing device
JP2006297538A (en) * 2005-04-20 2006-11-02 Olympus Medical Systems Corp Metal-plated optical member, and method and device for roughening surface of metal-plated optical member
JP2011079132A (en) * 2009-10-08 2011-04-21 Lg Chem Ltd Lower surface plate for float glass polishing system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002273652A (en) * 2001-03-14 2002-09-25 Fujikoshi Mach Corp Double-sided polishing device
JP4620884B2 (en) * 2001-03-14 2011-01-26 不二越機械工業株式会社 Double-side polishing equipment
JP2006297538A (en) * 2005-04-20 2006-11-02 Olympus Medical Systems Corp Metal-plated optical member, and method and device for roughening surface of metal-plated optical member
JP2011079132A (en) * 2009-10-08 2011-04-21 Lg Chem Ltd Lower surface plate for float glass polishing system

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