JPH06112252A - Pt-alloy extrafine wire for semiconductor element - Google Patents

Pt-alloy extrafine wire for semiconductor element

Info

Publication number
JPH06112252A
JPH06112252A JP4262212A JP26221292A JPH06112252A JP H06112252 A JPH06112252 A JP H06112252A JP 4262212 A JP4262212 A JP 4262212A JP 26221292 A JP26221292 A JP 26221292A JP H06112252 A JPH06112252 A JP H06112252A
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JP
Japan
Prior art keywords
wire
alloy
added
executed
high temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4262212A
Other languages
Japanese (ja)
Other versions
JP3074626B2 (en
Inventor
Kazumitsu Itabashi
一光 板橋
Takeshi Kujiraoka
毅 鯨岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
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Priority to JP04262212A priority Critical patent/JP3074626B2/en
Publication of JPH06112252A publication Critical patent/JPH06112252A/en
Application granted granted Critical
Publication of JP3074626B2 publication Critical patent/JP3074626B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PURPOSE:To provide a Pt-alloy extrafine wire, for semiconductor element use, wherein it enhances the high-temperature strength of a Pt extrafine wire, it lowers the incidence of an A-point exfoliation in a high-temperature shelf test and it is extremely useful for a wire bonding method and a bump connecting method. CONSTITUTION:One kind or two kinds out of Au and Pd are added to high- purity Pt at a total addition amount of 0.01 to 10wt.%, one kind or two kinds out of Ru and Rh are added to it at 0.01 to 1wt.%, one kind or two or more kinds out of Be, Ge, Ca, Si, Fe, So, Y and rare-earth elements at 0.0001 to 0.005wt.%, and this mixture is melted and cast. Then, a grooved roll working operation is executed, an annealing treatment is executed in its halfway part, a wiredrawing operation is then executed and a stress is removed sufficiently. Thereby, a bus having a wire diameter of 25mum is molded.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、半導体素子のチップ電
極と基板上の外部リードとを接続するために用いられる
半導体素子用Pt合金極細線、特にワイヤボンディング
法及びバンプ接続法に好適なものに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a Pt alloy ultrafine wire for semiconductor devices used for connecting a chip electrode of a semiconductor device and an external lead on a substrate, and particularly suitable for a wire bonding method and a bump connecting method. Regarding

【0002】[0002]

【従来の技術】従来から、例えばキャピラリーの先端に
垂下せしめた合金ワイヤの先端を電気トーチにより溶融
させてボールを形成し、このボールをチップ上のAl又
はAl合金からなる電極に圧着・切断してバンプ電極を
形成するバンプ接続法や、前記ボールをチップ電極に圧
着,接合せしめた後、ループ状に外部リードまで導いて
該外部リードに圧着・切断することにより、チップ電極
と外部リードを接続させるワイヤボンディング法が知ら
れている。また、この種ボンディングに用いるに有用な
合金ワイヤとして、特公昭62−43540号に開示さ
れるような、高純度PtからなるPtワイヤがある。
2. Description of the Related Art Conventionally, for example, the tip of an alloy wire suspended from the tip of a capillary is melted by an electric torch to form a ball, and the ball is pressure-bonded and cut to an electrode made of Al or Al alloy on a chip. To connect the chip electrode to the external lead by a bump connection method of forming a bump electrode by pressing, or after the ball is pressure-bonded and bonded to the chip electrode, then led to the external lead in a loop shape and pressure-bonded / cut to the external lead. A known wire bonding method is known. Further, as an alloy wire useful for this type of bonding, there is a Pt wire made of high-purity Pt as disclosed in Japanese Patent Publication No. 62-43540.

【0003】[0003]

【発明が解決しようとする課題】しかし乍ら、上記従来
のPtワイヤでは高温強度が弱く、所定のボンディング
強度が得られない欠点があると共に、Ptの純度が高す
ぎることから、チップ上のAl電極とボールとの接合面
(即ち、A点)におけるPtとAlの相互拡散が過剰に
なり、接合強度の低下が生じる結果、ボンディング後の
高温放置試験におけるA点剥がれの発生率が高くなると
いう不具合があった。
However, the above-mentioned conventional Pt wire has a drawback that the high temperature strength is weak and a predetermined bonding strength cannot be obtained, and the purity of Pt is too high. It is said that the mutual diffusion of Pt and Al at the joint surface between the electrode and the ball (that is, the point A) becomes excessive and the joint strength is reduced, resulting in a higher incidence of peeling at the point A in the high temperature storage test after bonding. There was a problem.

【0004】本発明はこのような従来事情に鑑みてなさ
れたものであり、その目的とするところは、所定の高温
強度が得られると共に、ボンディング後の高温放置試験
でA点剥がれが発生する虞れのない、信頼性の高い半導
体素子用Pt合金極細線を提供することである。
The present invention has been made in view of the above conventional circumstances, and an object thereof is to obtain a predetermined high temperature strength and to cause peeling of point A in a high temperature standing test after bonding. It is an object of the present invention to provide a highly reliable Pt alloy extra fine wire for a semiconductor device.

【0005】[0005]

【課題を解決するための手段】以上の目的を達成するた
めに、本発明の半導体素子用Pt合金極細線は、Au,
Pdの内の1種又は2種を総添加量で0.01〜10wt
%含有し、残部Ptからなることを特徴とする。
In order to achieve the above object, a Pt alloy extra fine wire for a semiconductor device of the present invention comprises Au,
0.01-10 wt% of Pd in total of 1 or 2
%, And the balance is Pt.

【0006】また、後述の理由から、上記の配合にR
u,Rhの内から1種又は2種を0.01〜1wt%含有
せしめること、さらには、前記の配合にBe,Ge,C
a,Si,Fe,Sc,Y,希土類元素の中から1種又
は2種以上を0.0001〜0.005wt%含有せしめ
ることが有用である。
For the reasons described below, R is added to the above composition.
One or two of u and Rh should be contained in an amount of 0.01 to 1 wt%, and further, Be, Ge, C may be added to the above composition.
It is useful to contain 0.0001 to 0.005 wt% of one or more of a, Si, Fe, Sc, Y and rare earth elements.

【0007】[0007]

【作用】上記の構成によれば、Au,PdはPtに全率
固溶し、高温強度の高いPt合金ワイヤを形成する。同
時に、その添加総量を0.01〜10wt%の範囲内とし
たことから、ボールとチップ電極の下地金属層との接合
面におけるPtとAlの相互拡散を適度に抑止し、該接
合面、即ち、A点における接合強度が改善される。
According to the above structure, Au and Pd all form a solid solution in Pt to form a Pt alloy wire having high strength at high temperature. At the same time, since the total addition amount is within the range of 0.01 to 10 wt%, the interdiffusion of Pt and Al at the joint surface between the ball and the base metal layer of the chip electrode is appropriately suppressed, and the joint surface, that is, , The bonding strength at points A is improved.

【0008】また、Ru,Rhを添加することで、前記
Pt合金における結晶の粗粒化(粒子の粗大化)を防止
し、ワイヤの高温強度をさらに向上させる。
Further, by adding Ru and Rh, coarsening of crystals (coarsening of grains) in the Pt alloy is prevented, and the high temperature strength of the wire is further improved.

【0009】さらに、Be,Ge,Ca,Si,Fe,
Sc,Y,希土類元素の添加により、前記結晶の粗粒化
防止をより促進し、さらに高レベルな高温強度を得る。
Further, Be, Ge, Ca, Si, Fe,
The addition of Sc, Y, and a rare earth element further promotes the prevention of coarsening of the crystal and obtains a higher level high temperature strength.

【0010】しかし乍ら、Au,Pd、Ru,Rh、B
e,Ge,Ca,Si,Fe,Sc,Y,希土類元素の
各添加量が上記添加範囲の下限未満では、上述の効果を
得ることができない。
However, Au, Pd, Ru, Rh, B
If the addition amount of each of e, Ge, Ca, Si, Fe, Sc, Y and the rare earth element is less than the lower limit of the above addition range, the above effect cannot be obtained.

【0011】また、Au,Pdの添加量が10wt%を越
えると、ワイヤ先端に形成するボールが硬くなり過ぎ、
ボンディング時においてチップ割れが生じるので好まし
くない。Ru,Rhの添加量が1wt%を越えると、合金
形成時に偏析が生じ、伸線加工できないので好ましくな
い。Be,Ge,Ca,Si,Fe,Sc,Y,希土類
元素の添加量が0.005wt%を越えると、ワイヤ先端
に形成するボールの形状が不安定になり、ボンディング
時におけるボールとチップとの接合強度が低下する。
If the amount of Au or Pd added exceeds 10 wt%, the ball formed at the tip of the wire becomes too hard,
It is not preferable because chip cracks occur during bonding. If the addition amount of Ru and Rh exceeds 1 wt%, segregation occurs during alloy formation and wire drawing cannot be performed, which is not preferable. If the addition amount of Be, Ge, Ca, Si, Fe, Sc, Y, or the rare earth element exceeds 0.005 wt%, the shape of the ball formed at the tip of the wire becomes unstable, and the ball and the chip during bonding become unstable. Bonding strength decreases.

【0012】従って、Au,Pdの添加量を0.01〜
10wt%の範囲に、Ru,Rhの添加量を0.01〜1
wt%の範囲に、Be,Ge,Ca,Si,Fe,Sc,
Y,希土類元素の添加量を0.0001〜0.005wt
%の範囲に、各々設定した。
Therefore, the addition amount of Au and Pd is 0.01 to
The addition amount of Ru and Rh is 0.01 to 1 within the range of 10 wt%.
Be, Ge, Ca, Si, Fe, Sc,
Y, the amount of rare earth element added is 0.0001 to 0.005 wt
Each range was set to%.

【0013】[0013]

【実施例】以下、具体的な実施例について説明する。EXAMPLES Specific examples will be described below.

【0014】高純度Ptに、Au,Pd,Ru,Rh,
Be,Ge,Ca、Si,Fe,Sc,Y,Laの各添
加元素を表1中に示す含有率に基づき添加して溶解鋳造
し、次に溝ロール加工を施し、その途中で焼なまし処理
を施した後に線引加工で線径25μmの母線に成形し、
更に十分な応力除去を行うことにより各試料とした。
High-purity Pt contains Au, Pd, Ru, Rh,
Additive elements of Be, Ge, Ca, Si, Fe, Sc, Y and La are added based on the content rates shown in Table 1 and melt-cast, then groove roll processed and annealed in the middle. After the treatment, it is drawn into a bus bar with a wire diameter of 25 μm.
Further, sufficient stress relief was performed to obtain each sample.

【0015】表1中の試料No.1〜8は高純度Ptに
Au,Pdの1種又は2種を添加した本発明実施品、試
料No.9〜14は前記Au,Pdの配合に加えてR
u,Rhの1種又は2種を添加した本発明実施品、試料
No.15〜26は前記Au,Pd,Ru,Rhの配合
に加えて、Be,Ge,Ca,Si,Fe,Sc,Y,
希土類元素(La)の中から1種又は2種以上を添加し
た本発明実施品である。
Sample No. 1 in Table 1 Samples Nos. 1 to 8 of the present invention in which one or two kinds of Au and Pd were added to high-purity Pt, Sample No. 9 to 14 are R in addition to the combination of Au and Pd.
u, Rh one or two kinds of the present invention, sample No. 15 to 26 are Be, Ge, Ca, Si, Fe, Sc, Y, in addition to the composition of Au, Pd, Ru, Rh.
It is a product of the present invention in which one or more of rare earth elements (La) are added.

【0016】また、試料No.27は高純度Pt(9
9.96wt%)に何も添加しない比較品である。
Sample No. 27 is high purity Pt (9
This is a comparative product in which nothing is added to 9.96 wt%).

【0017】尚、表1では希土類元素の代表としてLa
のデータを示したが、これ以外の希土類元素はLaと同
質性のため省略した。
In Table 1, La is shown as a representative of rare earth elements.
However, the other rare earth elements are omitted because they are homogeneous with La.

【0018】上記のようにして作製した各試料を熱処理
により所定の伸び率に合わせた後、高温強度及びA点剥
がれ発生率を測定した。
Each of the samples prepared as described above was heat-treated to have a predetermined elongation, and then the high temperature strength and the A point peeling occurrence rate were measured.

【0019】高温強度は、各試料を250℃×20秒保
持後、標点間距離100mmにて引張速度10mm/m
inで引張り試験を行った時の破断荷重を測定した。
The high-temperature strength was such that after holding each sample at 250 ° C. for 20 seconds, the tensile speed was 10 mm / m at a gauge length of 100 mm.
The breaking load was measured when the tensile test was performed in in.

【0020】A点剥がれ発生率は、各試料をAl薄膜
(0.8μm厚)のチップ電極上に所定条件にてボンデ
ィングした後、Alが拡散し易い高温条件下で放置し
(200℃×300時間)、その後にC点(ループ部)
を引張るプルテストを行って、ボンディングワイヤがチ
ップとの接合面から剥がれた割合を計算した。これらの
結果も表1中に示す。
The occurrence rate of peeling at point A was determined by bonding each sample to a chip electrode of an Al thin film (0.8 μm thick) under predetermined conditions and then leaving it under high temperature conditions where Al was likely to diffuse (200 ° C. × 300). Time), then point C (loop part)
Was pulled to calculate the rate at which the bonding wire was peeled from the bonding surface with the chip. These results are also shown in Table 1.

【0021】[0021]

【表1】 [Table 1]

【0022】試料No.1〜8の測定結果から、高純度
PtにAu,Pdの1種又は2種を、総添加量0.01
〜10wt%の範囲内で添加すれば、所定の高温強度が得
られると同時に、ボールとチップ電極の下地金属層との
接合面(A点)において剥がれが発生せず、該接合面に
おける接合強度が改善されることが確認できた。
Sample No. From the measurement results of 1 to 8, 1 or 2 kinds of Au and Pd were added to high-purity Pt in a total addition amount of 0.01
If added within the range of 10 wt%, a predetermined high temperature strength can be obtained, and at the same time, peeling does not occur at the joint surface (point A) between the ball and the underlying metal layer of the chip electrode, and the joint strength at the joint surface is high. Was confirmed to be improved.

【0023】また、試料No.9〜14の測定結果か
ら、0.01〜10wt%のAu,Pdの添加に加えて、
Ru,Rhの1種又は2種を所定量添加すれば、上記高
温強度をさらに向上できることが確認できた。
Sample No. From the measurement results of 9 to 14, in addition to the addition of 0.01 to 10 wt% Au and Pd,
It was confirmed that the high temperature strength can be further improved by adding a predetermined amount of one or two of Ru and Rh.

【0024】さらに、試料No.15〜26の測定結果
から、0.01〜10wt%のAu,Pdの添加、0.0
1〜1wt%のRu,Rhの添加に加えて、Be,Ge,
Ca,Si,Fe,Sc,Y,希土類元素の中から1種
又は2種以上を所定量添加すれば、上記高温強度をより
高レベルなものにし得ることが確認できた。
Further, the sample No. From the measurement results of 15 to 26, addition of 0.01 to 10 wt% of Au and Pd, 0.0
In addition to the addition of 1 to 1 wt% of Ru and Rh, Be, Ge,
It was confirmed that the high temperature strength can be increased to a higher level by adding a predetermined amount of one or more selected from Ca, Si, Fe, Sc, Y and rare earth elements.

【0025】また、試料No.27の測定結果から、高
純度PtにAu,Pd,Ru,Be,Ge,Ca,S
i,Fe,Sc,Y,希土類元素を添加しない場合は、
所定の高温強度が得られないと共に、A点剥がれの発生
率が高いことが確認できた。
Sample No. From the measurement results of 27, high purity Pt was added to Au, Pd, Ru, Be, Ge, Ca, S.
When i, Fe, Sc, Y and rare earth elements are not added,
It was confirmed that the predetermined high temperature strength could not be obtained and that the occurrence rate of A point peeling was high.

【0026】[0026]

【発明の効果】本発明に係る半導体素子用Pt合金極細
線は以上説明したように、高純度PtにAu,Pdを添
加することで、ワイヤの高温強度向上を図ると同時に、
ボンディング後の高温放置試験におけるA点剥がれの発
生率を著しく低下し得た。
As described above, in the Pt alloy ultrafine wire for semiconductor device according to the present invention, by adding Au and Pd to high-purity Pt, the high temperature strength of the wire is improved and at the same time,
The incidence of peeling at point A in the high temperature storage test after bonding could be significantly reduced.

【0027】従って、ボンディング後において所定の高
温強度を得られると共に、ボールとチップ電極の接合強
度を著しく改善して、ワイヤボンディング法及びバンプ
接続法に用いるに極めて有用な半導体素子用Pt合金極
細線を提供できた。
Therefore, a predetermined high temperature strength can be obtained after bonding, and the bonding strength between the ball and the chip electrode can be remarkably improved, which is extremely useful for the wire bonding method and the bump connecting method for the semiconductor element Pt alloy ultrafine wire. Could be provided.

【0028】また、Ru,Rhの添加によって上記高温
強度をより向上し得、さらには、Be,Ge,Ca,S
i,Fe,Sc,Y,希土類元素を添加することで、よ
り高レベルな高温強度を得ることができた。
The high temperature strength can be further improved by adding Ru and Rh, and further, Be, Ge, Ca and S can be added.
By adding i, Fe, Sc, Y and a rare earth element, a higher level high temperature strength could be obtained.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】Au,Pdの内の1種又は2種を総添加量
0.01〜10wt%含有し、残部Ptからなる半導体素
子用Pt合金極細線。
1. A Pt alloy extra fine wire for a semiconductor device, which contains one or two kinds of Au and Pd in a total amount of 0.01 to 10 wt% and the balance is Pt.
【請求項2】 Au,Pdの内の1種又は2種を総添加
量0.01〜10wt%含有すると共に、Ru,Rhの内
から1種又は2種を0.01〜1wt%含有し、残部Pt
からなる半導体素子用Pt合金極細線。
2. One or two kinds of Au and Pd are contained in a total amount of 0.01 to 10 wt% and one or two kinds of Ru and Rh are contained in 0.01 to 1 wt%. , Balance Pt
An ultrafine Pt alloy wire for a semiconductor device.
【請求項3】 Au,Pdの内の1種又は2種を0.0
1〜10wt%、Ru,Rhの内から1種又は2種を0.
01〜1wt%夫々含有すると共に、Be,Ge,Ca,
Si,Fe,Sc,Y,希土類元素の中から1種又は2
種以上を0.0001〜0.005wt%含有し、残部P
tからなる半導体素子用Pt合金極細線。
3. One or two of Au and Pd is 0.0
1 to 10 wt%, and one or two of Ru and Rh is added to 0.
01 to 1 wt% of each, Be, Ge, Ca,
One or two of Si, Fe, Sc, Y and rare earth elements
0.0001-0.005 wt% of seeds or more, balance P
A Pt alloy extra fine wire for a semiconductor element, which is composed of t.
JP04262212A 1992-09-30 1992-09-30 Pt alloy ultrafine wires for semiconductor devices Expired - Fee Related JP3074626B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP04262212A JP3074626B2 (en) 1992-09-30 1992-09-30 Pt alloy ultrafine wires for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04262212A JP3074626B2 (en) 1992-09-30 1992-09-30 Pt alloy ultrafine wires for semiconductor devices

Publications (2)

Publication Number Publication Date
JPH06112252A true JPH06112252A (en) 1994-04-22
JP3074626B2 JP3074626B2 (en) 2000-08-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
JP (1) JP3074626B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5945065A (en) * 1996-07-31 1999-08-31 Tanaka Denshi Kogyo Method for wedge bonding using a gold alloy wire
WO2010110746A1 (en) * 2009-03-26 2010-09-30 Autium Pte Ltd Platinum alloys and method for forming the same
JP2017145480A (en) * 2016-02-19 2017-08-24 石福金属興業株式会社 Platinum palladium rhodium alloy
CN113241303A (en) * 2021-05-19 2021-08-10 合肥矽格玛应用材料有限公司 Packaging bonding platinum wire and preparation method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5945065A (en) * 1996-07-31 1999-08-31 Tanaka Denshi Kogyo Method for wedge bonding using a gold alloy wire
WO2010110746A1 (en) * 2009-03-26 2010-09-30 Autium Pte Ltd Platinum alloys and method for forming the same
JP2017145480A (en) * 2016-02-19 2017-08-24 石福金属興業株式会社 Platinum palladium rhodium alloy
CN113241303A (en) * 2021-05-19 2021-08-10 合肥矽格玛应用材料有限公司 Packaging bonding platinum wire and preparation method thereof

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