JPH06112185A - Immersion type substrate processor - Google Patents

Abstract

PURPOSE:To prevent re-deposition of particles and heavy metal to a substrate by eliminating residence of processing solution in an immersion-type substrate processor having an upflow processing reservoir. CONSTITUTION:Processing solution supply pipes 12 are placed at both corners of a bottom 111 of a processing reservoir 1, and residence preventing slopes 111a, 111b having a slope along a lower face of a flow face of processing solution 2 jetted from a processing solution supply pipe 12 are provided symmetrically on the bottom 111.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an immersion type substrate processing apparatus for treating the surface of a thin substrate (hereinafter, simply referred to as "substrate") such as a semiconductor substrate or a glass substrate for liquid crystal or photomask. .

[0002]

2. Description of the Related Art FIG. 10 is a longitudinal sectional view showing the structure of a main part of a conventional immersion type substrate processing apparatus.

The processing bath 1 is filled with a substrate processing liquid (hereinafter simply referred to as "processing liquid") 2 such as a cleaning liquid or a chemical liquid. The substrate 3 has guide grooves 7 whose outer peripheral edges are formed on the upper surfaces of three substrate holding rods 7 arranged perpendicularly to the paper surface.
It is immersed in the treatment liquid 2 while being inserted into a and held vertically, and subjected to a predetermined surface treatment.

Below the substrate 3, a processing liquid supply pipe 4 is provided horizontally through the side surface of the processing tank 1 in a direction perpendicular to the plane of the drawing.
It is liquid-tightly fixed in the through hole.

The treatment liquid supply pipe 4 is a single pipe, and a plurality of treatment liquid ejection holes 5 are formed on the side surface of the treatment liquid supply pipe 4 at predetermined intervals in a direction perpendicular to the plane of the drawing toward the center of the substrate 3. A predetermined processing liquid 2 is supplied to the processing liquid supply pipe 4 from a processing liquid supply device (not shown) provided outside the processing tank 1, and the predetermined processing liquid 2 is supplied from the processing liquid ejection hole 5 toward the substrate 3. The processing liquid 2 is ejected.

The jetted processing liquid 2 flows on the surface of the substrate 3 and overflows from the upper edge portion 1a of the processing tank 1 and is received by an outer tank 6 provided along the periphery of the processing tank 1 to pass through a waste liquid pipe 6a. Waste liquid is disposed of through.

In this way, according to the method of performing the surface treatment of the substrate 3 by supplying the treatment liquid 2 from the lower side of the treatment tank 1 while overflowing it (overflow method), a new treatment liquid 2 is constantly added to the substrate 3. Since it is supplied to the surface, there is an advantage that the processing time can be shortened.

[0008]

However, in the processing liquid supply method of the overflow type immersion type substrate processing apparatus as described above, one of the processing liquids 2 supplied from the processing liquid supply pipe 4 into the processing bath 1 is used. Part stays in a specific place,
An unfavorable phenomenon that the replacement of the treatment liquid 2 did not occur only in that portion (the portion in which the treatment liquid in the treatment tank is retained in this manner is hereinafter referred to as "retention area").

FIG. 11 is a schematic view showing the flow state of the processing liquid 2 in the central cross section of the processing tank 1.

The flow of the processing liquid 2 ejected from the ejection holes 5 of the left and right processing liquid supply pipes 4 collides in the vicinity of the center of the substrate 3 and is divided into left and right parts, and a part thereof overflows from the upper edge portion 1a. The rest flows downward along the inner wall of the side surface of the processing tank 1 and circulates, and eventually overflows from the upper edge 1a.

In the middle of the processing liquid supply pipes 4 on the left and right sides, the jet flow of the processing liquid 2 circulates downward, so that vortices 2a and 2b gently circulate. Since the amount of the processing liquid 2 directly supplied to this portion from the ejection holes 5 is small, the processing liquid 2 stays and forms the staying area A.

Foreign matter such as particles and heavy metals generated in the surface treatment of the substrate 3 (hereinafter simply referred to as "foreign matter").
However, even if the amount of the treatment liquid 2 supplied from the treatment liquid supply pipe 4 is increased, the treatment liquid 2 is hardly supplied to the residence region A and circulates in the same area. The foreign matter is not discharged from the upper edge portion 1a and stays in the retention area A forever.

The foreign matter in the retention area A redeposits on the surface of the substrate 3 and is a cause of deteriorating the processing accuracy of the substrate.

In addition, in the portion B below the inner wall side surface on both sides, the circulation speed of the treatment liquid 2 becomes relatively slow, so that foreign matter, particularly heavy foreign matter such as heavy metals, is precipitated by the action of gravity, and in the case of the retention area A. There is a risk of reattachment to the substrate 3 in the same manner as.

The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to provide an immersion type substrate processing apparatus having a processing tank capable of minimizing the retention area in the processing tank. To aim.

[0016]

In order to achieve the above-mentioned object, an immersion type substrate processing apparatus according to the invention of claim 1 surface-treats the substrate by immersing the substrate in a processing tank for storing a processing liquid. In the immersion type substrate processing apparatus, the processing liquid supply pipe, which is provided at the bottom of the processing tank and has an ejection hole for ejecting the processing liquid toward a predetermined upper angle, is provided outside the processing tank. A treatment liquid supply means for supplying the treatment liquid to the treatment liquid supply pipe, and prevents the treatment liquid ejected from the treatment liquid supply pipe from flowing downward to form a retention area at the bottom of the treatment tank. In the immersion type substrate processing apparatus according to the invention of claim 2, the lower end of the stagnation prevention slope is the processing liquid supply pipe. of Serial substantially below the opening of the ejection hole abuts the inclined surface, characterized in that it is formed substantially along the bottom surface of the outflow surface of the treatment liquid flowing out from the jet holes.

Further, in the immersion type substrate processing apparatus according to the invention of claim 3, in the above-mentioned claim 2, the shape of the cross section of the inner wall surface of the processing tank is substantially rectangular, and two processing liquid supply pipes are provided. Facing each other and attached to both corners of the bottom surface of the processing tank, and the retention prevention slopes are provided on the bottom surface portion of the processing tank so as to be substantially symmetrical with respect to a plane orthogonal to the processing liquid supply pipe. Characterize.

Further, an immersion type substrate processing apparatus according to a fourth aspect of the present invention is the immersion type substrate processing apparatus according to the third aspect, wherein:
The respective lower ends of the pair of inner wall side faces parallel to the processing liquid supply pipes are in contact with the processing liquid supply pipes immediately outside the openings of the ejection holes.

[0019]

According to the first aspect of the present invention, the retention preventing slope is formed to prevent the processing liquid from being spouted into the processing tank from the spouting hole of the processing liquid supply pipe. The retention of the processing liquid below the liquid supply pipe is prevented.

According to the second aspect of the present invention, the lower end of the stagnation prevention slope contacts the lower side of the opening of the ejection hole of the processing liquid supply pipe, and the inclined surface extends from the ejection hole. Since it is formed substantially along the lower surface of the outflow surface of the outflowing processing liquid, it is possible to efficiently prevent the processing liquid from flowing downward.

Further, according to the invention of claim 3, two processing liquid supply pipes are provided facing each other at both corners of the bottom surface of the processing tank, and the retention preventing slopes are orthogonal to the processing liquid supply pipe. Since it is provided on the bottom surface of the processing tank so as to be substantially symmetrical with respect to the plane, retention of the two processing liquid supply pipes below the middle part is prevented, and the processing liquid flows symmetrically in the processing tank. .

According to the invention of claim 4, the lower end portion of each side surface of the inner wall of the treatment tank which is parallel to the treatment liquid supply pipe of the third aspect of the present invention is directly adjacent to the opening of the ejection hole of each treatment liquid supply pipe. Since it is in contact with the outside, the wraparound of the processing liquid in the lateral direction of the processing tank is minimized.

[0023]

Embodiments of the immersion type substrate processing apparatus according to the present invention will now be described in detail with reference to the drawings, but it goes without saying that the technical scope of the present invention is not limited thereto. .

FIG. 1 is a longitudinal sectional view showing the structure of the main part of an immersion type substrate processing apparatus 10 according to an embodiment of the present invention.

The processing tank 11 is made of quartz and has a width slightly wider than the diameter of the substrate 3, and a tapered portion 112a is formed above the side surface 112 and spreads outward.

An outer bath 22 also made of quartz is provided along the outer periphery of the treatment bath 11, and an upper edge portion 11 of the treatment bath 11 is provided.
The treatment liquid 2 overflowing from 2b is received by the outer tank 22 and collected in the waste liquid tank 38 (see FIG. 8) via the waste liquid pipe 22a.

Since the outer tank 22 is provided with a tank 22b having a large depth, the amount of the processing liquid 2 that temporarily overflows from the processing tank 11 for some reason becomes larger than the amount discharged from the waste liquid pipe 22a. However, there is no risk of water overflowing from the outer tank 22.

The processing liquid supply pipe 12 made of quartz has openings 11a provided at both corners of the bottom surface portion 111 of the processing tank 11.
11b is attached from the outside and fixed by welding without leaking liquid.

FIG. 2 is an enlarged view of the vicinity of the processing liquid supply pipe 12 on the right side of the two processing liquid supply pipes 12 in FIG.

As shown in the figure, the processing liquid supply pipe 12
Is a double tube consisting of an outer tube 13 and an inner tube 14 concentrically inserted in the outer tube 13, and is a position inclined by 10 ° from the vertical line of the outer tube 13 toward the inside of the processing tank 1. 70 ° opening angle
The slit-shaped main ejection holes 15 are provided in parallel with each other at a predetermined interval so as to be orthogonal to the longitudinal direction of the outer pipe 13 (see FIG. 4), while the inner pipe 14 is provided with the sub ejection holes 16. Inner tube 1
4 are formed in a row in the longitudinal direction of the nozzle 4 at equal intervals with the main ejection holes 15.

The auxiliary ejection hole 16 is formed such that its opening center is exactly 180 ° inverted from the opening center of the main ejection hole 15.

Returning to FIG. 1, the bottom portion 111 of the processing bath 11
Has a mountain-shaped shape that is symmetrical with respect to a plane orthogonal to the processing liquid supply pipe 12, and has a slope (retention prevention slope) 11
Reference numerals 1a and 111b denote the flow 2 at the lowermost portion of the outflow surface of the processing liquid 2 jetted from the processing liquid supply pipe 12, respectively.
c, 2d, the slopes 111a, 11
The respective lower ends 111c and 111d of 1b are in contact with the processing liquid supply pipe 12 immediately below the opening of the main ejection hole 15.

Reference numeral 17 (FIG. 1) is a substrate holding holder for vertically holding a plurality of substrates 3 at regular intervals, which comprises a hanging member 18 and a base frame 19 provided below the hanging member 18. Three holding rods 20 that extend perpendicularly to the paper surface are suspended from 19.

A plurality of guide grooves 2 are provided on the upper surface of the holding rod 20.
0a are formed at an equal pitch p, and the substrate 3 has its lower outer peripheral edge inserted into the guide groove 20a.
It is maintained in the processing tank 11 in an orderly manner.

FIG. 3 is a side view of the substrate holding holder 17. As shown in the figure, the holding rod 20 is horizontally hung between a pair of base frames 19, while an upper part of the hanging member 18 is provided with an engaging member 21 protruding outward in the horizontal direction.

The engaging member 21 is held by a substrate transfer device (not shown), and the substrate 3 together with the substrate holding holder 17 is pulled up from the processing tank 11 and transferred to another place. According to such a transfer method, the width of the processing tank 11 can be reduced by an amount that does not require the insertion of a chuck, as compared with a method of inserting a chuck into the processing tank 11 to grip and transfer the substrate 3. Therefore, there is an advantage that the amount of the processing liquid 2 can be saved accordingly.

FIG. 4 is a view showing the appearance of the processing liquid supply pipe 12.

The respective main ejection holes 15 are formed at the same pitch p as the pitch of the guide grooves 20a of the holding rod 20, and when the substrate 3 is soaked in the processing bath 11 by the substrate holding holder 17. Each main ejection hole 1 between the substrate
5 is positioned so that the processing liquid 2 flows out into each gap between the plurality of substrates 3 and the processing liquid 2 can be efficiently supplied to the surface of each substrate 3.

The end portion 14a of the inner pipe 14 is the outer pipe 13
Is liquid-tightly fixed to the end portion 13a of the
b penetrates the end portion 13b of the outer tube 13 and projects to the outside, is connected to the supply tube 37, and receives the supply of the processing liquid 2 from the processing liquid supply device 30 (FIG. 8).

FIG. 5 is a schematic diagram showing an experimental result of the outflow velocity v of the treatment liquid 2 ejected from each main ejection hole 15 of the treatment liquid supply pipe 12. In the conventional single-pipe type processing liquid supply pipe 4 (FIG. 10), there is a difference in the magnitude of static pressure in each ejection hole 5 due to Bernoulli's law, and the outflow speed of the processing liquid is different from each ejection hole 5. Although there was a difference in the outflow amount of the processing liquid 2 to be jetted, the double-pipe type processing liquid supply pipe 12 according to the present embodiment, as shown in FIG. The outflow velocities v of 2 become almost equal, and an equal amount of the processing liquid 2 is supplied to each substrate 3, which enables uniform processing.

The reason why the outflow velocity v of the treatment liquid 2 is made uniform in this way is that the sub-spout hole 1 of the inner pipe 14 is as shown in FIG.
The treatment liquid 2 jetted from 6 once collides with the inner wall of the outer pipe 13, the flow velocity becomes 0 at the collision point T, and it becomes a new divergence point with respect to each main jet hole 15 of the outer pipe 13. The liquid 2 passes through the flow paths r1 and r2 from the respective points, and the main ejection hole 15
It is considered that this is because the fluid dynamics conditions in each of the main ejection holes 15 are the same because they are ejected from.

Since the outflow velocity v of the treatment liquid 2 ejected from each main ejection hole 15 is made uniform by adopting the double pipe structure as described above, the opening area of each main ejection hole 15 is increased. But the balance is not broken. As a result, as shown in FIG. 2, the main ejection hole 15 can be formed into a slit shape to increase the opening area.

When the opening area is large, the outflow speed does not increase so much even if the inflow amount of the processing liquid 2 into the processing liquid supply pipe 12 is increased, so that charging occurs due to friction between the processing liquid 2 and the surface of the substrate 3. Particles and the like will not adhere to the surface of the substrate 3.

Further, since the slit of the main ejection hole 15 is formed in parallel with the main surface of the substrate 3, the outflow width of the processing liquid 2 ejected along the surface of the substrate 3 can be widened, Thus, the processing liquid 2 can be uniformly supplied to the surface of the substrate 3.

FIG. 8 is a diagram showing the structure of the processing liquid supply apparatus 30.

The electric pump 31 selectively pumps the chemical liquid 35 and pure water 36 from the chemical liquid tank 33 or the pure water tank 34 by switching the electromagnetic switching valve 32, and the inside of the processing liquid supply pipe 12 via the supply tube 37. Tube 14
Supply to.

The chemical solution 35 or pure water 36 overflowing from the processing tank 11 is received by the outer tank 22 and is collected in the waste liquid tank 38 via the waste liquid pipe 22a.

Each operation of the electric pump 31 and the electromagnetic switching valve 32 for selecting the type of the processing liquid 2 to be supplied is controlled by the control unit 39.

A flow rate sensor may be provided in the flow path of the supply tube 37 and fed back to the control unit 39 to control the operation of the electric pump to more accurately control the supply amount of the treatment liquid 2. . Further, since the two processing liquid supply pipes 12 are the same, the processing liquid 2 jetted out
The flow rates should be exactly the same, but variations may occur in the manufacturing stage, so a flow rate control valve may be provided in either or both of the flow paths 37a and 37b for fine adjustment.

If the treatment liquid 2 collected in the waste liquid tank 38 is purified by a filter or the like and reused, the running cost can be reduced.

In FIG. 9, the treatment liquid 2 is actually fed from the treatment liquid supply device 30 to the treatment tank 11 via the treatment liquid supply pipe 12.
2 schematically shows the flow state when the is supplied.

As shown in the figure, the processing liquid supply pipe 1
The treatment liquid 2 ejected from the main ejection holes 15 of 2 flows out symmetrically toward the center of the substrate 3 and is evenly supplied to the entire surface of the substrate 3. Along the tapered portion 112a of the upper edge 112b
Overflows from. Another flow R2 wraps around in the direction of the side surface 112 and descends along the inner wall of the side surface 112, and the main jet hole 15
While riding on the flow of the processing liquid 2 jetted from the tank, the liquid rises again and circulates in the processing tank 1, and finally overflows from the upper edge portion 112b.

Further, since the processing liquid 2 ejected from the ejection holes 15 does not go downward due to the action of the retention prevention slopes 111a and 111b, the two processing liquid supply pipes 1 are provided.
No stagnation zone is formed in the middle part of 2.

As described above, the processing tank 11 in this embodiment
Has a tapered portion 1 formed above the side surface 112.
Since it has 12a, it is possible to effectively form the overflow flow R1 and smooth out the unnecessary overflow of the processing liquid 2,
Further, since the lower end 112c of the inner wall of the side wall 112 is in contact with the outside of the opening of the main ejection hole 15, the treatment liquid 2
Is prevented from flowing unnecessarily in the lateral direction, and even if the processing liquid 2 descends along the inner wall of the side wall 112, there is the ejection hole 15 below it, so that the ejection liquid 15 is forced to ride on the flow of the ejection flow. It is circulated upward, and there is no risk of foreign matter settling in this part.

Furthermore, the retention prevention slopes 111a and 111b can effectively prevent the processing liquid 2 from retaining on the bottom surface portion 111, and foreign matter retains on this portion and the substrate 3
It will not redeposit on the surface.

In the above embodiment, the retention prevention slope 1
Lower end portions 111c and 111 of 11a and 111b, respectively.
d is brought into contact with the processing liquid supply pipe 12 immediately below the opening of the main ejection hole 15, and the inclined surface thereof is attached to the main ejection hole 1
Although it is formed along almost the lower surface of the outflow surface of the processing liquid flowing out from the No. 5 to minimize the occurrence of retention, the bottom surface portion 111 does not have to be strictly such a structure.
By appropriately forming the ridges, it is possible to obtain a retaining effect as such.

Further, the taper portion 112a of the processing tank 11
Is provided in order to prevent the overflow of the processing liquid 2 smoothly, and is not necessarily provided.

In the above embodiment, each main ejection hole 15 of the processing liquid supply pipe 12 is formed by one slit hole having an opening angle of 70 ° as shown in FIG. The main ejection holes 15 may be appropriately changed as necessary, and the main ejection holes 15 may be configured such that a plurality of small slit holes are arranged in the same opening angle, for example. FIG. 7A shows a part of the side surface when the main ejection hole 15 is formed by three small slits 15a, and FIG. 7B shows the shape of the small slit 15a in the cross section.

As described above, when one slit is divided into a plurality of small slits within the same opening angle, the opening area is reduced and the outflow state of the processing liquid 2 seems to be deteriorated. We have obtained experimental results that it will grow.

The reason for this is that the main ejection hole 15 is divided into a plurality of small slits 15a, so that the treatment liquid supply pipe 2
Is not immediately jetted to the outside, and is diffused from the small slits 15a dispersed in a wide opening angle in a state where the collision of the processing liquids 2 having passed through the flow paths r1 and r2 (see FIG. 6) is alleviated. It is thought that this is because it is ejected.

As described above, the processing liquid supply pipe 12
By changing the structure of (1) as needed, a more ideal supply of the processing liquid 2 can be made possible, and the flow rate of the processing liquid 2 supplied to the surface of each substrate 3 can be made uniform. At the same time, it is possible to contribute to the reduction of the retention area by the increase in the outflow width.

In this embodiment, the processing liquid supply pipe 1
The number of two is only two symmetrically provided at both corners of the bottom surface, but three or more may be provided as long as the flow state of the treatment liquid 2 can be symmetrical. In this case, the number of retention prevention slopes increases, and the shape of the bottom surface portion 111 becomes slightly complicated.

Further, as described above, the sub-spout hole 1 of the inner pipe 14
It is considered that the treatment liquid 2 ejected from the nozzle 6 is stalled by colliding with the inner wall of the outer tube 13 at one end, and thereby the outflow velocity from the main nozzle 15 is made uniform.
The position of 6 does not necessarily need to be inverted 180 ° from the center position of the opening of the main ejection hole 15, and at least the openings of both may not be overlapped. However, in this case, since the lengths of the flow paths r1 and r2 (FIG. 6) are not equal, it is sufficiently expected that the outflow direction and the outflow width of the processing liquid 2 will be changed.

The outer tube 13 and the inner tube 14 of the processing liquid supply pipe 12 do not necessarily have to be concentric, and the inner tube 14 may be slightly eccentric in some cases.

Further, the treatment liquid supply pipe 12 may have a multi-layer structure of three layers or more so that the positions of the ejection holes of the respective pipes are different from each other.

In this embodiment, the double pipe type processing liquid supply pipe 12 is used, but of course, even the conventional single pipe type processing liquid supply pipe 4 is treated like the processing tank 11. By providing the retention prevention slopes 111a and 111b, the retention area can be sufficiently reduced.

[0067]

According to the immersion type substrate processing apparatus of the first aspect of the present invention, a stagnation is formed on the bottom surface of the processing bath to prevent the processing solution from flowing out from the ejection holes of the processing solution supply pipe to flow under the processing solution. Since the prevention slope is formed, it is possible to prevent generation of a retention area below the processing liquid ejected from the processing liquid supply pipe, and particles and heavy metals are retained at the bottom of the processing bath and reattached to the substrate. As a result, the accuracy of substrate processing can be improved.

According to the second aspect of the present invention, the lower end of the stagnation prevention slope contacts the lower side of the opening of the ejection hole of the processing liquid supply pipe, and the inclined surface thereof flows out from the ejection hole. Since it is formed almost along the lower surface of the outflow surface of the processing solution, there is almost no room for the processing solution flowing out from the ejection hole to flow directly along the retention prevention slope and go around downward, and the processing solution supply pipe. The occurrence of a stagnation zone below can be minimized.

According to the third aspect of the present invention, the two processing liquid supply pipes are arranged facing each other at both corners of the bottom surface of the processing tank, and the retention preventing slopes are orthogonal to the processing liquid supply pipe. Since it is provided on the bottom surface of the processing tank so as to be substantially symmetrical with respect to the plane, it is possible to effectively prevent the accumulation of the two processing liquid supply pipes below the middle portion thereof, and to allow foreign matter to settle on the side surface. Does not cause In addition, since the processing liquid is symmetrical, the processing liquid uniformly flows in the processing tank, and the substrate processing can be made uniform.

According to the fourth aspect of the invention, since the lower end portion of the side surface of the inner wall is in contact with the outer side of the opening portion of the ejection hole, the wraparound of the processing liquid in the side surface direction is minimized and the inner wall surface is minimized. The processing liquid descending along the flow path rides on the jet flow from the jet holes and circulates upward again and overflows, so that the foreign matter is effectively discharged and there is no risk of re-adhesion to the substrate.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of a main part of an immersion type substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is an enlarged vertical sectional view of the vicinity of a processing liquid supply pipe in the embodiment of FIG.

FIG. 3 is a side view of a substrate holding holder in the embodiment of FIG.

FIG. 4 is a diagram showing an appearance of a processing liquid supply pipe in the embodiment of FIG.

FIG. 5 is a diagram showing how the outflow speed of the processing liquid ejected from the main ejection holes is made uniform when the processing liquid supply pipe of FIG. 2 is used.

FIG. 6 is a schematic diagram showing a flow state of the processing liquid in the processing liquid supply pipe of FIG.

FIG. 7 is a view showing another embodiment of the processing liquid supply pipe in a partial side view and a cross section.

8 is a diagram showing a configuration of a treatment liquid supply apparatus in the embodiment of FIG.

FIG. 9 is a schematic diagram showing a flow state of a processing liquid in the processing tank in the embodiment of FIG.

FIG. 10 is a vertical cross-sectional view of a main part of a conventional immersion type substrate processing apparatus.

11 is a schematic diagram showing a flow state of a processing liquid in a processing tank in the immersion type substrate processing apparatus of FIG.

[Explanation of symbols]

 2 processing liquid 3 substrate 10 immersion type substrate processing apparatus 11 processing tank 12 processing liquid supply pipe 13 outer pipe 14 inner pipe 15 main ejection hole 15a small slit 16 sub ejection hole 17 substrate holding holder 20 holding rod 22 outer bath 30 processing liquid supply Device 31 Electric pump 32 Electromagnetic switching valve 33 Chemical liquid tank 34 Pure water tank 38 Waste liquid tank 39 Control part 111 Bottom part 111a, 111b Retaining prevention slope

Claims (4)

[Claims] 1. An immersion-type substrate processing apparatus for surface-treating a substrate by immersing the substrate in a processing tank for storing a processing liquid, wherein the immersion-type substrate processing apparatus is provided at the bottom of the processing tank and is processed toward a predetermined upper angle. A treatment liquid supply pipe having ejection holes for ejecting a liquid; and a treatment liquid supply means provided outside the treatment tank and configured to supply the treatment liquid to the treatment liquid supply pipe. An immersion-type substrate processing apparatus, characterized in that a stagnation prevention slope is formed to prevent the processing solution jetted from the processing solution supply pipe from flowing downward to form a stagnation area. 2. The lower end of the stagnation prevention slope is in contact with substantially the lower side of the opening of the ejection hole of the treatment liquid supply pipe, and the inclined surface of the treatment liquid flows out of the ejection hole. The immersion type substrate processing apparatus according to claim 1, wherein the immersion type substrate processing apparatus is formed along substantially the lower surface. 3. A cross-sectional shape of an inner wall surface of the processing tank is substantially rectangular, two processing liquid supply pipes are provided facing each other at both corners of the bottom surface of the processing tank, and the retention is prevented. The immersion type substrate processing apparatus according to claim 2, wherein the inclined surface is provided on the bottom surface portion of the processing tank so as to be substantially symmetrical with respect to a plane orthogonal to the processing liquid supply pipe. 4. A lower end portion of each of a pair of inner wall side surfaces of the processing tank parallel to the processing liquid supply pipe is in contact with an outer side of an opening of the ejection hole of each processing liquid supply pipe. The immersion type substrate processing apparatus according to claim 3, wherein