JPH06107905A - Epoxy resin composition for electronic material - Google Patents

Abstract

PURPOSE:To provide the subject composition improved in water absorptivity, dielectric constant, etc., each required for electronic materials. CONSTITUTION:The objective epoxy resin composition essentially containing an indene-based resin which can be obtained by cationic polymerization of a monomer mixture of an indene and styrenic compound and >=1.5 in a weight ratio of the indene to styrene compound. The indene-based resin may contain <=10wt.% of a phenolic compound as a constituent monomer unit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition used in the field of electronic materials such as semiconductor encapsulants and circuit boards.

[0002]

2. Description of the Related Art Epoxy resin compositions used in the field of electronic materials such as semiconductor encapsulants and circuit boards contain some curing agents, curing accelerators, modifiers, fillers, etc. in the epoxy resin. A blended product is used. In such applications, low water absorption, low dielectric constant, and excellent heat resistance are required. It is also known from JP-A-54-18000 to blend a petroleum resin as a modifier with an epoxy resin. However, in these methods, it is not possible to improve the drawbacks of the epoxy resin such as high water absorption and dielectric constant without sacrificing other physical properties such as heat resistance (glass transition temperature) and dimensional stability (coefficient of linear expansion). could not. In recent years, semiconductors are becoming more and more surface-mounted, and semiconductor encapsulating materials are required to have resistance to soldering heat. However, when the water absorption of the epoxy resin composition is high, water expands and vaporizes during immersion of the solder, causing cracks. Further, a circuit board such as a printed circuit board has a problem of heat generation when a high frequency is applied, which is caused by a high dielectric constant of the epoxy resin composition. Although it is in the field of adhesives, it is known to mix a modified hydrocarbon resin as a modifier into an epoxy resin-based adhesive (JP-A-2-235977).

[0003]

SUMMARY OF THE INVENTION It is an object of the present invention to provide an epoxy resin composition having improved water absorption, dielectric constant and the like required for an epoxy resin composition for electronic materials.

[0004]

SUMMARY OF THE INVENTION The present invention is an indene resin obtained by cationically polymerizing indene or a monomer containing indene and styrene, wherein indene / styrene as a constituent monomer unit. Ratio (weight ratio)
Is an epoxy resin composition for electronic materials, which contains an indene resin having a ratio of 1.5 or more as an essential component.

The indene resin used in the present invention has a ratio of the indenes such as indene and alkylindene to the content of styrene such as styrene and alkylstyrene in the constituent monomer as indene / styrene (weight ratio). 1.5
The above is preferable, and the resin in which the proportion of indene is 60% by weight or more, and more preferably 70% by weight or more of the whole is preferable. Other constituent monomers are styrenes,
There are aromatic olefins such as coumarones and phenols. Styrenes have the effect of lowering the softening point, and phenols have the function of increasing the compatibility, but when contained in a large amount, they lower the heat resistance and the like.

This indene resin is obtained by cationically polymerizing indene or a monomer containing indene and styrene, and has a number average molecular weight of 500 to 20.
The softening point is about 00 and the softening point is about 30 to 160 ° C. This resin is a feedstock oil containing a predetermined concentration of indene, preferably a feedstock oil mainly composed of a 130 to 200 ° C. fraction obtained by distillation of a coal tar or coke oven gas gas oil, petroleum refining, Aromatic oil produced during petroleum decomposition is distilled to concentrate indene, and if necessary, a raw material oil is subjected to desulfurization treatment or component adjustment, followed by cationic polymerization using Lewis acid, Bronsted acid or solid acid as a catalyst. Is obtained by

The epoxy resin used in the present invention is not particularly limited, but o-cresol novolac type epoxy resin, phenol novolac type epoxy resin, biphenyl type epoxy resin, bisphenol A type epoxy resin, bispheno-type epoxy resin. Examples thereof include F-type epoxy resin and naphthalene-type epoxy resin. Its average molecular weight is 300-
4000, and the epoxy equivalent is preferably in the range of 180 to 3500 g / eq.

A curing agent is added to the epoxy resin composition of the present invention. The type of the curing agent is not particularly limited, but examples thereof include polyamides such as dicyandiamide and polyols such as novolac type phenol resin. The blending ratio is preferably in the range of 3 to 50 parts by weight of the indene resin with respect to 100 parts by weight of the epoxy resin, and the curing agent is preferably blended in an equivalent ratio of 0.8 to 1.5 with respect to the epoxy resin. Furthermore, as other compounds,
A filler such as silica and a release material such as wax can be mixed.

[0009]

Since the indene resin used in the epoxy resin composition of the present invention is more hydrophobic than the epoxy resin,
It is effective in reducing the water absorption rate and the dielectric constant, and further, the indene which is a main constituent monomer is a cyclic aromatic olefin,
Since the structure is rigid, it is considered that deterioration of physical properties such as deterioration of heat resistance due to a decrease in glass transition temperature is small.

[0010]

Examples Examples 1 to 4 As an epoxy resin, an o-cresol novolac type epoxy resin (EOCN-1029 manufactured by Nippon Kayaku Co., Ltd.),
A novolac-type phenol resin (Tamanor 758, manufactured by Arakawa Chemical Industry Co., Ltd.) was used as a curing agent, triphenylphosphine was used as a curing accelerator, and a modifier shown in Table 1 was used.
100 parts by weight of an epoxy resin, 54.6 parts by weight of a curing agent, 2.06 parts by weight of a curing accelerator and 20 parts by weight of a modifier are blended, kneaded with a roll and press-molded at 150 ° C.
A sample was prepared by aging for one day at 0 ° C. The methods for measuring physical properties are as follows, and the measurement results are shown in Table 2.

* Water absorption rate Using a pressure cooker tester, 133 ° C, 10
The weight increase rate of the cured composition after 96 hours was measured in an atmosphere of 0% RH and a pressure of 3 atm. * Dielectric constant The dielectric constant was calculated by measuring the electric capacity of the cured product at a frequency of 100 kHz and 25 ° C. * Glass transition temperature (glass region) and linear expansion coefficient TMA method was used. The temperature rising rate was 10 ° C./min, and the linear expansion coefficient was a value at 100 ° C.

Comparative Examples 1 to 4 Resins S shown in Table 1 as examples of modifiers containing no modifier.
For the examples using 1 to S3, samples were prepared in the same manner as in Example 1 and the physical properties were measured. The results are shown in Table 2. It can be seen that there are problems such as high water absorption and dielectric constant, low heat resistance, and high linear expansion coefficient, as compared with the examples.

[0013]

[Table 1]

[0014]

[Table 2]

[0015]

INDUSTRIAL APPLICABILITY The epoxy resin composition of the present invention has a low water absorption rate and a low dielectric constant, but exhibits little deterioration in physical properties, excellent solder heat resistance, and little heat generation. It has excellent physical properties as a resin composition.

Claims (2)

[Claims] 1. An indene resin obtained by cationically polymerizing indene or a monomer containing indene and styrene, wherein the ratio (weight ratio) of indene / styrene as a constituent monomer unit is 1. An epoxy resin composition for electronic materials, which contains an indene resin having a ratio of 0.5 or more as an essential component. 2. The epoxy resin composition for electronic materials according to claim 1, wherein the indene resin contains phenols in an amount of 10% by weight or less as a constituent monomer unit.