JPH06104317A - Tab tape and its manufacture - Google Patents

Tab tape and its manufacture

Info

Publication number
JPH06104317A
JPH06104317A JP27781492A JP27781492A JPH06104317A JP H06104317 A JPH06104317 A JP H06104317A JP 27781492 A JP27781492 A JP 27781492A JP 27781492 A JP27781492 A JP 27781492A JP H06104317 A JPH06104317 A JP H06104317A
Authority
JP
Japan
Prior art keywords
insulating tape
adhesive
tape
roll
metal foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27781492A
Other languages
Japanese (ja)
Inventor
Yoshinori Inada
義徳 稲田
Kenji Kawashima
健児 川嶋
Atsushi Nakada
淳 中田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP27781492A priority Critical patent/JPH06104317A/en
Publication of JPH06104317A publication Critical patent/JPH06104317A/en
Pending legal-status Critical Current

Links

Landscapes

  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To make an insulating tape with a bonding agent applied to the entire surface of its upper surface usable by sticking metallic foil to the central part of the insulating tape with the bonding agent by thermocompression bonding by using a pressing roll coated with a Teflon film. CONSTITUTION:A bonding agent is applied to the entire area of the upper surface of an insulating tape 1. Metallic foil 2 is stuck to the central part of the tape 1 by means of a heated pressing roll 3 except both side sections. Since the surface of the stainless steel roll 3 is coated with a Teflon film, adhesion of the bonding agent can be prevented by the Teflon film. The film coating the surface of the roll 3 can be formed of silicone (silicon resin), etc. Therefore, adhesion of the bonding agent to the surface of the surface of the roll 3 and further to the surface of a product can be prevented.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、上面全体に接着剤が塗
布された絶縁性テープを材料として用いるTABテープ
及びその製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB tape using an insulating tape having an adhesive applied to the entire upper surface as a material and a method for manufacturing the TAB tape.

【0002】[0002]

【従来の技術及びその問題点】半導体素子の実装技術と
してフィルムキャリア方式(TAB)が知られている。
これに用いられるTABテープはポリエステル樹脂等の
可撓性の絶縁性テープの中央部に両側部を残して接着剤
を用いて金属箔を圧着することにより形成され、この金
属箔にフォトレジスト法により導体パターンを形成し、
次いでAuバンプと接合するための錫めっきを施してな
る。
2. Description of the Related Art A film carrier method (TAB) is known as a mounting technology for semiconductor devices.
The TAB tape used for this is formed by pressure-bonding a metal foil with an adhesive while leaving both sides at the center of a flexible insulating tape made of polyester resin or the like. Forming a conductor pattern,
Then, tin plating is applied to bond the Au bumps.

【0003】現在、このようなTABテープに使用され
る絶縁性テープは、金属箔を接着する中央部に金属箔の
幅で接着剤が塗布されており、両側部には接着剤が塗布
されていなかった。このため、接着剤を絶縁性テープに
塗布する際に、接着する金属箔の位置に合わせ接着剤の
塗布位置を正確に定める必要があった。
At present, in the insulating tape used for such TAB tape, an adhesive is applied in the width of the metal foil to the central portion where the metal foil is adhered, and the adhesive is applied to both sides. There wasn't. Therefore, when applying the adhesive to the insulating tape, it is necessary to accurately determine the application position of the adhesive in accordance with the position of the metal foil to be adhered.

【0004】接着する金属箔の位置に合わせて接着剤の
塗布するのは極めて困難であり、予め保護フィルムに接
着剤を塗布し、必要な金属幅切断した後に絶縁性テープ
に圧着しなければならず、製造工程を煩雑にし、その結
果、製造コストの上昇を来すものであった。
Since it is extremely difficult to apply the adhesive in accordance with the position of the metal foil to be adhered, it is necessary to apply the adhesive to the protective film in advance, cut the required metal width, and then press-bond it to the insulating tape. However, the manufacturing process is complicated, and as a result, the manufacturing cost is increased.

【0005】そこで、金属箔と絶縁性テープとを熱圧着
する際、上面全面に接着剤の塗布された絶縁性テープを
用いると、従来使用されていた、中央部に接着剤が塗布
されている絶縁性テープを用いるときに比べ、上面全面
に接着剤の塗布された絶縁性テープが簡略化した製造工
程で得られることにより製造コストを低下させることが
できることになる。しかしながら、この場合、上面全面
に接着剤の塗布された絶縁性テープを用いると、通常は
ステンレス製である圧着ロールに絶縁性テープの両側部
に塗布された接着剤が付着することがあり、この圧着ロ
ールに付着した接着剤が金属箔表面に付着し、その結
果、使用に耐えられない製品となり、多量の不良品が発
生するという問題点を有するものであった。
Therefore, when the metal foil and the insulating tape are thermocompression-bonded, if an insulating tape having an adhesive applied to the entire upper surface is used, the adhesive is applied to the central portion, which has been conventionally used. Compared with the case where the insulating tape is used, the manufacturing cost can be reduced because the insulating tape having the adhesive applied to the entire upper surface can be obtained in a simplified manufacturing process. However, in this case, if an insulating tape coated with an adhesive on the entire upper surface is used, the adhesive coated on both sides of the insulating tape may adhere to the pressure roll, which is usually made of stainless steel. The adhesive adhered to the pressure bonding roll adheres to the surface of the metal foil, resulting in a product that cannot be used, resulting in a large amount of defective products.

【0006】本発明は、圧着ロールに接着剤が付着する
ことなしに、安価な、上面全面に接着剤が塗布された絶
縁性テープの使用を可能としたTABテープ及びその製
造方法を提供することを目的とする。
[0006] The present invention provides a TAB tape and a method for producing the same, which makes it possible to use an inexpensive insulating tape having an adhesive applied to the entire upper surface thereof without adhering the adhesive to a pressure roll. With the goal.

【0007】[0007]

【問題点を解決するための手段】本発明方法は、上面全
体に接着剤が塗布された絶縁性テープ中央部に金属箔
を、その表面にテフロン(商品名)の皮膜、もしくはシ
リコーン(ケイ素樹脂)の皮膜を施した圧着ロールを用
いて熱圧着することを特徴とするものであり、また、こ
の本発明方法により得られるTABテープは上面全体に
接着剤が塗布された絶縁性テープ中央部に金属箔が熱圧
着されてなるものであり、これらにより前記問題点を解
決したものである。
According to the method of the present invention, a metal foil is applied to the central portion of an insulating tape having an adhesive applied to the entire upper surface thereof, and a Teflon (trade name) film or silicone (silicon resin) is applied to the surface thereof. ) Is thermocompression-bonded by using a pressure-bonding roll coated with a film, and the TAB tape obtained by the method of the present invention has a central portion of an insulating tape having an adhesive applied to the entire upper surface. The metal foil is formed by thermocompression bonding, and these solve the above problems.

【0008】図1は本発明方法を実施する場合の工程説
明図であり、絶縁性テープ1の上面全面には接着剤が塗
布されており、この全面接着剤塗布絶縁性テープ1の中
央部に両側部を残して金属箔2が加熱した圧着ロール3
により熱圧着される状態を示している。通常、絶縁性テ
ープの上面全面に接着剤を塗布すると、金属箔2からは
み出した両側部の接着剤が露出し、これが圧着ロールに
付着して不都合を起すことは前述の通りであるが、本発
明で使用する圧着ロール3は、図2に示すようにステン
レス製圧着ロール4の表面にテフロン(商品名)の皮膜
5が形成されているため、この皮膜により接着剤の付着
が防止される。なお、ステンレス製圧着ロール4の表面
に形成する皮膜5はテフロン(商品名)に限らず、例え
ばシリコーン(ケイ素樹脂)等で形成しても良い。
FIG. 1 is a process explanatory diagram for carrying out the method of the present invention. An adhesive is applied to the entire upper surface of the insulating tape 1, and the central portion of the entire adhesive-applied insulating tape 1 is coated. Crimping roll 3 with metal foil 2 heated, leaving both sides
Shows the state of being thermocompression bonded. Usually, when the adhesive is applied to the entire upper surface of the insulating tape, the adhesive on both sides protruding from the metal foil 2 is exposed and adheres to the pressure bonding roll, causing a problem as described above. The pressure-bonding roll 3 used in the present invention has a film 5 of Teflon (trade name) formed on the surface of the stainless-made pressure-bonding roll 4, as shown in FIG. The film 5 formed on the surface of the stainless pressure roll 4 is not limited to Teflon (trade name), but may be formed of silicone (silicon resin) or the like.

【0009】このような本発明方法により得られるTA
Bテープは、上面全体に接着剤が塗布された絶縁性テー
プ中央部に金属箔が熱圧着されてなるものであるため、
金属箔が圧着された以外の両側部には、乾燥した接着剤
がそのまま残存してなる。
TA obtained by the method of the present invention
The B tape is formed by thermocompression bonding a metal foil to the central portion of the insulating tape whose entire upper surface is coated with an adhesive.
The dried adhesive remains as it is on both sides except where the metal foil is pressure-bonded.

【0010】[0010]

【実施例1】上面全面に接着剤を塗布した、幅35mm
のポリイミド製絶縁性テープを155℃、165℃、1
75℃にそれぞれ加熱した。ここに幅26.5mmの銅
箔を、130℃、及び140℃に加熱した表面にテフロ
ン(商品名)の皮膜を形成した圧着ロールを用いて熱圧
着したところ、いずれの条件でも圧着ロールへの接着剤
の付着はまったく生じず、従来と同様の製品が安価に製
造することができた。
Example 1 Adhesive is applied to the entire upper surface, width 35 mm
Insulating tape made of polyimide of 155 ℃, 165 ℃, 1
Each was heated to 75 ° C. When a copper foil having a width of 26.5 mm was thermocompression-bonded thereto using a pressure roll having a Teflon (trade name) film formed on the surface heated to 130 ° C. and 140 ° C. Adhesive adhesion did not occur at all, and a similar product to the conventional one could be manufactured at low cost.

【0011】[0011]

【実施例2】実施例1の圧着ロールとしてその表面にシ
リコーン(ケイ素樹脂)皮膜を形成したものを使用した
こと以外は、実施例1と同様にしてTABテープを製造
したが、圧着ロールへの接着剤の付着は殆ど生じず、良
好なTABテープが得られた。
Example 2 A TAB tape was produced in the same manner as in Example 1 except that the pressure-bonding roll of Example 1 having a silicone (silicon resin) film formed on its surface was used. Adhesive adhesion hardly occurred and a good TAB tape was obtained.

【0012】[0012]

【発明の効果】以上のような本発明によれば、上面全面
に接着剤が塗布された絶縁性テープと金属箔とを熱圧着
する際に従来のように圧着ロールに付着した接着剤が製
品に付着することが防止され、これにより安価な上面全
面に接着剤が塗布された絶縁性テープをTABテープの
原料として使用することが可能となる。さらに、接着剤
が付着した不良品の発生を無くすことができ、結果とし
て製造コストを低下させることが可能となる。
As described above, according to the present invention, when the insulating tape having the adhesive applied to the entire upper surface and the metal foil are thermocompression bonded, the adhesive adhered to the pressure-bonding roll as in the prior art is a product. It is possible to use the insulating tape, which is inexpensive and whose adhesive is applied to the entire upper surface, as a raw material of the TAB tape. Furthermore, it is possible to eliminate the generation of defective products to which the adhesive is attached, and as a result, it is possible to reduce the manufacturing cost.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明方法を実施する場合の工程例を示す説明
図である。
FIG. 1 is an explanatory diagram showing an example of steps when carrying out the method of the present invention.

【図2】本発明に使用する圧着ロールの斜視説明図であ
る。
FIG. 2 is a perspective explanatory view of a pressure bonding roll used in the present invention.

【符号の説明】[Explanation of symbols]

1 絶縁性テープ 2 金属箔 3 圧着ロール 4 ステンレス製圧着ロール 5 テフロン(商品名)の皮膜 1 Insulating tape 2 Metal foil 3 Crimping roll 4 Stainless steel pressure roll 5 Teflon (trade name) film

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 上面全体に接着剤が塗布された絶縁性テ
ープ中央部に金属箔が熱圧着されてなるTABテープ。
1. A TAB tape in which a metal foil is thermocompression bonded to a central portion of an insulating tape having an adhesive applied to the entire upper surface.
【請求項2】 上面全体に接着剤が塗布された絶縁性テ
ープ中央部に金属箔をその表面にテフロン(商品名)の
皮膜を施した圧着ロールを用いて熱圧着することを特徴
とするTABテープの製造方法。
2. A TAB characterized by thermocompression bonding a metal foil in the central portion of an insulating tape having an adhesive applied to the entire upper surface thereof, using a pressure bonding roll having a Teflon (trade name) film coated on the surface thereof. Tape manufacturing method.
【請求項3】 上面全体に接着剤が塗布された絶縁性テ
ープ中央部に金属箔をその表面にシリコーン(ケイ素樹
脂)の皮膜を施した圧着ロールを用いて熱圧着すること
を特徴とするTABテープの製造方法。
3. A TAB characterized in that a metal foil is thermocompression-bonded to a central portion of an insulating tape having an adhesive applied to the entire upper surface using a pressure-bonding roll having a silicone (silicon resin) coating on the surface thereof. Tape manufacturing method.
JP27781492A 1992-09-22 1992-09-22 Tab tape and its manufacture Pending JPH06104317A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27781492A JPH06104317A (en) 1992-09-22 1992-09-22 Tab tape and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27781492A JPH06104317A (en) 1992-09-22 1992-09-22 Tab tape and its manufacture

Publications (1)

Publication Number Publication Date
JPH06104317A true JPH06104317A (en) 1994-04-15

Family

ID=17588643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27781492A Pending JPH06104317A (en) 1992-09-22 1992-09-22 Tab tape and its manufacture

Country Status (1)

Country Link
JP (1) JPH06104317A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7563343B2 (en) * 2002-11-29 2009-07-21 Fujitsu Microelectronics Limited Film lamination apparatus and method and a manufacturing method of a semiconductor apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7563343B2 (en) * 2002-11-29 2009-07-21 Fujitsu Microelectronics Limited Film lamination apparatus and method and a manufacturing method of a semiconductor apparatus

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