JPH06101530B2 - Main circuit of power converter - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention relates to a main circuit of a power converter, and is particularly suitable for an inverter / converter control device in which an insulating transistor module element or a thyristor module element is mounted on a plane. The present invention relates to a main circuit of a power converter.

[Conventional technology]

The main circuit of a conventional power converter is Hitachi Review 66-6 (1984
-6) As shown in the paper "Development of Inverter Drive Power Saving Standard Elevator Utilizing Micro Computer" on pages 2 to 30, the structure is as shown in Fig. 7, and 2 is a semiconductor module device. , 13 are cooling fins, and 14 are electric wires, and it was difficult to mount the protection circuit and control circuit parts of the semiconductor module element 2 close to the semiconductor module element 2.

[Problems to be solved by the invention]

Semiconductor module elements of inverters and converters, and their protection circuit components and control circuit components are easily affected by harmonics and surge voltages.
It was necessary to mount the protection circuit parts and control circuit parts of the semiconductor module element as close as possible to the semiconductor module element and mount them with the shortest possible wiring length, but this is difficult with the main circuit of the conventional power converter. There was a problem that it was.

An object of the present invention is to solve the above-mentioned problems and to provide a main circuit of a power converter that can reduce the number of assembling steps.

[Means for solving problems]

For the above purpose, the semiconductor module device can be mounted on a plane,
Also, since the terminals have almost the same height, pay attention to the fact that a plate-shaped conductor can be used when connecting between the terminals, and a plate-shaped conductor can be placed on a plurality of semiconductor module elements according to the terminal positions of the semiconductor module elements. The plate-shaped insulating material in which a conductor is arranged is attached so that the plate-shaped conductor faces each of the semiconductor module elements, and the terminals of the semiconductor module elements are connected by tightening the plate-shaped conductor to connect the terminals of the plate-shaped insulating material. The protection circuit component and the control circuit component of each of the semiconductor module elements are attached to the surface on the opposite side of each of the semiconductor module elements.

[Action]

Since the protection circuit parts and control circuit parts of the semiconductor module element can be mounted close to the semiconductor module element,
Since the wiring length becomes short and is not affected by harmonics or surge voltage, stable operation of the semiconductor module element can be obtained. Further, when attaching the plate-shaped insulating material on which the plate-shaped conductor is arranged, it is only necessary to tighten it with the terminal screws of the semiconductor module element, which facilitates the connection between the terminals of the semiconductor module element and reduces the number of assembly work steps. .

〔Example〕

The present invention will be described in detail below with reference to the embodiments shown in FIGS. 1, 2, and 6 and FIGS.

FIG. 1 is a configuration diagram showing an embodiment of a main circuit of a power converter of the present invention, (a) is a plan view and (b) is a side view.
In FIG. 1, reference numeral 1 denotes a cooling fin, which is mounted with a plate-shaped insulator 5 in which a plate-shaped conductor 4 in contact with a main terminal 3 of a semiconductor module element 2 mounted on a flat surface of the cooling fin 1 is mounted. A protective circuit component and a control circuit component 6 are mounted on the surface of the body 5 opposite to the plate-shaped conductor 4. In this state,
The main circuit wiring is established by fastening the main terminal screw of the semiconductor module element 2 to the main terminal 3 of the semiconductor module 2 through the plate conductor 4 or the plate conductor 4 and the plate insulator 5.

Reference numeral 7 denotes a hole formed in the plate-like insulating material 5. The semiconductor module element 2 is fastened to the cooling fin 1 by the hole 7, and the wiring of the protection circuit component and the control circuit component 6 is connected to the control terminal 11 (third part of the semiconductor module element 2). (See figure). Reference numeral 8 is a connection terminal.

FIG. 2 is a constitutional view corresponding to FIG. 1 showing another embodiment of the present invention, in which (a) is a side view and (b) is a side view. The description is omitted here.
In FIG. 2, holes 9 are formed in the plate-shaped insulator 5 to avoid the protruding partition walls of the semiconductor module element 2. Others are the same as in FIG.

FIG. 3 is a configuration diagram showing an example of a semiconductor module element 2 used in a power conversion device, (a) is a plan view, (b) is a side view, and (c) is an internal circuit. This is called an insulating type semiconductor module element, and is composed of an insulated heat radiation surface 21 and an insulating material 22 in which the semiconductor module element is inserted.
The semiconductor module element 2 is provided with a main terminal 3, a mounting hole 10 and a control terminal 11.

4A and 4B are configuration diagrams showing another example of the semiconductor module element 2. FIG. 4A is a plan view, FIG. 4B is a side view, and the same parts as in FIG. In FIG. 4, the partition wall 12 is projected in order to secure the creepage distance between the main terminals 3.

5A and 5B are configuration diagrams showing still another example of the semiconductor module element 2. FIG. 5A is a plan view, FIG. 5B is a side view, and FIG. 5C is an internal circuit diagram. It is indicated by a symbol. In FIG. 5, the semiconductor module element 2 enclosed in the insulating material 22 is different.

Conventionally, such a semiconductor module element 2 was mounted as shown in FIG. FIG. 7 shows that three semiconductor module elements 2 are provided on the flat surface of an aluminum cooling fin 13 provided with grid-like ducts (or simple unevenness) so that one surface is flat and the other surface has a high cooling effect. It is attached so that the heat radiation surface 21 of is in contact with. The main terminals 3 of the three semiconductor module elements 2 were connected to each other by electric wires 14 to form the main circuit of FIG.

By the way, in a power converter that performs a large current and high speed switching control, a large noise is generated due to the control. Therefore, each semiconductor module element 2 needs an appropriate protection circuit (surge killer), and it is desirable to mount these circuit components as close to the semiconductor module element 2 as possible. Further, it is desirable to mount a control circuit component for controlling the semiconductor module element 2 near the semiconductor module element 2.

However, in the mounting form as shown in FIG. 7, since the electric wires 14 cross each other, there is no space for mounting the protection circuit component and the control circuit component, and it is difficult to mount them near the semiconductor module element 2. It was

However, according to FIG. 1 and FIG. 2, the wiring length between the semiconductor module element 2 and the protection circuit component and the control circuit component 6 can be shortened, and the influence of harmonics and noise voltage is reduced. Therefore, stable operation of the semiconductor module element 2 can be obtained.

In addition, the number of assembly work steps is reduced to a fraction of that of the conventional method, the reliability of the work can be expected, and the reliability is improved.

In the embodiment shown in FIGS. 1 and 2, the method of combining three semiconductor module elements 2 has been described.
When six semiconductor module elements 2 as shown in the figure are used, a larger effect can be expected.

The wiring between the protection circuit component and the control circuit component 6 can be printed on the surface of the plate-shaped insulator 5 to facilitate the mounting of these components.

Further, since the protection circuit component and the control circuit component 6 have a property of being weak against heat, a thermal margin can be obtained as compared with the structure which is directly attached to the cooling fin 1 as in the conventional technique, so that the reliability of the device is improved.

〔The invention's effect〕

As described above, according to the present invention, it is possible to shorten the wiring length between the semiconductor module element and the protection circuit component and the control circuit component, and to reduce the influence of harmonics and noise voltage. This has the effects of ensuring stable operation of the module element and reducing the number of assembly steps.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an embodiment of a main circuit of a power conversion device of the present invention, FIG. 2 is a configuration diagram corresponding to FIG. 1 showing another embodiment of the present invention, and FIGS. 1 is a block diagram showing an example of the semiconductor module element in FIG. 1 and FIG. 2, FIG. 6 is a circuit diagram showing an embodiment of the main circuit of the power converter of the present invention, and FIG. It is a block diagram of the main circuit of a converter. 1 ... Cooling fin, 2 ... Semiconductor module element, 3 ...
… Main terminals, 4 …… Plate conductors, 5 …… Plate insulators, 6 ……
Protection circuit parts and control circuit parts, 7 ... holes in plate-like insulator, 8 ... connection terminals, 9 ... holes, 10 ... mounting holes, 11 ... control terminals, 12 ... division wall, 21 ... … Heat dissipation surface, 22…
…Insulating material.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takeki Ando 4026 Kuji Town, Hitachi City, Hitachi, Ibaraki Prefecture Hitachi Research Institute Co., Ltd. (72) Inventor Shigeta Ueda 4026 Kuji Town, Hitachi City, Ibaraki Prefecture Hitachi Inside Hitachi Research Laboratory

Claims (3)

[Claims] 1. In a main circuit of a power converter in which a plurality of semiconductor module elements each having a flat cooling surface are joined to a surface of a cooling body, a terminal position of each semiconductor module element is provided on each of the plurality of semiconductor module elements. The plate-shaped insulating material in which the plate-shaped conductor is arranged according to the above is attached so that the plate-shaped conductor faces the semiconductor module element side, and the plate-shaped conductor is clamped and connected between the terminals of the semiconductor module elements, A main circuit of a power conversion device, characterized in that a protection circuit component and a control circuit component of each semiconductor module element are attached to a surface of the plate-shaped insulating material opposite to each semiconductor module element. 2. The main circuit of the power conversion device according to claim 1, wherein the plate-shaped insulating material on which the plate-shaped conductor is arranged is a printed wiring board. 3. The mounting of the plate-shaped insulating material and the tightening of the plate-shaped conductor on the plate-shaped insulating material to the terminals of each of the semiconductor module elements are performed using terminal screws of each of the semiconductor module elements. A main circuit of the power converter according to claim 1 or 2.