JPH0594266U - Shutter structure of sputtering equipment - Google Patents

Abstract

(57) [Summary] [Object] To provide a shutter structure of a sputtering apparatus capable of reliably preventing sputter particles from adhering to a work during pre-sputtering. [Structure] A stage 13 on which a work is placed,
The target 15 is installed in a state of facing the work placed on the stage, and is rotatably attached to the support shaft 19 located between the stage and the target.
A sputtering apparatus comprising: a shutter 16 having an opening for allowing sputtered particles to flow between the target and a work placed on a stage, the shutter 16 including at least two shutter plates 17, It is composed of 18. At least one of the shutter plates 17 and 18 is rotatably attached to the support shaft 19.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a sputtering apparatus for forming a sputtered film on a surface of a work, and more particularly to a structure of a shutter arranged between a work and a target.

[0002]

[Prior Art]

 FIG. 8 is a schematic side view showing a conventional device, and FIG. 9 is a partial plan view of the same. In the illustrated sputtering device 50, 51 is a bell jar that forms a sputtering chamber 52. A stage 53 is provided inside the sputtering chamber 52, and a work 54 is placed on the upper surface of the stage 53. Further, in the sputtering chamber 52, a target 55 is installed so as to face the work 54 placed on the stage 53.

A shutter 56 is arranged between the stage 53 and the target 55, and the shutter 56 is rotatably attached to a support shaft 57 vertically provided in the sputtering chamber 52. The conventional shutter 56 has a substantially disk shape with an outer diameter substantially the same as that of the stage 53, and an opening 56a is formed at a predetermined position corresponding to the installation location of the target 55 described above. The opening 56a is for allowing the sputtered particles to flow between the target 55 and the work 54 placed on the stage 53, and is configured to move around the support shaft 57 by the rotation of the shutter 56. Is becoming

In the above-described conventional sputtering apparatus 50 having the above-described structure, when forming a sputtered film on the work 54 placed on the stage 53, first, the shutter 56 is appropriately rotated so that the shutter 56 is directly below the target 55. The opening 56a of the shutter 56 is arranged. Then, from this state, a voltage is applied to the discharge gas introduced into the sputtering chamber 52 to generate a glow discharge. As a result, the positive ions in the plasma collide with the surface of the target 55 and the sputtered particles are ejected from the target 55, and the ejected sputtered particles adhere to the work 54 through the opening 56a of the shutter 56. A sputtered film is formed on the surface of the work 54.

By the way, before the actual sputtering process, the target 55 installed in the sputtering chamber 52 is exposed to the atmosphere, so that its surface is contaminated by impurities such as moisture, oxygen, and dirt. .. Therefore, if the sputter process is performed from this state, a sputtered film containing contaminants is formed on the work 54, and therefore a pre-process called pre-sputter is usually performed. When this pre-sputtering is performed by the above-described conventional sputtering apparatus 50, the shutter 56 is appropriately rotated to largely shift the position of the opening 56a of the shutter 56 from directly below the target 55 as shown in FIG. The sputtered particles containing .alpha. Were prevented from adhering to the work 54.

[0006]

[Problems to be solved by the device]

 However, in the above-described conventional sputtering apparatus 50, when pre-sputtering is performed, the sputtered particles are scattered in multiple directions due to the collision between the sputtered particles and the discharge gas or the collision between the sputtered particles, and the scattered sputtered particles surround the shutter 56. Also, there is a problem in that the work gets around from the opening a of the shutter 56 and adheres to the work 54. As a result, a sputtered film containing impurities is formed on the surface of the work 54, the adhesion between the work 54 and the sputtered film is significantly reduced, and the quality of the sputtered film becomes non-uniform, resulting in deterioration of characteristics. Was there.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a shutter structure of a sputtering apparatus capable of reliably preventing spatter particles from adhering to a work during pre-sputtering. To do.

[0008]

[Means for Solving the Problems]

 The present invention has been made in order to achieve the above-mentioned object, and a stage on which a work is placed on the upper surface, a target installed in a state of facing the work placed on the stage, and the stage and the target And a shutter that is rotatably attached to the spindle and is provided with an opening that allows the spatter particles to flow between the target and the workpiece placed on the stage. In the sputtering apparatus, the shutter is composed of at least two shutter plates, and at least one of the shutter plates is rotatably attached to the support shaft. Further, among the shutter plates constituting the shutter, at least one shutter plate has an outer peripheral edge extending outwardly of the outer peripheral edge of the stage.

Further, a stage on which a work is placed, a target placed in a state of facing a work placed on the stage, and a spindle positioned between the stage and the target. In the sputtering apparatus, which is rotatably attached to the target and has a shutter having an opening for allowing sputtered particles to flow between the target and a work placed on the stage, the outer peripheral edge of the shutter is It extends outside the outer edge of the stage.

Further, the outer peripheral edge of the shutter is formed with a flange portion extending upward and / or downward. In addition, the lower end of the flange portion formed on the outer peripheral edge of the shutter is arranged below the upper surface of the stage.

[0011]

[Action]

 In the shutter structure of the sputtering apparatus of the present invention, by appropriately rotating at least one of the shutter plates constituting the shutter, the openings of the shutter plates are closed by the other shutter plates. Be done. This prevents spattered particles from wrapping around from the opening of the shutter during pre-sputtering. Also, by extending the outer peripheral edge of the shutter (shutter plate) outward from the outer peripheral edge of the stage, the path from the periphery of the shutter starting from the target to the workpiece becomes longer than before, and the shutter during pre-sputtering The wraparound of sputter particles from the surroundings is reduced. Furthermore, by forming a flange on the outer peripheral edge of the shutter, the path from the periphery of the shutter to the work starting from the target becomes longer and more complicated, which results in sputter particles from the periphery of the shutter during pre-sputtering. Is prevented from wrapping around.

[0012]

【Example】

 Embodiments of the present invention will be described below with reference to the drawings. 1 is a schematic side view showing a first embodiment of the present invention, and FIG. 2 is a partial plan view of the same. In the illustrated sputtering apparatus 10, 11 is a bell jar that forms the sputtering chamber 12, 13 is a stage, 14 is a work placed on the upper surface of the stage 13, and 15 is opposed to the work 14 placed on the stage 13. The target is installed in this state, and the shutter 16 is arranged between the target 15 and the stage 13 described above.

In the sputtering apparatus 10 of the first embodiment, the shutter 16 is composed of two shutter plates 17 and 18, and each of the shutter plates 17 and 18 is a support shaft vertically installed in the sputtering chamber 12. It is rotatably attached to 19. Further, the shutter plates 17 and 18 are provided with openings 17a and 18a for passing the spatter particles between the target 15 and the work 14 placed on the stage 13.

In the sputtering apparatus 10 of the first embodiment having the above structure, when forming a sputtered film on the work 14 placed on the stage 13, first, the shutter plates 17 and 18 are appropriately rotated and the respective shutter plates 17 and 18 are rotated. The openings 17a and 18a are arranged directly below the target 15. As a result, the sputtered particles ejected from the surface of the target 15 adhere to the work 14 through the openings 17a, 18a of the shutter plates 17, 18 and form a sputtered film on the surface of the work 14.

On the other hand, in the case of performing pre-sputtering, the shutter plates 17 and 18 are appropriately rotated so that the positions of the openings 17a and 18a are shifted from directly below the target 15, and the openings 17a and 18a are The positions of 18a are also displaced from each other. As a result, the opening 17a of the shutter plate 17 is closed by the shutter plate 18, and at the same time, the opening 18a of the shutter plate 18 is closed by the shutter plate 17. Therefore, when pre-sputtering is performed from this state, it is possible to reliably prevent the spattered particles from flowing in through the openings (17a, 18a) of the shutter 16.

In the above description of the first embodiment, the shutter 16 is composed of two shutter plates 17 and 18, and the shutter plates 17 and 18 are rotatably attached to the support shaft 19. However, the present invention is not limited to this, and the shutter may be composed of three shutter plates or more, and only one of the shutter plates is rotatably attached to the spindle. The shutter plate other than that may be fixed to the support shaft in a state where the opening is arranged directly below the target.

FIG. 3 is a schematic side view showing a second embodiment of the present invention, and FIG. 4 is a partial plan view of the same. In the figure, the same parts as those in the first embodiment are designated by the same reference numerals, and the overlapping description will be omitted. In the configuration of the second embodiment, a shutter 20 is rotatably attached to a support shaft 19 vertically provided in the sputtering chamber 12, and an opening 20a is formed at a predetermined position of the shutter 20. ing. Here, the feature of the second embodiment lies in the size of the shutter 20 with respect to the stage 13. That is, although the outer diameters of the shutter and the stage have been set to be substantially the same in the past, in the present example, the outer diameter D1 of the shutter 20 is set to be sufficiently larger than the outer diameter D2 of the stage 13. Of the outer peripheral edge of the stage 13 extends outward from the outer peripheral edge of the stage 13.

With this configuration, the path from the circumference of the shutter 20 starting from the target 15 to the work 14 on the stage 13 (indicated by the one-dot chain line in the figure) becomes longer than in the conventional case, so that the pre-sputtering At this time, the wraparound of sputtered particles from around the shutter 20 is reduced.

The configuration of the second embodiment can also be adopted in the case of the first embodiment described above. That is, in the configuration of the first embodiment shown in FIG. 1, the outer peripheral edge of at least one shutter plate (17 or 18) among the shutter plates 17 and 18 constituting the shutter 16 is closer to the outer peripheral edge of the stage 13. Also extend outward. As a result, it is possible to obtain the same effect as that of the second embodiment.

FIG. 5 is a schematic side view showing a third embodiment of the present invention. The feature of the third embodiment resides in that the flange portion 20b is provided on the outer peripheral edge of the shutter 20 having the opening 20a in the configuration of the second embodiment described above. The flange portion 20b is formed so as to extend in the vertical direction from the outer peripheral edge of the shutter 20, and the lower end thereof is arranged below the upper surface of the stage 13.

With this configuration, the path from the circumference of the shutter 20 starting from the target 15 to the work 14 on the stage 13 (indicated by the one-dot chain line in the figure) is larger than that in the second embodiment. Since the length is longer and more complicated, it is possible to reliably prevent the spattered particles from wrapping around the shutter 20 during the pre-sputtering. In the shutter structure shown in FIG. 5, the flange portion 20b is formed so as to extend upward and downward from the outer peripheral edge of the shutter 20, but the flange portion 20b is extended only upward or downward. Even if only formed, a remarkable effect can be obtained as compared with the second embodiment described above.

FIG. 6 is a schematic side view showing a fourth embodiment of the present invention. In the shutter structure of the fourth embodiment, the shutter 30 is composed of two shutter plates 31 and 32, and openings 31a and 32a are formed in the shutter plates 31 and 32, respectively. A flange portion 31b is formed on an outer peripheral edge of one shutter plate 31 so as to extend upward, and a flange portion 32b is extended on an outer peripheral edge of the other shutter plate 32 so as to extend downward. Has been formed. Further, the lower end of the flange portion 32b is arranged below the upper surface of the stage 13 on which the work 14 is placed.

Further, each of the shutter plates 31 and 32 is rotatably attached to a support shaft 19 vertically provided in the sputtering chamber 12. Both of the shutter plates 31 and 32 may be rotatably attached to the support shaft 19, or one of the shutter plates 31 may have its opening 31a directly below the target 15. The shutter plate 32 may be fixed to the support shaft 19 and only the other shutter plate 32 may be rotatably attached to the support shaft 19.

In the shutter structure of the fourth embodiment having such a configuration, the shutter plates 31 and 32 are appropriately rotated so that the positions of the openings 21a and 32a are displaced from directly below the target 15. At the same time, the positions of the openings 31a and 32a are also shifted from each other, so that the opening 31a of the shutter plate 31 is closed by the shutter plate 32, and at the same time, the opening 32a of the shutter plate 32 is blocked by the shutter plate 31. Will be blocked. Further, since the flange portions 31b and 32b are formed on the outer peripheral edges of the shutter plates 31 and 32 so as to extend upward and downward, respectively, the shutter 15 from the target 15 as a starting point to the stage 13 on the stage 13. The path to the workpiece 14 is longer and more complicated than before. This prevents the spattered particles from wrapping around from the openings (31a, 32a) of the shutter 30 during pre-sputtering and the wrapping of sputtered particles from around the shutter 30, and the sputter containing impurities by the pre-sputtering. The particles are reliably prevented from adhering to the work 14.

In the configuration of the fourth embodiment described above, in addition to the configuration shown in FIG. 6, for example, as shown in FIG. 7, a shutter 40 is provided with two shutter plates 41, 42 (opened in each of them). Various forms are conceivable, such as one in which parts 41a and 42a are formed), one of which, that is, the flange part 42b is formed only in the shutter 42.

[0026]

[Effect of the device]

 As described above, according to the present invention, it is possible to reliably prevent the spatter particles containing impurities from being scattered around the shutter and from the opening of the shutter and adhering to the work on the stage during the pre-sputtering. It As a result, in the actual sputtering process, only the pure sputtered particles can be attached to the work to form the sputtered film, which improves the adhesion between the work and the sputtered film and makes the quality of the sputtered film uniform. Therefore, deterioration in characteristics is prevented.

[Brief description of drawings]

FIG. 1 is a schematic side view showing a first embodiment of the present invention.

FIG. 2 is a partial plan view of the first embodiment.

FIG. 3 is a schematic side view showing a second embodiment of the present invention.

FIG. 4 is a partial plan view of the second embodiment.

FIG. 5 is a schematic side view showing a third embodiment of the present invention.

FIG. 6 is a schematic side view showing a fourth embodiment of the present invention.

FIG. 7 is a schematic side view showing another aspect of the fourth embodiment.

FIG. 8 is a schematic side view showing a conventional device.

FIG. 9 is a partial plan view of a conventional device.

[Explanation of symbols]

10 Sputtering device 13 Stage 14 Work 15 Target 16, 20, 30, 40 Shutter 17, 18, 31, 32, 41, 42 Shutter plate 17a, 18a, 20a, 31a, 32a, 41a, 4
2a Opening 19 Support shaft 20b, 31b, 32b, 42b Flange

Claims (5)

[Scope of utility model registration request] 1. A stage on which a work is placed on an upper surface,
A target placed in a state of facing a work placed on this stage, and a target placed between the stage and the target and rotatably attached to a spindle, and placed on the target and the stage. A shutter having an opening for allowing sputtered particles to flow between the shutter and the work to be sputtered, the shutter being composed of at least two shutter plates, and at least one of the shutter plates. A shutter structure for a sputtering apparatus, wherein a sheet is rotatably attached to the support shaft. 2. The sputter according to claim 1, wherein at least one of the shutter plates constituting the shutter has an outer peripheral edge extending outwardly from an outer peripheral edge of the stage. Device shutter structure. 3. A stage on which a work is placed,
A target placed in a state of facing a work placed on the stage, rotatably attached to a spindle located between the stage and the target, and placed on the target and the stage. In a sputtering device including a shutter in which an opening for allowing sputtered particles to flow between the workpiece and the workpiece is placed, the outer peripheral edge of the shutter may extend outside the outer peripheral edge of the stage. The shutter structure of the characteristic sputtering device. 4. The shutter structure for a sputtering apparatus according to claim 2, wherein a flange portion extending upward and / or downward is formed on an outer peripheral edge of the shutter. 5. The shutter structure for a sputtering apparatus according to claim 4, wherein a lower end of a flange portion formed on an outer peripheral edge of the shutter is arranged below an upper surface of the stage.