JPH0590463A - Cooling device of integrated circuit - Google Patents

Abstract

PURPOSE:To provide a cooling device of an integrated circuit which has a high cooling efficiency, can be assembled easily, and is also effective for relieving thermal stress. CONSTITUTION:A title item which jets out an insulation refrigerant for performing a dip jet cooling consists of a thermally conductive flat plate 3 which is mounted on an integrated circuit chip surface, fins 4, 5, and 6 where a plurality of holes with a small diameter which are provided on a flat plate are placed, a primary nozzle 11 for supplying the insulation refrigerant, a secondary nozzle 8 which is connected via a flexible hose 10, a hole 9a with a small diameter which is located on a side surface, and a metal cover 9 in quadrangular pyramid shape which covers the flat plate and the entire fin, thus enabling a cooling efficiency of the integrated circuit to be improved and further the cooling device to be assembled easily and thermal stress to be relieved effectively by connecting the secondary nozzle to the primary nozzle through a flexible hose.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for an integrated circuit used in an electronic device or the like using liquid cooling, and in particular, immersion jet cooling is performed by directly ejecting a refrigerant from a nozzle using an insulating refrigerant. Regarding a cooling device.

[0002]

2. Description of the Related Art In the conventional immersion jet cooling, a refrigerant is directly jetted from a nozzle onto an integrated circuit chip immersed in an insulating liquid or a heat sink bonded to a heat dissipation surface of the integrated circuit chip. FIG. 3 shows the shape of a heat sink of a conventional convection type air cooling device, and FIG. 4 shows the structure of the cooling device. The conventional heat sink 30 has fins 31 having a constant pitch as shown in the figure, and is attached by solder or a heat conductive adhesive 32 so as to be perpendicular to the surface of the integrated circuit chip 1. Further, the surface of the fins 31 of the heat sink 30 is finished to be smooth or slightly rough, and the nozzle side, which is the upper end of the heat sink 30, is open. The refrigerant jetted from the nozzle 35 vertically collides with the central portion of the surface of the integrated circuit chip 1, then bounces off and flows out from the upper end portion of the heat sink 30.

[0003]

In the above-described conventional cooling device, the refrigerant jetted from the nozzle 35 removes heat from the surface of the fin 31 along the flow of the arrow. As a result, the cooling efficiency can be improved in the central portion of the integrated circuit chip 1, but the heat sink 30 is provided in the peripheral portion of the chip.
Since the fins 31 in the central portion of the are obstacles, the flow of the refrigerant is obstructed and the cooling efficiency cannot be improved. Therefore, there is a problem that the surface temperature of the integrated circuit chip 1 differs between the central part and the peripheral part of the chip and a sufficient cooling effect cannot be obtained.

The present invention has been made in view of the above problems and has a high cooling efficiency, and simplification of assembly,
An object of the present invention is to provide a cooling device for an integrated circuit which is also effective in alleviating thermal stress.

[0005]

In order to achieve the above object, an integrated circuit cooling device of the present invention is an integrated circuit cooling device which jets an insulating refrigerant to perform immersion jet cooling.
A heat conductive flat plate mounted on the surface of the integrated circuit chip, fins provided with a plurality of small diameter holes erected on the flat plate, a primary nozzle for supplying the insulating refrigerant, and a flexible hose are connected. The secondary nozzle and a metal cover having a small-diameter hole on the side surface and covering the flat plate and the entire fin are preferably formed, and the metal cover is preferably formed in a quadrangular pyramid shape.

[0006]

The insulating refrigerant ejected from the secondary nozzle comes into contact with the flat plate and fins on the integrated circuit chip. that time,
Since the whole is covered with a (pyramidal) metal cover,
The cooling medium circulates through the holes of the fins and forcibly contacts the fins and the flat plate for efficient cooling.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a partially cutaway perspective view of a cooling device for performing immersion jet cooling according to an embodiment of the present invention.
A flat plate 3 having good thermal conductivity is mounted on the radiation surface of the integrated circuit chip 1 via a solder or a thermally conductive adhesive 2. The flat plate 3 is provided with fins 4, 5 and 6 provided with a plurality of small-diameter holes 7 in an upright manner.
The fins 4, 5 and 6 are entirely covered with a secondary nozzle 8 and a quadrangular pyramidal metal cover 9 which also serves as a fin having a hole 9a having a small diameter on its side surface. The secondary nozzle 8 attached to the quadrangular pyramid-shaped metal cover 9 is connected to the primary nozzle 11 via a flexible hose 10. Note that the metal cover may have a shape other than the quadrangular pyramid shape.

FIG. 2 is a sectional view of the cooling device, showing the flow of the refrigerant during cooling. Next, the cooling operation will be described with reference to FIG. An insulating refrigerant such as fluorine carbide flows in the direction of the arrow in the figure. The refrigerant that has passed through the primary nozzle 11 passes through a hose 10 such as a rubber tube having excellent elasticity and is jetted in parallel from the secondary nozzle 8 attached to the quadrangular pyramid-shaped metal cover 9 to the fin 4 at the center of the heat sink. It collides with the flat plate 3 having good conductivity.

At this time, the refrigerant takes heat from the fins 4 at the center of the quadrangular pyramid-shaped metal cover 9 and collides with the flat plate 3 to take heat from the integrated circuit chip 1 and flows out from the plurality of holes 7 in the fins 5 and 6 at both ends. To do. When passing through the holes 7 of the fins 5 and 6 at both ends, the heat of the fins 5 and 6 is taken while increasing the flow velocity, and the heat is taken from the flat plate 3 portion of the next chamber defined by the fins 5 and 6 to form a quadrangular pyramid-shaped metal. It flows out from the hole 9a of the cover 9 to the outside of the heat sink.

In the cooling device of the present embodiment, if the entire shape of the heat sink is a quadrangular pyramid, the diffusion of the refrigerant is eliminated, and the fins 4, 5, 6 are provided with the plurality of holes 7 so that the refrigerant can be efficiently transmitted. The integrated circuit chip 1 can be cooled by contact with the hot surface.

Further, the secondary nozzle 8 attached to the quadrangular pyramid-shaped metal cover 9 is connected to the primary nozzle 11 via a flexible hose 10, so that regardless of the size of the arrangement of the chips, the secondary nozzle 8 is connected. The next nozzle 8 can be installed in the center of the integrated circuit chip 1. Further, as a result, the cooling device can be assembled to some degree of freedom, so that the problem of mounting error of the integrated circuit chip 1 can be solved and the assembly work can be simplified. further,
The flexible hose 10 also has a role of relieving thermal stress caused by thermal expansion of the integrated circuit 1 due to heat generation. that's all,
Although the present invention has been described with reference to the preferred embodiments, the present invention is not limited to the above embodiments.

[0012]

As described above, in the integrated circuit cooling device of the present invention, the insulating refrigerant is forcibly brought into contact with the flat plate and the fins by the quadrangular pyramidal metal cover,
The cooling efficiency of the integrated circuit can be improved without being disturbed by the fins of the heat sink as in the conventional case. Further, by connecting the secondary nozzle 8 of the quadrangular pyramid-shaped metal cover to the primary nozzle through a flexible hose, it is effective in simplifying the assembly of the cooling device and mitigating thermal stress.

[Brief description of drawings]

FIG. 1 is a partially cutaway perspective view of a cooling device according to an exemplary embodiment of the present invention.

FIG. 2 is a sectional view of an entire cooling device according to an exemplary embodiment of the present invention.

FIG. 3 is a perspective view showing a configuration of a conventional cooling device.

FIG. 4 is a sectional view of a conventional cooling device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Integrated circuit chip 2 ... Solder or heat conductive adhesive 3 ... Flat plate 4, 5, 6 ... Fin 7 ... Hole 8 ... Secondary nozzle 9 ... Square pyramidal metal cover 9a ... Hole 10 ... Hose 11 ... Primary nozzle 11 ... Arm fixing part 12 ... Groove part 13 ... Screw hole 31 ... Fitting part 61 ... Fixing hole

Claims (2)

[Claims] 1. A cooling device for an integrated circuit, in which an insulating refrigerant is jetted to perform immersion jet cooling, comprising: a heat conductive flat plate mounted on a surface of an integrated circuit chip; and a plurality of small diameter holes erected on the flat plate. It is composed of a fin provided, a secondary nozzle connected to the primary nozzle for supplying the insulating refrigerant through a flexible hose, and a metal cover having a small diameter hole on the side surface and covering the flat plate and the entire fin. An integrated circuit cooling device characterized by the above. 2. The cooling device for an integrated circuit according to claim 1, wherein the metal cover has a quadrangular pyramid shape.