JPH058971U - Multi-cavity ceramic board - Google Patents

Abstract

(57) [Abstract] [Purpose] The tip formed on the small ceramic substrate 2 is 45
There is no possibility that sharp-edged projections having an angle of ° may easily be formed, and the sharp-edged projections may be chipped to damage the mounted electronic element, render the element defective, or clog the transportation device or processing device. The purpose is to make the device completely non-functional. [Structure] A side of the through hole 4 which intersects with the dividing groove 3 is formed so as to be substantially perpendicular to the dividing groove 3. Even if the through hole 4 and the dividing groove 3 are formed deviating from each other, the small ceramic substrate 2 obtained by dividing a multi-cavity ceramic substrate along the dividing groove 3 has a sharp tip with an angle of 45 ° Is not formed.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a multi-cavity ceramic substrate for collectively manufacturing a large number of small ceramic substrates for mounting electronic devices such as semiconductor devices, resistors and capacitors. More specifically, it relates to a single ceramic substrate. The present invention relates to a multi-cavity ceramic substrate in which a large number of small ceramic substrates are collectively manufactured by dividing the substrate along the dividing grooves.

[0002]

[Prior Art]

 Conventionally, a multi-cavity ceramic substrate, in which a large number of small ceramic substrates for mounting electronic elements such as semiconductor elements, resistors, capacitors, etc. are collectively manufactured, has a flat plate shape as shown in FIGS. 4 and 5. The ceramic plate 21 is provided with a grid-shaped dividing groove 23 that divides the ceramic substrate 21 into a large number of small ceramic substrates 22 on the upper surface of the ceramic plate 21. The multi-cavity ceramic substrate is a metallization for connecting an electronic element mounted on each of the small ceramic substrates 22 divided by the dividing groove 23 from the upper surface to the lower surface of the small ceramic substrate 22 to an external electric circuit. A wiring layer 24 is formed, and an electronic element is mounted on the upper surface of each small ceramic substrate 22 so as to be electrically connected to the metallized wiring layer 24. The multi-cavity ceramic substrate is divided into a large number of small ceramic substrates 22 by chocolate breaks along the dividing grooves 23 before or after mounting the electronic elements on the respective small ceramic substrates 22. A large number of substrate 22 will be collectively manufactured.

The multi-cavity ceramic substrate serves as a passage for leading out the metallized wiring layer 24 from the upper surface to the lower surface at the intersection of the dividing grooves 23, and the multi-cavity ceramic substrate is properly arranged along the dividing groove 23. A through hole 25 for dividing is formed. The through hole 25 has a square shape such that each side thereof forms an angle of about 45 ° with the dividing groove 23, and the apex of the through hole 25 and the dividing groove 23 are formed to coincide with each other.

[0004]

[Problems to be solved by the device]

 However, in this conventional multi-cavity ceramic substrate, the through holes 25 are generally formed by punching using a punching die, while the dividing grooves 23 are formed by cutting using a cutter blade. As described above, in the conventional multi-cavity ceramic substrate, since the through hole 25 and the dividing groove 23 are formed in different steps, an error occurs in the processing position between the through hole 25 and the dividing groove 23, and the through hole 25 In some cases, the apexes and the dividing groove 23 may be formed so as to deviate from each other by a maximum of 0.1 mm. When the vertices of the through holes 25 and the dividing grooves 23 are formed so as to deviate from each other in this way, as shown in FIG. 6, a plurality of multi-cavity ceramic substrates can be obtained by dividing along the dividing grooves 23. The small-sized ceramic substrate 22 is formed with the acute-angled projection 26 having a tip of 45 °. Since the tip of the acute-angled projection 26 is 45 °, it is easy to be chipped, and when the small ceramic substrates 22 are conveyed or processed, the small-sized ceramic substrates 22 collide with each other or the small-sized ceramic substrate 22 collides with the transfer device or the processing device. The chip may be easily chipped and fallen off, and the fallen acute-angled projection 26 may damage the electronic element mounted on the small ceramic substrate 22 and cause a defect in the electronic element, or may cause a jam in a carrying device or a processing device. It had the drawback of causing damage to the processing equipment.

[0005]

[Means for Solving the Problems]

 The multi-cavity ceramic substrate of the present invention is a multi-cavity ceramic substrate having a flat ceramic plate having at least one main surface with dividing grooves arranged in a grid pattern and having through holes at intersections of the dividing grooves. The side of the through hole that intersects the dividing groove is substantially perpendicular to the dividing groove.

[0006]

【Example】

 Next, the multi-cavity ceramic substrate of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a plan view showing an embodiment of the multi-cavity ceramic substrate of the present invention, FIG. 2 is a sectional view of the multi-cavity ceramic substrate shown in FIG. 1, and FIG. 3 is shown in FIGS. FIG. 3 is a plan view showing a small ceramic substrate obtained by dividing a multi-cavity ceramic substrate, where 1 is a ceramic plate, 2 is a small ceramic substrate, 3 is a dividing groove, and 4 is a through hole.

The ceramic plate 1 is a flat plate made of ceramics such as alumina, aluminum nitride, mullite, and silicon carbide. The ceramic plate 1 has an upper surface for mounting electronic elements such as semiconductor elements, resistors, and capacitors. Lattice-shaped dividing grooves 3 which are divided into a large number of small ceramic substrates 2 and through holes 4 are formed at intersections of the dividing grooves 3, and each of the small ceramic substrates 2 divided by the dividing grooves 3 is provided with an upper surface thereof. A metallized wiring layer 5 for connecting an electronic element mounted on the small ceramic substrate 2 to an external electric circuit is formed through the through hole 4 to the lower surface.

When the ceramic plate 1 is made of alumina ceramics, for example, alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO), etc. Is added and mixed to form a sludge, and by adopting a conventionally known doctor blade method, a sheet-shaped ceramic green sheet (ceramic green sheet) is obtained, which is fired at a temperature of about 1600 ° C. Produced by

The dividing groove 3 has a function of dividing a multi-cavity ceramic substrate into a large number of small ceramic substrates 2 by chocolate breaking along the dividing groove 3, and a circular cutter is formed on a ceramic green sheet to be the ceramic substrate 1. It is formed by cutting with a blade such as a blade to a predetermined depth, and the depth is usually about half the thickness of the ceramic plate 1 and the width is about 0.01 mm.

The through hole 4 has an octagonal shape and serves as a passage for leading the metallized wiring layer 5 from the upper surface to the lower surface of the ceramic substrate 1, and at the same time, a multi-cavity ceramic substrate is provided along the dividing groove 3. It acts to divide correctly. The through hole 4 is formed substantially at a right angle to the dividing groove 3 where the sides 4a to 4d intersecting the dividing groove 3 intersect, and the lengths of the sides 4a to 4d are the through hole 4 and the dividing groove 3 respectively. It has a length of 0.2 mm or more, which is more than twice the maximum gap between and. Therefore, the multi-cavity ceramic substrate of the present invention can be obtained by dividing the through hole 4 and the dividing groove 3 along the dividing groove 3 as shown in FIG. Although the small ceramic substrate 2 is formed with the projection 6 having a tip of 90 °, there is no formation of an acute-angled projection having a tip of 45 °.

The through hole 4 is formed by punching a ceramic green sheet, which is the ceramic substrate 1, into a predetermined shape by a conventionally known punching press.

The metallized wiring layer 5 is made of a metal powder having a high melting point such as tungsten and molybdenum, and a metal paste obtained by adding and mixing an appropriate organic solvent and a binder to the metal powder such as tungsten is used as the ceramic plate 1. The green sheet is formed integrally with the ceramic plate 1 by applying a known thick film method such as screen printing and applying the print on the green sheet. If a metal having good conductivity and excellent corrosion resistance such as nickel and gold is plated on the exposed surface of the metallized wiring layer 5 to a thickness of 2 to 20 μm, the metallized wiring layer 5 will be corroded. Can be effectively prevented. Therefore, it is preferable that the exposed surface of the metallized wiring layer 5 be plated with a metal of good conductivity and corrosion resistance such as nickel or gold to a thickness of 2 to 20 μm by plating.

Thus, according to the multi-cavity ceramic substrate of the present invention, a chocolate break is formed along each of the small ceramic substrates 2 along the dividing groove 3 before or after mounting an electronic device such as a semiconductor device, a resistor, or a capacitor. As a result, it is divided into a large number of small ceramic substrates 2, and a large number of small ceramic substrates 2 for mounting electronic elements are collectively manufactured.

It should be noted that the present invention is not limited to the above-described embodiment. For example, if the side of the through hole that intersects the dividing groove is substantially perpendicular to the dividing groove, the through hole may have a quadrangular shape or other shapes. The shape may be changed, and various modifications can be made without departing from the gist of the present invention.

[0016]

[Effect of the device]

 According to the multi-cavity ceramic substrate of the present invention, since the side of the through hole that intersects the dividing groove has an angle that is substantially perpendicular to the dividing groove, the positions of the through hole and the dividing groove are misaligned. As a result, although the small ceramic substrate obtained by dividing this is formed with a projection having a tip of 90 °, an acute-angled projection having a tip of 45 ° is not formed. It is unlikely that the chip will drop off and fall off.Therefore, the sharp-edged projections that have chipped off will damage the electronic element on which it is mounted, causing defects in the electronic element, or clogging the carrier or processing equipment The processing equipment does not cause any trouble.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a multi-cavity ceramic substrate of the present invention.

FIG. 2 is a sectional view of the multi-cavity ceramic substrate shown in FIG.

3 is a plan view of a small ceramic substrate obtained by dividing the multi-cavity ceramic substrate shown in FIG.

FIG. 4 is a plan view showing a conventional multi-cavity ceramic substrate.

5 is a cross-sectional view of the multi-cavity ceramic substrate shown in FIG.

6 is a plan view of a small ceramic substrate obtained by dividing the multi-cavity ceramic substrate shown in FIG.

[Explanation of symbols]

 1 ... Ceramic plate 2 ... Small ceramic substrate 3 ... Dividing groove 4 ... Through hole

Claims (1)

[Claims for utility model registration] 1. A multi-cavity product having dividing grooves arranged in a grid pattern on at least one main surface of a flat ceramic plate, and having through holes at intersections of the dividing grooves. In the ceramic substrate, a side of the through hole which intersects with the dividing groove is substantially perpendicular to the dividing groove.